CN207924715U - The cement workpiece of hyperfrequency cement RFID tag and label - Google Patents
The cement workpiece of hyperfrequency cement RFID tag and label Download PDFInfo
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- CN207924715U CN207924715U CN201820042412.5U CN201820042412U CN207924715U CN 207924715 U CN207924715 U CN 207924715U CN 201820042412 U CN201820042412 U CN 201820042412U CN 207924715 U CN207924715 U CN 207924715U
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- cement
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- radio
- label
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Abstract
One side according to the present utility model discloses a kind of hyperfrequency cement RFID tag and posts the cement workpiece of the label, and the label includes：Label substrate, radio-frequency antenna, chip or module, sealing rubber column gel column, antenna dielectric protective layer and base material, wherein：Radio-frequency antenna is sintered on a side surface of label substrate；There is label substrate an accommodation space, chip or module to be located in accommodation space, the information of chip or module record cement workpiece；Radio-frequency antenna and chip or module interconnection and impedance matching；Sealing rubber column gel column protrudes from label substrate and covers and seal up chip or module and radio-frequency antenna and chip or the join domain of module；Antenna dielectric protective layer is attached to the side with radio-frequency antenna of label substrate, covers other regions in addition to sealing rubber column gel column position on label substrate；Base material is pasted onto on antenna dielectric protective layer, and a hole is carried on base material, and sealing rubber column gel column is housed inside in described hole.
Description
Technical field
The utility model is related to a kind of hyperfrequency cement RFID tag and the cement workpiece of label, belong to microwave communication
Technical field, the radio frequency identification being suitable in 840MHz~960MHz frequency ranges.
Background technology
With the development of society, various energy saving buildings and the material of environmental protection, integrated house, passive type building continue to bring out,
The prefabricated components of many cement all machine in factory.Utilize RFID (Radio Frequency
Identification) technology easily can be managed and trace to a variety of different cement workpiece, for example use RFID
The production number of label record cement workpiece, type, Fang Liang, weight, application site etc., can to cement workpiece go out storage,
The processes such as transport and installation are tracked, and the construction qualities problem such as avoid the occurrence of batch mixing, adulterate.
In the prior art, the cement that some must just be embedded in cement in cement workpiece when uncured is had been disclosed for use
RIFD labels, such as CN201120567617.3, technical solution used by the utility model essentially consist in：By RFID tag
It is wrapped in insulating film, so as to by the way that the RFID tag to be directly poured into cement brick.
Although also disclose that some in the prior art both and can be just embedded to when uncured in cement in cement workpiece and
The cement RIFD labels on the surface of cement workpiece, such as CN201220210266.5 are packed into or are pasted on after cement solidification, but
It is that its used technical solution also only uses plastic label shell, the ceramic sealings such as label shell or glass label shell not
Permeable shell is sealed the RFID tag, and the working frequency of tag circuit is 100KHz~30MHz, is not belonging to superelevation
The scope of frequency range.
Although also disclosing that mold is interior to fill epoxy resin, enclosed inside radio frequency to some shells using refining in the prior art
Card chip pours cement label made of pushing down, such as CN201620285036.3 by ultrasonic bonding combination, but it is adopted
Encapsulation technology is excessively complicated, and label own vol can be bigger, and is suitable for being imbedded in nonmetallic object, and cement is mixed
If there are many metal in solidifying soil, tag performance can be very limited.
However, since cement has stronger corrosivity to RFID tag, to being embedded in the encapsulating material requirement of internal label
Higher, in addition cement has stronger absorption to electromagnetic wave, also has many metals in cement workpiece, can even more shield electromagnetism
Wave causes the distance that label is read close, or even can not be checked to simultaneously because label is embedded in cement inside workpiece, no
Convenient for being noticeable and tracking.
It is shielded by well packaged, solution electromagnetic wave therefore, it is necessary to a kind of, the cement RFID tag being easily detected.
Utility model content
The utility model discloses a kind of hyperfrequency cement RFID tag and post the cement workpiece of the label, label quilt
It may make electromagnetic wave to be not easy to be shielded in well packaged, embedment cement workpiece, and be easy to be detected.
One side according to the present utility model discloses a kind of hyperfrequency cement RFID tag, including：Label base
Plate, radio-frequency antenna, chip or module, sealing rubber column gel column, antenna dielectric protective layer and base material, wherein：
The radio-frequency antenna is formed on a side surface of the label substrate；
There is the label substrate accommodation space, the chip or module to be located in the accommodation space, the chip
Or the information of module record cement workpiece；
The radio-frequency antenna is interconnected with the chip or module；
The sealing rubber column gel column is filled in the accommodation space and protrude from the label substrate carries the radio frequency day
One side surface of line, covers the bonding pad between the chip or module and the radio-frequency antenna and the chip or module
Join domain between the chip or module and the radio-frequency antenna and the chip or module is sealed in described close by domain
In sealing column；
The antenna dielectric protective layer is attached to the side surface that the radio-frequency antenna is carried on the label substrate,
Cover the radio-frequency antenna in other regions in addition to the sealing rubber column gel column position on the label substrate；
The base material is pasted onto the antenna dielectric protective layer and is pasted away from the side of the label substrate or the base material
Deviate from the side of the antenna dielectric protective layer in the label substrate；A hole is carried on the base material, protrudes from the mark
The sealing rubber column gel column of label substrate is housed inside in described hole.
Another aspect according to the present utility model discloses a kind of hyperfrequency cement RFID tag, including：
Label substrate, radio-frequency antenna, chip or module, sealing rubber column gel column, antenna dielectric protective layer and base material, wherein：
The radio-frequency antenna is formed in the both side surface of the label substrate；
There is the label substrate accommodation space, the accommodation space to pierce the label substrate, the chip or mould
Block is located in the accommodation space, the information of the chip or module record cement workpiece；
The radio-frequency antenna is interconnected with the chip or module；
The sealing rubber column gel column is filled in the accommodation space and protrudes from a wherein side surface for the label substrate, covers
The join domain between the chip or module and the radio-frequency antenna and the chip or module is covered, by the chip or mould
Join domain between block and the radio-frequency antenna and the chip or module is sealed in the sealing rubber column gel column；
Two antenna dielectric protective layers are attached to the both sides that the radio-frequency antenna is carried on the label substrate respectively
Surface covers the radio-frequency antenna in other regions in addition to the sealing rubber column gel column position on the label substrate；
The base material is pasted onto the described of the side surface with sealing rubber column gel column outstanding for being attached to the label substrate
On antenna dielectric protective layer；A hole is carried on the base material, the sealing rubber column gel column for protruding from the label substrate is received
In in described hole.
No matter the radio-frequency antenna is formed on a side surface of the label substrate or in both side surface, above-mentioned technology
Scheme can be combined as variant technical solution with one or more of following technical characteristics.
Other side according to the present utility model discloses a kind of hyperfrequency cement RFID tag, wherein the appearance
Receiving space pierces the label substrate, or, the accommodation space only forms pit on the label substrate.
Other side according to the present utility model discloses a kind of hyperfrequency cement RFID tag, wherein the mark
Label substrate is made of ceramics or FR4.
Other side according to the present utility model discloses a kind of hyperfrequency cement RFID tag, wherein the mark
The material of label substrate is ceramics.
Other side according to the present utility model discloses a kind of hyperfrequency cement RFID tag, wherein the mark
The shape for signing substrate is round or rectangular.
Other side according to the present utility model discloses a kind of hyperfrequency cement RFID tag, wherein the mark
The thickness for signing substrate is 0.5mm~5mm.
Other side according to the present utility model discloses a kind of hyperfrequency cement RFID tag, wherein described to penetrate
Frequency antenna is made of silver, copper, aluminium or electrically conductive ink.
Other side according to the present utility model discloses a kind of hyperfrequency cement RFID tag, wherein described close
Sealing column is epoxy glue.
Other side according to the present utility model discloses a kind of hyperfrequency cement RFID tag, wherein described close
The thickness of sealing column is 2mm~4mm.
Other side according to the present utility model discloses a kind of hyperfrequency cement RFID tag, wherein the day
Line insulating protective layer includes glass glaze, green oil.
Other side according to the present utility model discloses a kind of hyperfrequency cement RFID tag, wherein the base
Material is made of ceramics, PC or ABS plastic.
Other side according to the present utility model discloses a kind of hyperfrequency cement RFID tag, wherein the base
Material is made of ceramics.
Other side according to the present utility model discloses a kind of hyperfrequency cement RFID tag, wherein the base
The shape of material is round or rectangular.
Other side according to the present utility model discloses a kind of hyperfrequency cement RFID tag, wherein the base
The thickness of material is 2mm~5mm.
