CN207637788U - A kind of improved 263-5L lead frames - Google Patents
A kind of improved 263-5L lead frames Download PDFInfo
- Publication number
- CN207637788U CN207637788U CN201721647425.7U CN201721647425U CN207637788U CN 207637788 U CN207637788 U CN 207637788U CN 201721647425 U CN201721647425 U CN 201721647425U CN 207637788 U CN207637788 U CN 207637788U
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- CN
- China
- Prior art keywords
- matrix
- area
- improved
- lead frames
- pin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a kind of improved 263 5L lead frames, including several frame units made of sideband and dowel concatenation, each frame unit includes matrix and pin area, sideband is located at baseline top, dowel is located at pin area bottom, pin area includes five pins, in-between pin is connect by connection sheet with matrix, the top of other four pins is equipped with weld part, matrix is equipped with slide glass area, sideband has upward U-shaped opening, if the junction of sideband and matrix is equipped with arterial highway reinforcing rib, location hole is set on the dowel in adjacent leads area, there is chip positioning device in slide glass area.This infrastructure product production cost is low, product qualification rate is high, good water-proof effect.
Description
Technical field
The utility model belongs to technical field of semiconductor encapsulation, and in particular to a kind of improved 263-5L lead frames.
Background technology
Chip carrier of the lead frame as integrated circuit is that one kind realizing that chip internal circuits draw by means of bonding material
The electrical connection of outlet and outer lead, forms the key structure part of electric loop, it plays the bridge connected with outer lead
Effect is required in most semiconductor integrated blocks using lead frame, is basic material important in electronics and information industry
Material.263-5L lead frames are a kind of common lead frames, are equipped with 5 lead angles arranged side by side, however existing 263-5L draws
Wire frame needs to be respectively provided with location hole in top and bottom, and the length of outer lead foot is generally 12 ~ 14mm, because it is longer, processing
Process is inconvenient, and product input is larger；In addition, existing 263-5L lead frames to chip without positioning device, assembling
It is susceptible to chip displacement problem in the process, causes defect ware, influences product qualification rate.
Invention content
Goal of the invention：The utility model aim be in view of the deficiencies of the prior art, provide it is a kind of it is at low cost, convenient for plus
The improved 263-5L lead frames of work.
Technical solution：A kind of improved 263-5L lead frames described in the utility model, including by sideband and dowel
Several frame units made of concatenation, each frame unit includes matrix and pin area, and the sideband is located at matrix
Top, dowel are located at pin area bottom, and the pin area includes five pins, and in-between pin is connected by connection sheet and matrix
It connects, the top of other four pins is equipped with weld part, and described matrix is equipped with slide glass area, and there is the sideband upwards U-shaped to open
Mouthful, if the junction of sideband and matrix is equipped with arterial highway reinforcing rib, location hole is set, in slide glass area on the dowel in adjacent leads area
With chip positioning device.
Further, as preferred embodiment, the chip positioning device is included in the square groove of slide glass area setting, encloses
The rectangular rail provided around the square groove, horizontal a pair of " several " type locating plate on rectangular rail, the outer edge of square groove
With it is of same size with " several " type locating plate at a distance from rectangular rail inward flange, " several " type locating plate can be upper and lower on rectangular rail
Sliding.
Further, to improve bonding strength, frame is avoided to lose, the connection sheet is " ten " font structure, including vertical
The top of piece and transverse sheet, the vertical piece is connect with matrix, and bottom is connect with middle pin.
Further, to improve bonding strength, frame is avoided to lose, the first half of the vertical piece is inverted trapezoidal structure.
Further, for the ease of injection molding, the repressed vertical piece is S type structures, the top of S type structures and matrix
Connection, bottom connect with middle pin, makes matrix and pin area not in one plane.
Further, there is depth to have on the coining and coining of 0.02 ~ 0.04mm on the connection sheet and weld part
There is silver coating.
Further, to reduce production cost while ensureing properties of product, five pins of pin area equidistantly arrange,
While the height in outer lead area is 6 ~ 8 mm.
Further, to improve the water resistance of frame, the both sides of described matrix are equipped with ramp, and the ramp is by carrying
Section is gradually reduced to edge thickness.
Further, to improve the water resistance of frame, the ramp is equipped with one group of drainage channel.
Advantageous effect：（1）This structure is eliminated by the way that the sideband of baseline top to be designed as to the U-shaped structure of upward opening
The technique that mounting hole is beaten in collective simplifies production technology, reduces Productive statistics；（2）By the way that chip positioning is arranged in slide glass area
Device, the position of fixed chip, avoids chip from shifting in process, leads to fracture of wire problem, ensures the qualification rate of product；
（3）By the way that ramp and drainage channel is arranged in matrix both sides, the waterproof effect of frame is improved；（4）By to pin size
Design, ensure to save production cost under the premise of its normal function, improve its market competitiveness.
Description of the drawings
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the side view of the utility model；
Fig. 3 is the structural schematic diagram of " several " type locating plate；
Wherein：1, sideband, 11, U-shaped opening, 2, dowel, 3, frame unit, 31, matrix, 311, slide glass area, 32, pin
Area, 33, reinforcing rib, 4, connection sheet, 41, vertical piece, 42, transverse sheet, 5, weld part, 6, location hole, 7, chip positioning device, 71, side
Connected in star, 72, rectangular rail, 73, " several " type locating plate, 8, ramp, 9, drainage channel.
Specific implementation mode
Technical solutions of the utility model are described in detail below by attached drawing, but the scope of protection of the utility model
It is not limited to the embodiment.
Embodiment 1：As shown in Figure 1 and 2, a kind of improved 263-5L lead frames, including gone here and there by sideband 1 and dowel 2
Several frame units 3 made of connecing, each frame unit 3 includes matrix 31 and pin area 32, and the sideband 1 is located at
31 top of matrix, dowel 2 are located at 32 bottom of pin area, and the pin area 32 includes five pins, and five pins are equidistantly arranged
Row, while the height in outer lead area is 8 mm, in-between pin is connect by connection sheet 4 with matrix 31, is connected by front viewing angle
Contact pin is " ten " font structure, and side examination visual angle is S type structures, including vertical piece 41 and transverse sheet 42, and the first half for indulging piece 41 is terraced
The top of shape structure, vertical piece 41 is connect with matrix 31, and bottom is connect with middle pin, makes matrix 31 with pin area 32 not at one
In plane；The top of other four pins is equipped with weld part 5, and it is the pressure of 0.03mm to have depth in connection sheet 4 and weld part 5
There is silver coating on print and coining；Described matrix is equipped with slide glass area 311, and the sideband 1 has upward U-shaped opening 11, side
If the junction with 1 and matrix 31 is equipped with arterial highway reinforcing rib 33, location hole 6, slide glass are set on the dowel in adjacent leads area 32
There is chip positioning device 7 in area 311；The chip positioning device 7 is included in the square groove 71 of slide glass area setting, around side
Rectangular rail 72 provided around connected in star 71, horizontal a pair of " several " type locating plate 73 on rectangular rail 72, square groove 71
Outer edge is of same size with " several " type locating plate 73 at a distance from rectangular 72 inward flange of rail, and " several " type locating plate 73 is rectangular
It can be slided up and down on rail 72；The both sides of matrix 31 are equipped with ramp 8, and the ramp gradually subtracts from slide glass area to edge thickness
It is small；Ramp 8 is equipped with one group of drainage channel 9.
During load is welded in production, a pair " several " type locating plate is first pushed to the top and bottom of rectangular rail respectively
Portion, the square groove for chip are completely exposed, then progress weld tabs operation, after weld tabs that " several " type at top is fixed
Push away arranged side by side with " several " type locating plate of bottom under bit slice, covering part chip limits the position of chip, is then packaged, cuts
The techniques such as muscle.Whole process is conveniently operated, and improves the qualification rate of product.
As described above, although the utility model has been indicated and described with reference to specific preferred embodiment, it must not
It is construed to the limitation to the utility model itself.In the spirit and scope for not departing from the utility model that appended claims define
Under the premise of, it can various changes can be made in the form and details to it.
Claims (9)
1. a kind of improved 263-5L lead frames, including several frame units made of sideband and dowel concatenation,
Each frame unit includes matrix and pin area, and the sideband is located at baseline top, and dowel is located at pin area bottom,
The pin area includes five pins, and in-between pin is connect by connection sheet with matrix, and the top of other four pins is equipped with
Weld part, described matrix are equipped with slide glass area, it is characterised in that：The sideband has upward U-shaped opening, sideband and matrix
If junction is equipped with arterial highway reinforcing rib, location hole is set on the dowel in adjacent leads area, there is chip positioning dress in slide glass area
It sets.
2. improved 263-5L lead frames according to claim 1, it is characterised in that：The chip positioning device includes
In the square groove of slide glass area setting, the rectangular rail provided around the square groove, on rectangular rail horizontal a pair of " several "
Type locating plate, the outer edge of square groove are of same size with " several " type locating plate at a distance from rectangular rail inward flange.
3. improved 263-5L lead frames according to claim 1, it is characterised in that：The connection sheet is " ten " font
Structure, including vertical piece and transverse sheet, the top of the vertical piece are connect with matrix, and bottom is connect with middle pin.
4. improved 263-5L lead frames according to claim 3, it is characterised in that：The first half of the vertical piece is to fall
Trapezium structure.
5. improved 263-5L lead frames according to claim 3 or 4, it is characterised in that：The repressed vertical piece is S
The top of type structure, S type structures is connect with matrix, and bottom is connect with middle pin, makes matrix with pin area not in a plane
On.
6. improved 263-5L lead frames according to claim 1, it is characterised in that：The connection sheet and weld part
It is upper with depth on the coining and coining of 0.02 ~ 0.04mm with silver coating.
7. improved 263-5L lead frames according to claim 1, it is characterised in that：Between five pins of pin area etc.
Height away from arrangement, and outer lead area is 6 ~ 8 mm.
8. improved 263-5L lead frames according to claim 1, it is characterised in that：The both sides of described matrix are equipped with oblique
Ramp, the ramp are gradually reduced from slide glass area to edge thickness.
9. improved 263-5L lead frames according to claim 8, it is characterised in that：The ramp is equipped with one group
Drainage channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721647425.7U CN207637788U (en) | 2017-12-01 | 2017-12-01 | A kind of improved 263-5L lead frames |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721647425.7U CN207637788U (en) | 2017-12-01 | 2017-12-01 | A kind of improved 263-5L lead frames |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207637788U true CN207637788U (en) | 2018-07-20 |
Family
ID=62855416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721647425.7U Expired - Fee Related CN207637788U (en) | 2017-12-01 | 2017-12-01 | A kind of improved 263-5L lead frames |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207637788U (en) |
-
2017
- 2017-12-01 CN CN201721647425.7U patent/CN207637788U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180720 Termination date: 20191201 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |