CN101294854A - Chip type heater element - Google Patents
Chip type heater element Download PDFInfo
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- CN101294854A CN101294854A CNA2007100986241A CN200710098624A CN101294854A CN 101294854 A CN101294854 A CN 101294854A CN A2007100986241 A CNA2007100986241 A CN A2007100986241A CN 200710098624 A CN200710098624 A CN 200710098624A CN 101294854 A CN101294854 A CN 101294854A
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- heating wire
- membranaceous substrate
- chip type
- electrode
- type heater
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Abstract
The invention relates to a chip type heating device, which is characterized in that the device comprises a film-like base; at least a heating cord is arranged on the film-like base; the heating cord is divided into two marginal areas and a middle coverage area surrounded by the marginal areas through a plane topological structure design; at least four electrodes are arranged on the film-like base; the two ends of the heating cord are respectively connected with one of the four electrode; two test conductors are respectively led out from the middle coverage area and from the common border position of the two marginal areas of the heating cord; and the two test conductors are respectively connected with the other two electrodes. In the heating device, the heating cord, the temperature of which needs to be tested, is enclosed in the marginal areas, thereby effectively solving the problem of measuring the cold end of the heating cord and resulting in high measurement accuracy. The heating device has a concise structure and high measurement and control accuracy, and can be widely applied to the fields requiring temperature control in small size range, such as biochemical analysis, industrial instruments, etc.
Description
Technical field
The present invention relates to a kind of heater element, particularly about a kind of simple for structure, chip type heater element that the observing and controlling precision is high.
Background technology
In every field such as biology, chemical industry, medicine, household electrical appliances, usually can run into temperature controlled problem.Temperature sensor (comprising thermistor, thermocouple, simulation silicon temperature sensor and nickel/platinum resistance formula Temperature Detector etc.) is generally adopted in traditional temperature control, and realizes the closed-loop control of temperature by circuit design.Carry out temperature controlled place if desired,, make the precision of system's temperature control not reach requirement because some restriction (as size, distance, electric field etc.) can not the serviceability temperature sensor time, can not realize that then closed loop adds heat control.
Also have a kind of temperature control equipment at thermometric link serviceability temperature sensor not, but electric bridge method is directly measured the resistance variations of resistive heater element, realize FEEDBACK CONTROL scene temperature.The bridge method measuring resistance needs three build-out resistors of additional configuration, thereby the systematic comparison complexity; Usually there is certain distance at the scene at controller and heater element place in addition, needs plug connector to be connected between controller and the heater element for this reason; The general selection of build-out resistor is placed on controller one side, away from heater element.Be subjected to the restriction of heating power, the resistance of heater element is generally smaller, and the resistance change that temperature variation causes is littler.The bridge method measuring resistance is subjected to the influence of the distributed resistance of uncertain contact resistance and lead easily, have than mistake in the occasion of this small resistance measurement, so its temperature-controlled precision and repeatability is all bad.
The four-end method measuring resistance can be avoided the influence of stray resistance to small resistance measurement effectively, as shown in Figure 1, it is a kind of capillary heaters part that adopts the four-end method measuring resistance, it comprises a glass capillary 31, be wrapped in the heating wire 32 on the kapillary 31, heating wire 32 outsides are provided with the even hot Copper Foil 33 of one deck, and the two ends of heating wire 32 are fixed on both sides capillaceous by two copper rings 34, and each copper ring 34 is drawn two wiring 35.But this structure is just respectively drawn two wiring 35 from the two ends of heating wire 32 simply, form the four-end method measuring resistance, and ignored the influence of the cold junction of heating wire 32 both sides to thermometric, so measurement result is on the low side, influences temperature controlled accuracy.
Summary of the invention
At the problems referred to above, the purpose of this invention is to provide a kind of influence that can avoid cold junction to measurement, the chip type heater element that measuring accuracy is high based on the four-end method measuring resistance.
For achieving the above object, the present invention takes following technical scheme: a kind of chip type heater element, it is characterized in that, it comprises: a membranaceous substrate, described membranaceous substrate is provided with a heating wire, heating wire is by the flat topology structural design, be divided into two marginariums and a middle active zone that is surrounded by described marginarium, described membranaceous substrate is provided with at least four electrodes, the two ends of described whole section heating wire connect a described electrode respectively, a test lead is drawn at the two ends of active zone respectively in the middle of the described heating wire, is connected on two other described electrode.
The membranaceous substrate of described electrode present position is configured to the joint that is complementary with SD card size, has nine electrodes in the described membranaceous substrate, and described heating wire and test lead are connected on wherein four electrodes.
Described membranaceous substrate and on heating wire, test lead and electrode be to be bonded in two covers that are heated the chip positive and negative, stagger in the position of the heating wire of the heating wire in described front and test lead and described reverse side and test lead connection electrode.
The heating wire of the described electrode of connection and test lead and near described membranaceous substrate thereof are provided with heat conduction and suppress the hole.
The material of described membranaceous substrate is an insulating material.
The material of described membranaceous substrate is a conductive material, is provided with insulating material between described membranaceous substrate and the heating wire.
The present invention is owing to take above technical scheme, it has the following advantages: 1, the present invention is owing to adopt a heating wire, design by topological structure, the heating wire of tested temperature is trapped among the inside of marginarium, therefore solved the problem that influences of cold junction to measuring of heating wire effectively, made measuring accuracy very accurate.2, the present invention becomes the joint that is complementary with SD card size with the membranaceous substrate design of electrode present position, therefore apparatus of the present invention can be designed to the size of standard electronic chip, and its one or both sides that are attached to chip are its heating, can also peg graft easily with the SD card cooperates, and is specially adapted to portable or deserted occasion.3, the present invention combines with radiator valve, both can also can heat by thermometric, can realize temperature control easily.Show through concrete experimental result: use the present invention, temperature-controlled precision can be up to ± 0.1 ℃.The present invention is simple for structure, observing and controlling precision height, and it can be widely used in biochemical analysis, industrial instrumentation etc. need carry out temperature controlled field in range of small.
Description of drawings
Fig. 1 is the structural representation of a kind of capillary heaters part in the prior art
Fig. 2 is the embodiment of the invention 1 structural representation
Fig. 3 is embodiment 2 structural representations that the present invention can cooperate with the SD card
Fig. 4 is the synoptic diagram of embodiment 3 structures of multilayer heater strip of the present invention
Fig. 5 is a second layer heating wire structural representation among Fig. 4
Embodiment
Below in conjunction with drawings and Examples the present invention is described in detail.
Embodiment 1:
As shown in Figure 2, the present invention includes the membranaceous substrate of forming by two layers of polyimide 1, between the two layers of polyimide of membranaceous substrate 1, a heater strip 2 is set by the flexible circuit board machining process, heater strip 2 is divided into two marginariums 3 (part shown in the fine rule among the figure through the flat topology structural design, heater strip 2 diameters do not have to change) and a middle active zone 4 that is surrounded by marginarium 3 (part shown in the heater strip thick line among the figure), two marginariums 3 are the heating zone, middle active zone 4 is heating and temperature measuring area, membranaceous substrate 1 is provided with at least four electrodes 5 that appear the end face polyimide layer, the two ends of heater strip 2 respectively connect an electrode 5a, 5d is as the interface of heating current or thermometric electric current, middle active zone 4 and two positions 6 that marginarium 3 has a common boundary at heater strip 2,7, respectively draw a test lead 8 and be connected to two other electrode 5b, on the 5c, the output terminal of sensor during as temperature survey, and then the structure of formation four-end method measuring resistance.
Embodiment 2:
As shown in Figure 3, in the present embodiment, all structure divisions and embodiment 1 are roughly the same, and main difference is that the partial design that will be connected with radiator valve becomes the SD card shape of a standard, thereby can be plugged on easily on the SD card of radiator valve.The SD card generally has nine electrodes 21, and present embodiment can only use wherein four.
Embodiment 3:
As Fig. 4, shown in Figure 5, in the present embodiment, the material of forming membranaceous substrate 1 is three strata acid imides, every is respectively arranged with a heater strip 2 between two-layer, and two-layer heater strip 2 is independent mutually on electric, draws two test leads 8 on two-layer heater strip 2 respectively.Because the SD card has only the one-sided electrical interface that has, therefore the heater strip 2 and the test lead 8 that are positioned at the second layer need pass middle polyimide layer, be electrically connected on the electrode 5 that is arranged on the ground floor, and the heater strip 2 of the second layer and test lead 8 stagger with the link position of electrode 5 and the link position of ground floor heater strip 2 and test lead 8 and electrode 5, need take 8 in nine electrodes 5 so altogether, another is standby.
In the above-described embodiments, two heater strips 2 are separate, so each root heater strip 2 can be finished function of the present invention.Because the distance of two heater strips 2 is very near, the temperature difference is very little, and therefore two kinds of combination usages can be arranged:
1, two heater strips 2 are used for heating simultaneously, only with wherein one carry out thermometric, can obtain the heating power of twice like this, programming rate is faster;
2, in two heater strips 2 one be used for heating, one is used for thermometric, this usage can reduce the design difficulty of controller interface circuit.
In the various embodiments described above, membranaceous substrate 1, heater strip 2 and electrode 5 can constitute a complete chip type heater element, and its physical dimension can determine according to the dimensional requirement that is heated chip, during use be heated chip bonding and be integral.The material that membranaceous substrate 1 is used should be the material of the distortion of can not losing efficacy in the temperature-control range, such as: the polyimide that uses in the various embodiments described above, it is not only high temperature resistant, and easy to process, can also use other insulating material.If conductive material is adopted in membranaceous substrate 1, need insulation processing between then membranaceous substrate 1 and the heating wire 2.
In the foregoing description, heating wire 2 can adopt the conductive material of any one resistance with the temperature monotone variation, such as: fine copper, fine aluminium etc., because " resistance-temperature " curve of these metal materials has the high linearity, can simplify the thermometric algorithm.If the employing nonlinear material, then the thermometric link need be revised by any interpolation algorithm of complexity.
In the various embodiments described above, being provided with several heat conduction on the lead of connection electrode 5 and in the membranaceous substrate 1 between the lead and suppressing hole 9, mainly is for isolated heating zone and extraneous heat conduction preferably.
When the present invention uses, the present invention is connected with radiator valve, controller has two kinds of mode of operations: thermometric pattern and heating mode.As shown in Figure 2, under the thermometric pattern, controller gives whole heater strip 2 logical less current by interface electrode 5a, the 5d at two ends, voltage difference in the middle of measuring then on two interface electrode 5b, the 5c, thereby the temperature of active zone 4 in the middle of the resistance of effective coverage obtains in the middle of can calculating according to Ohm law.Under heating mode, controller gives whole heater strip logical bigger electric current by interface electrode 5a, the 5d at two ends, can cause whole heater strip to heat up, and can control the intensity of heating by pulse width modulation mode.Controller enters the thermometric pattern at set intervals, and this is an extremely short process consuming time, and according to temperature that records and target temperature, controller calculates to be needed the intensity that heats next time during this period of time and entering heating mode between the thermometric.
Claims (10)
1, a kind of chip type heater element, it is characterized in that, it comprises: a membranaceous substrate, described membranaceous substrate is provided with at least one heating wire, above-mentioned heating wire is by the flat topology structural design, be divided into two marginariums and a middle active zone that is surrounded by described marginarium, described membranaceous substrate is provided with at least four electrodes, the two ends of described heating wire connect a described electrode respectively, respectively draw a test lead at the middle active zone of above-mentioned heater strip and the position of boundary, two marginariums, two described test leads are connected on two other described electrode.
2, a kind of chip type heater element as claimed in claim 1, it is characterized in that: the membranaceous substrate of described electrode present position is configured to the joint that is complementary with SD card size, and described heating wire and test lead are connected on wherein four electrodes.
3, a kind of chip type heater element as claimed in claim 1, it is characterized in that: the heating wire of described membranaceous substrate, test lead are upper and lower two-layer, and the position that shared one group of electrode that is arranged on the ground floor, the described heating wire of the second layer and test lead are connected with electrode and the link position of described heating wire of described ground floor and test lead stagger.
4, a kind of chip type heater element as claimed in claim 2, it is characterized in that: the heating wire of described membranaceous substrate, test lead are upper and lower two-layer, and the position that shared one group of electrode that is arranged on the ground floor, the described heating wire of the second layer and test lead are connected with electrode and the link position of described heating wire of described ground floor and test lead stagger.
5, as claim 1 or 2 or 3 or 4 described a kind of chip type heater elements, it is characterized in that: the heating wire of the described electrode of connection and test lead and near described membranaceous substrate thereof are provided with heat conduction and suppress the hole.
6, as claim 1 or 2 or 3 or 4 described a kind of chip type heater elements, it is characterized in that: the material of described membranaceous substrate is an insulating material.
7, a kind of chip type heater element as claimed in claim 5 is characterized in that: the material of described membranaceous substrate is an insulating material.
8, as claim 1 or 2 or 3 or 4 described a kind of chip type heater elements, it is characterized in that: the material of described membranaceous substrate is a conductive material, is provided with insulating material between described membranaceous substrate and the heating wire.
9, a kind of chip type heater element as claimed in claim 5 is characterized in that: the material of described membranaceous substrate is a conductive material, is provided with insulating material between described membranaceous substrate and the heating wire.
10, a kind of chip type heater element as claimed in claim 6 is characterized in that: the material of described membranaceous substrate is a conductive material, is provided with insulating material between described membranaceous substrate and the heating wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100986241A CN101294854B (en) | 2007-04-23 | 2007-04-23 | Chip type heater element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100986241A CN101294854B (en) | 2007-04-23 | 2007-04-23 | Chip type heater element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101294854A true CN101294854A (en) | 2008-10-29 |
| CN101294854B CN101294854B (en) | 2010-12-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100986241A Active CN101294854B (en) | 2007-04-23 | 2007-04-23 | Chip type heater element |
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| CN (1) | CN101294854B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102192921A (en) * | 2010-02-25 | 2011-09-21 | 日立化成工业株式会社 | Semiconductor chip used for evaluation, evaluation system, and repairing method thereof |
| CN102378414A (en) * | 2010-08-06 | 2012-03-14 | 友丽系统制造股份有限公司 | Micro-heater with temperature monitoring function |
| TWI421659B (en) * | 2010-07-21 | 2014-01-01 | Unimems Mfg Co Ltd | A miniature heater with temperature monitoring function |
| CN109459683A (en) * | 2018-12-26 | 2019-03-12 | 上海捷策创电子科技有限公司 | A kind of apparatus for testing chip |
| CN109561524A (en) * | 2019-01-09 | 2019-04-02 | 武汉光迅科技股份有限公司 | A kind of microheater and its packaged type |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2799996B2 (en) * | 1989-09-04 | 1998-09-21 | 内橋エステック株式会社 | Temperature sensor |
| KR100213110B1 (en) * | 1997-06-12 | 1999-08-02 | 윤종용 | Thin film heater and its manufaturing method |
| CN2712717Y (en) * | 2003-10-15 | 2005-07-27 | 周子南 | Heating plate of automobile outer mirror |
-
2007
- 2007-04-23 CN CN2007100986241A patent/CN101294854B/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102192921A (en) * | 2010-02-25 | 2011-09-21 | 日立化成工业株式会社 | Semiconductor chip used for evaluation, evaluation system, and repairing method thereof |
| CN102192921B (en) * | 2010-02-25 | 2013-12-25 | 日立化成工业株式会社 | Semiconductor chip used for evaluation, evaluation system, and repairing method thereof |
| TWI421659B (en) * | 2010-07-21 | 2014-01-01 | Unimems Mfg Co Ltd | A miniature heater with temperature monitoring function |
| CN102378414A (en) * | 2010-08-06 | 2012-03-14 | 友丽系统制造股份有限公司 | Micro-heater with temperature monitoring function |
| CN102378414B (en) * | 2010-08-06 | 2013-06-12 | 友丽系统制造股份有限公司 | Micro-heater with temperature monitoring function |
| CN109459683A (en) * | 2018-12-26 | 2019-03-12 | 上海捷策创电子科技有限公司 | A kind of apparatus for testing chip |
| CN109561524A (en) * | 2019-01-09 | 2019-04-02 | 武汉光迅科技股份有限公司 | A kind of microheater and its packaged type |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101294854B (en) | 2010-12-01 |
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Owner name: CAPITALBIO CORPORATION CO., LTD. Free format text: FORMER NAME: CAPITALBIO CORPORATION |
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| CP01 | Change in the name or title of a patent holder |
Address after: 102206 Beijing City, Changping District Life Science Park Road No. 18 Patentee after: CAPITALBIO CORPORATION Patentee after: Tsinghua University Address before: 102206 Beijing City, Changping District Life Science Park Road No. 18 Patentee before: Capitalbio Corporation Patentee before: Tsinghua University |