CN103954649A - Multifunctional miniature temperature control device - Google Patents
Multifunctional miniature temperature control device Download PDFInfo
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- CN103954649A CN103954649A CN201410162669.0A CN201410162669A CN103954649A CN 103954649 A CN103954649 A CN 103954649A CN 201410162669 A CN201410162669 A CN 201410162669A CN 103954649 A CN103954649 A CN 103954649A
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Abstract
The invention relates to a multifunctional miniature temperature control device which consists of an automatic temperature measuring micro heating stage manufactured by a micromachining process, a miniature semiconductor chilling plate, an intelligent temperature controller, a computer and a data acquisition instrument, wherein the automatic temperature measuring micro heating stage and the miniature semiconductor chilling plate are vertically laminated and are tightly connected with each other; the automatic temperature measuring micro heating stage comprises an upper insulating layer, a resistance wire and multiple pairs of electrodes; the resistance wire comprises a heating resistance wire and a temperature measuring resistance wire; the heating resistance wire and the miniature semiconductor chilling plate are respectively connected with the intelligent temperature controller through wires; and the temperature measuring resistance wire is connected with the data acquisition instrument and the computer through wires. The multifunctional miniature temperature control device is diversified in functions, high in accuracy and convenient to operate, the limitation that the test operating space is small can be overcome, and damage to the material surface structure is avoided.
Description
Technical field
The invention belongs to material properties test technical field, be specifically related to a kind of multifunction micro temperature regulating device.
Background technology
In material science research, many performance parameters of material usually have temperature dependency, and the temperature dependency of test material performance contributes to study its mechanism in specified temp interval, expands its range of application.The test of material temperature dependence, such as the alternating temperature conductivity of material, the test processs such as alternating temperature Seebeck coefficient, are generally the temperature variation data that obtain material by contact means, change with test material surface temperature at material surface connection standard thermopair.Solid once be pasted not strongly, thermopair drops, and needs interrupt test or retests; The method of pasting standard couple easily causes material surface destructurized, the accuracy of test process after impact.The performance tests such as material alternating temperature conductivity or alternating temperature Seebeck coefficient, often need to use probe to carry out, and the operating space between vertical probe station and sample stage is little, causes temperature control operation inconvenience, even probe or sample is caused damage.Use electrothermal module to carry out temperature control because the restriction of electrothermal module power is difficult to manufacture larger temperature range.
Summary of the invention
The present invention is directed to the deficiency in above-mentioned background, a kind of multifunction micro temperature regulating device is provided.This device major part can be produced in batches by micro-processing technology from thermometric low-grade fever platform, can provide the temperature of tiny area to be uniformly distributed, can provide temperature linearity to change, can set up larger temperature variation interval, can set up the temperature difference at tiny area, can be in real time contactless accurately from thermometric, solve between test process middle probe platform and sample stage operating space little, the problem such as electrothermal module temperature control scope is little.
For achieving the above object, the present invention adopts following technical scheme:
A kind of multifunction micro temperature regulating device, manufactured by micro fabrication from thermometric low-grade fever platform, micro semiconductor cooling piece, intelligent temperature control instrument, computing machine and data collecting instrument composition, describedly closely be connected with micro semiconductor cooling piece stacked on top of one another from thermometric low-grade fever platform, describedly comprise upper insulation course from thermometric low-grade fever platform, resistance wire and multipair electrode, described resistance wire comprises resistive heater and temperature detecting resistance silk, described resistive heater is connected with intelligent temperature control instrument by wire respectively with micro semiconductor cooling piece, described temperature detecting resistance silk is connected with data collecting instrument and computing machine by wire.
Described electrode comprises heating electrode and thermometric electrode.
Described equal from thermometric low-grade fever platform and micro semiconductor cooling piece area.
Described resistive heater is snakelike symmetrical along axis, embeds temperature detecting resistance silk at axis place and in two ends, axis symmetric position.
Described resistive heater has 2n heating electrode, wherein n >=2.
Described resistive heater is identical with temperature detecting resistance silk material used, is resistance and has temperature dependent metal.
Compared with prior art, the invention has the beneficial effects as follows:
Can be manufactured in batches by micro-processing technology because volume little Yi processes from thermometric low-grade fever platform, can provide the temperature of microcell to be uniformly distributed, can provide temperature linearity to change, can set up larger temperature variation interval, can set up the temperature difference at microcell, can be in real time contactless accurately from thermometric, therefore can assist the temperature dependency test of material property in tiny area, as alternating temperature conductivity, alternating temperature Seebeck coefficient etc., function is many, and degree of accuracy is good, easy to operate, the little restriction in operating space can overcome test time, avoids material surface structure to damage.
Brief description of the drawings
Fig. 1 is device schematic diagram of the present invention.
Fig. 2 is the cross-sectional structure figure from thermometric low-grade fever platform that the present invention proposes.
Fig. 3 is the resistance wire from thermometric low-grade fever platform and the distribution of electrodes figure that the present invention proposes.
