CN207833775U - A kind of refrigerating chip experimental provision - Google Patents
A kind of refrigerating chip experimental provision Download PDFInfo
- Publication number
- CN207833775U CN207833775U CN201721529939.2U CN201721529939U CN207833775U CN 207833775 U CN207833775 U CN 207833775U CN 201721529939 U CN201721529939 U CN 201721529939U CN 207833775 U CN207833775 U CN 207833775U
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- CN
- China
- Prior art keywords
- refrigerating chip
- experimental provision
- type semiconductor
- refrigerating
- heat source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model proposes a kind of refrigerating chip experimental provisions, including fan, conducting wire, refrigerating chip, cooling fin, heat source and pedestal, the fan is connect by the conducting wire with the refrigerating chip, the refrigerating chip is connect with the cooling fin, the heat source is set on the pedestal, the heat source is for generating heat and heat being acted on the cooling fin, good appearance, it is small, the operation principle of refrigerating chip can vivo be demonstrated, it will integrade theory with practice, and reach good experiment and teaching purpose.
Description
Technical field
The utility model belongs to teaching aid field, is related to a kind of refrigerating chip experimental provision.
Background technology
In recent years, with the fast development of science and technology, each technical barrier of semiconductor cooling device is gradually broken through, and half
Conductor refrigeration device is even more the extensive use in small household appliances, skinny device.Semiconductor refrigeration chip has small, noiseless, nothing
The advantages that polluting, reliability height, being easy to thermostatic control and data acquisition, with the optimization of semiconductor refrigerating technique and quality, heat
Photoelectric transformation efficiency is continuously improved, and especially in the case where global environmental protection realizes reinforcement, this " Environmental cold source " technology will
Military in scientific research, aviation, animal husbandry is medical, and daily life etc. has important application in fields.Today's society, semiconductor refrigerating skill
Art development at full speed, it is domestic at present also to have progressed to semiconductor refrigerating technology, have now been developed cycle cold-storing types half in double
Conductor exchanger, it constitutes an energy conversion system with semiconductor energy source component, cooling system.This exchanger can facilitate
Applied to the green product in the refrigeration products such as refrigerator, air conditioner, being substitution mechanical compression pump and chlorofluoromethane refrigerant.This
Item technology should belong to top standard at home in terms of high power semi-conductor freezes complex technique.And in semiconductor heating efficiency application
Aspect then takes the lead in opening new field.
Although semiconductor refrigerating is more and more popular, the general public of our countries, which rarely has, to be related to, how using more
It is not know where to begin, on the one hand since existing refrigerating chip experiment instrument is complicated, another aspect cost is higher to be unfavorable for pushing away
It is wide to use.
In view of the above problems, the utility model proposes the experimental provision of a demonstration refrigerating chip operation principle,
Utility model content
In view of this, the purpose of this utility model is to provide a kind of refrigerating chip experimental provisions for solving the prior art
Higher, the complicated problem of middle experimental provision cost.Heat is provided by heat source, refrigerating chip is made to generate temperature difference, to
DC current is generated, electric current passes through conducting wire so that fan rotates.
In order to achieve the above objectives, the utility model provides the following technical solutions:A kind of refrigerating chip experimental provision includes wind
Fan, conducting wire, refrigerating chip, cooling fin, heat source and pedestal, the fan are connect by the conducting wire with the refrigerating chip, institute
It states refrigerating chip to connect with the cooling fin, the heat source is set on the pedestal, and the heat source is used to generate heat and will
Heat acts on the cooling fin.
Further, the refrigerating chip includes N-type semiconductor, P-type semiconductor and DC power supply, and the N-type is partly led
Body and the P-type semiconductor are connected to by concatenated mode with the DC power supply.
Further, the N-type semiconductor and the P-type semiconductor are made of bismuth telluride.
Further, one end of the N-type semiconductor and one end of the P-type semiconductor are hot junction, the N-type semiconductor
The other end and the other end of the P-type semiconductor be cold end, the cold end connect by the conducting wire with the DC power supply.
Further, the cooling fin is aluminum alloy heat sink, electronic radiation piece, copper radiating rib or silica gel radiating fin.
Further, the pedestal is the square bodily form, and its side length is 20 centimetres.
Further, the pedestal is made of metal or plastics.
Further, the heat source is burning candle or electric candle.
Further, the refrigerating chip is semiconductor refrigeration chip, electronic refrigerating chip or TEC refrigerating chips.
Further, the fan is made of aluminium, aluminium alloy or dilval.
The beneficial effects of the utility model are:It is simple in structure, cost is relatively low, convenient for promote, play it is good teaching and
Experiment purpose.
Other advantages, target and feature of the utility model will be explained in the following description to a certain extent
It states, and to a certain extent, based on will be apparent to those skilled in the art to investigating hereafter, or
Person can be instructed from the practice of the utility model.The target of the utility model and other advantages can be said by following
Bright book is realized and is obtained.
Description of the drawings
In order to keep the purpose of this utility model, technical solution and advantage clearer, below in conjunction with attached drawing to this practicality
It is novel to be preferably described in detail, wherein:
Fig. 1 is the overall structure diagram of the utility model;
Fig. 2 is the refrigerating chip structural schematic diagram of the utility model.
Specific implementation mode
Illustrate that the embodiment of the utility model, those skilled in the art can be by this theorys below by way of specific specific example
Content disclosed by bright book understands other advantages and effect of the utility model easily.The utility model can also be by addition
Different specific implementation modes are embodied or practiced, and the various details in this specification can also be based on different viewpoints and answer
With carrying out various modifications or alterations under the spirit without departing from the utility model.It should be noted that institute in following embodiment
The diagram of offer only illustrates the basic conception of the utility model in a schematic way, in the absence of conflict, following embodiment and
Feature in embodiment can be combined with each other.
- Fig. 2 is please referred to Fig.1, the element numbers in attached drawing indicate respectively:Fan 1, conducting wire 2, refrigerating chip 3, cooling fin 4,
Heat source 5, pedestal 6, DC power supply 31, P-type semiconductor 32, N-type semiconductor 33, hot junction 34, cold end 35.
The utility model is related to a kind of 3 experimental provision of refrigerating chip include fan 1, conducting wire 2, refrigerating chip 3, cooling fin 4,
Heat source 5 and pedestal 6, the fan 1 are connect by the conducting wire 2 with the refrigerating chip 3, and the refrigerating chip 3 is dissipated with described
Backing 4 connects, and the heat source 5 is set on the pedestal 6, and the heat source 5 is for generating heat and acting on heat described
On cooling fin 4.The refrigerating chip 3 includes N-type semiconductor 33, P-type semiconductor 32 and DC power supply 31, and the N-type is partly led
Body 33 and the P-type semiconductor 32 are connected to by concatenated mode with the DC power supply 31;Further, the N-type is partly led
One end of body 33 and one end of the P-type semiconductor 32 are hot junction 34, the other end of the N-type semiconductor 33 and the p-type half
The other end of conductor 32 is cold end 35, and the cold end 35 is connect by the conducting wire 2 with the DC power supply 31.Described in use
When refrigerating chip experimental provision, heat source 5 is opened, heats cooling fin 4 so that difference variation occurs on refrigerating chip 3, specifically:
The N-type semiconductor 33 and the P-type semiconductor 32 are connected to by concatenated mode with the DC power supply 31, and with it is described
The junction of N-type semiconductor 33 and the P-type semiconductor 32 will produce the transfer of the temperature difference and heat, therefore cold end 35 and hot junction 34
Between generate the temperature difference and generate voltage difference, and then the voltage difference drives the electric fan 1 to move, and reaches experiment and teaching purpose.
Specifically, the refrigerating chip 3 is semiconductor refrigeration chip, electronic refrigerating chip or TEC refrigerating chips;The N
Type semiconductor 33 and the P-type semiconductor 32 are made of bismuth telluride;The cooling fin 4 is aluminum alloy heat sink 4, electronic radiation piece
4, copper radiating rib 4 or silica gel radiating fin 4.
Preferably, the pedestal 6 is the square bodily form, and its side length is 20 centimetres;The pedestal 6 is by metal or plastics system
At;The heat source 5 is burning candle or electric candle;Further, the fan 1 is by aluminium, aluminium alloy or dilval
It is made.
Finally illustrate, above example is merely intended for describing the technical solutions of the present application, but not for limiting the present application, although ginseng
The utility model is described in detail according to preferred embodiment, it will be understood by those of ordinary skill in the art that, it can be to this
The technical solution of utility model is modified or replaced equivalently, should all without departing from the objective and range of the technical program
Cover in the right of the utility model.
Claims (10)
1. a kind of refrigerating chip experimental provision, which is characterized in that including fan, conducting wire, refrigerating chip, cooling fin, heat source and bottom
Seat, the fan are connect by the conducting wire with the refrigerating chip, and the refrigerating chip is connect with the cooling fin, the heat
Source is set on the pedestal, and the heat source is for generating heat and heat being acted on the cooling fin.
2. refrigerating chip experimental provision as described in claim 1, it is characterised in that:The refrigerating chip includes that N-type is partly led
Body, P-type semiconductor and DC power supply, the N-type semiconductor and the P-type semiconductor pass through concatenated mode and the direct current
Power supply is connected to.
3. refrigerating chip experimental provision as described in claim 2, it is characterised in that:The N-type semiconductor and the p-type half
Conductor is made of bismuth telluride.
4. refrigerating chip experimental provision as described in claim 3, it is characterised in that:One end of the N-type semiconductor and institute
One end of P-type semiconductor is stated as hot junction, the other end of the other end of the N-type semiconductor and the P-type semiconductor is cold end, institute
Cold end is stated to connect with the DC power supply by the conducting wire.
5. refrigerating chip experimental provision as described in claim 1, it is characterised in that:The cooling fin radiates for aluminium alloy
Piece, electronic radiation piece, copper radiating rib or silica gel radiating fin.
6. refrigerating chip experimental provision as described in claim 1, it is characterised in that:The pedestal is the square bodily form, side
A length of 20 centimetres.
7. refrigerating chip experimental provision as described in claim 6, it is characterised in that:The pedestal is by metal or plastics system
At.
8. refrigerating chip experimental provision as described in claim 1, it is characterised in that:The heat source is burning candle or electricity
Sub- candle.
9. refrigerating chip experimental provision as described in claim 1, it is characterised in that:The refrigerating chip is semiconductor refrigerating
Chip, electronic refrigerating chip or TEC refrigerating chips.
10. refrigerating chip experimental provision as described in claim 1, it is characterised in that:The fan by aluminium, aluminium alloy or
Dilval is made.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721529939.2U CN207833775U (en) | 2017-11-14 | 2017-11-14 | A kind of refrigerating chip experimental provision |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721529939.2U CN207833775U (en) | 2017-11-14 | 2017-11-14 | A kind of refrigerating chip experimental provision |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207833775U true CN207833775U (en) | 2018-09-07 |
Family
ID=63386514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201721529939.2U Expired - Fee Related CN207833775U (en) | 2017-11-14 | 2017-11-14 | A kind of refrigerating chip experimental provision |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN207833775U (en) |
-
2017
- 2017-11-14 CN CN201721529939.2U patent/CN207833775U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180907 Termination date: 20191114 |