CN102378414A - Micro-heater with temperature monitoring function - Google Patents
Micro-heater with temperature monitoring function Download PDFInfo
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- CN102378414A CN102378414A CN2010102506630A CN201010250663A CN102378414A CN 102378414 A CN102378414 A CN 102378414A CN 2010102506630 A CN2010102506630 A CN 2010102506630A CN 201010250663 A CN201010250663 A CN 201010250663A CN 102378414 A CN102378414 A CN 102378414A
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- heating
- weld pad
- heating plate
- temperature detecting
- heater
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Abstract
The invention discloses a micro-heater with a temperature monitoring function. The micro-heater comprises a chip, a heating plate, a first heating welding pad, a second heating welding pad, a temperature measuring resistor and a radiation emitting layer, wherein the heating plate is arranged on the chip, and two conducting ends are formed at the outer edge of the heating plate; the first heating welding pad and the second heating welding pad are arranged on the chip outside the heating plate, and respectively electrically connected with the two conducting ends of the heating plate; on end of the temperature measuring resistor is connected with the first heating welding pad; and the radiation emitting layer is arranged on the chip and covers the heating plate. In such a way, the micro-heater can judge the current temperature of the micro-heater according to the current flowing through the temperature measuring resistor, thereby achieving the function of temperature monitoring.
Description
Technical field
The relevant a kind of micro-heater of the present invention refers to a kind of micro-heater with temp monitoring function especially.
Background technology
The numerous types of heater, and heater is understood the external temperature transducer usually, uses the temperature of control heater.Along with the growth at full speed of science and technology, heater is gradually towards the microminiaturization development, and still, the control of the temperature of heater still must be monitored by external temperature sensor.This is prone to cause the puzzlement in the use, and required cost is higher.
Improving of the above-mentioned shortcoming of inventor's thoughts is that the spy concentrates on studies and cooperates the utilization of scientific principle, proposes a kind of reasonable in design and effectively improve the present invention of above-mentioned shortcoming finally.
Summary of the invention
Main purpose of the present invention is to provide a kind of micro-heater, and this micro-heater has temp monitoring function.
For reaching above-mentioned purpose, the present invention provides a kind of micro-heater with temp monitoring function, comprising: a chip; One heating plate, it is arranged on this chip, and this heating plate outer rim is formed with two conduction terminal; One first heating weld pad and one second heating weld pad, it is arranged on this outer chip of this heating plate, and this first heating weld pad and this second heating weld pad are electrically connected at this two conduction terminal of this heating plate respectively; One temperature detecting resistance, one of which end are connected in this first heating weld pad; And a radiation emitting layer, it is arranged on this chip and covers this heating plate.
The present invention provides a kind of micro-heater with temp monitoring function in addition, comprising: a chip; One heating plate, it is arranged on this chip, and this heating plate outer rim is formed with two conduction terminal; One first heating weld pad and one second heating weld pad, it is arranged on this outer chip of this heating plate, and this first heating weld pad and this second heating weld pad are electrically connected at this two conduction terminal of this heating plate respectively; One first temperature detecting resistance, one of which end are connected in this first heating weld pad; One second temperature detecting resistance, one of which end are connected in this second heating weld pad, and the resistance value of this second temperature detecting resistance is greater than the resistance value of this first temperature detecting resistance; And a radiation emitting layer, it is arranged on this chip and covers this heating plate.
The present invention has following useful effect:
The present invention is provided with temperature detecting resistance, uses to make micro-heater judge the temperature that micro-heater is present according to the electric current of the temperature detecting resistance of flowing through, and then reaches the function of monitoring temperature.
For enabling further to understand characteristic of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, but specification and accompanying drawing only are used for explaining the present invention, but not protection scope of the present invention are done any restriction.
Description of drawings
Fig. 1 has the micro-heater schematic top plan view of temp monitoring function for the present invention.
Fig. 2 has the micro-heater schematic side view of temp monitoring function for the present invention.
