CN207835926U - A kind of copper-clad laminate - Google Patents
A kind of copper-clad laminate Download PDFInfo
- Publication number
- CN207835926U CN207835926U CN201721404631.5U CN201721404631U CN207835926U CN 207835926 U CN207835926 U CN 207835926U CN 201721404631 U CN201721404631 U CN 201721404631U CN 207835926 U CN207835926 U CN 207835926U
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- China
- Prior art keywords
- prepreg
- copper foil
- resin
- copper
- glued membrane
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Abstract
The utility model discloses a kind of copper-clad laminate, including the prepreg of several stacked on top and the copper foil for being distributed in stacking prepreg both sides, and one layer of resin glued membrane has been installed between the copper foil and prepreg；The prepreg includes glass fabric and resin；The resin content of the prepreg is 40 50%；The thickness of the prepreg is 0.173 0.20mm；The thickness of the resin glued membrane is 80 120 μm.By installing resin glued membrane additional between copper foil and prepreg so that the copper foil surface for covering copper foil pressing plate is smooth, is estimated under microscope, and no glass fibre lines and intertwined point ensure that in the surface-pasted reliability requirement of accurate slice component.
Description
" technical field "
The utility model is related to copper-clad laminate technologies, and in particular to a kind of laminated construction of copper-clad laminate.
" background technology "
The copper-clad laminate of High Density Packaging circuit be by glass fabric for the copper-clad plate of reinforcing material based on,
Copper-clad laminate is that prepreg is made by baking drying in glass fabric dip-coating high performance polymer resin adhesive liquid,
Prepreg is superimposed, and is covered with copper foil, cures using lamination.Glass fabric is by radial direction, broadwise glass fibre
Silk is interlaced to be interwoven, even if the glass cloth surface dip-coating resin layer, surface more or less can also show glass
Filametntary lines in length and breadth and intertexture salient point, then, on the copper foil of copper-clad plate, the fiber interweaving that also will appear on microcosmic is convex
Point；And these salient points, shadow can bring about for surface mount (SMT) reliability of the accurate chip components and parts of High Density Packaging
It rings, there is certain gap or micro- stomata between the crystal face on the dress patch pin and pcb board of slice component, non-fully densely
In conjunction in this way, with the variation of electronic product use environment, the influence of humiture will directly influence electric equipment products
Stability.
" utility model content "
The utility model be intended to provide a kind of copper foil surface is smooth, be adapted to high-density installed techniques cover foil laminate.
The technical solution adopted in the utility model is as follows：A kind of copper-clad laminate, including the half of several stacked on top are solid
Change piece and be distributed in the copper foil for stacking prepreg both sides, one layer of resin glue is added between the copper foil and prepreg
Film.
In conventional glass fabric copper coated plate manufacturing process, when glass fabric dipping resin, part resin impregnated arrives
Among glass fiber bundle and between glass fiber bundle, part resin is attached to fiber cloth surface, this is attached to the resin layer on surface
Abbreviation butter layer；Can the thickness of prepreg butter layer will directly influence resin layer be completely covered by glass fiber bundle lines
With intertexture salient point；Obviously, butter layer is thicker, and it is better to cover performance.According to the thickness of glass fabric used by copper-clad plate,
And the manufacture technology of prepreg, under normal circumstances, this cream layer thickness is most thick not to be exceeded 25 μm (this thickness can not be complete
The full lines and intertexture salient point for blocking glass fabric).
So the utility model is in conventional prepreg and on the basis of copper foil coincidence process, copper foil and prepreg it
Between be further added by one layer of resin glued membrane without reinforcing material, to increase resin layer thickness between copper foil and glass fabric, reach pair
The covering purpose of glass fabric.
Further, the prepreg includes glass fabric and resin.
Further, the resin content of the prepreg is 40-50%.
Further, the resin content of the semi-solid preparation pain is 45%.
Further, the thickness of the prepreg is 0.173-0.20mm.
Further, the thickness of the prepreg is 0.185m.
Further, the thickness of the resin glued membrane is 80-120 μm.
Further, the thickness of the resin glued membrane is 100 μm.
By installing resin glued membrane additional between copper foil and prepreg so that the copper foil surface for covering copper foil pressing plate is smooth, shows
It is estimated under micro mirror, no glass fibre lines and intertwined point ensure that in the surface-pasted reliability requirement of accurate slice component.Together
When, since plate construction main body or glass fabric are reinforcing material, so the mechanical strength of plank is not by any shadow
It rings.
" description of the drawings "
The utility model will illustrate by example and with reference to the appended drawing, wherein：
Fig. 1 is the side cross-sectional view of prepreg；
Fig. 2 is the layer structure schematic diagram of existing copper-clad laminate；
Fig. 3 is the layer structure schematic diagram of the utility model copper-clad laminate；
Fig. 4 is another layer structure schematic diagram of the utility model copper-clad laminate.
" specific implementation mode "
Below in conjunction with the accompanying drawings, the utility model is described in detail.
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
As shown in Figure 1, prepreg includes glass fabric 1a and resin, by glass fabric dipping resin, part
Among resin impregnated to glass fiber bundle and between glass fiber bundle, part resin is attached to fiber cloth surface, this is attached to table
The resin layer 1b abbreviation butter layers in face.