Fig. 4 is the control panel schematic diagram of intelligent temperature control instrument of the present invention.
Fig. 5 is fundamental diagram of the present invention.
Fig. 6 is temperature detecting resistance R-T curve and the fitting formula thereof from thermometric low-grade fever platform that the present invention proposes.
Embodiment
Below in conjunction with accompanying drawing, specific embodiments of the invention are further described.
As depicted in figs. 1 and 2, a kind of multifunction micro temperature regulating device, manufactured by micro fabrication from thermometric low-grade fever platform 1, micro semiconductor cooling piece 2, intelligent temperature control instrument 3, computing machine 4 and data collecting instrument 5 form, describedly closely be connected with micro semiconductor cooling piece 2 stacked on top of one another from thermometric low-grade fever platform 1, describedly comprise upper insulation course 1a from thermometric low-grade fever platform 1, resistance wire 1b and multipair electrode 1c, described resistance wire 1b comprises resistive heater 1b-1 and temperature detecting resistance silk 1b-2, described resistive heater 1b-1 is connected with intelligent temperature control instrument 3 by wire respectively with micro semiconductor cooling piece 2, described temperature detecting resistance silk 1b-2 is connected with data collecting instrument 5 and computing machine 4 by wire.
As shown in Figure 3, described resistive heater 1b-1 is snakelike symmetrical along axis, energising end has 2nn=2 heating electrode 1c-2,1c-3,1c-5,1c-7, described temperature detecting resistance silk 1b-2 is embedded in the position of Chu Jiyan axis, axis symmetry, and temperature detecting resistance silk has thermometric electrode 1c-1,1c-4,1c-6; Resistive heater distributes and has guaranteed the homogeneity in temperature control region, and 2n heating electrode guaranteed the variation of apparatus function; 1c-2 and 1c-7,1c-3 and 1c-5 form respectively loop, can form the temperature difference, and temperature is also respectively by thermometric electrode 1c-1 and 1c-4 non-contact detection, for subtest Seebeck coefficient; 1c-5 and 1c-7 form loop, and temperature is detected by thermometric electrode 1c-6, can be used for the temperature dependency of material property in subtest tiny area.
As shown in Figure 4, described intelligent temperature control instrument 3 comprises minimizing key 3a, increases and build 3b, confirmation/operation key 3c, stop key 3d and display panel 3e.
When use, multifunction micro temperature regulating device is placed on the sample stage of probe station of four point probe measuring resistance, then, in its surface spreading detected materials, then probe moves down contact material; Heating electrode 1c-5 is connected intelligent temperature control instrument 3 with 1c-7, thermometric electrode 1c-6 connection data Acquisition Instrument 5 and computing machine 4; Temperature control condition based on heat up-cooling or intensification-constant temperature-cooling is at intelligent temperature control instrument 3 edit routines, under principle shown in Fig. 5, size of current and switching by temperature control programmed control from thermometric low-grade fever platform branch road and semiconductor chilling plate branch road, and gathered the resistance information of temperature detecting resistance silk by data collecting instrument 5, under the linear relationship of R-T shown in Fig. 6, feedback obtains corresponding temperature information, combine with four point probe institute measuring resistance information again, thereby obtain the temperature dependency data of material resistance in tiny area.
When use, multifunction micro temperature regulating device is placed on the sample stage of Seebeck coefficient proving installation, then in its surface spreading detected materials, then hot junction probe and cold junction probe move down and are placed in respectively both sides, axis; Heating electrode 1c-2 is connected intelligent temperature control instrument 3 and forms a loop with 1c-7, thermometric electrode 1c-1 connection data Acquisition Instrument 5 gathers local terminal resistance data; Heating electrode 1c-3 is connected intelligent temperature control instrument 3 and forms another loop with 1c-5, thermometric electrode 1c-4 connection data Acquisition Instrument 5 gathers local terminal resistance data; Temperature control condition based on maintain constant temperature in different temperature points is at intelligent temperature control instrument 3 edit routines, under principle shown in Fig. 5, size of current and switching by temperature control programmed control from thermometric low-grade fever platform branch road and semiconductor chilling plate branch road, and gathered the resistance information of temperature detecting resistance silk by data collecting instrument 5, under the linear relationship of R-T shown in Fig. 6, feedback obtains corresponding temperature information, combine with the data of Seebeck coefficient proving installation gained again, thereby obtain the temperature dependency data of material Seebeck coefficient in tiny area.
Claims (6)
1. a multifunction micro temperature regulating device, it is characterized in that, manufactured by micro fabrication from thermometric low-grade fever platform (1), micro semiconductor cooling piece (2), intelligent temperature control instrument (3), computing machine (4) and data collecting instrument (5) composition, describedly closely be connected with micro semiconductor cooling piece (2) stacked on top of one another from thermometric low-grade fever platform (1), describedly comprise upper insulation course (1a) from thermometric low-grade fever platform (1), resistance wire (1b) and multipair electrode (1c), described resistance wire (1b) comprises resistive heater (1b-1) and temperature detecting resistance silk (1b-2), described resistive heater (1b-1) is connected with intelligent temperature control instrument (3) by wire respectively with micro semiconductor cooling piece (2), described temperature detecting resistance silk (1b-2) is connected with data collecting instrument (5) and computing machine (4) by wire.
2. a kind of multifunction micro temperature regulating device according to claim 1, is characterized in that, described electrode (1c) comprises heating electrode and thermometric electrode.
3. a kind of multifunction micro temperature regulating device according to claim 1, is characterized in that, described equal from thermometric low-grade fever platform (1) and micro semiconductor cooling piece (2) area.
4. a kind of multifunction micro temperature regulating device according to claim 1, is characterized in that, described resistive heater (1b-1) is snakelike symmetrical along axis, embeds temperature detecting resistance silk (1b-2) at axis place and in two ends, axis symmetric position.
5. a kind of multifunction micro temperature regulating device according to claim 1, is characterized in that, described resistive heater (1b-1) has 2n heating electrode, wherein n >=2.
6. a kind of multifunction micro temperature regulating device according to claim 1, is characterized in that, described resistive heater (1b-1) is identical with temperature detecting resistance silk (1b-2) material used, is resistance and has temperature dependent metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410162669.0A CN103954649A (en) | 2014-04-22 | 2014-04-22 | Multifunctional miniature temperature control device |
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| CN201410162669.0A CN103954649A (en) | 2014-04-22 | 2014-04-22 | Multifunctional miniature temperature control device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109212004A (en) * | 2017-06-30 | 2019-01-15 | 宝山钢铁股份有限公司 | Hydrogen experimental detection device and detection method are surveyed in the quick-fried performance drain of glassed steel squama |
| CN109561524A (en) * | 2019-01-09 | 2019-04-02 | 武汉光迅科技股份有限公司 | A kind of microheater and its packaged type |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6662121B1 (en) * | 1999-04-27 | 2003-12-09 | Yazaki Corporation | Thermal fluid sensor, fluid discriminating apparatus and method, flow sensor, and flow rate measuring apparatus and method |
| CN101086009A (en) * | 2006-06-06 | 2007-12-12 | 北京大学 | Temperature-control matrix biochip and its processing method |
| CN101203074A (en) * | 2006-12-14 | 2008-06-18 | 探微科技股份有限公司 | Ultra-alloy minitype heater and method for making |
| JP2009022202A (en) * | 2007-07-19 | 2009-02-05 | Sony Corp | Reaction-treating device |
| CN102378414A (en) * | 2010-08-06 | 2012-03-14 | 友丽系统制造股份有限公司 | Micro-heater with temperature monitoring function |
| CN103135634A (en) * | 2013-01-18 | 2013-06-05 | 上海交通大学 | Temperature control method and device for polymerase chain reaction biochip |
| CN103596304A (en) * | 2013-11-07 | 2014-02-19 | 上海大学 | Embedded self-temperature-testing type mini heating stage and manufacturing method thereof |
-
2014
- 2014-04-22 CN CN201410162669.0A patent/CN103954649A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6662121B1 (en) * | 1999-04-27 | 2003-12-09 | Yazaki Corporation | Thermal fluid sensor, fluid discriminating apparatus and method, flow sensor, and flow rate measuring apparatus and method |
| CN101086009A (en) * | 2006-06-06 | 2007-12-12 | 北京大学 | Temperature-control matrix biochip and its processing method |
| CN101203074A (en) * | 2006-12-14 | 2008-06-18 | 探微科技股份有限公司 | Ultra-alloy minitype heater and method for making |
| JP2009022202A (en) * | 2007-07-19 | 2009-02-05 | Sony Corp | Reaction-treating device |
| CN102378414A (en) * | 2010-08-06 | 2012-03-14 | 友丽系统制造股份有限公司 | Micro-heater with temperature monitoring function |
| CN103135634A (en) * | 2013-01-18 | 2013-06-05 | 上海交通大学 | Temperature control method and device for polymerase chain reaction biochip |
| CN103596304A (en) * | 2013-11-07 | 2014-02-19 | 上海大学 | Embedded self-temperature-testing type mini heating stage and manufacturing method thereof |
Non-Patent Citations (2)
| Title |
|---|
| K.L.ZHANG ET AL.: "Fabrication, modeling and testing of a thin film Au/Ti microheater", 《INTERNATIONAL JOURNAL OF THERMAL SCIENCES》 * |
| 闫卫平等: "金属薄膜加热器的研究", 《传感技术学报》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109212004A (en) * | 2017-06-30 | 2019-01-15 | 宝山钢铁股份有限公司 | Hydrogen experimental detection device and detection method are surveyed in the quick-fried performance drain of glassed steel squama |
| CN109561524A (en) * | 2019-01-09 | 2019-04-02 | 武汉光迅科技股份有限公司 | A kind of microheater and its packaged type |
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Application publication date: 20140730 |