CN207954887U - A kind of halogen-free copper-clad plate of high-peeling strength structure - Google Patents
A kind of halogen-free copper-clad plate of high-peeling strength structure Download PDFInfo
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- CN207954887U CN207954887U CN201820339722.3U CN201820339722U CN207954887U CN 207954887 U CN207954887 U CN 207954887U CN 201820339722 U CN201820339722 U CN 201820339722U CN 207954887 U CN207954887 U CN 207954887U
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Abstract
The utility model discloses a kind of halogen-free copper-clad plates of high-peeling strength structure, including substrate, adhesive layer, copper foil layer, the upper surface of base plate is provided with adhesive surface, the substrate is internally provided with adhesive slot, the bonding trench bottom is provided with bottom surface, the adhesive slot interior side is provided with left wall, the left wall side is provided with right wall inside the adhesive slot, the adhesive slot inner upper is provided with upper wall, the adhesive slot inner lower is provided with lower wall, the adhesive surface surface is provided with adhesive layer, and copper foil layer is provided at the top of the adhesive layer.Advantageous effect is：The utility model can be such that the adhesive layer and the bond area of the substrate greatly increases, and to improve peel strength, replace, effectively reduce cost without special material filling.
Description
Technical field
The utility model is related to halogen-free copper-clad plate technical fields, and in particular to a kind of Halogen of high-peeling strength structure covers copper
Plate.
Background technology
Copper-clad plate --- -- also known as base material.Supporting material is soaked with resin, one or both sides are formed coated with copper foil through hot pressing
A kind of board-like material, referred to as copper-clad laminate.It is the basic material for being PCB, is often base material.When it gives birth to for multi-layer board
When production, core plate is also（CORE）.Copper-clad plate is the basic material of electronics industry, is mainly used for fabricating printed circuit board
(PCB), the electronic products such as television set, radio, computer, computer, mobile communication are widely used in.Copper-clad plate has last 100 years already
History, this be one with electronic information industry, especially with PCB industry synchronized development, indivisible technograph.Cover copper
The development of plate, starts from early in the twentieth century.At that time, the manufacture of copper-clad plate resin, reinforcing material and substrate, have it is gratifying into
Exhibition, such as：1909, development and application of U.S. Buckland doctor (Bakeland) to phenolic resin.1934, German Si Qilai
Gram (Schlack) has synthesized epoxy resin by bisphenol-A and epoxychloropropane.1938, U.S. Ovens is healthy and free from worry, and glass company opened
Begin production glass fibre.Nineteen thirty-nine, Anaconda companies of the U.S. have initiated makes copper foil technology with electrolysis.The above technology is opened
Hair, is all the development of copper-clad plate, has laid important foundation and has created necessary condition.Hereafter, with the invention of integrated circuit
With application, the miniaturization of electronic product, high performance have pushed copper-clad plate technology and production further development.It supplies in the market
Copper-clad plate, from base material consider, can mainly divide following a few classes：The classification of copper-clad plate, the classification of copper-clad plate, paper base plate, glass-fiber-fabric
Substrate, synthetic fiber cloth substrate, non-woven fabrics substrate, composite substrate.So-called base material refers to the reinforcing materials such as paper or glass-fiber-fabric.If
By Shape Classification, following 4 kinds are can be divided into：Copper-clad plate, barricade, Multilayer Material, specific substrate.Above-mentioned 4 kinds of plank, respectively
It is described as follows：Copper-clad plate refers to the base materials such as paper and glass-fiber-fabric, soaks with resin, bonding sheet (gummed paper and adhesive plaster) is made, viscous by several
After sheeting combination, single or double mixes copper foil, through hot-press solidifying, manufactured plate-like product.Barricade, which refers to internal layer, has screen
Cover the copper-clad plate of layer or figure circuit.As long as the circuit on processing and fabricating two sides, you can at multilayer circuit board.Also known as " band shielded layer
Copper-clad plate ".Build-up multi layer board technology is grown rapidly, and the various news baseplate material such as resin coated copper foil occurs therewith.According to
This, copper-clad plate base material also has to comply with the requirement of " unleaded " Halogen.Currently, newest IPC " unleaded " FR-4 draft standards include
Following main contents.IPC-4101/99：Resin system main body be epoxy resin, it is secondary be multifunctional modified epoxy or non-epoxy,
Fire retardant mechanism bromine/meet RoHS；Bifunctional oxygen based on IPC-4101/101 resin system main bodys, it is secondary be multifunctional modified ring
Oxygen or non-epoxy, fire retardant mechanism bromine/meet RoHS；IPC-4101/121 resin system main bodys be bifunctional oxygen, it is secondary be more officials
It can modified epoxy or non-epoxy fire retardant mechanism bromine/meet RoHS；IPC-4101/124 resin system main bodys are bifunctional oxygen, secondary
For multifunctional modified epoxy or non-epoxy, fire retardant mechanism bromine/meet RoHS；IPC-4101/126 resin system main bodys are more officials
Oxygen, modified epoxy or non-epoxy, fire retardant mechanism bromine/meet RoHS；IPC-4101/129 resin system main bodys be more official's oxygen,
Modified epoxy or non-epoxy, fire retardant mechanism bromine/meet RoHS.Its peel strength is big after existing copper-clad plate uses halogen-free material
It is big to reduce, novel alternative materials are mostly used greatly in order to improve peel strength, and cost is higher.
Invention content
The purpose of this utility model is that solve the above-mentioned problems and provides a kind of Halogen of high-peeling strength structure
Copper-clad plate.
The utility model is achieved through the following technical solutions above-mentioned purpose：
A kind of halogen-free copper-clad plate of high-peeling strength structure, including substrate, adhesive layer, copper foil layer, the upper surface of base plate
It is provided with adhesive surface, the substrate is internally provided with adhesive slot, and the bonding trench bottom is provided with bottom surface, inside the adhesive slot
Side is provided with left wall, and the separate left wall side is provided with right wall inside the adhesive slot, and the adhesive slot inner upper is set
It is equipped with upper wall, the adhesive slot inner lower is provided with lower wall, and the adhesive surface surface is provided with adhesive layer, the adhesive layer top
Portion is provided with copper foil layer.
In above structure, Halogen functional resin is uniformly applied on the adhesive surface of the substrate top, and nothing
Halogen functional resin fills the adhesive slot, at the same with the bottom surface inside the adhesive slot, the left wall, the right wall, institute
Upper wall, lower wall bonding are stated, the bond area of adhesive layer and the substrate is considerably increased, greatly improves the Halogen and cover copper
The peel strength of plate is covered the copper foil layer to the adhesive layer upper table by forming the adhesive layer after drying, standing
Face, and handled through heat pressing process and can be obtained the halogen-free copper-clad plate with high-peeling strength.
In order to further increase a kind of using effect of the halogen-free copper-clad plate of high-peeling strength structure, the adhesive surface molding
In the upper surface of base plate, the adhesive slot takes shape in inside the substrate.
In order to further increase a kind of using effect of the halogen-free copper-clad plate of high-peeling strength structure, the bottom surface takes shape in
The bonding trench bottom.
In order to further increase a kind of using effect of the halogen-free copper-clad plate of high-peeling strength structure, the left wall takes shape in
The adhesive slot interior side, the right wall take shape in inside the adhesive slot far from the left wall side.
In order to further increase a kind of using effect of the halogen-free copper-clad plate of high-peeling strength structure, the upper wall takes shape in
The adhesive slot inner upper, the lower wall take shape in the adhesive slot inner lower.
In order to further increase a kind of using effect of the halogen-free copper-clad plate of high-peeling strength structure, the adhesive surface and institute
Copper foil layer is stated to bond by the adhesive layer.
In order to further increase a kind of using effect of the halogen-free copper-clad plate of high-peeling strength structure, the adhesive layer material
For Halogen functional resin.
Advantageous effect is：The utility model can be such that the adhesive layer and the bond area of the substrate greatly increases, from
And peel strength is improved, it replaces, effectively reduces cost without special material filling.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of the halogen-free copper-clad plate of high-peeling strength structure described in the utility model；
Fig. 2 be a kind of high-peeling strength structure described in the utility model halogen-free copper-clad plate in substrate structural schematic diagram；
Fig. 3 be a kind of high-peeling strength structure described in the utility model halogen-free copper-clad plate in adhesive slot vertical view.
The reference numerals are as follows：
1, copper foil layer；2, adhesive layer；3, substrate；4, adhesive slot；5, right wall；6, upper wall；7, left wall；8, bottom surface；9, lower wall；
10, adhesive surface.
Specific implementation mode
The utility model is described in further detail below in conjunction with the accompanying drawings：
As shown in Figure 1-Figure 3, a kind of halogen-free copper-clad plate of high-peeling strength structure, including substrate 3, adhesive layer 2, copper foil layer
1,3 upper surface of substrate is provided with adhesive surface 10, and substrate 3 is internally provided with adhesive slot 4, and 4 bottom of adhesive slot is provided with bottom surface 8, glues
It closes 4 interior side of slot and is provided with left wall 7,4 inside of adhesive slot is provided with right wall 5,4 inner upper of adhesive slot far from 7 side of left wall
It is provided with upper wall 6,4 inner lower of adhesive slot is provided with lower wall 9, and 10 surface of adhesive surface is provided with adhesive layer 2,2 top of adhesive layer
It is provided with copper foil layer 1.