As shown in Figure 1 and Figure 2, copper-clad laminate in the prior art includes the prepreg 1 of several stacked on top, with
And it is distributed in and stacks prepreg both sides copper foil 2.Even if due to glass fabric surface dip-coating resin layer, surface or it is more or
Few lines in length and breadth and intertexture salient point that can also show glass fiber, then, on the copper foil of copper-clad plate, also it will appear microcosmic
On fiber interweaving salient point；And these salient points, it can for the surface mount (SMT) of the accurate chip components and parts of High Density Packaging
Influence is can bring about by property.
As shown in Fig. 1, Fig. 3, Fig. 4, the copper-clad laminate in the application include the prepreg 1 of several stacked on top with
And be distributed in and stack 1 both sides copper foil 2 of prepreg, while one layer of resin glue is added between the copper foil 2 and prepreg 1
Film 3.
3 thickness of resin glued membrane is designed according to the plate thickness of technological requirement.Resin glued membrane 3 is deposited there are two types of form
One is individual resin glued membrane is as shown in Figure 3；Another kind is that resin component is applied directly on copper foil 2, forms adherency
Resin glued membrane 3 on copper foil 2, abbreviation resin coated copper foil, as shown in Figure 4.
Embodiment 1
The preparation process (the present embodiment with Fig. 3 as reference) of copper-clad laminate：
1) it is first positioned on pressing steel plate using a copper foil as lower copper foil 2a.
2) a resin glued membrane is placed on lower copper foil 2a, claims lower resin glued membrane 3a.
3) totally 7 folded with together, the thickness of prepreg 1 of glass fabric prepreg 1 for being 40% by resin content
Degree is 0.173mm.1 lamination of prepreg is positioned on lower resin glued membrane 3a.
4) a upper resin glued membrane 3b is placed on the lamination of prepreg 1.
5) upper copper foil 2b is placed on upper gummy glued membrane 3b.
6) resin glued membrane 3b is identical as the lower thickness of resin glue 3a on, is 80 μm.
7) pressing steel plate finally is placed on upper copper foil 2b, in padding compression moulding in press.
Embodiment 2
The preparation process (the present embodiment with Fig. 3 as reference) of copper-clad laminate：
1) it is first positioned on pressing steel plate using a copper foil as lower copper foil 2a.
2) a resin glued membrane is placed on lower copper foil 2a, claims lower resin glued membrane 3a.
3) totally 5 folded with together, the thickness of prepreg 1 of glass fabric prepreg 1 for being 50% by resin content
Degree is 0.20mm.1 lamination of prepreg is positioned on the 3a of lower resin glued membrane.
4) a upper resin glued membrane 3b is placed on the lamination of prepreg 1.
5) upper copper foil 2b is placed on upper gummy glued membrane 3b.
6) resin glued membrane 3b is identical as the lower thickness of resin glued membrane 3a on, is 120 μm.
7) pressing steel plate finally is placed on upper copper foil 2b, in padding compression moulding in press.
Embodiment 3
The preparation process (the present embodiment with Fig. 3 as reference) of copper-clad laminate：
1) it is first positioned on pressing steel plate using a copper foil as lower copper foil 2a.
2) a resin glued membrane is placed on lower copper foil 2a, claims lower resin glued membrane 3a.
3) totally 9 folded with together, the thickness of prepreg 1 of glass fabric prepreg 1 for being 45% by resin content
Degree is 0.185mm.1 lamination of prepreg is positioned on lower resin glued membrane 3a.
4) a upper resin glued membrane 3b is placed on the lamination of prepreg 1.
5) upper copper foil 2b is placed on upper gummy glued membrane 3b.
6) resin glued membrane 3b is identical as the lower thickness of resin glued membrane 3a on, is 100 μm.
7) pressing steel plate finally is placed on upper copper foil 2b, in padding compression moulding in press.
Above example is only fully open and unrestricted the utility model, all creation purports based on the utility model,
The replacement of equivalence techniques feature without creative work should be considered as the range of the application exposure.
Claims (6)
1. a kind of copper-clad laminate, including the prepreg of several stacked on top and it is distributed in and stacks prepreg both sides
Copper foil, it is characterised in that：One layer of resin glued membrane is added between the copper foil and prepreg.
2. copper-clad laminate as described in claim 1, it is characterised in that：The prepreg includes glass fabric and tree
Fat.
3. copper-clad laminate as claimed in claim 2, it is characterised in that：The thickness of the prepreg is 0.173-
0.20mm。
4. copper-clad laminate as claimed in claim 2, it is characterised in that：The thickness of the prepreg is 0.185mm.
5. copper-clad laminate as described in claim 1, it is characterised in that：The thickness of the resin glued membrane is 80-120 μm.
6. copper-clad laminate as claimed in claim 5, it is characterised in that：The thickness of the resin glued membrane is 100 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721404631.5U CN207835926U (en) | 2017-10-27 | 2017-10-27 | A kind of copper-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721404631.5U CN207835926U (en) | 2017-10-27 | 2017-10-27 | A kind of copper-clad laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207835926U true CN207835926U (en) | 2018-09-07 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721404631.5U Active CN207835926U (en) | 2017-10-27 | 2017-10-27 | A kind of copper-clad laminate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548279A (en) * | 2018-12-29 | 2019-03-29 | 广州兴森快捷电路科技有限公司 | Prepreg lamination design method |
-
2017
- 2017-10-27 CN CN201721404631.5U patent/CN207835926U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548279A (en) * | 2018-12-29 | 2019-03-29 | 广州兴森快捷电路科技有限公司 | Prepreg lamination design method |
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