CN208445832U - A kind of PCB circuit board casting glue that shock resistance is good - Google Patents
A kind of PCB circuit board casting glue that shock resistance is good Download PDFInfo
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- CN208445832U CN208445832U CN201820852723.8U CN201820852723U CN208445832U CN 208445832 U CN208445832 U CN 208445832U CN 201820852723 U CN201820852723 U CN 201820852723U CN 208445832 U CN208445832 U CN 208445832U
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- layer
- fixedly connected
- casting glue
- flame
- copper billet
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Abstract
The utility model discloses a kind of good PCB circuit board casting glues of shock resistance, including substrate and casting glue ontology, circuit element is fixedly connected at the top of the substrate, the two sides of the circuit element are provided with the copper billet being fixedly connected on substrate, coated plate is welded at the top of the copper billet, the casting glue ontology is coated on the outer surface of circuit element and copper billet, the casting glue ontology includes the first adhesive layer, the bottom of first adhesive layer is fixedly connected with the first flame-retardant layer, the bottom of first flame-retardant layer is fixedly connected with solvent resistant layer, the bottom of the solvent resistant layer is fixedly connected with refractory layer, the bottom of the refractory layer is fixedly connected with the second flame-retardant layer.For the utility model by setting copper billet, the first adhesive layer, the first flame-retardant layer, solvent resistant layer, refractory layer, the second flame-retardant layer and the second adhesive layer, it is low to solve heat resistance, and the problem of burning is easy when circuit element temperature increases.
Description
Technical field
The utility model relates to casting glue technical field, the good PCB circuit board encapsulating of specially a kind of shock resistance
Glue.
Background technique
With the fast development of electronic science and technology, electronic component, device, instrument and instrument obtain in the electronics industry
It is widely applied.Since the working environment of many electronic equipments is complicated and changeable, exceedingly odious natural item can be even encountered sometimes
Part is influenced to protect electronic component and integrated circuit not by working environment, is improved the electric property and stability of electronic device, is tasted
It tastes and needs to be potted electronic equipment protection.Encapsulating is one of important procedure of electronic components, it is by Embedding Material
It is filled into the gap of electronic device with the methods of mechanical or manual, machine-shaping under certain condition makes device inside
The operating procedure that electronic component and route are environmentally isolated with.Currently, electronic component and integrated circuit forward direction high-performance, densification,
High-precision and powerful direction are fast-developing, this necessarily causes the calorific value of electronic device to greatly improve.Meanwhile electronics device
The miniaturization of part again strongly reduces its heat-dissipating space, and heat dissipation channel is more crowded, and heat is caused largely to gather, if heat is not
Can timely and effectively conduct, it will a possibility that making the operating temperature of circuit rise rapidly, electronic device is caused to fail at
Increase again, seriously affects the stability and reliability of electronic device, or even the service life of electronic equipment can be shortened.Therefore, it uses
Not only there is good electrical insulation capability also to answer the capacity of heat transmission with higher in the Embedding Material of electronic device, in order to avoid height
Cause Embedding Material kindling under the operating conditions such as voltage and electric discharge, also requires Embedding Material that there is good flame retardant property, in addition,
Moisture and pernicious gas cause the pollution and corrosion of circuit board, Embedding Material sea by the gap between electronic device in order to prevent
English has good adhesive property.Organosilicon material has excellent electrical insulation capability, especially additional organosilicon casting glue
The dosage of catalyst is less when solidification, and no coupling product generates, and the dimensional stability of solidfied material is high, and linear shrinkage is low, and chemistry is steady
It is qualitative good, thus development prospect is extensive, but common organic silicon potting adhesive there are thermal conductivities low, anti-flammability and adhesive property are poor
The disadvantages of, application range is seriously affected, although encapsulating can be improved by largely adding heat filling, fire retardant and bonding agent
The performance of glue, but can mechanical property, processing performance to casting glue have adverse effect on, so research tack Halogen resistance
Thermally conductive additional organosilicon casting glue is fired with important theory significance and application prospect.
The casting glue of existing PCB circuit board has the disadvantage that
1. heat resistance is low, burning is easy when circuit element temperature increases.
Utility model content
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of PCB circuit board encapsulating that shock resistance is good
The problem of glue, it is low to solve heat resistance, and burning is easy when circuit element temperature increases.
(2) technical solution
To achieve the above object, the utility model provides the following technical solutions: a kind of PCB circuit board that shock resistance is good
With casting glue, including substrate and casting glue ontology, it is fixedly connected with circuit element at the top of the substrate, the circuit element
Two sides are provided with the copper billet being fixedly connected on substrate, and coated plate, the casting glue ontology are welded at the top of the copper billet
It is coated on the outer surface of circuit element and copper billet, the casting glue ontology includes the first adhesive layer, the bottom of first adhesive layer
Portion is fixedly connected with the first flame-retardant layer, and the bottom of first flame-retardant layer is fixedly connected with solvent resistant layer, the solvent resistant layer
Bottom is fixedly connected with refractory layer, and the bottom of the refractory layer is fixedly connected with the second flame-retardant layer, the bottom of second flame-retardant layer
Portion is fixedly connected with the second adhesive layer.
