CN207896121U - The structure of High Power LED chip - Google Patents

Abstract

The utility model discloses a kind of structures of High Power LED chip, including diode ontology, diode chip for backlight unit ontology and mounting box, the diode chip for backlight unit ontology is fixedly connected on the top of mounting box inner wall, the diode ontology is fixedly connected on the upper surface of diode chip for backlight unit ontology, and diode ontology runs through and extends to the outside of mounting box, the bottom of the mounting box inner wall is fixedly connected with storage cylinder, the surface of the storage cylinder is fixed and is inlaid with heat exchange fin, the inside of the mounting box offers cavity, the inner wall uplink of storage cylinder offers intercommunicating pore, and intercommunicating pore is connected with cavity, the first conductive sheet is fixedly connected at the top of cavity inner wall.The utility model is by being arranged storage cylinder, heat exchange fin, cavity, accumulator and cooling fan, solves High Power LED when in use, since power is higher, the heat that diode chip for backlight unit generates is larger, if radiating not in time, the problem of service life of light emitting diode can be shortened.

Description

The structure of High Power LED chip

Technical field

The utility model is related to High Power LED chip cooling technical field, a kind of specially high-power light emitting two The structure of pole pipe chip.

Background technology

Light emitting diode is a kind of semiconductor electronic component that can convert electrical energy into luminous energy.This electronic component early in Occur within 1962, the feux rouges of low luminosity can only be sent out in early days, other monochromatic versions are developed later, can send out even to this day Light spread visible light, infrared ray and ultraviolet light, luminosity is also increased to comparable luminosity.And purposes is also by the beginning as instruction Lamp, display board etc.；With being constantly progressive for technology, light emitting diode has been widely used in display, television set daylighting dress Decorations and illumination.

Continue to develop with industry, the leap of technology is broken through, and application is widelyd popularize, and the light efficiency of light emitting diode also exists It is continuously improved, when in use, since power is higher, the heat that diode chip for backlight unit generates is larger, if not for High Power LED Heat dissipation in time, can shorten the service life of light emitting diode.

Utility model content

(1) the technical issues of solving

In view of the deficiencies of the prior art, the utility model provides a kind of structure of High Power LED chip, solution High Power LED determined when in use, since power is higher, the heat that diode chip for backlight unit generates is larger, if dissipating not in time Heat, the problem of service life of light emitting diode can be shortened.

(2) technical solution

To achieve the above object, the utility model provides the following technical solutions：A kind of High Power LED chip Structure, including diode ontology, diode chip for backlight unit ontology and mounting box, the diode chip for backlight unit ontology are fixedly connected on mounting box The top of inner wall, the diode ontology is fixedly connected on the upper surface of diode chip for backlight unit ontology, and diode ontology is through simultaneously The outside of mounting box is extended to, the bottom of the mounting box inner wall is fixedly connected with storage cylinder, and the surface of the storage cylinder is fixed It is inlaid with heat exchange fin, the inside of the mounting box offers cavity, and the inner wall uplink of the storage cylinder offers intercommunicating pore, and Intercommunicating pore is connected with cavity, and the first conductive sheet, the bottom of the cavity inner wall are fixedly connected at the top of the cavity inner wall It is fixedly connected with the second conductive sheet, the right side of the mounting box is fixedly connected with accumulator, and the second conductive sheet passes through conducting wire It is electrically connected with accumulator.

The right side of the mounting box, which is fixed, is inlaid with cylinder, and cavity is between accumulator and cylinder, the cylinder Inner wall on be fixedly connected with holder, the other end of the holder is fixedly connected with cooling fan, and first conductive sheet passes through Conducting wire is electrically connected with cooling fan, and the left side of the mounting box offers heat emission hole.

Preferably, the two sides of the mounting box have been fixedly connected with mounting plate, and the upper surface of the mounting plate offers Mounting hole.

Preferably, the inside of the storage cylinder is filled with liquid mercury, and the bottom of heat exchange fin extends to liquid mercury Inside.

Preferably, the quantity of the heat exchange fin is four, and four equidistant fixations of heat exchange fin are embedded in storage cylinder Surface.

Preferably, the front elevational view shape of the heat exchange fin is Y shape.

(3) advantageous effect

The utility model provides a kind of structure of High Power LED chip, has following advantageous effect：

The utility model is by being arranged storage cylinder, heat exchange fin, cavity, accumulator and cooling fan, diode chip for backlight unit sheet When body running gives out heat, the heat exchange fin absorption diode chip body heat that comes out of work simultaneously passes to storage cylinder Internal liquid mercury, the coefficient of thermal expansion and contraction of liquid mercury is larger, and electrically conductive, and liquid mercury flows through intercommunicating pore and enters cavity Inside so that accumulator is connected with the circuit of cooling fan, cooling fan work, drive air flowing, to diode chip for backlight unit Ontology radiates, and solves High Power LED when in use, since power is higher, the heat of diode chip for backlight unit generation It is larger, if radiating not in time, the problem of service life of light emitting diode can be shortened.

Description of the drawings

Fig. 1 is the utility model front elevational view；

Fig. 2 is schematic enlarged-scale view at A in the utility model Fig. 1.

In figure：1 diode ontology, 2 diode chip for backlight unit ontologies, 3 mounting boxs, 4 storage cylinders, 5 heat exchange fins, 6 cavitys, 7 connect Through-hole, 8 first conductive sheets, 9 second conductive sheets, 10 accumulators, 11 cylinders, 12 holders, 13 cooling fans, 14 heat emission holes, 15 peaces Loading board, 16 mounting holes.

Specific implementation mode

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work The every other embodiment obtained, shall fall within the protection scope of the present invention.

As shown in Figs. 1-2, the utility model provides a kind of technical solution：A kind of knot of High Power LED chip Structure, including diode ontology 1, diode chip for backlight unit ontology 2 and mounting box 3, diode chip for backlight unit ontology 2 are fixedly connected on mounting box 3 The top of inner wall, diode ontology 1 is fixedly connected on the upper surface of diode chip for backlight unit ontology 2, and diode ontology 1 runs through and prolongs The outside of mounting box 3 is extended to, the two sides of mounting box 3 have been fixedly connected with mounting plate 15, and the upper surface of mounting plate 15 offers Bolt is inserted into mounting hole 16, you can mounting box 3 is fixed, the bottom of 3 inner wall of mounting box by mounting hole 16 when mounted Portion is fixedly connected with storage cylinder 4, and the inside of storage cylinder 4 is filled with liquid mercury, and the bottom of heat exchange fin 5 extends to liquid water The inside of silver, the surface of storage cylinder 4, which is fixed, is inlaid with heat exchange fin 5, and the quantity of heat exchange fin 5 is four, and four heat exchange wings 5 equidistant fixation of piece is embedded in the surface of storage cylinder 4, and the front elevational view shape of heat exchange fin 5 is Y shape, and the heat exchange fin 5 of Y shape increases Add the contact area of heat exchange fin 5 and air, can quickly absorb heat, and passes to liquid mercury, the inside of mounting box 3 Cavity 6 is offered, the inner wall uplink of storage cylinder 4 offers intercommunicating pore 7, and intercommunicating pore 7 is connected with cavity, the top of cavity inner wall Portion is fixedly connected with the first conductive sheet 8, and the bottom of 6 inner wall of cavity is fixedly connected with the second conductive sheet 9, the right side of mounting box 3 It is fixedly connected with accumulator 10, and the second conductive sheet 9 is electrically connected by conducting wire with accumulator 10.

The right side of mounting box 3, which is fixed, is inlaid with cylinder 11, and cavity 6 is between accumulator 10 and cylinder 11, cylinder Holder 12 is fixedly connected on 11 inner wall, the other end of holder 12 is fixedly connected with cooling fan 13, and the first conductive sheet 8 passes through Conducting wire is electrically connected with cooling fan 13, and the left side of mounting box 3 offers the work of 14 cooling fan 13 of heat emission hole, drives air stream Dynamic, mounting box 3 is discharged in the hot-air in mounting box 3 from heat emission hole 14.

When the work of diode chip for backlight unit ontology 2 gives out heat, the work of 5 absorption diode chip body 2 of heat exchange fin distributes Heat out simultaneously passes to the liquid mercury inside storage cylinder 4, and the coefficient of thermal expansion and contraction of liquid mercury is larger, and electrically conductive, Liquid mercury flows through the inside that intercommunicating pore 7 enters cavity 6, and circuit is connected between the first conductive sheet 8 and 9 second conductive sheets so that Accumulator 10 is connected with the circuit of cooling fan 13, and cooling fan 13 works, and air flowing is driven, to diode chip for backlight unit ontology 2 It radiates.

It can to sum up obtain, the utility model is by being arranged storage cylinder 4, heat exchange fin 5, cavity 6, accumulator 10 and cooling fan 13, solve High Power LED when in use, since power is higher, the heat that diode chip for backlight unit generates is larger, if not The problem of radiating in time, the service life of light emitting diode can be shortened.

It should be noted that herein, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also include other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.

Claims (5)

1. a kind of structure of High Power LED chip, including diode ontology (1), diode chip for backlight unit ontology (2) and peace Mounted box (3), the diode chip for backlight unit ontology (2) are fixedly connected on the top of mounting box (3) inner wall, the diode ontology (1) It is fixedly connected on the upper surface of diode chip for backlight unit ontology (2), and diode ontology (1) runs through and extends to the outer of mounting box (3) Side, it is characterised in that：The bottom of mounting box (3) inner wall is fixedly connected with storage cylinder (4), the surface of the storage cylinder (4) Fixed to be inlaid with heat exchange fin (5), the inside of the mounting box (3) offers cavity (6), on the inner wall of the storage cylinder (4) Row offers intercommunicating pore (7), and intercommunicating pore (7) is connected with cavity, and first is fixedly connected at the top of the cavity inner wall and is led The bottom of electric piece (8), cavity (6) inner wall is fixedly connected with the second conductive sheet (9), and the right side of the mounting box (3) is solid Surely it is connected with accumulator (10), and the second conductive sheet (9) is electrically connected by conducting wire with accumulator (10)；

The right side of the mounting box (3) is fixed and is inlaid with cylinder (11), and cavity (6) is located at accumulator (10) and cylinder (11) Between, it is fixedly connected with holder (12) on the inner wall of the cylinder (11), the other end of the holder (12) is fixedly connected with scattered Air-heater (13), first conductive sheet (8) are electrically connected by conducting wire with cooling fan (13), the left side of the mounting box (3) Face offers heat emission hole (14).

2. the structure of High Power LED chip according to claim 1, it is characterised in that：The mounting box (3) Two sides be fixedly connected with mounting plate (15), the upper surface of the mounting plate (15) offers mounting hole (16).

3. the structure of High Power LED chip according to claim 1, it is characterised in that：The storage cylinder (4) Inside be filled with liquid mercury, and the bottom of heat exchange fin (5) extends to the inside of liquid mercury.

4. the structure of High Power LED chip according to claim 1, it is characterised in that：The heat exchange fin (5) quantity is four, and four equidistant fixations of heat exchange fin (5) are embedded in the surface of storage cylinder (4).

5. the structure of High Power LED chip according to claim 1, it is characterised in that：The heat exchange fin (5) front elevational view shape is Y shape.