CN207460681U - It is a kind of using new embedding black glue come the power supply of embedding - Google Patents
It is a kind of using new embedding black glue come the power supply of embedding Download PDFInfo
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- CN207460681U CN207460681U CN201721450162.0U CN201721450162U CN207460681U CN 207460681 U CN207460681 U CN 207460681U CN 201721450162 U CN201721450162 U CN 201721450162U CN 207460681 U CN207460681 U CN 207460681U
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- embedding
- power supply
- black glue
- capacitance
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Abstract
The utility model it is a kind of using new embedding black glue come the power supply of embedding, including outer casing of power supply, end cap, embedding black glue, pcb board, output capacitance, high frequency transformer, radiator, switching transistor, high frequency capacitance, rectifier bridge stack, input safety capacitance, high-frequency rectification diode, electromagnetic interface filter, input protective tube and cable-through hole.The utility model can rapidly export the heat of power source internal, with the ageing time realized good heat dissipation effect He delay power source internal pcb board and other electronic components, so as to improve the quality of power supply and extend the service life of power supply, make it that not only there is good anti-flammability, it is also good with cementability, the advantages of protective capability is by force and hardening time is fast, weight the embedding black glue within 100 grams hardening time within 30 seconds, it is compared with the hardening time of current casting glue is when 12 24 is small, it greatly improves the embedding efficiency of power supply, production capacity is high, use cost is low.
Description
Technical field
The utility model is related to it is a kind of using new embedding black glue come the power supply of embedding.
Background technology
The glue that power supply is potted being usually used at present AB glue, the solidification process of AB glue belongs to chemical reaction process,
Shrink big when it is reacted, the reaction time is long, the reaction time about all when 12 is small -24 it is small when between, and high temperature can be generated, cured
Hardness is big afterwards, and low thermal conductivity, cementability is low, so as to cause cannot effectively export internal heat using the power supply after its embedding
Amount, needs radiate by outer casing of power supply, make the component ageings such as pcb board fast, and the parameter of power supply output is unstable, failure rate
Height, service life are short.Again since the structure setting of each electronic component in current power supply is unreasonable, it is caused to transport
With often occur during use because cause during mechanical damage solder joint crack or component wear, the dust and water protection of power supply entirety
Etc. protective capacities it is poor, use environment is restricted.
The content of the invention
Power source internal heat, heat dissipation effect can be rapidly exported the technical problem to be solved by the present invention is to provide a kind of
It is good, power source internal pcb board and the ageing time of other electronic components can be delayed, to realize the quality for improving power supply, extend power supply
Service life, make it not only there is good anti-flammability, also with cementability is good, protective capability is strong and hardening time is fast
Advantage, degree of protection reach IP67, it is highly practical using embedding black glue come embedding, there is thermal conductive resin and anti-flammability
Power supply.The utility model is achieved through the following technical solutions：
It is a kind of using new embedding black glue come the power supply of embedding, including outer casing of power supply, the left and right ends of outer casing of power supply are distinguished
End cap is provided with, the outer casing of power supply has embedding black glue from bottom surface to top surface embedding, is provided on the bottom surface of the outer casing of power supply
Pcb board is equipped with output capacitance on the pcb board, high frequency transformer, the high frequency transformer is provided on the right side of output capacitance
Right side be provided with radiator, be provided with switching transistor on the right side of the radiator, the right side of the switching transistor is set
There is high frequency capacitance, rectifier bridge stack is provided on the right side of the high frequency capacitance, input safety is provided on the right side of the rectifier bridge stack
Capacitance；The hardening time of the embedding black glue of the weight less than 100g is less than 30 seconds.The embedding black glue is to be by weight ratio
The asphalt of 65%-70%, the aluminium oxide of 2%-5%, the silica of 25%-30%, the aluminium hydroxide of 1%-2%, the polyethylene of 3%-5%
With the SBS materials (i.e. styrene-butadiene-styrene triblock copolymer) of 0-0.5% in (140 DEG C -150 of specific temperature
DEG C) under the conditions of through high temperature subtract cut and stir it is compound after a kind of new material with property for being formed, new material tool
Have the advantages that good thermal conductivity, anti-flammability, ageing resistance and hardening time are fast, can rapidly export the heat of power source internal
Amount, to realize the purpose of rapid heat dissipation and good heat dissipation effect.
Preferably, the one side of the output capacitance is provided with high-frequency rectification diode.
Preferably, it is provided with electromagnetic interface filter on rear side of the rectifier bridge stack.
Preferably, input protective tube is provided on rear side of the electromagnetic interface filter.
Preferably, being provided with cable-through hole in the middle part of each end cap, cable-through hole is provided with more than one.
Preferably, the thermal conductivity of the embedding black glue is up to 0.819W/m.k.
Preferably, the electrical strength of the embedding black glue is up to 12.4 MV/m.
Preferably, the hardening time of the embedding black glue of the weight less than 200g is less than 1 minute.
The utility model it is a kind of using new embedding black glue come the power supply of embedding, it is black including outer casing of power supply, end cap, embedding
Glue, pcb board, output capacitance, high frequency transformer, radiator, switching transistor, high frequency capacitance, rectifier bridge stack, input safety electricity
Appearance, high-frequency rectification diode, electromagnetic interface filter, input protective tube and cable-through hole.The utility model use have thermal conductive resin and
The embedding black glue of anti-flammability is from the bottom embedding of power supply outer casing of power supply to the top of power supply outer casing of power supply, by pcb board, output electricity
Appearance, high frequency transformer, radiator, switching transistor, high frequency capacitance, rectifier bridge stack, input safety capacitance, two pole of high-frequency rectification
The electronic components such as pipe, electromagnetic interface filter and input protective tube, which are all filled out, to be enclosed in embedding black glue, and embedding black glue can rapidly export electricity
Heat inside source, with the ageing time realized good heat dissipation effect He delay power source internal pcb board and other electronic components, thus
It improves the quality of power supply and extends the service life of power supply, make it that not only there is good anti-flammability, also with cementability
Good, the advantages of protective capability is strong and hardening time is fast, flame retardant rating reaches UL94V0, and its hardening time is short, embedding black glue
Weight in the hardening time within 100 grams within 30 seconds, the hardening time with current casting glue is in the small phases of 12-24
Compare, it greatly improves the embedding efficiency of power supply, and production capacity is high, and use cost is low, also passes through scientific and reasonable layout pcb board
On each electronic component position, it is made to cause pcb board when being avoided during transport and use because mechanical damage
The problem of solder joint cracks or electronic component damages, the safe waterproof and dustproof of overall structure energy, degree of protection is high, protection etc.
Grade reaches IP67, highly practical using the limitation from environment.
Description of the drawings
For ease of explanation, the utility model is described in detail by following preferred embodiments and attached drawing.
Fig. 1 for the utility model it is a kind of using new embedding black glue come the inside of the non-embedding embedding black glue of the power supply of embedding
Structural exploded view.
Fig. 2 for the utility model it is a kind of using new embedding black glue come the stereogram of the power supply of embedding.
Specific embodiment
For the ease of understanding the utility model, the utility model is more fully retouched below with reference to relevant drawings
It states.The better embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms
It realizes, however it is not limited to embodiments described herein.On the contrary, the purpose of providing these embodiments is that make new to this practicality
The more thorough and comprehensive that the disclosure of type understands.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to the technology of the utility model
The normally understood meaning of technical staff in domain is identical.It is simply in the term used in the description of the utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.
In the present embodiment, referring to figs. 1 to shown in Fig. 2, the utility model it is a kind of using new embedding black glue come embedding
Power supply, including outer casing of power supply 1, the left and right ends of outer casing of power supply 1 are respectively arranged with end cap 2, and the outer casing of power supply 1 is from bottom surface to top
Face embedding has embedding black glue 3, and pcb board 4 is provided on the bottom surface of the outer casing of power supply 1, and output electricity is equipped on the pcb board 4
Hold 5, the right side of output capacitance 5 is provided with high frequency transformer 6, and the right side of the high frequency transformer 6 is provided with radiator 7, described
The right side of radiator 7 is provided with switching transistor 8, and the right side of the switching transistor 8 is provided with high frequency capacitance 9, the high frequency
The right side of capacitance 9 is provided with rectifier bridge stack 10, and the right side of the rectifier bridge stack 10 is provided with input safety capacitance 11；The embedding
The electrical strength of black glue 3 is less than or equal to 12.4 MV/m.
In a wherein embodiment, the one side of the output capacitance 5 is provided with high-frequency rectification diode 12.
In a wherein embodiment, the rear side of the rectifier bridge stack 10 is provided with electromagnetic interface filter 13.
In a wherein embodiment, the rear side of the electromagnetic interface filter 13 is provided with input protective tube 14.
In a wherein embodiment, the middle part of each end cap 2 is provided with cable-through hole 21, cable-through hole 21 set there are one with
On.
In a wherein embodiment, the thermal conductivity of the embedding black glue 3 is less than or equal to 0.819W/m.k.
In a wherein embodiment, the hardening time of the embedding black glue 3 of the weight less than 100g is less than 30 seconds.
In a wherein embodiment, the hardening time of the embedding black glue 3 of the weight less than 200g is less than 1 minute.
In a wherein embodiment, this use new embedding black glue come the structural principle of the power supply of embedding for：First, PCB
Plate 4 is mounted on the bottom surface of outer casing of power supply 1, then, by the embedding in outer casing of power supply 1 of embedding black glue 3, until embedding black glue 3 fills
Until the top surface for being sealed to outer casing of power supply 1, by pcb board 4, output capacitance 5, high frequency transformer 6, radiator 7, switching transistor 8,
High frequency capacitance 9, rectifier bridge stack 10, input safety capacitance 11, high-frequency rectification diode 12, electromagnetic interface filter 13 and input protective tube
14 grade electronic components, which are all filled out, to be enclosed in embedding black glue 3, since embedding black glue 3 is that a kind of have thermal conductive resin, anti-flammability, anti-
Shield property, cementability and hardening time fast new material can rapidly export the heat of power source internal, to realize heat dissipation effect
Well and power source internal pcb board 4 and the ageing time of other electronic components can be delayed, so as to improve the quality of power supply and extend
The service life of power supply makes it not only have good anti-flammability, also with cementability is good, protective capability is strong and hardening time
The advantages of fast, flame retardant rating reach UL94V0, and weight can be completed to cure within 30 seconds in the embedding black glue 3 within 100 grams,
Itself and current casting glue（That is AB glue）Hardening time compare when 12-24 is small, it greatly improves power supply embedding effect
Rate and the production cycle for shortening power supply, production capacity is high, and use cost is low, also by being scientifically and rationally first laid out on pcb board 4
Embedding black glue 3 is reinjected behind the position of each electronic component, pcb board 4 and each electronic component is made to reinforce be locked at completely
In outer casing of power supply 1, the power supply after completion curing is made to cause pcb board when being avoided that during transport and use because mechanical damage
The problem of 4 solder joints crack or electronic component damages, meanwhile, embedding black glue 3 can hold tightly together with outer casing of power supply 1, make
Its overall structure can safe waterproof and dustproof, degree of protection is high, and degree of protection reaches IP67, using the limitation from environment,
It is highly practical.
The utility model it is a kind of using new embedding black glue come the power supply of embedding, it is black including outer casing of power supply, end cap, embedding
Glue, pcb board, output capacitance, high frequency transformer, radiator, switching transistor, high frequency capacitance, rectifier bridge stack, input safety electricity
Appearance, high-frequency rectification diode, electromagnetic interface filter, input protective tube and cable-through hole.The utility model can rapidly export power source internal
Heat and power source internal pcb board and the ageing time of other electronic components can be delayed, good heat dissipation effect can improve the product of power supply
Matter and the service life for extending power supply, make it not only have good anti-flammability, also with cementability is good, protective capability is strong and
The advantages of hardening time is fast, degree of protection reaches IP67, highly practical, and solving current power supply is used as using AB glue
Embedding black glue, with the reaction time it is long, cure after hardness is big, low thermal conductivity, cementability is low, heat dissipation effect is poor, failure
The problems such as rate is high, anti-aging property is poor, service life is short, water resistance and dust-proof effect are poor.
Above-described embodiment, simply the utility model an example, be not for limit the implementation of the utility model with
Interest field, all technical solutions identical or equivalent with content described in the utility model claims, should all be included in this practicality
In novel protected scope.
Claims (8)
1. it is a kind of using new embedding black glue come the power supply of embedding, it is characterised in that：Including outer casing of power supply, the left and right of outer casing of power supply
Both ends are respectively arranged with end cap, and the outer casing of power supply has embedding black glue, the bottom surface of the outer casing of power supply from bottom surface to top surface embedding
On be provided with pcb board, output capacitance on the pcb board is installed, high frequency transformer, the height are provided on the right side of output capacitance
Radiator is provided on the right side of frequency power transformer, switching transistor is provided on the right side of the radiator, the switching transistor
Right side is provided with high frequency capacitance, and rectifier bridge stack is provided on the right side of the high frequency capacitance, is provided on the right side of the rectifier bridge stack
Input safety capacitance；The hardening time of the embedding black glue of the weight less than 100g is less than 30 seconds.
2. it is according to claim 1 it is a kind of using new embedding black glue come the power supply of embedding, it is characterised in that：The output
The one side of capacitance is provided with high-frequency rectification diode.
3. it is according to claim 1 it is a kind of using new embedding black glue come the power supply of embedding, it is characterised in that：The rectification
Electromagnetic interface filter is provided on rear side of bridge heap.
4. it is according to claim 3 it is a kind of using new embedding black glue come the power supply of embedding, it is characterised in that：The EMI
Input protective tube is provided on rear side of wave filter.
5. it is according to claim 1 it is a kind of using new embedding black glue come the power supply of embedding, it is characterised in that：Each end
Cable-through hole is provided in the middle part of lid, cable-through hole is provided with more than one.
6. it is according to claim 1 it is a kind of using new embedding black glue come the power supply of embedding, it is characterised in that：The embedding
The thermal conductivity of black glue is up to 0.819W/m.k.
7. it is according to claim 1 it is a kind of using new embedding black glue come the power supply of embedding, it is characterised in that：The embedding
The electrical strength of black glue is up to 12.4 MV/m.
8. it is according to claim 1 it is a kind of using new embedding black glue come the power supply of embedding, it is characterised in that：Weight is less than
The hardening time of the embedding black glue of 200g is less than 1 minute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721450162.0U CN207460681U (en) | 2017-11-03 | 2017-11-03 | It is a kind of using new embedding black glue come the power supply of embedding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721450162.0U CN207460681U (en) | 2017-11-03 | 2017-11-03 | It is a kind of using new embedding black glue come the power supply of embedding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207460681U true CN207460681U (en) | 2018-06-05 |
Family
ID=62253698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721450162.0U Expired - Fee Related CN207460681U (en) | 2017-11-03 | 2017-11-03 | It is a kind of using new embedding black glue come the power supply of embedding |
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| Country | Link |
|---|---|
| CN (1) | CN207460681U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113613418A (en) * | 2021-10-08 | 2021-11-05 | 南通腾颢电子有限公司 | Intelligent aging power supply |
-
2017
- 2017-11-03 CN CN201721450162.0U patent/CN207460681U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113613418A (en) * | 2021-10-08 | 2021-11-05 | 南通腾颢电子有限公司 | Intelligent aging power supply |
| CN113613418B (en) * | 2021-10-08 | 2022-02-08 | 南通腾颢电子有限公司 | Intelligent aging power supply |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180605 Termination date: 20181103 |