Preferably, the height of the circuit element is lower than the height of copper billet, and the copper billet is at a distance from the circuit element of two sides
It is identical.
Preferably, first adhesive layer and the second adhesive layer are tackifier adhesive layer, first flame-retardant layer and
Two flame-retardant layers are fluorine silicon resin adhesive layer.
Preferably, the solvent resistant layer includes urethane resin layer and polyimide layer, the urethane resin layer and poly-
Imide layer is fixedly connected.
Preferably, the refractory layer includes ethylene-propylene-diene monomer glue-line and acrylic rubber layer, the ethylene propylene diene rubber
Layer is fixedly connected with acrylic rubber layer.
(3) beneficial effect
The utility model provides a kind of PCB circuit board casting glue that shock resistance is good, has following
The utility model has the advantages that
(1) the utility model is used for earth shield, to improve product electrical property, grasps by adding copper billet on substrate
Make more convenient, to have structure simple, easy to maintenance advantage, can effectively have been improved by the adhesive layer that tackifier are constituted
The caking property of casting glue ontology, tensile shear strength are improved in casting glue ontology by the flame-retardant layer that fluorine silicon resin is constituted
Dispersion compatibility, improve the heat resistance, anti-flammability and shock resistance of casting glue ontology.
(2) the utility model by setting urethane resin layer and polyimide layer make casting glue ontology have environmental protection,
The advantages that good toughness, softness, water-fast, solvent resistant, and have good adhesion strength, by setting ethylene-propylene-diene monomer glue-line and
Acrylic rubber layer makes casting glue ontology have the characteristics that resistance to ozone, heat-resisting and ageing-resistant performance are excellent, plays resistance to height
The effect of temperature.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the utility model casting glue structural schematic diagram；
Fig. 3 is the utility model solvent resistant schematic diagram of a layer structure；
Fig. 4 is the heat-resisting schematic diagram of a layer structure of the utility model.
In figure: 1, substrate；2, circuit element；3, copper billet；4, casting glue ontology；5, coated plate；6, the first adhesive layer；7,
One flame-retardant layer；8, solvent resistant layer；9, refractory layer；10, the second flame-retardant layer；11, the second adhesive layer；12, polyurethane resin；13, gather
Imide layer；14, ethylene-propylene-diene monomer glue-line；15, acrylic rubber layer.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
As shown in Figs 1-4, the utility model provides a kind of technical solution: a kind of PCB circuit board that shock resistance is good use
Casting glue, including substrate 1 and casting glue ontology 4, the top of substrate 1 are fixedly connected with circuit element 2, the two sides of circuit element 2
It is provided with the copper billet 3 being fixedly connected on substrate 1, the top of copper billet 3 is welded with coated plate 5, and casting glue ontology 4 is coated on electricity
The outer surface of circuit component 2 and copper billet 3, the height of circuit element 2 are lower than the height of copper billet 3, copper billet 3 and two sides circuit element 2
Apart from identical, by adding copper billet 3 on substrate 1, be used for earth shield, to improve product electrical property, operate it is more convenient,
Advantage simple with structure, easy to maintenance, casting glue ontology 4 include the first adhesive layer 6, and the bottom of the first adhesive layer 6 is fixed
Be connected with the first flame-retardant layer 7, by tackifier constitute adhesive layer can effectively improve casting glue ontology 4 caking property,
Tensile shear strength improves the dispersion compatibility in casting glue ontology 4 by the flame-retardant layer that fluorine silicon resin is constituted, improves
The bottom of heat resistance, anti-flammability and the shock resistance of casting glue ontology 4, the first flame-retardant layer 7 is fixedly connected with solvent resistant layer 8,
Solvent resistant layer 8 includes urethane resin layer 12 and polyimide layer 13, and urethane resin layer 12 and polyimide layer 13, which are fixed, to be connected
It connects, makes casting glue ontology that there is environmental protection, good toughness, softness, resistance to by setting urethane resin layer 12 and polyimide layer 13
The advantages that water, solvent resistant, and have good adhesion strength, the bottom of solvent resistant layer 8 is fixedly connected with refractory layer 9, heat-resisting
Layer 9 includes ethylene-propylene-diene monomer glue-line 14 and acrylic rubber layer 15, ethylene-propylene-diene monomer glue-line 14 and acrylic rubber layer 15
Be fixedly connected, by setting ethylene-propylene-diene monomer glue-line 14 and acrylic rubber layer 15 make 4 body of casting glue sheet have resistance to ozone,
The heat-resisting and excellent feature of ageing-resistant performance, plays effect resistant to high temperature, it is fire-retardant that the bottom of refractory layer 9 is fixedly connected with second
Layer 10, the bottom of the second flame-retardant layer 10 are fixedly connected with the second adhesive layer 11, and the first adhesive layer 6 and the second adhesive layer 11 are to increase
Stick adhesive layer, the first flame-retardant layer 7 and the second flame-retardant layer 10 are fluorine silicon resin adhesive layer.
In use, scratching casting glue ontology 4 after casting glue encapsulation in circuit element by scraper, keeping copper billet 3 convex
The top of casting glue ontology 4 out, then coated plate 5 and copper billet 3 are welded, by the setting of adhesive layer, play the good effect of caking property
Fruit plays the good effect of heat-resisting, fire-retardant and shock resistance by the setting of flame-retardant layer, passes through 12 He of urethane resin layer
The setting of polyimide layer 13 plays solvent-proof effect, passes through ethylene-propylene-diene monomer glue-line 14 and acrylic rubber layer 15
Setting, play effect resistant to high temperature.
It can to sum up obtain, the utility model passes through setting copper billet 3, the first adhesive layer 6, the first flame-retardant layer 7, solvent resistant layer 8, resistance to
Thermosphere 9, the second flame-retardant layer 10 and the second adhesive layer 11, it is low to solve heat resistance, holds when 2 temperature of circuit element increases
Incendive problem.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of good PCB circuit board casting glue of shock resistance, including substrate (1) and casting glue ontology (4), feature exists
In: it is fixedly connected with circuit element (2) at the top of the substrate (1), the two sides of the circuit element (2) are provided with fixed company
The copper billet (3) on substrate (1) is connect, is welded with coated plate (5) at the top of the copper billet (3), casting glue ontology (4) cladding
In the outer surface of circuit element (2) and copper billet (3), the casting glue ontology (4) includes the first adhesive layer (6), and described first is viscous
The bottom for closing layer (6) is fixedly connected with the first flame-retardant layer (7), and the bottom of first flame-retardant layer (7) is fixedly connected with solvent resistant
Layer (8), the bottom of the solvent resistant layer (8) are fixedly connected with refractory layer (9), and the bottom of the refractory layer (9) is fixedly connected with
The bottom of second flame-retardant layer (10), second flame-retardant layer (10) is fixedly connected with the second adhesive layer (11).
2. a kind of good PCB circuit board casting glue of shock resistance according to claim 1, it is characterised in that: described
The height of circuit element (2) is lower than the height of copper billet (3), and the copper billet (3) is identical at a distance from two sides circuit element (2).
3. a kind of good PCB circuit board casting glue of shock resistance according to claim 1, it is characterised in that: described
First adhesive layer (6) and the second adhesive layer (11) are tackifier adhesive layer, first flame-retardant layer (7) and the second flame-retardant layer
It (10) is fluorine silicon resin adhesive layer.
4. a kind of good PCB circuit board casting glue of shock resistance according to claim 1, it is characterised in that: described
Solvent resistant layer (8) includes urethane resin layer (12) and polyimide layer (13), and the urethane resin layer (12) and polyamides are sub-
Amine layer (13) is fixedly connected.
5. a kind of good PCB circuit board casting glue of shock resistance according to claim 1, it is characterised in that: described
Refractory layer (9) includes ethylene-propylene-diene monomer glue-line (14) and acrylic rubber layer (15), the ethylene-propylene-diene monomer glue-line (14) with
Acrylic rubber layer (15) is fixedly connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820852723.8U CN208445832U (en) | 2018-06-04 | 2018-06-04 | A kind of PCB circuit board casting glue that shock resistance is good |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820852723.8U CN208445832U (en) | 2018-06-04 | 2018-06-04 | A kind of PCB circuit board casting glue that shock resistance is good |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208445832U true CN208445832U (en) | 2019-01-29 |
Family
ID=65091478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820852723.8U Expired - Fee Related CN208445832U (en) | 2018-06-04 | 2018-06-04 | A kind of PCB circuit board casting glue that shock resistance is good |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208445832U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108811322A (en) * | 2018-07-03 | 2018-11-13 | 芜湖佳华代代网络科技有限公司 | A kind of PCB circuit board casting glue that shock resistance is good |
-
2018
- 2018-06-04 CN CN201820852723.8U patent/CN208445832U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108811322A (en) * | 2018-07-03 | 2018-11-13 | 芜湖佳华代代网络科技有限公司 | A kind of PCB circuit board casting glue that shock resistance is good |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190129 Termination date: 20210604 |