CN207753040U - A kind of LED component - Google Patents
A kind of LED component Download PDFInfo
- Publication number
- CN207753040U CN207753040U CN201721793071.7U CN201721793071U CN207753040U CN 207753040 U CN207753040 U CN 207753040U CN 201721793071 U CN201721793071 U CN 201721793071U CN 207753040 U CN207753040 U CN 207753040U
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- led
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- base board
- aluminum base
- chip
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Abstract
A kind of LED component, including mirror-surface aluminum base board and several LED light strings being installed in mirror-surface aluminum base board, the LED light string includes several LED chips being serially connected, silicon chip is equipped between adjacent LED chip, the silicon chip is fixed on the surface of mirror-surface aluminum base board by the first heat conduction silicone, the surface of the mirror-surface aluminum base board forms reflector space between adjacent silicon chip, the both ends of the LED chip are fixed on the top of adjacent two silicon chip by the second heat conduction silicone respectively, and the bottom of the LED chip is corresponding with the reflector space.The utility model is simple in structure, and manufacture craft is simple, and light extraction efficiency is high, good heat dissipation.
Description
Technical field
The utility model is related to LED field, especially a kind of LED component.
Background technology
Currently, LED light emitting diodes due to have many advantages, such as power consumption is low, environmental protection and energy saving and obtain the wide of various circles of society
General concern and approval, the energy-saving and emission-reduction policy that numerous relevant production firm's active response countries propose, LED research and development and push away
Be made that very big input on wide, many companies all have developed integrated LED module, but existing LED module there are some not
Foot place：The low common aluminum substrate of substrate reflectivity, has that light efficiency is low in LED module, and thermal resistance is high, heat dissipation
Performance is also bad, and the reliability of LED module is caused to substantially reduce；LED chip is fixed on by crystal-bonding adhesive on substrate, and crystal-bonding adhesive is led
It is hot very low, it is not easy to heat be distributed, the service life of product is influenced；Each LED chip is connected by bonding wire, and bonding wire holds
It easily breaks, crash rate is very high, reduces the stability of product.
To solve the above problems, a kind of light reflection substrate that China Patent Publication No. is 104124325, including minute surface aluminium base
Plate, mirror-surface aluminum base board are equipped with insulation photosensitive layer, and insulation photosensitive layer is equipped with conductive circuit layer, and conductive circuit layer is equipped with
The tin coating of positive electrode and negative electrode for connecting LED chips and the protective layer for protecting conductive circuit layer.Above-mentioned patent
Due to using mirror-surface aluminum base board as support plate, although improving the light reflectivity and heat dissipation performance of aluminum substrate.But its structure is multiple
It is miscellaneous, complex manufacturing technology；In addition, due to conductive circuit layer, insulation photosensitive layer and the most of mirror-surface aluminum base board of protective layer covering, one
The light reflection for determining obstruction mirror-surface aluminum base board in degree reduces light extraction efficiency, and influences heat dissipation.
Invention content
Simple in structure the technical problem to be solved by the utility model is to provide a kind of LED component, manufacture craft is simple,
Light extraction efficiency is high, good heat dissipation.
In order to solve the above technical problems, the technical solution of the utility model is：A kind of LED component, including mirror-surface aluminum base board
With several LED light strings being installed in mirror-surface aluminum base board, the LED light string includes several LED chips being serially connected, adjacent
Silicon chip is equipped between LED chip, the silicon chip is fixed on the surface of mirror-surface aluminum base board, the minute surface by the first heat conduction silicone
The surface of aluminum substrate forms reflector space between adjacent silicon chip, and the both ends of the LED chip pass through the second heat conductive silica gel respectively
Layer is fixed on the top of adjacent two silicon chip, and the bottom of the LED chip is corresponding with the reflector space.The utility model utilizes silicon
Piece supports LED chip as insulating materials, can be detached with mirror-surface aluminum base board；Since LED chip is installed on silicon chip,
Most heat is transferred to by thermaltransmission mode on silicon chip in LED chip, in order to improve the radiating efficiency of LED chip, LED
Heat conduction good heat conductive silica gel is set between chip and silicon chip and between silicon chip and mirror-surface aluminum base board, so the heat of LED chip
Amount, which can be rapidly transferred in mirror-surface aluminum base board, to radiate.Silicon chip is that interval is arranged, and mirror-surface aluminum base board most surfaces are exposed,
The light of LED chip can be reflected, be not only able to improve light extraction efficiency, and reduce the heat absorption of substrate；LED core
The bottom of piece corresponds to reflector space, efficiently uses the bottom light extraction of LED chip, improves light extraction efficiency.
As an improvement, the LED chip is flip-chip.
As an improvement, the top surface of the silicon chip is equipped with line layer, the LED chip in LED light string passes through line layer electricity
Property connection.
As an improvement, the mirror-surface aluminum base board is rectangle, the LED light string is along the length direction interval of mirror-surface aluminum base board
It is arranged in parallel.
As an improvement, the mirror-surface aluminum base board is equipped with the fluorescent adhesive layer of covering LED light string.
As an improvement, the both ends of the mirror-surface aluminum base board are respectively equipped with positive welding section and cathode welding section, LED light string
Anode is connected on positive welding section, and cathode is welded on cathode welding section.
Caused advantageous effect is the utility model compared with prior art：
1, the utility model supports LED chip using silicon chip as insulating materials, can be detached with mirror-surface aluminum base board；
2, since LED chip is installed on silicon chip, most heat is transferred to silicon by thermaltransmission mode in LED chip
On piece is arranged to improve the radiating efficiency of LED chip between LED chip and silicon chip and between silicon chip and mirror-surface aluminum base board
The good heat conductive silica gel of heat conduction radiates so the heat of LED chip can be rapidly transferred in mirror-surface aluminum base board；
3, silicon chip is that interval is arranged, and mirror-surface aluminum base board most surfaces are exposed, can be carried out the light of LED chip anti-
It penetrates, is not only able to improve light extraction efficiency, and reduce the heat absorption of substrate；
4, the bottom of LED chip corresponds to reflector space, efficiently uses the bottom light extraction of LED chip, improves light extraction efficiency.
Description of the drawings
Fig. 1 is the utility model section view.
Fig. 2 is the utility model vertical view.
Fig. 3 is enlarged drawing at the A of Fig. 1.
Specific implementation mode
The utility model is described in further detail with reference to the accompanying drawings of the specification.
As shown in Figures 1 to 3, a kind of LED component, including mirror-surface aluminum base board 1 and several be installed in mirror-surface aluminum base board 1
The LED component of LED light string, the present embodiment is COB, and the mirror-surface aluminum base board 1 is rectangle, and the surface of mirror-surface aluminum base board 1 is equipped with
The spaced and parallel setting LED light string of four length directions along mirror-surface aluminum base board 1, the mirror-surface aluminum base board 1 are equipped with covering LED light
The fluorescent adhesive layer 4 of string.The both ends of the mirror-surface aluminum base board 1 are respectively equipped with positive welding section 8 and cathode welding section 9, LED light string
Anode is connected on positive welding section 8, and cathode is welded on cathode welding section 9.
As shown in Figures 1 to 3, the LED light string includes several LED chips 2 being serially connected, and the LED chip 2 is in a word
It arranges, silicon chip 3 is equipped between adjacent LED chip 2, the interval between adjacent silicon chip 3 is equal.The silicon chip 3 passes through the first heat conduction
Layer of silica gel 6 is fixed on the surface of mirror-surface aluminum base board 1, and the surface of the mirror-surface aluminum base board 1 forms echo area between adjacent silicon chip 3
Domain 5.The both ends of the LED chip 2 are fixed on the end at the top of adjacent two silicon chip 3, institute by the second heat conduction silicone 7 respectively
The bottom for stating LED chip 2 is corresponding with the reflector space 5；The thickness of first silica gel heat-conducting layer 6 is more than the second silica gel heat-conducting layer 7
Thickness.The LED chip 2 is flip-chip, and the top surface of the silicon chip 3 is equipped with line layer, the LED chip 2 in LED light string
Electrode is electrically connected by the line layer.
The utility model supports LED chip 2 using silicon chip 3 as insulating materials, can divide with mirror-surface aluminum base board 1
From；Since LED chip 2 is installed on silicon chip 3, most heat is transferred to silicon chip 3 by thermaltransmission mode in LED chip 2
On, in order to improve the radiating efficiency of LED chip 2, between LED chip 2 and silicon chip 3 and between silicon chip 3 and mirror-surface aluminum base board 1
The good heat conductive silica gel of heat conduction is set, is radiated so the heat of LED chip 2 can be transferred to rapidly in mirror-surface aluminum base board 1.
Silicon chip 3 is that interval is arranged, and 1 most surfaces of mirror-surface aluminum base board are exposed, can reflect the light of LED chip 2, not only can
Light extraction efficiency is enough improved, and reduces the heat absorption of substrate；The bottom of LED chip 2 corresponds to reflector space 5, efficiently uses LED
The bottom light extraction of chip 2 improves light extraction efficiency.
Claims (6)
1. a kind of LED component, including mirror-surface aluminum base board and several LED light strings being installed in mirror-surface aluminum base board, it is characterised in that：
The LED light string includes several LED chips being serially connected, and is equipped with silicon chip between adjacent LED chip, the silicon chip passes through first
Heat conduction silicone is fixed on the surface of mirror-surface aluminum base board, and the surface of the mirror-surface aluminum base board forms echo area between adjacent silicon chip
Domain, the both ends of the LED chip are fixed on the top of adjacent two silicon chip, the LED chip by the second heat conduction silicone respectively
Bottom it is corresponding with the reflector space.
2. a kind of LED component according to claim 1, it is characterised in that：The LED chip is flip-chip.
3. a kind of LED component according to claim 1, it is characterised in that：The top surface of the silicon chip is equipped with line layer, LED
LED chip in lamp string is electrically connected by the line layer.
4. a kind of LED component according to claim 1, it is characterised in that：The mirror-surface aluminum base board is rectangle, described
Length direction spaced and parallel setting of the LED light string along mirror-surface aluminum base board.
5. a kind of LED component according to claim 1, it is characterised in that：The mirror-surface aluminum base board is equipped with covering LED light
The fluorescent adhesive layer of string.
6. a kind of LED component according to claim 4, it is characterised in that：The both ends of the mirror-surface aluminum base board are respectively equipped with
The anode of positive welding section and cathode welding section, LED light string is connected on positive welding section, and cathode is welded on cathode welding section
On.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721793071.7U CN207753040U (en) | 2017-12-20 | 2017-12-20 | A kind of LED component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721793071.7U CN207753040U (en) | 2017-12-20 | 2017-12-20 | A kind of LED component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207753040U true CN207753040U (en) | 2018-08-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721793071.7U Active CN207753040U (en) | 2017-12-20 | 2017-12-20 | A kind of LED component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207753040U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111793476A (en) * | 2020-07-09 | 2020-10-20 | 深圳先进电子材料国际创新研究院 | Heat conduction material and preparation method thereof |
-
2017
- 2017-12-20 CN CN201721793071.7U patent/CN207753040U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111793476A (en) * | 2020-07-09 | 2020-10-20 | 深圳先进电子材料国际创新研究院 | Heat conduction material and preparation method thereof |
| CN111793476B (en) * | 2020-07-09 | 2022-01-25 | 深圳先进电子材料国际创新研究院 | Heat conduction material and preparation method thereof |
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