CN207835916U - A kind of high temperature resistant circuit board - Google Patents
A kind of high temperature resistant circuit board Download PDFInfo
- Publication number
- CN207835916U CN207835916U CN201820194338.9U CN201820194338U CN207835916U CN 207835916 U CN207835916 U CN 207835916U CN 201820194338 U CN201820194338 U CN 201820194338U CN 207835916 U CN207835916 U CN 207835916U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- thermally conductive
- board body
- component
- conductive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of high temperature resistant circuit boards, including circuit board body, the upper surface of the circuit board body is fixedly installed component, the component is welded and fixed by scolding tin to be arranged in the upper surface of component, the upper surface that the upper surface of the component is fixedly installed heat dissipation resin described in heat dissipation resin by smearing is fixedly installed thermally conductive sheet, one end of the thermally conductive sheet is fixed at the upper surface of component by resin bonding of radiating, and the other end of the thermally conductive sheet is fixedly installed thermally conductive sheet fixed ring by die casting；The radiator structure of circuit board carries out optimization again, it radiates the another side that the heat that the unilateral component of circuit board generates when in use can be transmitted to circuit board, the heat dissipation area of circuit board is greatly increased when circuit board is run, it can more effectively radiate to circuit board itself, extend the service life of circuit board.
Description
Technical field
The utility model belongs to circuit board technology field, and in particular to a kind of high temperature resistant circuit board.
Background technology
The title of circuit board has：Ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board,
Pcb board, aluminum substrate, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board print (copper lithographic technique)
Circuit board etc..Circuit board makes circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance for permanent circuit are laid out lifting
It acts on.Current circuit board concentrates on a certain region because of the highly concentrated of circuit element, this region can produce when in use
Raw a large amount of heat, a large amount of heat can cause the temperature of circuit board excessively high, the excessively high electricity to inside circuit board of circuit board temperature
Resistiveization is particularly evident, and circuit board is not easy accurately to be adjusted under high temperature, and circuit board service life significantly reduces, for current
Circuit board the problem of working life obviously shortens under high temperature environment, thus it is proposed that a kind of high temperature resistant circuit board.
Utility model content
The purpose of this utility model is to provide a kind of high temperature resistant circuit boards, to solve mentioned above in the background art ask
Topic.
To achieve the above object, the utility model provides the following technical solutions：A kind of high temperature resistant circuit board, including circuit board
The upper surface of ontology, the circuit board body is fixedly installed component, and the component is welded and fixed setting by scolding tin and exists
The upper surface of component, the upper surface of the component are fixedly installed the upper table for the resin that radiates described in heat dissipation resin by smearing
Face is fixedly installed thermally conductive sheet, and one end of the thermally conductive sheet is fixed at the upper surface of component by resin bonding of radiating,
The other end of the thermally conductive sheet is fixedly installed thermally conductive sheet fixed ring by die casting, and the thermally conductive sheet fixed ring is one with thermally conductive sheet
The upper surface of body structure, the circuit board body is provided through through-hole, and the inside of the through-hole is provided through heating column,
The heating column, which is bolted, to be arranged in the upper surface of circuit board body, and the other end of the heating column runs through circuit board
The upper surface of ontology reaches the lower surface of circuit board body, and the top of the heating column, which is threadably secured, is provided with thermally conductive sheet,
The surface of the circuit board body is provided through mounting hole, and the inner surface of the mounting hole is provided through fixing bolt, institute
One end outer surface for stating fixing bolt is fixedly installed damping spring, and organism is fixedly installed in the lower section of the circuit board body,
The circuit board body is fixed at the upper surface of body, the upper surface of the damping spring and circuit board by fixing bolt
The lower surface of ontology contacts, and the lower end of the damping spring is contacted with the upper surface of body, the lower end table of the circuit board body
Face is fixedly installed thermal insulation layer, and a side surface of the thermal insulation layer is in contact with the side of circuit board body, the thermal insulation layer
Another side, which is fixedly installed, destatics layer, and described destatic is fixedly installed radiating fin below layer, the radiating fin
Quadrangle is connected by welding with the lower end top of heating column, and the side of the radiating fin is fixedly installed cooling fan, institute
The bottom end for stating cooling fan is bolted and is arranged in the upper surface of body.
Preferably, the fixed position of the heating column is that symmetric points are fixed centered on component.
Preferably, the cross sectional shape of the radiating fin is laminated structure, and the surface of the radiating fin is vertically and fixedly provided with
Cooling fin, the top of the cooling fin are not contacted with the lower surface for destaticing layer, and the rear surface of the radiating fin vacantly exists
The upper surface of body.
Preferably, the cooling fan is fixed at a side-lower of circuit board body, and the circuit board body is being shaken
It will not be in contact with cooling fan when dynamic, the height of the cooling fan is one millimeter lower than the height of circuit board body.
Preferably, the layer and one end of radiating fin of destaticing has ground connection.
Compared with prior art, the utility model has the beneficial effects that：
(1) radiator structure of circuit board carries out optimization again, the heat that the unilateral component of circuit board generates when in use
The another side that circuit board can be transmitted to is radiated, and the heat dissipation area of circuit board is greatly increased when circuit board is run,
It can more effectively radiate to circuit board itself, extend the service life of circuit board.
(2) heat can effectively be passed to thermally conductive sheet, heat by the resinous coat of the upper surface of the component of circuit board
Conductive post effectively conducts heat when circuit board is run, it is ensured that heat flows ultimately into radiating fin up, greatly
The heat dissipation area for improving circuit board.
(3) structure at circuit board back is redesigned, and the dust when air radiates in air will not be because of electrostatic
The back of circuit board is acted on and is bonded in, effectively preventing the thick and heavy dust of air causes circuit board element short-circuit.
(4) the fixed bumper post of fixation outer surface of column of circuit board can be reduced centainly in circuit board when being subjected to impact
Impact force effectively prevents circuit board component in impact impaired, improves the service life of component.
Description of the drawings
Fig. 1 is the surface structure schematic diagram of the utility model；
Fig. 2 is the side structure schematic view of the utility model；
In figure：1- components, 2- circuit board bodies, 3- fixing bolts, 4- heating columns, 5- thermally conductive sheets, 6- thermally conductive sheets are fixed
Ring, 7- damping springs, 8- heat dissipations resin, 9- thermal insulation layers, 10- destatic layer, 11- bodies, 12- radiating fins, 13- radiation airs
Machine.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- Fig. 2 is please referred to Fig.1, the utility model provides a kind of technical solution：A kind of high temperature resistant circuit board, including circuit board
The upper surface of ontology 2, circuit board body 2 is fixedly installed component 1, and component 1 is welded and fixed by scolding tin to be arranged in first device
The upper surface of part 1, the upper surface fixation that the upper surface of component 1 is fixedly installed the heat dissipation resin 8 of resin 8 that radiates by smearing are set
It is equipped with thermally conductive sheet 5, one end of thermally conductive sheet 5 is adhesively fixed by the resin 8 that radiates to be arranged in the upper surface of component 1, thermally conductive sheet 5
The other end is fixedly installed thermally conductive sheet fixed ring 6 by die casting, and thermally conductive sheet fixed ring 6 is integrated with thermally conductive sheet 5, circuit
The upper surface of plate ontology 2 is provided through through-hole, and the inside of through-hole is provided through heating column 4, and heating column 4 is bolted
It is arranged in the upper surface of circuit board body 2, and the other end of heating column 4 reaches circuit board through the upper surface of circuit board body 2
The lower surface of ontology 2, the top of heating column 4, which is threadably secured, is provided with thermally conductive sheet 5, and the surface of circuit board body 2, which is run through, to be set
It is equipped with mounting hole, the inner surface of mounting hole is provided through fixing bolt 3, and one end outer surface of fixing bolt 3 is fixedly installed
Organism 11 is fixedly installed in the lower section of damping spring 7, circuit board body 2, and circuit board body 2 is fixedly installed by fixing bolt 3
In the upper surface of body 11, the upper surface of damping spring 7 is contacted with the lower surface of circuit board body 2, the lower end of damping spring 7 with
The upper surface of body 11 contacts, and the rear surface of circuit board body 2 is fixedly installed thermal insulation layer 9, a side surface of thermal insulation layer 9 with
The side of circuit board body 2 is in contact, and the another side of thermal insulation layer 9, which is fixedly installed, destatics layer 10, destatics the lower section of layer 10
It is fixedly installed radiating fin 12, the quadrangle of radiating fin 12 is connected by welding with the lower end top of heating column 4, radiating fin
The side of piece 12 is fixedly installed cooling fan 13, and the bottom end of cooling fan 13 is bolted the upper table being arranged in body 11
Face.
In order to enable circuit board can preferably radiate, preferably extend its service life, reduces unnecessary throwing
Enter, in the present embodiment, it is preferred that the fixed position of heating column 4 is that symmetric points are fixed centered on component 1.
In order to avoid the component in the case where being subjected to impact on circuit board collides with other objects, this implementation
In example, it is preferred that the cross sectional shape of radiating fin 12 is laminated structure, and the surface of radiating fin 12 is vertically and fixedly provided with cooling fin,
The top of cooling fin is not contacted with the lower surface for destaticing layer 10, and the rear surface of radiating fin 12 is vacantly in the upper table of body 11
Face.
In order to avoid the circuit board when generating vibrations will not be mutual with other structures contact-impact, in the present embodiment,
Preferably, cooling fan 13 is fixed at a side-lower of circuit board body 2, circuit board body 2 in vibrations will not with dissipate
Air-heater 13 is in contact, and the height of cooling fan 13 is one millimeter lower than the height of circuit board body 2.
In order to ensure radiating fin and the surface for destaticing coating do not have the dust absorption of electrification, to influence electricity
The normal operation of road plate, in the present embodiment, it is preferred that there is ground connection in the one end for destaticing layer 10 and radiating fin 12.
The operation principle and process for using of the utility model：Thermally conductive sheet 5 is fixed by smearing heat dissipation resin 8 when the use
Be arranged in the upper surface of component 1, the other end of thermally conductive sheet 5 be fixed to the top of heating column 4, realize thermally conductive sheet 5 with
The heat on 12 surface of radiating fin is taken away, is removed simultaneously by the heat transfer of radiating fin 12, the when in use startup of cooling fan 13
Electrostatic layer 10 prevents dust to be sticked to the side of circuit board body 2, and when shaking, damping spring 7 can subtract to a certain extent
Few damage of the impact force to circuit board body 2, at the same the hanging type design of radiating fin 12 enable each structure mutually not
It can contact.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of high temperature resistant circuit board, including circuit board body (2), it is characterised in that：The upper surface of the circuit board body (2)
It is fixedly installed component (1), the component (1) is welded and fixed setting in the upper surface of component (1) by scolding tin, described
The upper surface of component (1) is fixedly installed the upper surface fixed setting of heat dissipation resin (8) the heat dissipation resin (8) by smearing
Have a thermally conductive sheet (5), one end of the thermally conductive sheet (5) by the resin (8) that radiates be adhesively fixed setting component (1) upper table
The other end in face, the thermally conductive sheet (5) is fixedly installed thermally conductive sheet fixed ring (6), the thermally conductive sheet fixed ring (6) by die casting
Be integrated with thermally conductive sheet (5), the upper surface of the circuit board body (2) is provided through through-hole, the through-hole it is interior
Portion is provided through heating column (4), and the heating column (4), which is bolted, to be arranged in the upper surface of circuit board body (2), and
The other end of the heating column (4) reaches the lower surface of circuit board body (2) through the upper surface of circuit board body (2), described
The top of heating column (4), which is threadably secured, is provided with thermally conductive sheet (5), and the surface of the circuit board body (2) is provided through
The inner surface of mounting hole, the mounting hole is provided through fixing bolt (3), and one end outer surface of the fixing bolt (3) is solid
Surely damping spring (7), the lower section fixed setting organism (11) of the circuit board body (2), the circuit board body are provided with
(2) upper surface of body (11), the upper surface of the damping spring (7) and circuit board are fixed at by fixing bolt (3)
The lower surface of ontology (2) contacts, and the lower end of the damping spring (7) is contacted with the upper surface of body (11), the circuit board sheet
The rear surface of body (2) is fixedly installed thermal insulation layer (9), the side of the side surface and circuit board body (2) of the thermal insulation layer (9)
Face is in contact, and the another side of the thermal insulation layer (9), which is fixedly installed, destatics layer (10), and the lower section for destaticing layer (10) is solid
Surely it is provided with radiating fin (12), the quadrangle of the radiating fin (12) is connected by welding with the lower end top of heating column (4)
It connects, the side of the radiating fin (12) is fixedly installed cooling fan (13), and the bottom end of the cooling fan (13) passes through spiral shell
Bolt is fixed at the upper surface of body (11).
2. a kind of high temperature resistant circuit board according to claim 1, it is characterised in that：The fixed position of the heating column (4)
It is that symmetric points are fixed centered on component (1).
3. a kind of high temperature resistant circuit board according to claim 1, it is characterised in that：The section shape of the radiating fin (12)
Shape is laminated structure, and the surface of the radiating fin (12) is vertically and fixedly provided with cooling fin, the top of the cooling fin with destatic
The lower surface of layer (10) does not contact, and the rear surface of the radiating fin (12) is vacantly in the upper surface of body (11).
4. a kind of high temperature resistant circuit board according to claim 1, it is characterised in that：Cooling fan (13) fixed setting
In a side-lower of circuit board body (2), the circuit board body (2) will not connect in vibrations with cooling fan (13)
It touches, the height of the cooling fan (13) is one millimeter lower than the height of circuit board body (2).
5. a kind of high temperature resistant circuit board according to claim 1, it is characterised in that：It is described to destatic layer (10) and radiating fin
There is ground connection in one end of piece (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820194338.9U CN207835916U (en) | 2018-02-05 | 2018-02-05 | A kind of high temperature resistant circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820194338.9U CN207835916U (en) | 2018-02-05 | 2018-02-05 | A kind of high temperature resistant circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207835916U true CN207835916U (en) | 2018-09-07 |
Family
ID=63396955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820194338.9U Expired - Fee Related CN207835916U (en) | 2018-02-05 | 2018-02-05 | A kind of high temperature resistant circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207835916U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116567918A (en) * | 2023-07-07 | 2023-08-08 | 深圳市领耀东方科技股份有限公司 | Miniature circuit board capable of realizing high-density wiring and preparation method thereof |
-
2018
- 2018-02-05 CN CN201820194338.9U patent/CN207835916U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116567918A (en) * | 2023-07-07 | 2023-08-08 | 深圳市领耀东方科技股份有限公司 | Miniature circuit board capable of realizing high-density wiring and preparation method thereof |
| CN116567918B (en) * | 2023-07-07 | 2024-01-26 | 深圳市领耀东方科技股份有限公司 | Miniature circuit board capable of realizing high-density wiring and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20060181852A1 (en) | Heat sink module for an electronic device | |
| US9911678B2 (en) | Substrate with integrated heat spreader | |
| CN207340280U (en) | A kind of computer heat radiation system flexible circuit board | |
| CN108990259A (en) | A kind of PCB circuit board | |
| CN207219146U (en) | Heat abstractor for heat dissipation for circuit board | |
| CN207835916U (en) | A kind of high temperature resistant circuit board | |
| CN106982544A (en) | A kind of radiator structure of high power density Switching Power Supply | |
| CN109068545A (en) | A kind of heat sinking circuit board | |
| CN208623979U (en) | A kind of double-layer circuit board and the Switching Power Supply with the double-layer circuit board | |
| CN109257870A (en) | A kind of double-layer PCB board component of perfect heat-dissipating | |
| CN206118265U (en) | Electronic equipment heat radiation structure | |
| CN206365135U (en) | A kind of high accuracy prints circuit board with diamagnetic interference structure | |
| CN208300108U (en) | A kind of accurate printed wiring board | |
| CN201426228Y (en) | Radiating structure with heat-conducting and heat-radiating printing ink | |
| CN207475973U (en) | A kind of integrated circuit board of cinema sound equipment | |
| CN207083348U (en) | A kind of radiator structure of high power density Switching Power Supply | |
| CN210247329U (en) | Large-scale radiator | |
| JP2006173243A (en) | Printed wiring board and heat dissipation structure of printed circuit board | |
| CN213280203U (en) | Copper-clad laminate with enhanced heat dissipation and optimized electric conduction | |
| CN210042687U (en) | Fan type heat radiation module | |
| CN213280205U (en) | Copper-clad laminate with high heat conduction and enhanced heat dissipation | |
| CN211959664U (en) | Heat radiation assembly of PCB (printed circuit board) | |
| CN213280206U (en) | Copper-clad laminate with improved local heat dissipation | |
| JP2014197643A (en) | Electronic control device | |
| CN108922873A (en) | A kind of radiating subassembly and mounting process for Spacecraft Electronic products C QFP device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180907 Termination date: 20220205 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |