CN203250737U

CN203250737U - LED area source

Info

Publication number: CN203250737U
Application number: CN2013203053213U
Authority: CN
Inventors: 侯华敏
Original assignee: Individual
Current assignee: Individual
Priority date: 2013-05-30
Filing date: 2013-05-30
Publication date: 2013-10-23
Anticipated expiration: 2023-05-30

Abstract

An LED surface light source includes a chipset, a ceramic substrate, fluorescent silica gel, and a circuit layer, and the fluorescent silica gel is covered on the chipset. It utilizes the low thermal resistance of the ceramic substrate, the expansion coefficient is similar to that of the chip, the chipset is directly fixed on the ceramic substrate, and the heat is directly transmitted to the ceramic substrate, replacing the previous high thermal conductivity metal layer, which improves the heat dissipation performance. While reducing the failure rate of LED surface light sources, the service life is prolonged, and the structure of the ceramic substrate is stable. It is not easy to cause dead lights or insufficient heat dissipation due to chip open welding during installation or use, and will not be deformed due to long-term high temperature exposure; use The high reflectivity and insulation of the ceramic substrate replace the traditional reflective layer and insulating layer, which not only makes the light reflection effect of the LED surface light source better, but also ensures the safety of the LED surface light source when used. Therefore, the structure of the utility model Reasonable, reducing production costs and improving production efficiency.

Description

The LED area source

Technical field

The utility model relates to a kind of LED area source.

Background technology

We know, the PCB substrate of traditional LED area source is by reflector layer, circuit layer, insulating barrier and high-thermal conductive metal body form, the chip of this LED area source is installed in the circuit layer surface of PCB substrate, after circuit layer and insulating barrier are passed through in the caloric requirement that chip came out when energising was used successively, so it is poor to pass to the radiating effect of the LED area source that dispels the heat on the outside radiator by the high-thermal conductive metal body again, make easily chip occur wearing out because of excess Temperature, the situation that light decay is large, shorten the useful life of LED area source, and, because the coefficient of expansion of high-thermal conductive metal body is higher than the coefficient of expansion of chip, when the temperature of chip raises, cause that easily chip snaps, cause decay or dead lamp, in addition, because high-thermal conductive metal needs often to bear higher temperature in use, so in use for some time, high-thermal conductive metal just may produce deformation, poor stability.

Summary of the invention

The purpose of this utility model is to be to overcome the deficiencies in the prior art, provides a kind of rational in infrastructure, perfect heat-dissipating, and the light reflection effect is good, and security performance is high, can be in reduce trouble, the LED area source that greatly increases the service life.

In order to solve the technical problem of above-mentioned existence, the utility model is taked following technical proposals:

A kind of LED area source includes the chipset that is comprised of several chips, and ceramic substrate excites rear luminous fluorescence silica gel by chipset, and is located at the circuit layer that is communicated with chipset on the ceramic substrate, and described fluorescence silica gel covers on the chipset.

In the improvement project to above-mentioned LED area source, outside described chipset, be arranged with the outer corral glue of fluorescence silica gel outflow ceramic substrate in the time of can preventing from producing.

In the improvement project to above-mentioned LED area source, described chipset is welded on the circuit layer.

In the improvement project to above-mentioned LED area source, the chip of described chipset connects by wire.

Compared with prior art, the beneficial effects of the utility model are: it is to utilize the low-heat of ceramic substrate resistive, the characteristics that the coefficient of expansion and chip are close, directly be fixed on chipset on the ceramic substrate, heat is directly conducted on the ceramic substrate, effectively replaced needing the multiple high-thermal conductive metal layer that conducts heat in the substrate in the past, improved the heat dispersion of LED area source, when reducing LED area source failure rate, greatly prolonged its useful life, and ceramic substrate structure is stable, install or use procedure in be difficult for deforming and cause dead lamp or heat radiation not enough, can as high-thermal conductive metal in the past, not produce deformation because bearing for a long time high temperature yet, prolong from another point of view the useful life of LED area source; And utilize high reflecting rate and the insulating properties of ceramic substrate, traditional reflector layer and insulating barrier have been replaced, this not only makes the light reflection effect of LED area source better, can also guarantee the fail safe when the LED area source uses, therefore of the present utility model rational in infrastructure, reduce production cost, improved production efficiency.

Below in conjunction with the drawings and specific embodiments the utility model is further specified:

[description of drawings]

Fig. 1 is the stereogram of the utility model embodiment one;

Fig. 2 is the cutaway view of the utility model embodiment one;

Fig. 3 is the structural representation of the utility model embodiment one;

Fig. 4 is the stereogram of the utility model embodiment two;

Fig. 5 is the cutaway view of the utility model embodiment two;

Fig. 6 is the structural representation of the utility model embodiment two.

[embodiment]

A kind of LED area source, as shown in Figure 1, 2, 3, include the chipset 20 that is formed by several chips, ceramic substrate 10, excite rear luminous fluorescence silica gel 30 by chipset 20, and being located at circuit layer 40 on the ceramic substrate 10, the circuit layer 40 of chipset 20 on ceramic substrate 10 is connected with extraneous power supply energising; Described fluorescence silica gel 30 covers on the chip 20.Ceramic substrate 10 has that high thermal conductivity, low-heat are resistive, high reflectance, high-insulativity, the characteristic that its coefficient of expansion and chip are close.The utility model is when work, make chipset 20 energisings on the circuit layer 40, excite the fluorescence silica gel 30 of chipset 20 tops luminous after making each chip send visible light or invisible light, the heat that produces during chipset 20 work directly passes on the ceramic substrate 10 with its close contact, fast heat is passed by ceramic substrate 10.Because the thermal resistance of ceramic substrate 10 is low, conductive coefficient is high, it can distribute the heat that chipset 20 passes over rapidly, to realize the fast cooling to chipset 20, it is aging that chip is difficult for, thereby improved the useful life of LED area source, and the stability of ceramic substrate 10 is high, the coefficient of expansion is low, be difficult for deforming etc., can bear high temperature for a long time and can not produce deformation, prolonged from another point of view the useful life of LED area source, therefore structure of the present utility model is more reasonable, long service life; And, because the coefficient of expansion of ceramic substrate 10 is close with the coefficient of expansion of chip, so in use cause that chip snaps and the decay and dead lamp that cause light source with regard to not differing because of expanding with heat and contract with cold of substrate and chip, thereby effectively reduced the failure rate of LED area source, promoted the stability of LED area source; In addition, because the smooth surface of ceramic substrate 10, reflecting rate is high, the a part of light that comes out from fluorescence silica gel 30 directly penetrates, and the surface of another part light directive ceramic substrate 10 reflects away again, thereby has effectively replaced the reflector layer of traditional LED area source, and the light that is mapped to ceramic substrate 10 surfaces shines out after diffuse reflection equably, this has also reduced the junction temperature of chip indirectly not only so that light becomes soft, has further prolonged the life-span of LED area source; Moreover the high-insulativity of ceramic substrate 10 has also replaced the insulating barrier of traditional LED area source, has guaranteed LED area source safety in use.

For convenient when producing, quick and cause unnecessary waste, in the utility model, shown in Fig. 1 to 6, outside described chipset 20, be arranged with the outer corral glue 50 of fluorescence silica gel 30 outflow ceramic substrates 10 in the time of can preventing from producing, like this when producing, elder generation is corral glue 50 outside stamping a circle around the chipset 20, and then outward in the corral glue 50, fluorescence silica gel 30 is coated in the top of chipset 20, fluorescence silica gel 30 will be blocked by outer corral glue 50 like this, can not cause color inconsistent because flowing out ceramic substrate 10, can not cause unnecessary waste simultaneously yet.

In embodiment one, as shown in Figures 1 to 3, described chipset 20 is welded on the circuit layer 40; And in embodiment two, as shown in Figs. 4-6, the chip of described chipset 20 connects by wire 60.

In actual use, ceramic substrate 10 can be circle, also can be square other shapes such as grade, and ceramic substrate 10 shapes all can be decided according to the needs of usefulness with the quantity that is installed in the chip on the ceramic substrate 10.

Although with reference to embodiment the utility model is illustrated, should be understood to and in the purport of the utility model design and scope, to carry out multiple improvement.Therefore, the utility model is not limited to described embodiment, but by the described four corner of claims.

Claims

1. A kind of LED surface light source, it is characterized in that, comprise the chipset that is made up of several chips, ceramic substrate, the fluorescent silica gel that emits light after being excited by chipset, and be located at the circuit layer that is communicated with chipset on the ceramics substrate, The fluorescent silica gel is covered on the chipset.

2 . The LED surface light source according to claim 1 , characterized in that, an outer ring surrounding glue that can prevent fluorescent silica gel from flowing out of the ceramic substrate during production is provided on the periphery of the chipset. 3 .

3. The LED surface light source according to claim 1 or 2, characterized in that the chipset is welded on the circuit layer.

4. The LED surface light source according to claim 1 or 2, characterized in that: the chips of the chipset are connected by wires.