The operating frequency range of the cement label is 840MHz~960MHz.There are two types of installation sides for the cement label
Method, the first is to be directly installed on uncured cement surface, after cement solidification, is integrally formed with cement；Be for second
Cement surface in solidification process reserves the hole that an area is more bigger than the cement label, thickness is 5mm~1cm, after solidification,
The cement label is pasted onto with modes such as epoxy AB glues in the hole of cement workpiece.
Compared with the label that tradition is embedded in cement, this label good, easy retrospect, high-low temperature resistant, waterproof with radio-frequency performance
The advantages that anti-corrosion capability is strong.
Description of the drawings
Fig. 1 is the constructive embodiment schematic diagram of the utility model.
In figure：Label substrate 1, radio-frequency antenna 2, chip 3, sealing rubber column gel column 4, antenna dielectric protective layer 5, base material 6.
Specific implementation mode
Specific implementation example described herein is only used to explain the utility model, is not used to limit this practicality newly
Type.
With reference to figure 1, the hyperfrequency cement label includes label substrate 1, radio-frequency antenna 2, chip 3, sealing rubber column gel column 4, day
Line insulating protective layer 5 and base material 6.
In the present embodiment shown in Fig. 1, the label substrate 1 is made by circle, by ceramics, and the radio-frequency antenna 2 can
To be printed by silver paste, the techniques sintering such as high temperature sintering is on the label substrate 1.Have one to accommodate on the label substrate 1
Space, the accommodation space pierce the label substrate, or, the accommodation space only formed on the label substrate it is recessed
Hole.The chip 3 is located in the accommodation space, and the radio-frequency antenna 2 is interconnected with the chip 3, and the radio frequency day
Line 2 and 3 impedance matching of the chip, the chip 3 are used to record the relevant information of cement workpiece.The chip 3 is penetrated with described
There are two types of the connection types of frequency antenna 2：First, COB gold thread bonding process realizes the company of the chip 3 and the radio-frequency antenna 2
It connects；Second is that the chip 3 uses modularized encapsulation, chip module and the radio-frequency antenna are realized by techniques such as Reflow Soldering patches
2 connection.
In another embodiment of the utility model, the label substrate 1 is FR4 substrates, is carried out on the FR4 substrates
The technique of chemical copper etching realizes the radio-frequency antenna 2.
The sealing rubber column gel column 4 is covered in the join domain of the chip 3 and the radio-frequency antenna 2, the sealing rubber column gel column 4
It is made of corrosion-resistant and waterproof epoxy glue, the thickness of the sealing rubber column gel column 4 is 2mm~4mm, preferably to protect chip
3。
The antenna dielectric protective layer 5 is made of glass glaze, and the antenna dielectric protective layer 5 is by the side such as printing, being sintered
Formula is attached to the label substrate 1, in order to the radio-frequency antenna in addition to sealing rubber column gel column 4 position is covered, described in protection
Radio-frequency antenna 2 is not corroded or oxygenated.Under the premise of realizing foregoing purpose or the antenna dielectric protective layer 5 can also cover
It covers so that the antenna dielectric protective layer 5 covers other areas in addition to 4 position of the sealing rubber column gel column on the label substrate 1
Domain, as in the present embodiment, 5 carry a hole on the antenna dielectric protective layer, and the area of described hole is than the sealing
The cross-sectional area of rubber column gel column 4 is bigger, and the sealing rubber column gel column 4 can be accommodated in the inner by described hole, it is preferable that the area ratio of described hole
The big 5%-30% of cross-sectional area of the sealing rubber column gel column 4 so that the antenna dielectric protective layer 5 covers the label substrate 1
On other regions in addition to sealing rubber column gel column 4 position, protect the radio-frequency antenna 2 not to be corroded or oxygenated.
The base material 6 can carry adhesive, be secured on the antenna dielectric protective layer 5.Due to the sealing rubber column gel column
4 thickness are 2mm~4mm, therefore there are a holes on the base material 6, and the area of described hole is than the cross for sealing rubber column gel column 4
Sectional area is bigger, and the sealing rubber column gel column 4 can be contained in described hole by described hole, it is preferable that the area ratio of described hole
The big 5%-30% of cross-sectional area of the sealing rubber column gel column 4.The base material 6 can be made of plastics such as ceramics or PC, ABS, and by
Good with the stickup of cement in ceramics, the base material 6 is preferably made of ceramics, and the adhesive of 6 bands of the base material can be double
Face glue or epoxy glue.The thickness of the base material 6 is slightly larger than or equal to the thickness for sealing rubber column gel column 4 simultaneously, in the present embodiment
In, the thickness of the base material 6 is 2mm~5mm.After the base material 6 is pasted onto on the antenna dielectric protective layer 5, entire water
It does not all protrude on two surfaces of mud label.
In the present embodiment, by the way that the sealing rubber column gel column 4, the antenna dielectric protective layer 5 and the base material 6 is arranged,
Multiple protective radio-frequency antenna 2 and chip 3, selected material can realize that radio-frequency performance is good, be easy to retrospect, high-low temperature resistant, preventing again
The functions such as water anticorrosion.
In the present embodiment, the encapsulation process of the hyperfrequency cement label is：
Antenna is prepared on label substrate；
Label substrate, antenna dielectric protective layer, base material are sequentially arranged at together；
Due to label substrate, antenna dielectric protective layer, base material all band holes, a receiving space is formed, chip is put
It is welded in receiving space, and by the antenna bond pad of chip or module and antenna；
Fluid sealant is filled into accommodation space so that chip or module are fixed in accommodation space.
If only in the case where the side of label substrate 1 has radio-frequency antenna 2, the antenna dielectric protective layer 5 is only attached
It to that side surface with radio-frequency antenna 2 of the label substrate 1, then lamination order can be：Base material 6, antenna are exhausted
Edge protective layer 5, label substrate 1；Or, base material 6, label substrate 1, antenna dielectric protective layer 5.
If in the case where the both sides of label substrate 1 all have radio-frequency antenna 2, the antenna dielectric protective layer 5 adheres to
To the label substrate 1 both side surface, then lamination order successively can be：Base material 6, antenna dielectric protective layer 5, label base
Plate 1, antenna dielectric protective layer 5.
In the present embodiment, the shape of the antenna dielectric protective layer 5 and the base material 6 is round or rectangular.
In the embodiments of the present invention, the thickness of the label substrate 1 is 0.5mm~5mm.
In the embodiments of the present invention, the radio-frequency antenna 2 is made of silver, copper, aluminium or electrically conductive ink.
In the embodiments of the present invention, the antenna dielectric protective layer 5 includes green oil.
The operating frequency range of the hyperfrequency cement RFID tag is 840MHz~960MHz.
The hyperfrequency cement RFID tag can be directly installed on uncured cement surface, after cement solidification,
It is integrally formed with cement；Cement surface that can also be in the curing process reserves an area than the hyperfrequency cement RFID
The groove that the cross-sectional area of label is bigger, thickness is 5mm~1cm, it is preferable that the area of the groove is than the hyperfrequency cement
With the big 5%-30% of the cross-sectional area of RFID tag, after cement solidification, with modes such as epoxy AB glues by the hyperfrequency cement
It is pasted onto in the above-mentioned reserved groove of cement workpiece with RFID tag.
The utility model, which is based on such encapsulating structure and both above-mentioned installation methods, label, can just realize radio frequency
Performance is good, the advantages of being easy to trace.
The above is only the preferred embodiment of the present invention, and it does not limit the scope of the patent of the present invention,
Every equivalent structure transformation done using the utility model specification and accompanying drawing content, or be used in directly, indirectly other
Relevant technical field, is equally included in the patent within the scope of the utility model.
Claims (9)
1. a kind of hyperfrequency cement RFID tag, including：
Label substrate, radio-frequency antenna, chip or module, sealing rubber column gel column, antenna dielectric protective layer and base material, wherein：
The radio-frequency antenna is formed on the one or both sides surface of the label substrate；
There is the label substrate accommodation space, the chip or module to be located in the accommodation space, the chip or mould
Block records the information of cement workpiece；
The radio-frequency antenna is interconnected with the chip or module；
The sealing rubber column gel column is filled in the accommodation space and protrudes from the label substrate, cover the chip or module with
And the join domain between the radio-frequency antenna and the chip or module, by the chip or module and the radio-frequency antenna
Join domain between the chip or module is sealed in the sealing rubber column gel column；
The antenna dielectric protective layer is attached to the one or both sides table that the radio-frequency antenna is carried on the label substrate
Face covers the radio-frequency antenna in other regions in addition to the sealing rubber column gel column position on the label substrate；
The base material is pasted onto the antenna dielectric protective layer and is pasted onto institute away from the side of the label substrate or the base material
State the side that label substrate deviates from the antenna dielectric protective layer；A hole is carried on the base material, protrudes from the label base
The sealing rubber column gel column of plate is housed inside in described hole.
2. hyperfrequency cement RFID tag as described in claim 1, wherein the label substrate by ceramics or FR4 be made,
The shape of the label substrate is that the thickness of the round or rectangular and described label substrate is 0.5mm~5mm；Or, the radio frequency day
Line is made of silver, copper, aluminium or electrically conductive ink.
3. hyperfrequency cement RFID tag as described in claim 1, wherein the accommodation space pierces the label base
Plate, or, the accommodation space only forms pit on the label substrate.
4. hyperfrequency cement RFID tag as described in claim 1, wherein the sealing rubber column gel column is epoxy glue, described close
The thickness of sealing column is 2mm~4mm.
5. hyperfrequency cement RFID tag as described in claim 1, wherein the base material is by ceramics, PC or ABS plastic
It is made, the base material is the base material with adhesive, and the shape of the base material is round or rectangular, and the thickness of the base material is 2mm
~5mm.
6. hyperfrequency cement RFID tag as described in claim 1, wherein the area of described hole is than the sealing rubber column gel column
Cross-sectional area it is bigger；Or, the radio-frequency antenna and the chip or module impedance matching.
7. the hyperfrequency cement RFID tag as described in any one of claim 1-6, the quilt when cement workpiece pours cement
It is embedded to cement workpiece surface；Or, cement surface in the curing process reserves an area than the hyperfrequency cement RFID
The groove that the cross-sectional area of label is bigger, thickness is 5mm~1cm, after solidification, is used the hyperfrequency cement with epoxy AB glue
RFID tag is pasted onto in the groove of cement workpiece.
8. a kind of cement workpiece, which is characterized in that the cement workpiece surface is pasted just like described in any one of claim 1-7
Hyperfrequency cement RFID tag, the hyperfrequency cement with RFID tag by band base material be attached to uncured cement workpiece
Surface.
9. a kind of cement workpiece, which is characterized in that the cement workpiece surface is pasted just like described in any one of claim 1-6
Hyperfrequency cement RFID tag, uncured cement workpiece surface reserve an area than the hyperfrequency cement RFID
The groove that the cross-sectional area of label is bigger, thickness is 5mm~1cm, the hyperfrequency cement RFID tag pass through band base material and paste
In the groove of uncured cement workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820042412.5U CN207924715U (en) | 2018-01-11 | 2018-01-11 | The cement workpiece of hyperfrequency cement RFID tag and label |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820042412.5U CN207924715U (en) | 2018-01-11 | 2018-01-11 | The cement workpiece of hyperfrequency cement RFID tag and label |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207924715U true CN207924715U (en) | 2018-09-28 |
Family
ID=63617320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820042412.5U Active CN207924715U (en) | 2018-01-11 | 2018-01-11 | The cement workpiece of hyperfrequency cement RFID tag and label |
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| Country | Link |
|---|---|
| CN (1) | CN207924715U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112183685A (en) * | 2020-09-18 | 2021-01-05 | 中国石油天然气集团有限公司 | Rotary guide part identification method |
-
2018
- 2018-01-11 CN CN201820042412.5U patent/CN207924715U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112183685A (en) * | 2020-09-18 | 2021-01-05 | 中国石油天然气集团有限公司 | Rotary guide part identification method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190905 Address after: 610015 China (Sichuan) Free Trade Pilot Zone, Chengdu City, Sichuan Province Patentee after: Sichuan Huada Hengxin Technology Co., Ltd. Address before: Room 303-304, Block A, 112 Liangxiu Road, Shanghai Pudong New Area Free Trade Pilot Area, 201203 Patentee before: HUADA SEMICONDUCTOR CO., LTD. |
|
| TR01 | Transfer of patent right | ||
| CP03 | Change of name, title or address |
Address after: Floor 17, unit 2, building 6, 171 hele 2nd Street, Chengdu hi tech Zone, Chengdu pilot Free Trade Zone, Sichuan 610212 Patentee after: Huada Hengxin Technology Co.,Ltd. Address before: 610015 1-3 / F, block B, building 4, No. 200, Tianfu 5th Street, Chengdu hi tech Zone, China (Sichuan) pilot Free Trade Zone, Chengdu, Sichuan Patentee before: Sichuan Huada Hengxin Technology Co.,Ltd. |
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| CP03 | Change of name, title or address |