CN208013259U - A kind of high temperature test probe card heating control system - Google Patents
A kind of high temperature test probe card heating control system Download PDFInfo
- Publication number
- CN208013259U CN208013259U CN201820089833.3U CN201820089833U CN208013259U CN 208013259 U CN208013259 U CN 208013259U CN 201820089833 U CN201820089833 U CN 201820089833U CN 208013259 U CN208013259 U CN 208013259U
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- CN
- China
- Prior art keywords
- probe card
- temperature
- substrate
- control system
- stiffening plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000523 sample Substances 0.000 title claims abstract description 110
- 238000012360 testing method Methods 0.000 title claims abstract description 39
- 238000010438 heat treatment Methods 0.000 title claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000000919 ceramic Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 abstract description 5
- 238000012544 monitoring process Methods 0.000 abstract description 2
- 230000003014 reinforcing effect Effects 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000002787 reinforcement Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 230000036413 temperature sense Effects 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model provides a kind of high temperature test probe card heating control system, including：Probe card, the probe card include stiffening plate, substrate, probe, and stiffening plate be installed on substrate, probe is below substrate；Heater is arranged between stiffening plate and substrate, is heated to probe card at least part；Temperature inductor is connected in probe card, the temperature for incuding the probe card；Temperature controller is connected to heater and temperature inductor, is controlled by temperature control system.The shape of heater annular is arranged, and can equably be heated, and is arranged between reinforcing plate and substrate, reduces to maximum efficiency the substrate deformation different degrees of with the variation of peripheral environment temperature, reduces the deformation of probe, stablizes the position of probe.Temperature inductor can incude the temperature of different location, realize the temperature of real time monitoring probe card different location in higher efficiency, carry out Automatic Control by temperature control system, ensure the reliability of test data.
Description
Technical field
The utility model is related to a kind of semiconductor testing apparatus, more particularly to a kind of high temperature test probe card computer heating control
System.
Background technology
As the continuous development of semiconductor test is visited based on the considerations of cost and quality control and process optimization in wafer
Needle test phase need to introduce high temperature test.Compared with the wafer test under room temperature, the high temperature wafer probe test of temperature parameter is introduced,
Be more easy to occur the yield caused by poor contact is bad or probe trace it is too deep caused by product stability it is poor.
The needle length of wafer pyrometer test middle probe card can increase as the temperature increases.The thin such as hair of the needle of probe card,
And the needle of needle and wafer contacts pressure is micron order.General pyrometric probe card only heats metal reinforcement plate, and hot using absorbing
The mode of energy itself does not have heating device, such as in order to ensure the yield and needle trace of wafer, is needed in high temperature test using spy
Needle machine (Chuck) gives probe card preheating, general 30 minutes of preheating time, to reach perfect condition later and carry out probe card needle
The calibration of position and height.Probe card once leaves probe machine (Chuck) (heat source), then the long shrinkage of probe card needle can occur and cause
Needle position and height change, and cause test failure.It can be according to the coefficient of expansion of time out and probe, manually in current procedure
Or probe card is preheated automatically, therefore the single-wafer testing time will be influenced.
Under hot environment, probe trace is increasing after starting test, and depth is more and more deeper, leads to the wafer weldering after test
The destruction of pad or the stability of product are poor, to affect the quality of product.In test process, it is temporary that wafer changes built-in testing, board
Stop, occur after automated cleaning needle card needle trace shoal or directly no needle mark and cause yield low or without yield.Problem above also as
The accessories such as substrate are deformed upon because being affected by temperature during follow-on test, when needle position then being caused to be positioned with initial board
Setting position it is different and deviation occur.When needle trace is increasingly deeper, illustrate that needle position occurs downwards compared with initial, set position
Increasing deviation, substrate continue deforming upon under high temperature environment as time increases；And work as the board long period
Pause, when substrate peripheral environment temperature reduces, reverse strain occurs for substrate, and to occur, needle trace is excessively shallow or contact of no needle mark
Bad phenomenon；The depth of probe trace differs, suddenly big or suddenly small, illustrates that with the variation of peripheral environment temperature difference is occurring for substrate
The deformation of degree.
In the prior art, such as CN203849299U, heater is arranged between ceramic wafer and pedestal, can only to probe into
Row computer heating control.Therefore continuous heating control can not be carried out to substrate, variation of the substrate with peripheral environment temperature can not be improved
In the different degrees of deformation of generation, and then influence the position of probe.
Utility model content
The purpose of this utility model is to provide for a kind of control system heated to probe card (including substrate and probe)
System, controls the temperature of probe card.
To achieve the above object, the utility model provides a kind of high temperature test probe card heating control system, including probe
Card；Heater on the probe card is set, probe card at least part is heated, including substrate, probe are carried out
Heating；Temperature inductor sense on the probe card is set, the temperature of the probe card different location is incuded；Temperature control system,
It is connected to the heater and temperature inductor, receives the signal of the temperature inductor, and according to the signal to described
Heater is heated up or is cooled down control.
The wherein described probe card includes stiffening plate, substrate, probe.The stiffening plate is mounted on the upper surface of substrate, for giving
Probe card increases the effect of rigidity and transition temperature.The stiffening plate can be made of any material appropriate, be not limited to aluminium,
The metals such as stainless steel, alloy.Stiffening plate can be heated, transition temperature to substrate keeps the temperature of substrate more uniform.Institute
It states substrate to be made of printed circuit board, the printed circuit board uses epoxy glass fiber plate or metallic plate.The probe peace
Below the substrate, including at least two probes.The probe card further includes ceramic ring, pedestal.The ceramic ring peace
Below substrate.The pedestal is below ceramic ring, using heat-resisting material, preferably epoxide resin material.The spy
Needle is fixed between the ceramic ring and the pedestal.
The heater includes one or more, is heated to probe card at least part.The heater
It can have any shape, it is therefore preferable to which annular can be heated equably.The heater can be arranged in the stiffening plate
Upper surface is either inside stiffening plate either between the stiffening plate and the substrate or probe card other positions.To reinforcement
Plate and substrate are heated, and heat is transmitted to probe by substrate, and heating is also carried out at the same time to probe.Preferably, heater is arranged
Between the stiffening plate and the substrate, it can effectively heat the substrate, reduce the deformation of substrate.It again will by substrate
Temperature conduction ensures that the deformation rate of probe is relatively low, the efficiency of heating surface is higher to probe.Stiffening plate can also play substrate temperature guarantor
Temperature effect.
The temperature inductor, including one or more, it is arranged in the probe card, for incuding the probe card
Temperature.Either either stiffening plate upper surface or probe between substrate and stiffening plate can be set inside the stiffening plate
On, the temperature for incuding different location.The preferably described temperature inductor is arranged inside the stiffening plate.
The temperature control system is connected on the probe card and temperature inductor, receives the temperature inductor
Signal, and heated up to the heater according to the signal or the control that cools down.The temperature control system is monolithic
Machine or computer or microcontroller and host computer association system.The probe card is heated according to the temperature of setting, such as
The temperature that temperature inductor described in fruit senses the probe card is less than preset temperature, and temperature control system controls the heating
Device automatic heating, if after reaching set temperature, temperature control system is automatically stopped heating, and remains temperature in setting model
In enclosing.
The beneficial effects of the utility model：It is arranged by the shape of heater annular, can be equably heated, and
It is arranged between reinforcing plate and substrate, reduces to maximum efficiency substrate with the variation of peripheral environment temperature and in various degree
Deformation reduces the deformation of probe, stabilizes the position of probe.Temperature inductor can incude the temperature of different location, higher
The temperature for efficient realizing real time monitoring probe card different location carries out Automatic Control by temperature control system, ensure that
The reliability of test data.
According to the accompanying drawings to the detailed description of the utility model specific embodiment, those skilled in the art will be more
Add the above-mentioned and other purposes, advantages and features of clear the utility model.
Description of the drawings
Some specific realities of the utility model are described in detail by way of example rather than limitation with reference to the accompanying drawings hereinafter
Apply example.Identical reference numeral denotes same or similar component or part in attached drawing.It should be appreciated by those skilled in the art that
The drawings are not necessarily drawn to scale.In attached drawing：
Fig. 1 is the probe card side view signal of the high temperature test probe card heating control system of the utility model one embodiment
Figure；
Fig. 2 is the probe card plan structure of the high temperature test probe card heating control system of the utility model one embodiment
Schematic diagram；
Fig. 3 is the general illustration of the high temperature test probe card heating control system of the utility model one embodiment.
Wherein：1 stiffening plate, 2 substrates, 3 probes, 4 heaters, 5 temperature inductors, 6 ceramic rings, 7 pedestals, 8 microcontrollers, 9
Host computer, 10 probe cards.
Specific implementation mode
Fig. 1 is the probe card side view according to the high temperature test probe card heating control system of the utility model one embodiment
Schematic diagram.As shown in Figure 1, a kind of high temperature test probe card heating control system, including probe card 10；It is arranged in probe card 10
Heater 4, for being heated to 10 at least part of probe card, including substrate 2, probe 3 are heated；Temperature sense
Device 5 is arranged in probe card 10, the temperature for incuding the probe card 10.
As shown in figure 3, in the present embodiment, a kind of high temperature test probe card heating control system further includes temperature control system
System, the temperature control system include microcontroller 8, host computer 9, and microcontroller 8 is connected to heater 4, temperature inductor 5 and upper
Machine 9.
The present embodiment middle probe card 10 includes stiffening plate 1, substrate 2, probe 3, and stiffening plate 1 is mounted on above substrate 2, probe
3 are mounted below substrate 2.Stiffening plate 1 is metal reinforcement plate in the present embodiment, can enhance the intensity of probe card 10, and realize
Conduct the function of heat.Stiffening plate 1 is not limited to metal reinforcement plate, or other any materials appropriate.Substrate 2 is printing electricity
Epoxy glass fiber plate or metallic plate may be used in road plate.The probe card 10 further includes ceramic ring 6, pedestal in the present embodiment
7.Ceramic ring 6 is mounted below substrate 2.Pedestal 7 is epoxide resin material, in other embodiments may be used below ceramic ring 6
Think other heat-resisting materials.Probe 3 is fixed between ceramic ring 6 and pedestal 7, and probe 3 includes at least two.
Heater 4 includes one in the present embodiment, is arranged between stiffening plate 1 and substrate 2, can be effectively to substrate 2
It is heated, reduces the deformation of substrate 2.And by substrate 2 by temperature conduction to probe 3, the efficiency of heating surface is higher.Other embodiment
In be not limited to only this, may include multiple, and position is not limited between stiffening plate 1 and substrate 2, can also be on stiffening plate
1 surface either other positions of the inside of stiffening plate 1 or probe card 10.The heater 4 is the heating plate of annular, heater
4 shape is not limited only to the shape in Fig. 1, or the other shapes such as snakelike, rectangular.
As shown in Figure 1 and Figure 2, temperature inductor 5 is arranged inside stiffening plate 1, can in other embodiments including multiple
With setting in 1 upper surface of stiffening plate either between stiffening plate 1 and substrate 2 or the other positions of probe card 10, such as probe 3
Top.Temperature inductor 5 is used to incude the temperature of stiffening plate 1 in the present embodiment.
As shown in figure 3, the high temperature test probe card heating control system of the present embodiment further includes temperature control system, the temperature
Degree control system includes microcontroller 8, host computer 9, in the present embodiment microcontroller 8 connect temperature inductor 5, heater 4 and on
Position machine 9, microcontroller 8 receive the signal of temperature inductor 5, and transmit the signal to host computer 9, are controlled by host computer 9.
Probe card 10 is heated according to the temperature of setting, if temperature inductor 5 senses the temperature of probe card 10 less than default
Temperature, temperature control system control will control 4 automatic heating of heater, if reach set temperature after, temperature control system from
It is dynamic to stop heating, and remain temperature in setting range.In other embodiments, temperature control system can also be single
Microcontroller or computer.
So far, although those skilled in the art will appreciate that the more of the utility model have been shown and described in detail herein
A exemplary embodiment still, still can be according to the utility model public affairs in the case where not departing from the spirit and scope of the utility model
The content opened directly determines or derives many other variations or modifications for meeting the utility model principle.Therefore, this practicality is new
The range of type is understood that and regards as to cover other all these variations or modifications.
Claims (10)
1. a kind of high temperature test probe card heating control system, including：Probe card, the probe card include stiffening plate, substrate, spy
Needle, the stiffening plate are mounted on the thereon, and the probe is mounted below the substrate, which is characterized in that further includes：
At least one heater, is arranged between the stiffening plate and the substrate or stiffening plate upper surface or stiffening plate
The substrate is heated in inside；
At least one temperature inductor is arranged in the probe card, the temperature for incuding the probe card；
Temperature control system is connected to the heater and temperature inductor.
2. high temperature test probe card heating control system according to claim 1, which is characterized in that the heater is ring
Shape heater.
3. high temperature test probe card heating control system according to claim 1, which is characterized in that the temperature inductor
It is arranged inside the stiffening plate either between the substrate and stiffening plate or on probe.
4. high temperature test probe card heating control system according to claim 1, which is characterized in that the substrate is printing
Circuit board.
5. high temperature test probe card heating control system according to claim 4, which is characterized in that the printed circuit board
For epoxy glass fiber plate or metallic plate.
6. high temperature test probe card heating control system according to claim 1, which is characterized in that the stiffening plate is gold
Belong to stiffening plate.
7. high temperature test probe card heating control system according to claim 1, which is characterized in that the probe card is also wrapped
Ceramic ring is included, the ceramic ring is mounted below the substrate.
8. high temperature test probe card heating control system according to claim 7, which is characterized in that the probe card is also wrapped
Pedestal is included, the floor installation is below the ceramic ring.
9. according to the high temperature test probe card heating control system described in claim 8, which is characterized in that the material of the pedestal
Material is heat-resisting material.
10. according to the high temperature test probe card heating control system described in claim 9, which is characterized in that the pedestal
Material is epoxide resin material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820089833.3U CN208013259U (en) | 2018-01-18 | 2018-01-18 | A kind of high temperature test probe card heating control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820089833.3U CN208013259U (en) | 2018-01-18 | 2018-01-18 | A kind of high temperature test probe card heating control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208013259U true CN208013259U (en) | 2018-10-26 |
Family
ID=63883947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820089833.3U Expired - Fee Related CN208013259U (en) | 2018-01-18 | 2018-01-18 | A kind of high temperature test probe card heating control system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208013259U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111948519A (en) * | 2020-08-20 | 2020-11-17 | 广东全芯半导体有限公司 | Method for controlling high-temperature test needle mark of wafer |
| CN112881886A (en) * | 2021-01-13 | 2021-06-01 | 上海华岭集成电路技术股份有限公司 | Multi-station probe card and wafer testing method |
| WO2023005034A1 (en) * | 2021-07-28 | 2023-02-02 | 长鑫存储技术有限公司 | Probe card, operation method for probe card, and test system |
| CN115825706A (en) * | 2023-02-24 | 2023-03-21 | 长春光华微电子设备工程中心有限公司 | Control method for probe temperature |
| CN117030431A (en) * | 2023-08-04 | 2023-11-10 | 青岛海洋地质研究所 | In-situ cleaning device and method for ultralow-temperature hydrate nano probe |
| CN117554659A (en) * | 2023-11-10 | 2024-02-13 | 华中科技大学 | High-temperature probe card and heat measuring device for combined type calorimetric analysis |
| CN117554659B (en) * | 2023-11-10 | 2024-06-21 | 华中科技大学 | High-temperature probe card and heat measuring device for combined type calorimetric analysis |
-
2018
- 2018-01-18 CN CN201820089833.3U patent/CN208013259U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111948519A (en) * | 2020-08-20 | 2020-11-17 | 广东全芯半导体有限公司 | Method for controlling high-temperature test needle mark of wafer |
| CN112881886A (en) * | 2021-01-13 | 2021-06-01 | 上海华岭集成电路技术股份有限公司 | Multi-station probe card and wafer testing method |
| WO2023005034A1 (en) * | 2021-07-28 | 2023-02-02 | 长鑫存储技术有限公司 | Probe card, operation method for probe card, and test system |
| CN115825706A (en) * | 2023-02-24 | 2023-03-21 | 长春光华微电子设备工程中心有限公司 | Control method for probe temperature |
| CN117030431A (en) * | 2023-08-04 | 2023-11-10 | 青岛海洋地质研究所 | In-situ cleaning device and method for ultralow-temperature hydrate nano probe |
| CN117030431B (en) * | 2023-08-04 | 2024-02-20 | 青岛海洋地质研究所 | In-situ cleaning device and method for ultralow-temperature hydrate nano probe |
| CN117554659A (en) * | 2023-11-10 | 2024-02-13 | 华中科技大学 | High-temperature probe card and heat measuring device for combined type calorimetric analysis |
| CN117554659B (en) * | 2023-11-10 | 2024-06-21 | 华中科技大学 | High-temperature probe card and heat measuring device for combined type calorimetric analysis |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181026 |