CN207496155U - A kind of FR-4 single-side coated copper plates of the high low DMF contents that radiate - Google Patents
A kind of FR-4 single-side coated copper plates of the high low DMF contents that radiate Download PDFInfo
- Publication number
- CN207496155U CN207496155U CN201721648543.XU CN201721648543U CN207496155U CN 207496155 U CN207496155 U CN 207496155U CN 201721648543 U CN201721648543 U CN 201721648543U CN 207496155 U CN207496155 U CN 207496155U
- Authority
- CN
- China
- Prior art keywords
- prepreg
- copper
- heat dissipation
- radiate
- high low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model is related to a kind of 4 single-side coated copper plates of FR of the high low DMF contents that radiate, including the prepreg (1) as base material, the prepreg (1) is made of the glass-fiber-fabric (1.1) as skeleton and the low DMF content resins (1.2) being coated on the outside of glass-fiber-fabric (1.1), the front of the prepreg (1) is provided with copper foil (2), the back side of the prepreg (1) is provided with the radiating bottom plate made of heat dissipating silicone grease (3), heat dissipation copper post (4) is evenly arranged in the front of the radiating bottom plate (3), the back side is formed with radiating fin (5), the heat dissipation copper post (4) contacts across prepreg (1) with copper foil (2) afterwards.The DMF contents of the utility model in 1000ppm hereinafter, and heat dissipation performance be far longer than previous copper-clad plate, improve the service life of product.
Description
Technical field
The utility model is related to copper-clad plate manufacturing technology field, especially a kind of high FR-4 single sides for radiating low DMF contents cover
Copper coin.
Background technology
The RoHS instruction requirements issued according to European Union are, it is specified that DMF (dimethylformamide) content is low in electronic electric equipment
In 1000ppm, major electronics firm such as Sony, Dell and Microsoft etc. also require upstream supplier as a result, reduce to the greatest extent or even
DMF materials must not be contained on product and part, to meet this requirement of European Union.At the same time, existing FR-4 (epoxy glass
Fiber fabric base clad copper coin) plank because it has many advantages, such as excellent heat resistance and machining property, produces in the electronics of multiple fields
It is widely used in the application of product, however, as the limitation of conventional process techniques, the DMF contents in FR-4 products are higher, difficult
To reach the requirement of ROHS instructions.
At the same time, basic material of the FR-4 planks as PCB, less and less with PCB volumes, power density is more next
Bigger, the heat dissipation problem of pcb board in itself has been an important problem.If during pcb board use, particularly have
During a variety of high power devices, a large amount of heat can be generated, cannot such as be radiated in time, a system can be caused in itself to component and plank
The problem of row.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of DMF contents for above-mentioned production status to exist
The high heat dissipation FR-4 single-side coated copper plates of below 1000ppm.
The technical scheme in the invention for solving the above technical problem is:A kind of FR-4 of the high low DMF contents that radiate is mono-
Face copper-clad plate, including the prepreg as base material, the prepreg is by the glass-fiber-fabric as skeleton and is coated on glass-fiber-fabric
The low DMF content resins in outside are formed, and the front of the prepreg is provided with copper foil, is set at the back side of the prepreg
The radiating bottom plate made of heat dissipating silicone grease is equipped with, is evenly arranged with heat dissipation copper post in the front of the radiating bottom plate, the back side is formed
There are radiating fin, the heat dissipation copper post to be contacted after passing through prepreg with copper foil.
Preferably, the thickness of the heat dissipation copper post is identical with the thickness of prepreg.
Preferably, the one side of the resin-bonded of the copper foil and prepreg forms microcosmic honeycomb knot by oxidation processes
Structure.
Compared with prior art, the utility model has the advantage of:
Ethylene glycol monomethyl ether is used to use acetone generation as solvent as the prepreg of copper-clad plate core plate in the utility model
The gelatin viscosity in impregnation glue groove is adjusted for DMF to be made, greatly reduces the content of DMF, and the RoHS for meeting European Union's publication refers to
Enable requirement;Increase radiating bottom plate at the copper-clad plate back side simultaneously, the heat of generation is oriented to bottom plate, and pass through bottom by heat dissipation copper post
The radiating fin in portion quickly disperses heat, substantially increases the heat dissipation performance of copper-clad plate.
Description of the drawings
Fig. 1 is the structure sectional view of the utility model.
Wherein:
Prepreg 1
Glass-fiber-fabric 1.1
Resin 1.2
Copper foil 2
Radiating bottom plate 3
Copper post 4
Radiating fin 5.
Specific embodiment
The utility model is described in further detail below in conjunction with attached drawing embodiment.
As shown in Figure 1, a kind of FR-4 single-side coated copper plates of high low DMF contents that radiate in the present embodiment, including as base
The prepreg 1 of material, the prepreg 1 is by the glass-fiber-fabric 1.1 as skeleton and the resin being coated on the outside of glass-fiber-fabric 1.1
1.2 are formed, and the resin 1.2, as solvent, replaces DMF to adjust the glue in impregnation glue groove using ethylene glycol monomethyl ether using acetone
Viscosity is made, and on the one hand can reduce the DMF contents in adhesive plaster, on the other hand can increase the uniformity and permeability of glue,
Copper foil 2 is provided in the front of the prepreg 1, the copper foil 2 passes through on one side with what the resin 1.2 of prepreg 1 was combined
Oxidation processes form microcosmic honeycomb, to improve the combined with firmness of the two.
In order to improve heat dissipation effect of the copper-clad plate as pcb board base material, the back side of the prepreg 1 is provided with heat dissipation
Bottom plate 3, radiating bottom plate 3 are made of heat dissipating silicone grease, have efficient heat dissipation performance, are uniformly set in the front of the radiating bottom plate 3
Heat dissipation copper post 4 is equipped with, the back side is formed with radiating fin 5, and radiating fin 5 is made with bottom plate ontology of identical material, the heat dissipation
Copper post 4 contacts after passing through prepreg 1 with copper foil 2, plays conductive force, and the heat of generation is oriented to radiating bottom plate, and by dissipating
The quick volatilization heat of hot fin 5, the thickness of the heat dissipation copper post 4 is identical with the thickness of prepreg 1, and the copper post 4 that radiates
Top and 2 contact position of copper foil are by oxidation processes to ensure that resin material enters copper post end, and is effectively pressed between copper foil 2
It closes.
In addition to the implementation, the utility model has further included other embodiment, all to use equivalents or equivalent
The technical solution that alternative is formed, should all fall within the protection domain of the utility model claims.
Claims (3)
1. a kind of FR-4 single-side coated copper plates of the high low DMF contents that radiate, including the prepreg (1) as base material, feature exists
In:The prepreg (1) is by the glass-fiber-fabric (1.1) as skeleton and the low DMF contents tree being coated on the outside of glass-fiber-fabric (1.1)
Fat (1.2) is formed, and the front of the prepreg (1) is provided with copper foil (2), is set at the back side of the prepreg (1)
There is the radiating bottom plate made of heat dissipating silicone grease (3), heat dissipation copper post (4), the back of the body are evenly arranged in the front of the radiating bottom plate (3)
Face is formed with radiating fin (5), and the heat dissipation copper post (4) contacts across prepreg (1) with copper foil (2) afterwards.
2. a kind of FR-4 single-side coated copper plates of high low DMF contents that radiate according to claim 1, it is characterised in that:It is described
The thickness of the copper post that radiates (4) is identical with the thickness of prepreg (1).
3. a kind of FR-4 single-side coated copper plates of high low DMF contents that radiate according to claim 1, it is characterised in that:It is described
The one side that the resin (1.2) of copper foil (2) and prepreg (1) combines forms microcosmic honeycomb by oxidation processes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721648543.XU CN207496155U (en) | 2017-11-30 | 2017-11-30 | A kind of FR-4 single-side coated copper plates of the high low DMF contents that radiate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721648543.XU CN207496155U (en) | 2017-11-30 | 2017-11-30 | A kind of FR-4 single-side coated copper plates of the high low DMF contents that radiate |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207496155U true CN207496155U (en) | 2018-06-15 |
Family
ID=62507885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201721648543.XU Active CN207496155U (en) | 2017-11-30 | 2017-11-30 | A kind of FR-4 single-side coated copper plates of the high low DMF contents that radiate |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN207496155U (en) |
-
2017
- 2017-11-30 CN CN201721648543.XU patent/CN207496155U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2014127701A (en) | Wiring board and method of manufacturing the same | |
WO2008090614A1 (en) | Prepreg, printed wiring board, multilayer circuit board and process for manufacturing printed wiring board | |
CN207496155U (en) | A kind of FR-4 single-side coated copper plates of the high low DMF contents that radiate | |
CN103763849A (en) | High-heat radiation copper-based circuit board | |
CN203537743U (en) | Electromagnetic shielding wave-absorbing heat-conducting film | |
CN207283915U (en) | A kind of wiring board of perfect heat-dissipating | |
CN208675596U (en) | A kind of multilayer circuit board of high intensity | |
CN207410588U (en) | A kind of copper base of perfect heat-dissipating | |
CN103228101A (en) | FR4 circuit board enhanced by high-thermal-conductive nano DLC (diamond-like carbon) coating | |
CN203788546U (en) | Heat dissipating PCB | |
JPS6369106A (en) | Laminate plate for electricity and printed wiring board using the same | |
CN205755047U (en) | The pcb board that a kind of thermal diffusivity is strong | |
CN206894989U (en) | A kind of Upper conductive layer of net substrate | |
TWI661757B (en) | Printed circuit board and method for manufacturing the same | |
CN206024228U (en) | High radiating thickness copper coin | |
CN205202355U (en) | Copper base copper -clad plate of ceramic film structure | |
CN205051964U (en) | Multilayer compound circuit board | |
KR20150041529A (en) | Printed circuit board | |
CN209497678U (en) | A kind of motor encoder control circuit board | |
JP4154630B2 (en) | Metal foil laminate | |
CN209072789U (en) | A kind of copper-clad plate easy to process | |
CN206790771U (en) | One side copper foil baseplate structure | |
CN203072251U (en) | Ceramic circuit board provided with blind hole. | |
CN207011078U (en) | A kind of multilayer circuit board with composite adhered layer | |
CN210202201U (en) | Double-sided tin spraying plate structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |