CN207705186U - A kind of lead frame on biradical island - Google Patents
A kind of lead frame on biradical island Download PDFInfo
- Publication number
- CN207705186U CN207705186U CN201820123526.2U CN201820123526U CN207705186U CN 207705186 U CN207705186 U CN 207705186U CN 201820123526 U CN201820123526 U CN 201820123526U CN 207705186 U CN207705186 U CN 207705186U
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- lead frame
- dao
- main reinforcement
- pin
- distributed
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- 230000002787 reinforcement Effects 0.000 claims abstract description 53
- 210000003205 muscle Anatomy 0.000 claims abstract description 22
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 238000004806 packaging method and process Methods 0.000 claims description 19
- 239000004033 plastic Substances 0.000 claims description 18
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 230000003064 anti-oxidating effect Effects 0.000 claims description 6
- 230000002146 bilateral effect Effects 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 230000001413 cellular effect Effects 0.000 claims description 2
- 238000007596 consolidation process Methods 0.000 claims description 2
- 238000011161 development Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000002775 capsule Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000013139 quantization Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model provides a kind of lead frame on biradical island, including lead frame unit, pin, internal pin, transverse bar, reinforcing rib, side muscle, located lateral main reinforcement and longitudinal register main reinforcement；The first Ji Dao and the second Ji Dao is distributed on the lead frame unit.It optimizes the biradical island lead frame frame of the small outline packages structures of original SOP8, improve internal pin and base island interconnectivity, compared to the IC chip that traditional biradical island lead frame frame can only be bonded two same polarities or opposed polarity, the IC chip of bonding four same polarities of novel biradical island lead frame frame or opposed polarity, to meet the IC chip mounting bonding of opposed polarity on the lead frames, give full play to the space availability ratio of biradical island frame, attachment class component is set to have multi-functional characteristic, product has high standardization, high reliability, in high precision, high density, high yield quantifies and multifunction, manufacturing cycle greatly shortens.
Description
Technical field
The technical field that the utility model is related to be surveyed to semiconductor electronic envelope, and in particular to arrive a kind of lead frame on biradical island
Frame.
Background technology
Lead frame is the carrier for installing IC chip, is that one kind realizing chip interior by means of bonding wire
The electrical connection of circuit exit and outer lead forms the key structure part of electric loop, it is played connects with outer lead
Function served as bridge, most semiconductor chips is required for installing and using lead frame, is base important in semiconductor industry
Plinth material.
SOP8（The small outline packages of 8 pins）Lead frame is produced with the generation of the semiconductor electronic components such as integrated circuit
Raw, along with the development of semiconductor technology, rapid with integrated circuit integrated level improves and high reliability, small-sized
Change, the development of surface mount, equal to the design, processing, quality of lead frame more stringent requirements are proposed, and lead frame newly produces
The update of product and the appearance of new process, and the development of semicon industry is promoted, with the development of industry, lead frame institute
The ratio for accounting for cost is higher and higher, exerts a certain influence accordingly to SOP8 lead frames：
（1）SOP8 lead frame digits increase, and to meet the needs of high yield, single lead frame is arranged to array
Development, and tradition SOP8 lead frames are mostly single base island structure, chip bonding can only realize the chip of single or double a same polarities
On Ji Dao, the polarity of product itself is limited, product develops without normal direction multipolarity application trend, single base island structure
SOP8 lead frames also occupy excessive chip bonding and wire bonding apparatus simultaneously, remaining after chip bonding is mounted on Ji Dao
The spaces Ji Dao are excessive, and SOP8 lead frames is caused to cannot get effective utilization rate；
（2）SOP8 lead frames, which are frequently present of, is bonded in two chip packages in same packaging body, existing market application
Occurred having the lead frame on biradical island though upper, pin position side is mutually not connected to Ji Dao, other side pin position then with
Ji Dao is interconnected, and limits SOP8 lead frames when installing two different IC chips, Ji Dao interconnects side with pin position
Electrical foot position polarity it is identical, cause the welding region of ic core on piece when wire bonding to be not in full use.
Invention content
The purpose of the utility model is to overcome the technological deficiencies of the above-mentioned existing small outline packages of SOP8, are provided to society
A kind of production efficiency and utilization rate of raw materials are high, product package quality is good, service life is long and have high reliability, high-precision,
The biradical island lead frame frame that high density, high yield develop is conducive to the interior circuit protection and electricity of integrated circuit attachment class component
Gas connects, and greatly shortens manufacturing cycle.
In order to solve the problem above-mentioned, the preferred embodiment of the utility model is a kind of lead frame on biradical island, feature
It is, biradical island lead frame frame includes integrally lead frame unit, pin, internal pin, transverse bar, reinforcing rib, side muscle, located lateral master
Muscle and longitudinal register main reinforcement；The first Ji Dao and the second Ji Dao, first Ji Dao and second are distributed on the lead frame unit
Ji Dao is both provided with the reinforcing rib being used to support, and said inner tube foot symmetrically couples with the pin, said inner tube foot, pin
Adjacent junction is then provided with the transverse bar of single load bearing, and the pin end is connected with the side muscle, the reinforcement
Muscle, transverse bar and side muscle are both connected in longitudinal register main reinforcement, and the located lateral main reinforcement is distributed in outside bilateral, are then institute in bilateral
It states lead frame unit, pin, internal pin, transverse bar, reinforcing rib, side muscle and longitudinal register main reinforcement to constitute, the located lateral main reinforcement
An overall structure is surrounded jointly with longitudinal register main reinforcement.
Preferably, the first Ji Dao of the lead frame unit is connected with the first internal pin, and connection included angle is at 30 °
~ 60 °, second Ji Dao is at least connected with an internal pin, and connection included angle is at 30 ° ~ 60 °, first Ji Dao, the
Diyl island is placed in the bottom of entire lead frame structure, and indent slot structure is presented.
Further, first Ji Dao, the second surfaces Ji Dao are coated with one layer of antioxidation coating, the antioxidation coating tool
Body is the superior plating silver layer of an electric conductivity, and plating silver thickness is 10 ± 5 μm, to realize that chip is fixed on described the
Enhance conductivity and Electric connection characteristic on one Ji Dao, the second Ji Dao.
Further, the lead frame cellular manufacture is manufactured using winding continuous cutting, and is arranged in 8 row array column, often
Lead frame unit described in being distributed with 2 groups, lead frame unit described in a total of 16 groups are arranged, punching material uses electric conductivity good
Copper-based, aluminium base or ferrous alloy as chip bonding substrate, thickness is in 0.20 ± 0.10mm, and material hardness performance is in 200HV
Below.
Further, the reinforcing rib is a rectangle sheet metal component, and shares 2, and width is 0.26 ± 0.10mm,
One connect with the center of first Ji Dao in 30 ° ~ 60 ° of included angle, another and second base island centre bit
Set in the connection of 30 ° ~ 60 ° of included angle, effectively ensure the strength and stiffness of plastic packaging Ji Dao, avoid deforming, by first Ji Dao,
The bearing load of second Ji Dao is shared in the longitudinal register main reinforcement.
Further, the transverse bar is distributed in the both sides up and down of first Ji Dao, the second Ji Dao, the transverse bar
Optimum width is 0.30 ± 0.10mm, and linking between the pin and internal pin is reinforced when one mould fecund of plastic packaging to realize,
First Ji Dao, the second Ji Dao not flexural deformations are supported under plastic packaging clamping pressure and injection pressure.
Further, the side muscle is in symmetrical parallel with the transverse bar, and one that the side muscle width is the transverse bar
Half, the compression strength of the first Ji Dao, the second Ji Dao described in second consolidation under plastic packaging clamping pressure, injection pressure, to eliminate gold
Belong to elasticity, it is ensured that there is good bending resistance under the pin stress.
Further, the located lateral main reinforcement shares 2, is respectively distributed in both sides of edges, wherein described in side laterally
Positioning main reinforcement on be provided with for chip bonding equipment retainer, guide elliptical aperture and for prevented positioning machinery positioning
Hole, located lateral main reinforcement described in the other side are then provided with leading for diamond hole for being molded diaphragm capsule molding and the charging of arranging machine step pitch
Expect that circular hole, group number length of the located lateral main reinforcement total length by the lead frame unit along X-axis array arrangement determine.
Further, the longitudinal register main reinforcement is distributed in the both sides of first Ji Dao, the second Ji Dao, the longitudinal direction
It positions main reinforcement length to be determined along the quantity being distributed in Y-axis by the lead frame unit, and between lead frame unit described in every 2 groups
The longitudinal register main reinforcement on injection molding channel is distributed with, several straight trough mouths are distributed on the injection molding channel, straight trough mouth is long
Degree is 4.60 ± 0.10mm, and width is 1.50 ± 0.10mm, and 8 or more are at least distributed in the longitudinal register main reinforcement,
The epoxy resin flows situation being effectively improved in plastic packaging molding.
A kind of lead frame advantageous effect on biradical island provided by the utility model is:Compared with the prior art, this practicality
It is novel that the biradical island lead frame framves of original SOP8 are optimized, internal pin and base island interconnectivity are improved, compared to traditional pair
Base island lead frame frame can only be bonded the IC chip of two same polarities or opposed polarity, and novel biradical island lead frame frame can key
The IC chip of four same polarities or opposed polarity is closed, the IC chip mounting bonding to meet opposed polarity is drawing
On wire frame, the space availability ratio of biradical island frame is given full play to, so that attachment class component is had multi-functional characteristic, product has
High standardization, high reliability, high-precision, high density, high yield quantization and multifunction, manufacturing cycle greatly shorten.
Description of the drawings
Fig. 1 is the utility model product structure schematic diagram.
Fig. 2 is the utility model product local expansion schematic diagram.
Specific implementation mode
The utility model is further explained in detail with reference to embodiments, embodiment only does explanation and is not used in limitation
The utility model.
As shown in Fig. 1 to 2, the utility model embodiment provides a kind of lead frame on biradical island, which is characterized in that double
Base island lead frame frame includes integrally lead frame unit 101, pin 102, internal pin 103, transverse bar 104, reinforcing rib 105, side muscle
106, located lateral main reinforcement 107 and longitudinal register main reinforcement 108；The first base island 109 and are distributed on the lead frame unit 101
Diyl island 110, first base island 109 and the second base island 110 are both provided with the reinforcing rib 105 being used to support, described interior
Pin 103 symmetrically couples with the pin 102, and said inner tube foot 103,102 adjacent junction of pin are then provided with single load bearing
The transverse bar 104,102 end of the pin are connected with the side muscle 106, the reinforcing rib 105, transverse bar 104 and side
Muscle 106 is both connected in longitudinal register main reinforcement 108, and the located lateral main reinforcement 107 is distributed in outside bilateral, is then described in bilateral
Lead frame unit 101, pin 102, internal pin 103, transverse bar 104,107 structure of reinforcing rib 105, side muscle 106 and longitudinal register main reinforcement
At the located lateral main reinforcement 108 and longitudinal register main reinforcement 107 surround an overall structure jointly.
As shown in Fig. 2, the first base island 109 of lead frame unit described in the present embodiment 101 and first 103 phase of internal pin
Connection, at 30 °, the 5th, second base island 110 internal pin 103 is connected connection included angle, couples included angle
At 30 °, first base island 109, the second base island 110 are placed in the bottom of entire lead frame structure, indent slot structure are presented, just
Bank radian is reduced in wire bonding process in bonding equipment, make its height no more than plastic packaging product and cause product leak electricity and
Open short circuit.
As shown in Fig. 2, the first base island 109 described in the present embodiment, 110 surface of the second base island be coated with one layer it is anti-oxidation
Layer, the antioxidation coating is specially the superior plating silver layer of an electric conductivity, and plating silver thickness is 12 μm, is conducive to high speed
Die Bonder increases the degree of cohering between Ji Dao and chip in chip bonding situations, to realize that chip is fixed on described first
Enhance conductivity and Electric connection characteristic on base island 109, the second base island 110.
As shown in Figure 1, the production of lead frame unit described in the present embodiment 101 is manufactured using winding continuous cutting, and it is in 8 rows
Array is arranged, and lead frame unit 101 described in being distributed with 2 groups, lead frame unit 101 described in a total of 16 groups, punching are often arranged
Material using electric conductivity it is good it is copper-based be used as chip bonding substrate, the ingredient of copper occupies the majority in matrix, and integral thickness exists
0.3mm, material hardness performance is in 150HV.
As shown in Figure 1, reinforcing rib 105 described in the present embodiment is a rectangle sheet metal component, and 2 are shared, width is
0.17mm, one connect with the center on first base island 109 in 30 ° of included angle, another and second Ji Dao
110 centers effectively ensure that the strength and stiffness on the islands plastic packaging forming process Zhong Ji remain unchanged in 30 ° of connections of included angle,
It avoids deforming in molding, the bearing load on first base island 109, the second base island 110 is shared in the longitudinal register
In main reinforcement 108, bearing load is made to greatly reduce, chip can be protected to be unlikely to rupture and bonding wire bank in plastic packaging forming process
It is unlikely to line phenomenon of collapsing.
As shown in Fig. 2, transverse bar 104 described in the present embodiment be distributed in first base island 109, the second base island 110 it is upper
The width on lower both sides, the transverse bar 104 is 0.3mm, and the pin 102 and internal pin are reinforced when one mould fecund of plastic packaging to realize
Link between 103 supports first base island 109, the second base island 110 not to be bent under plastic packaging clamping pressure and injection pressure
Deformation, avoid IC chip rupture and bonding wire bank collapse line, broken string.
As shown in Fig. 2, side muscle described in the present embodiment 106 and the transverse bar 104 be in symmetrical parallel, and the side muscle 106
Width is the half of the transverse bar 104, i.e. 106 width of side muscle is 0.15mm, secondary under plastic packaging clamping pressure, injection pressure to add
Gu the compression strength on first base island 109, the second base island 110, to eliminate metallic elastic, it is ensured that under 102 stress of the pin
With good bending resistance.
As shown in Figure 1, located lateral main reinforcement described in the present embodiment 107 shares 2, it is respectively distributed in both sides of edges, wherein
It is provided in located lateral main reinforcement 107 described in side for chip bonding equipment retainer, the elliptical aperture 111 of guide and for preventing
The machinery positioning hole 112 of positioning is crossed, located lateral main reinforcement 107 is then provided with the diamond shape for being molded diaphragm capsule molding described in the other side
The guide circular hole 114 of hole 113 and the charging of arranging machine step pitch, 107 total length of located lateral main reinforcement is by the lead frame unit
101 determine that array arrangement group number has 2 groups along the group number length of X-axis array arrangement, and the length of located lateral main reinforcement 107 is
30.4mm, and can be increased according to array group number, extend the length of located lateral main reinforcement 107.
As shown in Figure 1, longitudinal register main reinforcement described in the present embodiment 108 is distributed in first base island 109, the second Ji Dao
110 both sides, 108 length of longitudinal register main reinforcement determining along the quantity being distributed in Y-axis by the lead frame unit 101
Fixed, lead frame unit 101 has 8 rows distribution along Y-axis, and the length of longitudinal register main reinforcement 108 is 69.8mm, and is drawn described in every 2 groups
Injection molding channel 115 is distributed in the longitudinal register main reinforcement 108 between wire frame unit 101, if being distributed on the injection molding channel
Dry straight trough mouth 116,116 length of straight trough mouth is 4.60mm, width 1.50mm, in the longitudinal register main reinforcement 108 altogether
8 are distributed with, the epoxy resin flows situation being effectively improved in plastic packaging molding makes epoxy resin when injection molding be unlikely to flash, with
It causes in being sticked on mold and lead frame.
A kind of lead frame advantageous effect on biradical island that the utility model embodiment is provided is：Compared to existing skill
Art, the present embodiment optimize the biradical island lead frame framves of original SOP8, internal pin and base island interconnectivity are improved, by first
Pin and the 5th pin interconnect with Ji Dao respectively, realize bonding four same polarities of biradical island lead frame frame or difference
Polar IC chip gives full play to the space availability ratio of biradical island frame, and attachment class component is made to have multi-functional spy
Property, and Ji Dao is in inner groovy state, FLUTE ANGLE is bigger, and the radian of bank can more reduce when wire bonding, make its lead not
Package body structure is overflowed, more ensures that Ji Dao avoids flexural deformation in plastic packaging clamping pressure, product has high standardization, highly reliable
Property, high-precision, high density, high yield quantization and multifunction, manufacturing cycle greatly shorten, meet market to the small shapes of SOP8 seal
Fill the requirement of multipolarity specification.
Obviously, above-described embodiment of the utility model is merely to clearly demonstrate the citing that the utility model is used,
And it is not the restriction to the embodiment of the utility model；For those of ordinary skill in the art, it is stated upper
It can also be made other variations or changes in different ways on the basis of bright, there is no need and unable to give all embodiments
With exhaustion；All any modification, equivalent and improvement made within the spirit and principle of the present invention etc. should all include
Within the protection domain of the utility model claims.
Claims (9)
1. a kind of lead frame on biradical island, it is characterised in that：Biradical island lead frame frame integrally include lead frame unit, pin,
Internal pin, transverse bar, reinforcing rib, side muscle, located lateral main reinforcement and longitudinal register main reinforcement；It is distributed with first on the lead frame unit
Ji Dao and the second Ji Dao, first Ji Dao and the second Ji Dao are both provided with the reinforcing rib being used to support, said inner tube foot
Symmetrically couple with the pin, the adjacent junction of said inner tube foot, pin is then provided with the transverse bar of single load bearing, described
Pin end is connected with the side muscle, and the reinforcing rib, transverse bar and side muscle are both connected in longitudinal register main reinforcement, the transverse direction
Positioning main reinforcement be distributed in outside bilateral, in bilateral then be the lead frame unit, pin, internal pin, transverse bar, reinforcing rib, side muscle and
Longitudinal register main reinforcement is constituted, and the located lateral main reinforcement and longitudinal register main reinforcement surround an overall structure jointly.
2. a kind of lead frame on biradical island according to claim 1, characterized in that the first base of the lead frame unit
Island is connected with the first internal pin, and at 30 ° ~ 60 °, second Ji Dao's connection included angle is at least connected with an internal pin
It connects, for connection included angle at 30 ° ~ 60 °, first Ji Dao, the second Ji Dao are placed in the bottom of entire lead frame structure, are in
Existing indent slot structure.
3. a kind of lead frame on biradical island according to claim 2, characterized in that first Ji Dao, the second Ji Dao
Surface is coated with one layer of antioxidation coating, and the antioxidation coating is specially the superior plating silver layer of an electric conductivity, and silver layer is electroplated
Thickness is 10 ± 5 μm, enhances conductivity and electrical connection to realize that chip is fixed on first Ji Dao, the second Ji Dao
Characteristic.
4. a kind of lead frame on biradical island according to claim 1, characterized in that the lead frame cellular manufacture uses
Winding continuous cutting manufactures, and arranges in 8 row array column, lead frame unit described in being distributed with 2 groups is often arranged, described in a total of 16 groups
Lead frame unit, punching material is using the good copper-based, aluminium base of electric conductivity or ferrous alloy as chip bonding substrate, thickness
Degree is in 0.20 ± 0.10mm, and material hardness performance is in 200HV or less.
5. a kind of lead frame on biradical island according to claim 1, characterized in that the reinforcing rib is a rectangle metal plate
Golden part, and 2 are shared, width is 0.26 ± 0.10mm, and one and first Ji Dao center is in 30 ° of included angle
~ 60 ° of connections, another connect with the centers second Ji Dao in 30 ° ~ 60 ° of included angle, effectively ensures plastic packaging Ji Dao's
Strength and stiffness avoid deforming, and the bearing load of first Ji Dao, the second Ji Dao are shared in the longitudinal register main reinforcement
On.
6. a kind of lead frame on biradical island according to claim 1, characterized in that the transverse bar is distributed in described first
The optimum width on the both sides up and down of Ji Dao, the second Ji Dao, the transverse bar is 0.30 ± 0.10mm, to realize plastic packaging one mould fecund
Linking between pin and internal pin described in Shi Jiagu, supported under plastic packaging clamping pressure and injection pressure first Ji Dao,
Second Ji Dao not flexural deformations.
7. a kind of lead frame on biradical island according to claim 1, characterized in that the side muscle is in pair with the transverse bar
Claim parallel, and the half that the side muscle width is the transverse bar, under plastic packaging clamping pressure, injection pressure the described in second consolidation
The compression strength of one Ji Dao, the second Ji Dao, to eliminate metallic elastic, it is ensured that have under the pin stress good counter-bending
Property.
8. a kind of lead frame on biradical island according to claim 1, characterized in that the located lateral main reinforcement shares 2
Item, is respectively distributed in both sides of edges, is wherein provided in located lateral main reinforcement described in side for chip bonding equipment retainer, guide
Elliptical aperture and machinery positioning hole for preventing positioning, located lateral main reinforcement described in the other side be then provided with for injection mould
The diamond hole of box molding and the guide circular hole of arranging machine step pitch charging, the located lateral main reinforcement total length is by the lead frame list
Member is determined along the group number length of X-axis array arrangement.
9. a kind of lead frame on biradical island according to claim 1, characterized in that the longitudinal register main reinforcement is distributed in
The both sides of first Ji Dao, the second Ji Dao, the longitudinal register main reinforcement length is by the lead frame unit along being distributed in Y-axis
Quantity decision, and injection molding channel, the note is distributed in the longitudinal register main reinforcement between lead frame unit described in every 2 groups
Several straight trough mouths are distributed on creeping road, straight trough mouth length is 4.60 ± 0.10mm, and width is 1.50 ± 0.10mm, in institute
It states and 8 or more is at least distributed in longitudinal register main reinforcement, the epoxy resin flows situation being effectively improved in plastic packaging molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820123526.2U CN207705186U (en) | 2018-01-25 | 2018-01-25 | A kind of lead frame on biradical island |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820123526.2U CN207705186U (en) | 2018-01-25 | 2018-01-25 | A kind of lead frame on biradical island |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207705186U true CN207705186U (en) | 2018-08-07 |
Family
ID=63035604
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| CN201820123526.2U Active CN207705186U (en) | 2018-01-25 | 2018-01-25 | A kind of lead frame on biradical island |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4027382A4 (en) * | 2019-09-30 | 2023-04-05 | Huawei Technologies Co., Ltd. | Lead frame, packaged integrated circuit board, power chip, and circuit board packaging method |
-
2018
- 2018-01-25 CN CN201820123526.2U patent/CN207705186U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4027382A4 (en) * | 2019-09-30 | 2023-04-05 | Huawei Technologies Co., Ltd. | Lead frame, packaged integrated circuit board, power chip, and circuit board packaging method |
| US11887918B2 (en) | 2019-09-30 | 2024-01-30 | Huawei Technologies Co., Ltd. | Lead frame, packaged integrated circuit board, power chip, and circuit board packaging method |
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Address after: 247099 Factory Building No. 9, Phase 4, Electronic Information Industry Park, Economic and Technological Development Zone, Chizhou City, Anhui Province Patentee after: Anhui Xianjie Electronics Co.,Ltd. Address before: 522021 Within Yuhu Renhe Industrial Park, Airport Economic Zone, Jieyang City, Guangdong Province Patentee before: GUANGDONG XIANJIE ELECTRONIC CO.,LTD. |
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Denomination of utility model: A lead frame for dual base islands Effective date of registration: 20231007 Granted publication date: 20180807 Pledgee: Agricultural Bank of China Limited by Share Ltd. Chizhou branch Pledgor: Anhui Xianjie Electronics Co.,Ltd. Registration number: Y2023980060145 |