In above structure, Halogen functional resin is uniformly applied on the adhesive surface 10 at 3 top of substrate, and Halogen function
Resin fills adhesive slot 4, while being bonded with the bottom surface 8 inside adhesive slot 4, left wall 7, right wall 5, upper wall 6, lower wall 9, greatly increases
Adhesive layer 2 and the adhesive surface 10 of substrate 3 accumulate, and greatly improve the peel strength of the halogen-free copper-clad plate, after drying, standing
Adhesive layer 2 is formed, copper foil layer 1 is covered to 2 upper surface of adhesive layer, and can be obtained through heat pressing process processing has high stripping strong
The halogen-free copper-clad plate of degree.
In order to further increase a kind of using effect of the halogen-free copper-clad plate of high-peeling strength structure, adhesive surface 10 takes shape in
3 upper surface of substrate, adhesive slot 4 take shape in inside substrate 3, and bottom surface 8 takes shape in 4 bottom of adhesive slot, and left wall 7 takes shape in adhesive slot 4
Interior side, right wall 5 take shape in 4 inside of adhesive slot far from 7 side of left wall, and upper wall 6 takes shape in 4 inner upper of adhesive slot, lower wall 9
4 inner lower of adhesive slot is taken shape in, adhesive surface 10 is bonded with copper foil layer 1 by adhesive layer 2, and 2 material of adhesive layer is Halogen function
Resin.
The basic principles and main features and advantage of the utility model have been shown and described above.The technical staff of the industry
It should be appreciated that the present utility model is not limited to the above embodiments, the above embodiments and description only describe this
The principle of utility model, on the premise of not departing from the spirit and scope of the utility model, the utility model also has various change
And improvement, these various changes and improvements fall within the scope of the claimed invention.
Claims (7)
1. a kind of halogen-free copper-clad plate of high-peeling strength structure, it is characterised in that：Including substrate（3）, adhesive layer（2）, copper foil layer
（1）, the substrate（3）Upper surface is provided with adhesive surface（10）, the substrate（3）It is internally provided with adhesive slot（4）, the bonding
Slot（4）Bottom is provided with bottom surface（8）, the adhesive slot（4）Interior side is provided with left wall（7）, the adhesive slot（4）It is internal remote
From the left wall（7）Side is provided with right wall（5）, the adhesive slot（4）Inner upper is provided with upper wall（6）, the adhesive slot
（4）Inner lower is provided with lower wall（9）, the adhesive surface（10）Surface is provided with adhesive layer（2）, the adhesive layer（2）Top
It is provided with copper foil layer（1）.
2. a kind of halogen-free copper-clad plate of high-peeling strength structure according to claim 1, it is characterised in that：The adhesive surface
（10）Take shape in the substrate（3）Upper surface, the adhesive slot（4）Take shape in the substrate（3）It is internal.
3. a kind of halogen-free copper-clad plate of high-peeling strength structure according to claim 1, it is characterised in that：The bottom surface
（8）Take shape in the adhesive slot（4）Bottom.
4. a kind of halogen-free copper-clad plate of high-peeling strength structure according to claim 1, it is characterised in that：The left wall
（7）Take shape in the adhesive slot（4）Interior side, the right wall（5）Take shape in the adhesive slot（4）The internal separate left wall
（7）Side.
5. a kind of halogen-free copper-clad plate of high-peeling strength structure according to claim 1, it is characterised in that：The upper wall
（6）Take shape in the adhesive slot（4）Inner upper, the lower wall（9）Take shape in the adhesive slot（4）Inner lower.
6. a kind of halogen-free copper-clad plate of high-peeling strength structure according to claim 1, it is characterised in that：The adhesive surface
（10）With the copper foil layer（1）Pass through the adhesive layer（2）It bonds.
7. a kind of halogen-free copper-clad plate of high-peeling strength structure according to claim 1, it is characterised in that：The adhesive layer
（2）Material is Halogen functional resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820339722.3U CN207954887U (en) | 2018-03-13 | 2018-03-13 | A kind of halogen-free copper-clad plate of high-peeling strength structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820339722.3U CN207954887U (en) | 2018-03-13 | 2018-03-13 | A kind of halogen-free copper-clad plate of high-peeling strength structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207954887U true CN207954887U (en) | 2018-10-12 |
Family
ID=63742265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820339722.3U Active CN207954887U (en) | 2018-03-13 | 2018-03-13 | A kind of halogen-free copper-clad plate of high-peeling strength structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207954887U (en) |
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2018
- 2018-03-13 CN CN201820339722.3U patent/CN207954887U/en active Active
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