CN207925457U - A kind of semiconductor package part that more solder joints continuously weld - Google Patents

A kind of semiconductor package part that more solder joints continuously weld Download PDF

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Publication number
CN207925457U
CN207925457U CN201820301993.XU CN201820301993U CN207925457U CN 207925457 U CN207925457 U CN 207925457U CN 201820301993 U CN201820301993 U CN 201820301993U CN 207925457 U CN207925457 U CN 207925457U
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CN
China
Prior art keywords
bonding wire
lead frame
solder joint
pin
solder joints
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201820301993.XU
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Chinese (zh)
Inventor
周金成
胡魁
李习周
慕蔚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianshui Huatian Technology Co Ltd
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Tianshui Huatian Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to CN201820301993.XU priority Critical patent/CN207925457U/en
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Publication of CN207925457U publication Critical patent/CN207925457U/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Wire Bonding (AREA)

Abstract

The utility model discloses a kind of semiconductor package parts that more solder joints continuously weld, and belong to semiconductor integrated circuit package field, yielding after plant ball superposition bonding wire when solving the problems, such as that the more solder joints of semiconductor package part connect.Device includes lead frame, chip, packing colloid, lead frame and chip exterior are enclosed with packing colloid, lead frame includes chip carrier and pin, by combining material to connect between chip carrier and chip, solder joint on cake core, it is connected by the first bonding wire between solder joint, one close to pin is connected between solder joint and pin by the second bonding wire.The utility model eliminates the plant ball in traditional plant ball bonding, for welding spot size size, without particular/special requirement, is disposably continuously finished welding using a continuous bonding wire, debugging is fast, high-quality, efficient；It is continuously welded with a root bead line between multiple solder joint solder joints, bonding wire is camber line, improves product reliability；The utility model is simple in structure, easy to operate, product safety is reliable, and production efficiency is high.

Description

A kind of semiconductor package part that more solder joints continuously weld
Technical field
The utility model belongs to semiconductor integrated circuit package field, and in particular to what a kind of more solder joints continuously welded partly leads Body packaging part.
Background technology
It is interconnected between multiple solder joints in semiconductor packages chips, is important one of the wire soldering technology of semiconductor packages, it is more Solder joint interconnection technique refers to being completed inside circuit by means of the connection between multiple solder joints on bonding apparatus realization chip by bonding wire With the electrical connection of outer lead, the key method of electric loop is formed, is welded in most semiconductor integrated block chips more Point interconnection, is all connected using the mode that more root bead lines interconnect.
Connection in existing semiconductor package part chips between multiple solder joints is by the solder joint of semiconductor chip with more Bonding wire multiple stacking connects, and is all first to plant ball on solder joint, then the connection of ball point will be planted with bonding wire, after next solder joint first plants ball again Bonding wire connects, and stage by stage connects more solder joints with different sections of bonding wire, is finally connected on the pin of lead frame, finally borrows again By packing colloid cladding semiconductor chip, bonding wire and lead frame, this technique bonding wire efficiency is low, and step is complicated, and plants bulb Point easily the problems such as buttock line, scrap wire occur influences follow-up bonding wire, in bonding wire again on planting ball point, easily has skidded, bank deformation etc. Problem；It cannot ensure the quality of bonding wire and the quality of packaging part well.
The semiconductor package part of more solder joint connections on existing chip is used since same solder joint need to plant ball and superposition bonding wire First plant ball, then on planting ball point bonding wire multi-step, it is necessary to ball parameter is planted in setting, and bonding wire parameter, radian parameter burn ball ginseng The parameter setting of the different groups such as number, setting is complicated and needs to debug and optimize determination repeatedly, and process debugging phases-time is long；Also hold Easily there is a solder joint and occur the problems such as bottom stress is damaged because of multiple welding, while needing to weld with root wire bonding contact because planting ball In conjunction with, easily there is deviation in bound fraction, increase there are gap, binding force deficiency, conducting resistance, take off ball and other issues；And Soldered ball can deform in welding, it is therefore desirable to welding spot size it is big, it is no it will cause soldered ball overflow welding zone, with the non-conterminous line in side Road or solder joint short circuit, butt welding point size are distinctly claimed, and it is higher to operate level requirement to operating personnel.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor package parts that more solder joints continuously weld, to solve semiconductor Problem yielding after plant ball superposition bonding wire when the more solder joints of packaging part connect.
In order to solve problem above, technical solutions of the utility model are：
A kind of semiconductor package part that more solder joints continuously weld, including lead frame, disjunctor cake core, packing colloid, conducting wire Frame and connection type chip exterior are enclosed with packing colloid, and lead frame includes chip carrier and pin, chip carrier and disjunctor cake core it Between by combining material to connect, disjunctor cake core is equipped at least two solder joints, passes through the connection of the first bonding wire between solder joint, close to pipe One of foot is connected between solder joint and pin by the second bonding wire.
A kind of semiconductor package part that more solder joints continuously weld, including lead frame, independent cake core, packing colloid, conducting wire Frame and self chip exterior are enclosed with packing colloid, and lead frame includes chip carrier and pin, and chip carrier is equipped at least two Independent cake core, by combining material to connect between chip carrier and independent cake core, independent cake core is equipped with solder joint, between solder joint It is connected by the first bonding wire, one close to pin is connected between solder joint and pin by the second bonding wire.
Further, the first bonding wire and the second bonding wire are the continuous bonding wire of same root.
Further, the first bonding wire and the second bonding wire are camber line.
The beneficial effects of the utility model are as follows：The utility model eliminates the plant ball in traditional plant ball bonding, for Welding spot size size is disposably continuously finished welding without particular/special requirement using a continuous bonding wire, does not have to frequently adjust and join Number, therefore debug fast, due to the superposition of not no soldered ball, avoiding soldered ball can deform in welding, overflow the problems such as welding zone, weld It is high-quality, it is efficient；It is continuously welded with a root bead line between multiple solder joint solder joints, bonding wire is camber line, improves product reliability；This Utility model is simple in structure, easy to operate, product safety is reliable, and production efficiency is high, and promotion prospect is good.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram for the semiconductor package part that more solder joints continuously weld；
Fig. 2 is the structural schematic diagram for the semiconductor package part that another more solder joints continuously weld.
Reference numeral is as follows：1, chip carrier；2, pin；3, in conjunction with material；4, independent cake core；41, disjunctor cake core；5, it welds Point；61, the first bonding wire；62, the second bonding wire；7, packing colloid.
Specific implementation mode
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Embodiment 1
As shown in Figure 1, a kind of semiconductor package part that more solder joints continuously weld, including lead frame, disjunctor cake core 41, envelope Colloid 7 is filled, is enclosed with packing colloid 7 outside the lead frame and disjunctor cake core 41, lead frame includes chip carrier 1 and pin 2, By combining material 3 to connect between the chip carrier 1 and disjunctor cake core 41, the disjunctor cake core 41 is equipped at least two welderings Point 5 is connected by the first bonding wire 61 between the solder joint 5, by the between the solder joint 5 and pin 2 of the close pin 2 Two bonding wires 62 connect, and the first bonding wire 61 and the second bonding wire 62 are the continuous bonding wire of same root, the first bonding wire 61 and the second bonding wire 62 It is camber line.
When operation, bonding wire is taken to be welded on solder joint 5, after the welding for completing all solder joints as required, bonding wire end is welded Extra bonding wire is removed after the completion of pin 2, welding, does not have extra bonding wire head in entire semiconductor package part, there is no short circuits May, safety higher.
Embodiment 2
As shown in Fig. 2, a kind of semiconductor package part that more solder joints continuously weld, including lead frame, independent cake core 4, envelope Colloid 7 is filled, packing colloid 7 is enclosed with outside the lead frame and independent cake core 4, the lead frame includes chip carrier 1 and pipe Foot 2, the chip carrier 1 are equipped at least two independent cake cores 4, pass through combination between the chip carrier 1 and independent cake core 4 Material 3 connects, and the independent cake core 4 is equipped with solder joint 5, is connected by the first bonding wire 61 between the solder joint 5, described close to pipe It is connected by the second bonding wire 62 between the solder joint 5 and pin 2 of foot 2, the first bonding wire 61 and the second bonding wire 62 connect for same root Continuous bonding wire, the first bonding wire 61 and the second bonding wire 62 are camber line.
When operation, bonding wire is taken to be welded on solder joint 5, after the welding for completing all solder joints as required, bonding wire end is welded Extra bonding wire is removed after the completion of pin 2, welding, does not have extra bonding wire head in entire semiconductor package part, there is no short circuits May, safety higher.

Claims (4)

1. a kind of semiconductor package part that more solder joints continuously weld, including lead frame, disjunctor cake core（41）, packing colloid（7）, The lead frame and disjunctor cake core（41）Outside is enclosed with packing colloid（7）, it is characterised in that：The lead frame includes chip Seat（1）And pin（2）, the chip carrier（1）With disjunctor cake core（41）Between by combining material（3）Connection, the connection type Chip（41）It is equipped at least two solder joints（5）, the solder joint（5）Between pass through the first bonding wire（61）Connection, it is described close to pipe Foot（2）A solder joint（5）With pin（2）Between pass through the second bonding wire（62）Connection.
2. a kind of semiconductor package part that more solder joints continuously weld, including lead frame, independent cake core（4）, packing colloid（7）, The lead frame and independent cake core（4）Outside is enclosed with packing colloid（7）, it is characterised in that：The lead frame includes chip Seat（1）And pin（2）, the chip carrier（1）It is equipped at least two independent cake cores（4）, the chip carrier（1）With self Chip（4）Between by combining material（3）Connection, the independent cake core（4）It is equipped with solder joint（5）, the solder joint（5）Between lead to Cross the first bonding wire（61）Connection, the close pin（2）A solder joint（5）With pin（2）Between pass through the second bonding wire（62） Connection.
3. a kind of semiconductor package part that more solder joints continuously weld as claimed in claim 1 or 2, it is characterised in that：Described One bonding wire（61）With the second bonding wire（62）For the continuous bonding wire of same root.
4. a kind of semiconductor package part that more solder joints continuously weld as claimed in claim 3, it is characterised in that：First weldering Line（61）With the second bonding wire（62）It is camber line.
CN201820301993.XU 2018-03-05 2018-03-05 A kind of semiconductor package part that more solder joints continuously weld Active CN207925457U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820301993.XU CN207925457U (en) 2018-03-05 2018-03-05 A kind of semiconductor package part that more solder joints continuously weld

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820301993.XU CN207925457U (en) 2018-03-05 2018-03-05 A kind of semiconductor package part that more solder joints continuously weld

Publications (1)

Publication Number Publication Date
CN207925457U true CN207925457U (en) 2018-09-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820301993.XU Active CN207925457U (en) 2018-03-05 2018-03-05 A kind of semiconductor package part that more solder joints continuously weld

Country Status (1)

Country Link
CN (1) CN207925457U (en)

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