CN116567918A - Miniature circuit board capable of realizing high-density wiring and preparation method thereof - Google Patents
Miniature circuit board capable of realizing high-density wiring and preparation method thereof Download PDFInfo
- Publication number
- CN116567918A CN116567918A CN202310827834.9A CN202310827834A CN116567918A CN 116567918 A CN116567918 A CN 116567918A CN 202310827834 A CN202310827834 A CN 202310827834A CN 116567918 A CN116567918 A CN 116567918A
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- China
- Prior art keywords
- circuit board
- miniature circuit
- fixedly connected
- heat dissipation
- main body
- Prior art date
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- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 230000017525 heat dissipation Effects 0.000 claims abstract description 56
- 239000011347 resin Substances 0.000 claims abstract description 51
- 229920005989 resin Polymers 0.000 claims abstract description 51
- 238000003466 welding Methods 0.000 claims abstract description 22
- 238000013016 damping Methods 0.000 claims abstract description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims description 10
- 230000005855 radiation Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 8
- 230000009471 action Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
- F16F15/06—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs
- F16F15/067—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs using only wound springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Aviation & Aerospace Engineering (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a miniature circuit board capable of realizing high-density wiring and a preparation method thereof, comprising a miniature circuit board main body, wherein the top side surface of the miniature circuit board main body is provided with a plurality of welding spots, the bottom side surface of the miniature circuit board main body is provided with a heat dissipation assembly, and the top side surface of the miniature circuit board is provided with a damping mechanism; the heat dissipation assembly comprises a heat conduction resin layer, a heat dissipation plate, heat dissipation fins, a fixing seat and a mounting bolt, wherein the heat conduction resin layer is fixedly adhered to the bottom side surface of the main body of the miniature circuit board, the heat dissipation plate is attached to the bottom side surface of the heat conduction resin layer, the heat dissipation fins are fixedly connected to the bottom side surface of the heat dissipation plate, the fixing seat is fixedly connected to the side surface of the heat dissipation plate, and the fixing seat is fixedly connected with the bottom side surface of the heat conduction resin layer through the mounting bolt. According to the invention, heat conduction is carried out through the heat conduction resin layer, and the heat dissipation effect of the micro circuit board main body is improved through the cooperation of the heat dissipation plate and the heat dissipation fins, so that the service life of the micro circuit board is ensured.
Description
Technical Field
The invention relates to the technical field of miniature circuit boards, in particular to a miniature circuit board capable of realizing high-density wiring and a preparation method thereof.
Background
The circuit board can be called a printed circuit board or a printed circuit board, has the characteristics of high wiring density, light weight, thin thickness and good flexibility, and the birth and development of Flexible Printed Circuit (FPC) and Printed Circuit Board (PCB) of a flexible printed circuit board and a rigid printed circuit board are promoted, so that the flexible printed circuit board and the rigid printed circuit board are combined together according to related technological requirements through the working procedures of pressing, and the formed circuit board with FPC characteristics and PCB characteristics is divided into three large classifications of a single panel, a double panel and a multi-layer circuit board according to the number of layers.
At present, in the use of circuit board, the circuit component on the miniature circuit board is fixed on the circuit board surface through the welded mode, does not need manual wiring, and current some circuit board fixed effect is not ideal, influences the welding quality of worker to the circuit board, is inconvenient for the worker to weld, reduces welding efficiency.
Disclosure of Invention
The invention aims to provide a miniature circuit board capable of realizing high-density wiring and a preparation method thereof, so as to solve the related problems in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the miniature circuit board capable of realizing high-density wiring comprises a miniature circuit board main body, wherein a plurality of welding spots are formed on the top side surface of the miniature circuit board main body, a heat dissipation assembly is arranged on the bottom side surface of the miniature circuit board main body, and a damping mechanism is arranged on the top side surface of the miniature circuit board;
the heat dissipation assembly comprises a heat conduction resin layer, a heat dissipation plate, heat dissipation fins, a fixing seat and a mounting bolt, wherein the heat conduction resin layer is fixedly adhered to the bottom side surface of the main body of the miniature circuit board, the heat dissipation plate is attached to the bottom side surface of the heat conduction resin layer, the heat dissipation fins are fixedly connected to the bottom side surface of the heat dissipation plate, the fixing seat is fixedly connected to the side surface of the heat dissipation plate, and the fixing seat is fixedly connected with the bottom side surface of the heat conduction resin layer through the mounting bolt.
Preferably, fixing seats are fixedly connected at four corner positions of the side surface of the heat dissipation plate, mounting bolts penetrate through the surface threads of the fixing seats, the tail ends of the mounting bolts are in threaded connection with the bottom side surface of the heat conduction resin layer, and a plurality of heat dissipation fins are uniformly distributed on the bottom side surface of the heat dissipation plate.
Preferably, the damping mechanism comprises an elastic column, a fixed seat, a first spring and a fixed ring, wherein the elastic column penetrates through the side surface of the main body of the miniature circuit board in a sliding mode, the surface of two opposite ends of the elastic column is fixedly connected with mounting seats, the surface of the elastic column is sleeved with the first spring, and one end of the first spring is fixedly connected with the fixed ring sleeved on the surface of the elastic column.
Preferably, the number of the elastic columns is four, the four elastic columns are positioned at four corner positions on the surface of the main body of the miniature circuit board, and the bottom ends of the elastic columns penetrate through the surface of the heat conducting resin layer in a sliding mode.
Preferably, the elastic column is sleeved with first springs on the surfaces of two opposite ends, the first springs are fixedly connected with the side surfaces of the mounting seat, the bottom ends of the first springs are fixedly connected with the corresponding side surfaces of the fixing rings, and the two fixing rings are respectively tightly attached to the attached micro circuit board main body and the heat-conducting resin layer.
Preferably, a method for manufacturing a micro wiring board capable of realizing high-density wiring, the method comprising the steps of:
1. the heat-conducting resin layer is compositely bonded on the bottom side surface of the main body of the miniature circuit board, the heat-radiating plate is bonded and placed on the bottom side surface of the heat-conducting resin layer, the mounting bolt is rotated, the tail end of the mounting bolt penetrates through the surface of the fixing seat, and the fixing seat and the heat-conducting resin are fixed through the mounting bolt, so that heat radiation is facilitated;
2. the tail end of the elastic column penetrates through the surfaces of the main body of the miniature circuit board and the heat conducting resin layer in a sliding manner, the surface of the elastic column is sleeved with a fixing ring in a sliding manner, the fixing ring is respectively attached to the side surface of the main body of the miniature circuit board and the surface of the heat conducting resin layer, the other side of the fixing ring corresponding to one end of the spring is fixedly welded, mounting seats are fixedly connected to the two opposite ends of the elastic column, the mounting seats are used for mounting and fixing the subsequent miniature circuit board, one end of the spring is fixedly connected with the attached mounting seat surface, and therefore the damping performance of mounting of the main body of the miniature circuit board is improved;
3. in the preparation of miniature circuit board main part, with the fixed centre gripping of miniature circuit board main part at welded fastening subassembly top, the installation of guarantee miniature circuit board main part is stable, improves miniature circuit board main part follow-up welding stability, the welding of miniature circuit board main part top electrical components of being convenient for, and then accomplishes miniature circuit board surface's welding operation, realizes miniature circuit board main part's preparation.
Preferably, the welded fastening assembly includes installing frame, support, electric putter, movable clamp plate, standing groove, guide bar, linear bearing, second spring, slide bar and rubber splint, four corner fixedly connected with supports in installing frame bottom surface, installing frame top inner wall fixedly connected with guide bar, installing frame outside fixedly connected with electric putter, electric putter output fixedly connected with movable clamp plate, the standing groove has been seted up to movable clamp plate top side surface, sliding connection has the slide bar in the standing groove, slide bar one end fixedly connected with second spring, slide bar other end fixedly connected with rubber splint.
Preferably, the positive side cross-section of installing frame is U type structure, installing frame top inner wall fixedly connected with two guide bars of parallel placement, guide bar surface mounting has linear bearing, linear bearing fixed connection is at the movable clamp plate side surface.
Preferably, the cross section of the rubber clamping plate is of an L-shaped structure, one side of the rubber clamping plate is attached to the side surface of the main body of the miniature circuit board, a plurality of sliding rods are uniformly and fixedly connected to the other side surface of the rubber clamping plate, and the tail ends of the sliding rods are elastically connected with the inner wall of the placing groove through second springs.
Preferably, the number of the movable clamping plates is two, the two movable clamping plates are placed in parallel, the movable clamping plates are connected to the inner wall of the bottom side of the mounting frame in a sliding mode, and the movable clamping plates and the guide rods are vertically distributed.
Compared with the prior art, the invention provides the miniature circuit board capable of realizing high-density wiring and the preparation method thereof, and the miniature circuit board has the following beneficial effects:
in the invention, in the heat dissipation use of the miniature circuit board, the heat dissipation plate is attached to the bottom side surface of the heat conduction resin layer, the mounting bolt is rotated, the tail end of the mounting bolt penetrates through the surface of the fixing seat, the fixing seat and the heat conduction resin are fixed through the mounting bolt, heat conduction is carried out through the heat conduction resin layer, the heat dissipation effect of the miniature circuit board main body is improved through the cooperation of the heat dissipation plate and the heat dissipation fins, and the service life of the miniature circuit board is ensured.
In the process of mounting and damping the miniature circuit board, the miniature circuit board body is mounted through the mounting seat, and the damping and buffering effects of the miniature circuit board body are improved under the cooperation of the springs and the elastic columns in the process of vibrating the miniature circuit board body.
In the clamping welding of the miniature circuit board, the miniature circuit board main body is placed between the rubber clamping plates, the electric push rod is started to push the fixedly connected movable clamping plates to move, the movable clamping plates move along the surface of the guide rod through the linear bearing, the movable clamping plates drive the elastically connected sliding rods to move, the fixedly connected rubber clamping plates are driven by the sliding rods to move, the clamping of the miniature circuit board main body by the rubber clamping plates is facilitated, the connection stability of the rubber clamping plates and the miniature circuit board main body is improved under the cooperation of the springs, the stable clamping of the miniature circuit board main body is ensured, and the subsequent welding stability is ensured.
Drawings
FIG. 1 is a front cross-sectional view of the present invention;
FIG. 2 is a bottom view of the present invention;
FIG. 3 is an enlarged schematic view of a portion of the invention generally shown at A in FIG. 1;
FIG. 4 is a schematic diagram of the connection of a fixed solder assembly to a micro circuit board according to the present invention;
FIG. 5 is a schematic side view of a mobile clamping plate according to the present invention;
fig. 6 is a flowchart of a method for manufacturing a micro circuit board according to the present invention.
In the figure: 1. a micro circuit board main body; 2. welding spots; 3. a heat conductive resin layer; 4. a heat dissipation plate; 5. radiating fins; 6. a fixing seat; 7. installing a bolt; 8. an elastic column; 9. a mounting base; 10. a first spring; 11. a fixing ring; 12. a mounting frame; 13. a support; 14. an electric push rod; 15. moving the clamping plate; 1501. a placement groove; 16. a guide rod; 17. a linear bearing; 18. a second spring; 19. a slide bar; 20. rubber splints.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-6, the present invention provides a technical solution: a miniature circuit board capable of realizing high-density wiring and a preparation method thereof comprise a miniature circuit board main body 1, wherein the top side surface of the miniature circuit board main body 1 is provided with a plurality of welding spots 2, the bottom side surface of the miniature circuit board main body 1 is provided with a heat dissipation component, and the top side surface of the miniature circuit board is provided with a damping mechanism;
the heat dissipation assembly comprises a heat conduction resin layer 3, a heat dissipation plate 4, heat dissipation fins 5, a fixing seat 6 and a mounting bolt 7, wherein the heat conduction resin layer 3 is fixedly adhered to the bottom side surface of the miniature circuit board main body 1, the heat dissipation plate 4 is attached to the bottom side surface of the heat conduction resin layer 3, the heat dissipation fins 5 are fixedly connected to the bottom side surface of the heat dissipation plate 4, the fixing seat 6 is fixedly connected to the side surface of the heat dissipation plate 4, and the fixing seat 6 is fixedly connected with the bottom side surface of the heat conduction resin layer 3 through the mounting bolt 7.
Further, fixing seats 6 are fixedly connected to four corner positions on the side surface of the heat dissipation plate 4, mounting bolts 7 penetrate through the surface threads of the fixing seats 6, the tail ends of the mounting bolts 7 are in threaded connection with the bottom side surface of the heat conduction resin layer 3, and a plurality of heat dissipation fins 5 are evenly distributed on the bottom side surface of the heat dissipation plate 4, so that heat dissipation effects are facilitated.
Further, the damping mechanism comprises an elastic column 8, a fixed seat 6, a first spring 10 and a fixed ring 11, wherein the elastic column 8 penetrates through the side surface of the miniature circuit board main body 1 in a sliding mode, the surface of two opposite ends of the elastic column 8 is fixedly connected with mounting seats 9, the surface of the elastic column 8 is sleeved with the first spring 10, one end of the first spring 10 is fixedly connected with the fixed ring 11 sleeved on the surface of the elastic column 8, and the damping mechanism is convenient to buffer and damp after being mounted.
Further, the number of the elastic columns 8 is four, the four elastic columns 8 are located at four corner positions on the surface of the micro circuit board main body 1, and the bottom ends of the elastic columns 8 penetrate through the surface of the heat conducting resin layer 3 in a sliding mode, so that heat is conveniently conducted out.
Further, the elastic columns 8 are sleeved with first springs 10 on the surfaces of two opposite ends, the first springs 10 are fixedly connected with the side surfaces of the mounting seats 9, the bottom ends of the first springs 10 are fixedly connected with the side surfaces of corresponding fixing rings 11, and the two fixing rings 11 are respectively and tightly attached to the attached micro circuit board main body 1 and the heat conducting resin layer 3.
Further, a method for manufacturing a miniature circuit board capable of realizing high-density wiring, the method comprising the following steps:
1. the heat-conducting resin layer 3 is compositely bonded on the bottom side surface of the miniature circuit board main body 1, the heat-radiating plate 4 is bonded and placed on the bottom side surface of the heat-conducting resin layer 3, the mounting bolt 7 is rotated, the tail end of the mounting bolt 7 penetrates through the surface of the fixing seat 6, and the fixing seat 6 and the heat-conducting resin are fixed through the mounting bolt 7, so that heat radiation is facilitated;
2. the tail end of the elastic column 8 penetrates through the surfaces of the miniature circuit board main body 1 and the heat conducting resin layer 3 in a sliding manner, the surface of the elastic column 8 is sleeved with a fixing ring 11 in a sliding manner, the fixing ring 11 is respectively attached to the side surface of the miniature circuit board main body 1 and the surface of the heat conducting resin layer 3, the other side corresponding to the fixing ring 11 is fixedly welded with one end of a spring, mounting seats 9 are fixedly connected to the two opposite ends of the elastic column 8, the mounting seats 9 are used for mounting and fixing the subsequent miniature circuit board, one end of the spring is fixedly connected with the surface of the attached mounting seat 9, and therefore the damping performance of mounting of the miniature circuit board main body 1 is improved;
3. in the preparation of miniature circuit board main part 1, with the fixed centre gripping of miniature circuit board main part 1 at welded fastening subassembly top, guarantee miniature circuit board main part 1's installation is stable, improves miniature circuit board main part 1 follow-up welding stability, the welding of miniature circuit board main part 1 top electrical component of being convenient for, and then accomplishes miniature circuit board surface's welding operation, realizes miniature circuit board main part 1's preparation.
Further, the welding fixed assembly comprises a mounting frame 12, a support 13, an electric push rod 14, a movable clamping plate 15, a placing groove 1501, a guide rod 16, a linear bearing 17, a second spring 18, a sliding rod 19 and a rubber clamping plate 20, wherein the support 13 is fixedly connected to the four corner positions of the bottom surface of the mounting frame 12, the guide rod 16 is fixedly connected to the inner wall of the top end of the mounting frame 12, the electric push rod 14 is fixedly connected to the outer side surface of the mounting frame 12, the movable clamping plate 15 is fixedly connected to the output end of the electric push rod 14, the placing groove 1501 is formed in the side surface of the top end of the movable clamping plate 15, the sliding rod 19 is connected in a sliding manner in the placing groove 1501, one end of the sliding rod 19 is fixedly connected with the second spring 18, and the other end of the sliding rod 19 is fixedly connected with the rubber clamping plate 20, so that the micro circuit board body 1 is facilitated to be fixed.
Further, the front side section of the installation frame 12 is of a U-shaped structure, two parallel-arranged guide rods 16 are fixedly connected to the inner wall of the top end of the installation frame 12, linear bearings 17 are mounted on the surfaces of the guide rods 16, and the linear bearings 17 are fixedly connected to the side surfaces of the movable clamping plates 15, so that friction is reduced.
Further, the cross section of the rubber clamping plate 20 is of an L-shaped structure, one side of the rubber clamping plate 20 is attached to the side surface of the miniature circuit board main body 1, a plurality of sliding rods 19 are uniformly and fixedly connected to the other side surface of the rubber clamping plate 20, and the tail ends of the sliding rods 19 are elastically connected with the inner wall of the placing groove 1501 through second springs 18, so that the miniature circuit board is convenient to use.
Further, the number of the movable clamping plates 15 is two, the two movable clamping plates 15 are arranged in parallel, the movable clamping plates 15 are connected to the inner wall of the bottom side of the mounting frame 12 in a sliding mode, and the movable clamping plates 15 and the guide rods 16 are vertically distributed to facilitate clamping arrangement.
In embodiment 1, as shown in fig. 1-2, in the heat dissipation use of the micro circuit board, the heat dissipation plate 4 is attached to the bottom surface of the heat conducting resin layer 3, the mounting bolt 7 is rotated, the tail end of the mounting bolt 7 penetrates through the surface of the fixing seat 6, the fixing seat 6 and the heat conducting resin are fixed through the mounting bolt 7, heat conduction is performed through the heat conducting resin layer 3, the heat dissipation effect of the micro circuit board main body 1 is improved through the cooperation of the heat dissipation plate 4 and the heat dissipation fins 5, and the service life of the micro circuit board is ensured.
Embodiment 2, as shown in fig. 1 and 3, in the process of vibration absorption during installation of the micro circuit board, in the process of installation of the micro circuit board main body 1, the micro circuit board main body 1 is installed through the installation seat 9, and in the process that the micro circuit board main body 1 is vibrated, the vibration absorption and buffering effects of the micro circuit board main body 1 are improved under the cooperation of the springs and the elastic columns 8, so that the use is convenient.
In embodiment 3, as shown in fig. 4-6, in the clamping welding of the micro circuit board, by placing the micro circuit board main body 1 between the rubber clamping plates 20, by starting the electric push rod 14, the electric push rod 14 pushes the movable clamping plate 15 which is fixedly connected to move, the movable clamping plate 15 moves along the surface of the guide rod 16 through the linear bearing 17, the movable clamping plate 15 drives the sliding rod 19 which is elastically connected to move, and the sliding rod 19 drives the rubber clamping plate 20 which is fixedly connected to move, so that the rubber clamping plate 20 clamps the micro circuit board main body 1 conveniently, and under the cooperation of the springs, the connection stability of the rubber clamping plate 20 and the micro circuit board main body 1 is improved, the stable clamping of the micro circuit board main body 1 is ensured, and the subsequent welding stability is ensured.
Working principle: before using with the device switch-on, in miniature circuit board heat dissipation use, place heating panel 4 laminating at heat conduction resin layer 3 downside surface, rotatory mounting bolt 7, mounting bolt 7 terminal runs through fixing base 6 surface, fix fixing base 6 and heat conduction resin through mounting bolt 7, heat conduction is carried out through heat conduction resin layer 3, under the cooperation of heating panel 4 and heat dissipation wing 5, improve the radiating effect of miniature circuit board main part 1, guarantee miniature circuit board's life, in miniature circuit board installation shock attenuation process, in miniature circuit board main part 1 installation, install miniature circuit board main part 1 through mount pad 9, receive the vibrations in-process at miniature circuit board main part 1, through the cooperation effect of spring and elastic column 8 under, through placing miniature circuit board main part 1 between rubber splint 20, through starting electric putter 14, electric putter 14 promotes fixed connection's movable splint 15 and removes, movable splint 15 is through linear bearing 17 along guide bar 16 surface movement, drive elastic connection's slide bar 19 through movable splint 15, through the continuous rubber splint 19 of movable connection's movable splint 19 drive rubber splint 1 through the fixed connection's of movable splint 20 effect, the continuous welded connection of miniature circuit board main part 1, the steady clamp plate 20 is convenient for the steady clamp plate, the continuous welded connection of miniature circuit board 1 is realized through the miniature circuit board's of miniature circuit board's centre gripping effect.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The electrical components are all connected with an external main controller and 220V mains supply, and the main controller can be conventional known equipment for controlling a computer and the like.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The miniature circuit board capable of realizing high-density wiring comprises a miniature circuit board main body (1), wherein a plurality of welding spots (2) are formed on the top side surface of the miniature circuit board main body (1), and the miniature circuit board is characterized in that a heat dissipation assembly is arranged on the bottom side surface of the miniature circuit board main body (1), and a damping mechanism is arranged on the top side surface of the miniature circuit board;
the heat dissipation assembly comprises a heat conduction resin layer (3), a heat dissipation plate (4), heat dissipation fins (5), a fixing seat (6) and a mounting bolt (7), wherein the heat conduction resin layer (3) is fixedly adhered to the bottom side surface of the miniature circuit board main body (1), the heat dissipation plate (4) is attached to the bottom side surface of the heat conduction resin layer (3), the heat dissipation fins (5) are fixedly connected to the bottom side surface of the heat dissipation plate (4), the fixing seat (6) is fixedly connected to the side surface of the heat dissipation plate (4), and the fixing seat (6) is fixedly connected with the bottom side surface of the heat conduction resin layer (3) through the mounting bolt (7).
2. The miniature circuit board capable of realizing high-density wiring according to claim 1, wherein: four corner positions on the side surface of the heat radiation plate (4) are fixedly connected with fixing seats (6), mounting bolts (7) penetrate through the surface threads of the fixing seats (6), the tail ends of the mounting bolts (7) are in threaded connection with the bottom side surface of the heat conduction resin layer (3), and a plurality of heat radiation fins (5) are uniformly distributed on the bottom side surface of the heat radiation plate (4).
3. The miniature circuit board capable of realizing high-density wiring according to claim 1, wherein: the damping mechanism comprises an elastic column (8), a fixed seat (6), a first spring (10) and a fixed ring (11), wherein the elastic column (8) penetrates through the side surface of the miniature circuit board main body (1) in a sliding mode, mounting seats (9) are fixedly connected to the surfaces of the two opposite ends of the elastic column (8), the first spring (10) is sleeved on the surface of the elastic column (8), and one end of the first spring (10) is fixedly connected with the fixed ring (11) sleeved on the surface of the elastic column (8).
4. A miniature circuit board capable of high-density wiring as in claim 3, wherein: the number of the elastic columns (8) is four, the four elastic columns (8) are located at four corner positions on the surface of the miniature circuit board main body (1), and the bottom ends of the elastic columns (8) penetrate through the surface of the heat conducting resin layer (3) in a sliding mode.
5. A miniature circuit board capable of high-density wiring as in claim 3, wherein: the elastic column (8) has all cup jointed first spring (10) at opposite both ends surface, first spring (10) and mount pad (9) side surface fixed connection, first spring (10) bottom and corresponding solid fixed ring (11) side surface fixed connection, two gu fixed ring (11) closely laminate with miniature circuit board main part (1) and heat conduction resin layer (3) of laminating respectively.
6. The micro wiring board capable of realizing high-density wiring according to any one of claims 1 to 5, wherein the manufacturing method of the micro wiring board capable of realizing high-density wiring comprises the steps of:
1. the heat-conducting resin layer (3) is compositely bonded on the bottom side surface of the miniature circuit board main body (1), the heat-radiating plate (4) is bonded on the bottom side surface of the heat-conducting resin layer (3), the mounting bolts (7) are rotated, the tail ends of the mounting bolts (7) penetrate through the surface of the fixing seat (6), and the fixing seat (6) and the heat-conducting resin are fixed through the mounting bolts (7), so that heat dissipation is facilitated;
2. the tail end of the elastic column (8) penetrates through the surfaces of the miniature circuit board main body (1) and the heat conducting resin layer (3) in a sliding mode, the surface of the elastic column (8) is sleeved with a fixing ring (11) in a sliding mode, the fixing ring (11) is respectively attached to the side surface of the miniature circuit board main body (1) and the surface of the heat conducting resin layer (3), the fixing ring (11) is fixedly welded with one end of a spring corresponding to the other side, mounting seats (9) are fixedly connected to the two opposite ends of the elastic column (8), the mounting seats (9) are used for mounting and fixing a follow-up miniature circuit board, one end of the spring is fixedly connected with the surface of the attached mounting seat (9), and therefore the damping performance of mounting of the miniature circuit board main body (1) is improved;
3. in the preparation of miniature circuit board main part (1), with the fixed centre gripping of miniature circuit board main part (1) at welded fastening subassembly top, guarantee the installation of miniature circuit board main part (1) is stable, improves the follow-up welding stability of miniature circuit board main part (1), the welding of miniature circuit board main part (1) top electrical component of being convenient for, and then accomplishes the welding operation on miniature circuit board surface, realizes the preparation of miniature circuit board main part (1).
7. The miniature circuit board capable of high-density wiring as recited in claim 6, wherein: the welding fixture assembly comprises a mounting frame (12), a support (13), an electric push rod (14), a movable clamping plate (15), a placing groove (1501), a guide rod (16), a linear bearing (17), a second spring (18), a sliding rod (19) and a rubber clamping plate (20), the support (13) is fixedly connected to four corner positions on the bottom surface of the mounting frame (12), the guide rod (16) is fixedly connected to the inner wall of the top end of the mounting frame (12), the electric push rod (14) is fixedly connected to the outer side surface of the mounting frame (12), the movable clamping plate (15) is fixedly connected to the output end of the electric push rod (14), the placing groove (1501) is formed in the side surface of the top end of the movable clamping plate (15), the sliding rod (19) is connected to the second spring (18) in a sliding mode, and the rubber clamping plate (20) is fixedly connected to the other end of the sliding rod (19).
8. The miniature circuit board capable of high-density wiring as recited in claim 7, wherein: the front side section of the mounting frame (12) is of a U-shaped structure, two parallel-placed guide rods (16) are fixedly connected to the inner wall of the top end of the mounting frame (12), linear bearings (17) are mounted on the surfaces of the guide rods (16), and the linear bearings (17) are fixedly connected to the side surfaces of the movable clamping plates (15).
9. The miniature circuit board capable of high-density wiring as recited in claim 7, wherein: the cross section of the rubber clamping plate (20) is of an L-shaped structure, one side of the rubber clamping plate (20) is attached to the side surface of the main body (1) of the miniature circuit board, a plurality of sliding rods (19) are uniformly and fixedly connected to the surface of the other side of the rubber clamping plate (20), and the tail ends of the sliding rods (19) are elastically connected with the inner wall of the placing groove (1501) through second springs (18).
10. The miniature circuit board capable of high-density wiring as recited in claim 7, wherein: the number of the movable clamping plates (15) is two, the two movable clamping plates (15) are placed in parallel, the movable clamping plates (15) are connected to the inner wall of the bottom side of the mounting frame (12) in a sliding mode, and the movable clamping plates (15) and the guide rods (16) are vertically distributed.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310827834.9A CN116567918B (en) | 2023-07-07 | 2023-07-07 | Miniature circuit board capable of realizing high-density wiring and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310827834.9A CN116567918B (en) | 2023-07-07 | 2023-07-07 | Miniature circuit board capable of realizing high-density wiring and preparation method thereof |
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| CN116567918B CN116567918B (en) | 2024-01-26 |
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| JPH05211257A (en) * | 1991-11-13 | 1993-08-20 | Nec Corp | Mounting method of semiconductor integrated circuit |
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| CN215698679U (en) * | 2021-07-29 | 2022-02-01 | 合肥智贤智能化科技有限公司 | PCB welding fixture |
| CN217985583U (en) * | 2022-06-16 | 2022-12-06 | 深圳仪电电子有限公司 | SMT template convenient to equipment |
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05211257A (en) * | 1991-11-13 | 1993-08-20 | Nec Corp | Mounting method of semiconductor integrated circuit |
| CN207835916U (en) * | 2018-02-05 | 2018-09-07 | 梅州市山美电子有限公司 | A kind of high temperature resistant circuit board |
| CN207835914U (en) * | 2018-02-05 | 2018-09-07 | 梅州市山美电子有限公司 | A kind of corrosion resistant type circuit board |
| CN211509454U (en) * | 2019-12-10 | 2020-09-15 | 李权云 | LED circuit board processing device |
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| CN215698679U (en) * | 2021-07-29 | 2022-02-01 | 合肥智贤智能化科技有限公司 | PCB welding fixture |
| CN217985583U (en) * | 2022-06-16 | 2022-12-06 | 深圳仪电电子有限公司 | SMT template convenient to equipment |
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| CN116567918B (en) | 2024-01-26 |
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