Symbol description
1 chip, 11 films
2 heating plates, 21 conduction terminal
22 breach, 23 paths
231 subpaths, 24 slits
25 beads, 3 first heating weld pads
31 thermometric weld pads, 4 second heating weld pads
41 thermometric weld pads, 5 first temperature detecting resistances
6 second temperature detecting resistances, 7 radiation emitting layers
8 passages
Embodiment
See also Fig. 1 and Fig. 2; It is preferred embodiment of the present invention; The present invention is a kind of micro-heater with temp monitoring function, and it comprises: a chip 1, a heating plate 2, one first heating weld pad 3, one second heating weld pad 4, one first temperature detecting resistance 5, one second temperature detecting resistance 6 and a radiation emitting layer 7.Wherein, heating plate 2, the first heating weld pad 3, second heat weld pad 4, first temperature detecting resistance 5 and second temperature detecting resistance 6 and are arranged between chip 1 and the radiation emitting layer 7.Wherein, this chip 1 forms a film 11 in centre.
This heating plate 2 is arranged on the film 11 of chip 1, and heating plate 2 outer rims are formed with two conduction terminal 21.Two ora terminalis of heating plate 2 inwardly are arranged with several breach 22 alternately, and breach 22 is strip and is parallel to each other, and make heating plate 2 form several paths that are connected 23.Those paths 23 that are connected be connected to two conduction terminal 21 with least significant end foremost.Those paths 23 respectively are formed with a slit 24, and slit 24 is strip and is parallel to breach 22, those paths 23 respectively via slit 24 to form two subpaths 231; By this, when electric current was flowed through path 23, electric current can be scattered in two subpaths 231 more uniformly.
Moreover the external form of heating plate 2 can be square, and two conduction terminal 21 are extended to form by two jiaos of institutes of heating plate 2 one sides, and the material of heating plate 2 can be platinum or polysilicon.The present invention is an example with above-mentioned shape and material, but practical application is not as limit.
This first heating weld pad 3 is arranged on the outer chip 1 of heating plate 2 with the second heating weld pad 4, and subtend ground is arranged at heating plate 2 outsides, and first heats the outer rim that inner edge that weld pad 3 and second heats weld pad 4 is parallel to heating plate 2.Form two passages 8 between the first heating weld pad 3 and the second heating weld pad 4, and this two passage 8 is communicated in the breach 22 of 2 liang of ora terminalis of heating plate respectively.The first heating weld pad 3 and the second heating weld pad 4 are connected to two conduction terminal 21 of heating plate 2; By this, make heating plate 2 can be electrically connected at the first heating weld pad 3 and the second heating weld pad 4.
Moreover the first heating weld pad 3 and the second heating weld pad 4 can be connected in an external power source, use the generation electric current.The material of the first heating weld pad 3 and the second heating weld pad 4 can be aluminium or gold, but not as limit.
First temperature detecting resistance, 5 one ends are connected in the first heating weld pad, 3, the second temperature detecting resistances, 6 one ends and are connected in the second heating weld pad 4.The resistance value of second temperature detecting resistance 6 is greater than the resistance value of first temperature detecting resistance 5, and the resistance value of first temperature detecting resistance 5 and second temperature detecting resistance 6 is definite value, and its neither meeting changes along with variations in temperature.And first temperature detecting resistance 5 and second temperature detecting resistance 6 optionally use one of them; By this, when electric current is flowed through first temperature detecting resistance 5 or second temperature detecting resistance 6, can judge the temperature value that micro-heater is present through size of current thus, and then reach the function of monitoring temperature.
Wherein, the material of this first temperature detecting resistance 5 and second temperature detecting resistance 6 is tantalum, tantalum nitride or nichrome.Moreover, can be further the material of first temperature detecting resistance 5 being defined as tantalum, the material of second temperature detecting resistance 6 is defined as tantalum nitride.And second temperature detecting resistance 6 can be the interdigitated temperature detecting resistance.The present invention is an example with above-mentioned shape and material, but practical application is not as limit.
This radiation emitting layer 7 is arranged on the chip 1, and covers whole heating plate 2, uses to reach high radiation radiation.The material of radiation emitting layer 7 can be silicon dioxide or silicon nitride, and can plate high emissivity film, but not as limit.
In addition, these heating plate 2 outer rims can further be formed with two beads 25.This first heating weld pad 3 and second heats weld pad 4, and each further has a thermometric weld pad 31,41; This two thermometrics weld pad 31,41 is connected to the other end of first temperature detecting resistance 5 and the other end of second temperature detecting resistance 6, and this two thermometrics weld pad 31,41 is arranged at intervals at two beads, 25 outsides respectively abreast.Wherein, two beads 25 are extended to form by the 2 liang of angles of heating plate with respect to conduction terminal 21.The inner edge of the first heating weld pad 3 and the second heating weld pad 4 is parallel to the side of two beads 25 respectively; By this, when heating plate 2 is heated when making bead 25 contact at the inner edge of the first heating weld pad 3 and this second heating weld pad 4, can reach the effect that stress disperses.
(characteristics of the present invention)
(1) have temp monitoring function: the present invention is provided with first temperature detecting resistance 5 and second temperature detecting resistance 6; Use and make the micro-heater can be according to the electric current of flow through first temperature detecting resistance 5 or second temperature detecting resistance 6; Judge the temperature that micro-heater is present, and then reach the function of monitoring temperature.
(2) electric current evenly flows: the present invention is formed with slit 24 in each path 23, to form two subpaths 231; By this, when electric current was flowed through path 23, electric current can be scattered in two subpaths 231 more uniformly.
(3) the radiation heating effect is preferable: radiation emitting layer 7 of the present invention is covered in heating plate 2, uses to reach high radiation emissivity.
(4) stress disperses: the inner edge of the first heating weld pad 3 of the present invention and the second heating weld pad 4 is parallel to the side of two beads 25 respectively; By this, when heating plate 2 is heated when making bead 25 contact at the inner edge of the first heating weld pad 3 and this second heating weld pad 4, can reach the effect that stress disperses.
More than disclosed content, be merely preferred embodiment of the present invention, from can not limiting protection scope of the present invention with this, the equalization of therefore doing according to protection range of the present invention changes or modifies, and still belongs to the scope that the present invention is contained.
Claims (10)
1. the micro-heater with temp monitoring function is characterized in that, comprising:
One chip;
One heating plate, it is arranged on this chip, and this heating plate outer rim is formed with two conduction terminal;
One first heating weld pad and one second heating weld pad, it is arranged on this outer chip of this heating plate, and this first heating weld pad and this second heating weld pad are electrically connected at this two conduction terminal of this heating plate respectively;
One temperature detecting resistance, one of which end are connected in this first heating weld pad; And
One radiation emitting layer, it is arranged on this chip and covers this heating plate.
2. the micro-heater with temp monitoring function as claimed in claim 1 is characterized in that, is arranged at this heating plate outside to this first heating weld pad and this second heating weld pad subtend, forms two passages between this first heating weld pad and this second heating weld pad.
3. the micro-heater with temp monitoring function as claimed in claim 1; It is characterized in that; This heating plate outer rim is formed with a bead; This first heating weld pad has a thermometric weld pad, and this thermometric weld pad is connected in the other end of this temperature detecting resistance, and this thermometric weld pad is arranged at intervals at this bead outside abreast.
4. the micro-heater with temp monitoring function as claimed in claim 1; It is characterized in that; These heating plate two ora terminalis inwardly are arranged with several breach alternately, make this heating plate form several paths that are connected, those paths that are connected be connected to this two conduction terminal with least significant end foremost.
5. the micro-heater with temp monitoring function as claimed in claim 4 is characterized in that those paths respectively are formed with a slit, those paths respectively via those slits to form two subpaths.
6. the micro-heater with temp monitoring function as claimed in claim 1 is characterized in that, this temperature detecting resistance is the interdigitated temperature detecting resistance.
7. the micro-heater with temp monitoring function as claimed in claim 1 is characterized in that, the material of this heating plate is platinum or polysilicon, and the material of this temperature detecting resistance is tantalum, tantalum nitride or nichrome.
8. the micro-heater with temp monitoring function is characterized in that, comprising:
One chip;
One heating plate, it is arranged on this chip, and this heating plate outer rim is formed with two conduction terminal;
One first heating weld pad and one second heating weld pad, it is arranged on this outer chip of this heating plate, and this first heating weld pad and this second heating weld pad are electrically connected at this two conduction terminal of this heating plate respectively;
One first temperature detecting resistance, one of which end are connected in this first heating weld pad;
One second temperature detecting resistance, one of which end are connected in this second heating weld pad, and the resistance value of this second temperature detecting resistance is greater than the resistance value of this first temperature detecting resistance; And
One radiation emitting layer, it is arranged on this chip and covers this heating plate.
9. the micro-heater with temp monitoring function as claimed in claim 8; It is characterized in that; This heating plate outer rim is formed with two beads; This first heating weld pad and this second heating weld pad respectively have a thermometric weld pad, and this two thermometrics weld pad is connected to the other end of this first temperature detecting resistance and the other end of this second temperature detecting resistance, and this two thermometrics weld pad is arranged at intervals at this two beads outside respectively abreast.
10. the micro-heater with temp monitoring function as claimed in claim 8; It is characterized in that the material of this heating plate is platinum or polysilicon, the material of this first temperature detecting resistance is a tantalum; The material of this second temperature detecting resistance is a tantalum nitride, and this second temperature detecting resistance is the interdigitated temperature detecting resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010250663 CN102378414B (en) | 2010-08-06 | 2010-08-06 | Micro-heater with temperature monitoring function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010250663 CN102378414B (en) | 2010-08-06 | 2010-08-06 | Micro-heater with temperature monitoring function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102378414A true CN102378414A (en) | 2012-03-14 |
| CN102378414B CN102378414B (en) | 2013-06-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010250663 Expired - Fee Related CN102378414B (en) | 2010-08-06 | 2010-08-06 | Micro-heater with temperature monitoring function |
Country Status (1)
| Country | Link |
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| CN (1) | CN102378414B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103954649A (en) * | 2014-04-22 | 2014-07-30 | 上海大学 | Multifunctional miniature temperature control device |
| CN112378963A (en) * | 2020-11-04 | 2021-02-19 | 北京航天微电科技有限公司 | Humidity sensor with heating and temperature measuring functions and manufacturing method thereof |
| CN112378963B (en) * | 2020-11-04 | 2024-05-07 | 北京航天微电科技有限公司 | Humidity sensor with heating and temperature measuring functions and manufacturing method thereof |
Citations (7)
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|---|---|---|---|---|
| US4900161A (en) * | 1986-12-10 | 1990-02-13 | Fissler Gmbh | System for measuring temperature of a filled vessel on a hot plate |
| CN1478644A (en) * | 2002-07-26 | 2004-03-03 | �����ɷ� | Temp sensor and heating device for hot, runner system |
| EP1641319A2 (en) * | 2004-09-24 | 2006-03-29 | EADS Deutschland GmbH | Infared radiant heater made as micromechanical |
| CN1767149A (en) * | 2004-10-28 | 2006-05-03 | 京瓷株式会社 | Heater, wafer heating apparatus and method for manufacturing heater |
| CN101294854A (en) * | 2007-04-23 | 2008-10-29 | 博奥生物有限公司 | Chip type heater element |
| TWI305550B (en) * | 2004-11-15 | 2009-01-21 | Cree Inc | Restricted radiated heating assembly for high temperature processing |
| CN101588654A (en) * | 2008-12-15 | 2009-11-25 | 贵州彩阳电暖科技有限公司 | Carbon fiber flexible electric heating device with full line safety protection and automatic temperature control |
-
2010
- 2010-08-06 CN CN 201010250663 patent/CN102378414B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4900161A (en) * | 1986-12-10 | 1990-02-13 | Fissler Gmbh | System for measuring temperature of a filled vessel on a hot plate |
| CN1478644A (en) * | 2002-07-26 | 2004-03-03 | �����ɷ� | Temp sensor and heating device for hot, runner system |
| EP1641319A2 (en) * | 2004-09-24 | 2006-03-29 | EADS Deutschland GmbH | Infared radiant heater made as micromechanical |
| CN1767149A (en) * | 2004-10-28 | 2006-05-03 | 京瓷株式会社 | Heater, wafer heating apparatus and method for manufacturing heater |
| TWI305550B (en) * | 2004-11-15 | 2009-01-21 | Cree Inc | Restricted radiated heating assembly for high temperature processing |
| CN101294854A (en) * | 2007-04-23 | 2008-10-29 | 博奥生物有限公司 | Chip type heater element |
| CN101588654A (en) * | 2008-12-15 | 2009-11-25 | 贵州彩阳电暖科技有限公司 | Carbon fiber flexible electric heating device with full line safety protection and automatic temperature control |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103954649A (en) * | 2014-04-22 | 2014-07-30 | 上海大学 | Multifunctional miniature temperature control device |
| CN112378963A (en) * | 2020-11-04 | 2021-02-19 | 北京航天微电科技有限公司 | Humidity sensor with heating and temperature measuring functions and manufacturing method thereof |
| CN112378963B (en) * | 2020-11-04 | 2024-05-07 | 北京航天微电科技有限公司 | Humidity sensor with heating and temperature measuring functions and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN102378414B (en) | 2013-06-12 |
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Granted publication date: 20130612 Termination date: 20150806 |
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