CN207358383U - A kind of brittle transparent material laser processing device - Google Patents
A kind of brittle transparent material laser processing device Download PDFInfo
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- CN207358383U CN207358383U CN201720980027.0U CN201720980027U CN207358383U CN 207358383 U CN207358383 U CN 207358383U CN 201720980027 U CN201720980027 U CN 201720980027U CN 207358383 U CN207358383 U CN 207358383U
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Abstract
The utility model proposes a kind of brittle transparent material laser processing device, including workbench, autofocus system, focusing unit, reflector element, positioning CCD, beam shaping, spatial filter, expand unit, laser and control system；Control system control laser transmitting laser beam；Laser beam passes sequentially through expand unit, spatial filter, beam shaping, reflector element and focusing unit and is irradiated on the workpiece of table surface；Focusing unit is placed on autofocus system；The position of figure to be processed on workpiece is identified positioning in positioning CCD, and control system is moved in the horizontal plane according to positioning CCD identification positioning signal control workbench.The mutual cooperation of various operations, makes laser beam eliminate various influences when processing fragile material；And laser is disposably punched when processing, a series of micron order apertures are formed, the processing of overall figure is completed by continuous aperture, the injury to fragile material reduces.
Description
Technical field
Field of laser processing is the utility model is related to, more particularly to a kind of brittle transparent material laser processing device.
Background technology
With the high speed development of laser precision machining, more and more materials can use laser to carry out Precision Machining, example
Such as, metal material, the corresponding Precision Machining of brittle transparent material material (such as glass material) carry out are used using laser
Laser precision machining can improve the precision of processing, and improve the efficiency of processing, be widely used in various manufacture fields, make essence
The cost of close processing is cheaper, is appropriate for producing in batches.
However, since brittle transparent material has frangible property, the focusing that traditional laser processing device is formed in itself
Laser beam can have the problems such as Energy distribution is uneven, and the influence of light beam veiling glare is big, and brittle transparent material is being added using laser
In man-hour, can cause brittle transparent material to crush or be damaged.
Utility model content
The purpose of this utility model is that a kind of brittle transparent material laser processing device is proposed, to solve in background technology
The problems such as focusing laser beam energy distribution that existing laser processing device is formed is uneven and is difficult to brittle transparent material.
To achieve the above object, the utility model proposes a kind of brittle transparent material laser processing device, including workbench,
Autofocus system, focusing unit, reflector element, positioning CCD, beam shaping, spatial filter, expand unit, laser
And control system；Wherein, the control system controls the laser transmitting laser beam；The laser beam passes sequentially through the expansion
Shu Danyuan, spatial filter, beam shaping, reflector element and focusing unit are irradiated on the workpiece of the table surface；
The focusing unit is placed on the autofocus system；The positioning CCD carries out the position of figure to be processed on workpiece
Identification positioning, the control system identify that positioning signal controls the workbench to carry out in the horizontal plane according to the positioning CCD
It is mobile.
Preferably, in the brittle transparent material laser processing device, the focusing unit is aspherical focus lamp.
Preferably, in the brittle transparent material laser processing device, the expand unit expands for variable power
Mirror.
Preferably, in the brittle transparent material laser processing device, the workbench is installed on a guide rail.
Compared with prior art, the beneficial effects of the utility model are mainly reflected in：The utility model passes through expand unit
Adjust lasing beam diameter；The veiling glare of laser beam is filtered out by spatial filter；Pass through the group of beam shaping and focusing unit
Close and coordinate, make the Energy distribution of laser beam uniform.The mutual cooperation of various operations, make laser beam eliminate processing fragile material when
Various influences；And laser is disposably punched when processing, a series of micron order apertures are formed, are completed by continuous aperture
The processing of overall figure, the injury to fragile material reduce.
Brief description of the drawings
Fig. 1 is the front view of brittle transparent material laser processing device in one embodiment of the utility model；
Fig. 2 is the process flow chart of brittle transparent material laser processing in one embodiment of the utility model；
Fig. 3 is the workpieces processing front view of brittle transparent material laser processing device in one embodiment of the utility model；
Fig. 4 is that laser focuses on line chart in one embodiment of the utility model.
Embodiment
To make the purpose of this utility model, technical solution and advantage clearer, below by the technology of the utility model
Scheme is further described.
Please refer to Fig.1, the utility model proposes a kind of brittle transparent material laser processing device, including it is workbench 1, automatic
Focusing system 3, focusing unit 4, reflector element 5, positioning CCD (Charge Coupled Device charge coupled cells are also figure
As controller) 6, beam shaping 7, spatial filter 8, expand unit 9, laser 11 and control system 12.
Wherein, the laser 11 is controlled by the instruction of the control system 12, for launching laser beam 10；The laser
Beam 10 is adjusted by the expand unit 9 first after launching via the laser 11, is adjusted straight to required light beam
Behind footpath, then the filtering by the spatial filter 8 progress veiling glare, to eliminate the veiling glare produced in 10 transmitting procedure of laser beam,
Avoid having a negative impact to machining area；Then, shaping is carried out by the beam shaping 7, makes the energy of laser beam 10
It is evenly distributed, the workpiece 2 positioned at 1 surface of workbench is exposed to through the focusing unit 4 finally by the reflector element 5
On, to carry out corresponding Precision Machining to workpiece 2.
Wherein, the focusing unit 4 is placed on the autofocus system 3, and autofocus system 3 is in control
Mobile focusing unit 4 under the control of system 12, can make laser focus on beam and be moved to predetermined focal position；The positioning CCD
Positioning is identified in the position of figure to be processed on 6 pairs of workpiece 2, so that when carrying out technique, control system 12 controls workbench
1, real-time tracking adjustment is carried out, to complete processing of the laser beam 10 to workpiece 2.
In the present embodiment, the focusing unit 4 is aspherical focus lamp, as shown in figure 4, using aspherical focus lamp energy
Enough ensure that the femtosecond light beam 14 after shaping forms the uniform laser focused beam acts 15 of an Energy distribution.
In the present embodiment, the horizontal multi-direction shifting of the workbench 1 can be realized in 1 upper mounting rail of workbench
It is dynamic.The expand unit 9 is variable power beam expanding lens, and those skilled in the art can change the straight of light beam by actual conditions
Footpath.
Please refer to Fig.2, in the present embodiment, it is also proposed that a kind of processing method of brittle transparent material laser, using such as
Brittle transparent material laser processing device described above, includes the following steps:
Step 1：Control system 12 controls autofocus system 3 to carry out the identification to 2 thickness of workpiece, and controls focusing unit
4 are moved to focal position；
Step 2：Control system 12 controls laser 11 to launch laser beam 10, and the laser beam 10, which first passes through, described expands list
Member 9；Pass through the spatial filter 8 again；Then the beam shaping 7 is passed through；Institute is passed through finally by the reflector element 5
State focusing unit 4 to expose on the workpiece 2 on 1 surface of workbench, to carry out corresponding Precision Machining to workpiece 2；
Step 3：Positioning is identified to the position of figure to be processed on workpiece 2 in positioning CCD 6；The control system 12 is controlled
Workbench 1 processed, carries out real-time tracking adjustment, to complete processing of the laser beam to workpiece.
In the present embodiment, specifically, in step 1, the control system 12 carries out coordination control first, it is automatic right to make
Burnt system 3 identifies the thickness of workpiece 2, and then control system 12 determines focal position according to the thickness of workpiece 2, and controls poly-
Burnt unit 4 is moved to focal position, so that laser beam can focus to the surface of workpiece 2.
In step 2, the laser beam 10 is adjusted to required beam diameter by first passing through expand unit 9；It is described
Laser beam 10 eliminates the veiling glare produced in 10 transmitting procedure of laser beam by spatial filter 8 again, is produced to avoid to machining area
Raw adverse effect；Then, the laser beam 10 carries out shaping by beam shaping 7, to ensure at 10 focal line of laser beam
Energy distribution is uniform；Finally, the laser beam 10 penetrates the focusing unit 4 by reflector element 5 and is irradiated on workpiece 2, with
Proceed by working process.
In step 3, the current position of laser beam that the control system 12 is collected according to positioning CCD 6 again by with
The fixation and recognition of figure to be processed, control workbench 1 is moved, so that workpiece 2 is moved relative to laser beam so that is swashed
Light beam 10 can carry out workpiece 2 according to figure to be processed moving processing.
In addition, in the present embodiment, as shown in figure 4, in 12 mobile work platform 1 of control system, it is ensured that focusing unit 4
The laser focal line 15 of generation is remained inside workpiece 2, and is moved according to the track of figure to be processed, Zhi Daotu
Case scribes completion.
In the present embodiment, as shown in figure 3, the laser beam 10 first gets micron order aperture 13 on workpiece 2, then pass through
Workbench 2 moves horizontally, these apertures 13 are continuously produced in workpiece 2, so as to complete to process.
The preferred embodiment of the utility model is above are only, does not play the role of any restrictions to the utility model.
Any person of ordinary skill in the field, in the range of the technical solution of the utility model is not departed from, to the utility model
The technical solution and technology contents of exposure make the variation such as any type of equivalent substitution or modification, belong to without departing from the utility model
Technical solution content, still fall within the scope of protection of the utility model.
Claims (4)
1. a kind of brittle transparent material laser processing device, it is characterised in that including workbench, autofocus system, focus on list
Member, reflector element, positioning CCD, beam shaping, spatial filter, expand unit, laser and control system；Wherein, it is described
Control system controls the laser transmitting laser beam；The laser beam passes sequentially through the expand unit, spatial filter, light
Beam reshaper, reflector element and focusing unit are irradiated on the workpiece of the table surface；The focusing unit is placed in institute
State on autofocus system；The position of figure to be processed on workpiece is identified positioning, the control system in the positioning CCD
Identify that positioning signal controls the workbench to be moved in the horizontal plane according to the positioning CCD.
2. brittle transparent material laser processing device according to claim 1, it is characterised in that the focusing unit is non-
Spherical surface focusing mirror.
3. brittle transparent material laser processing device according to claim 1, it is characterised in that the expand unit is can
Become multiplying power beam expanding lens.
4. brittle transparent material laser processing device according to claim 1, it is characterised in that the workbench is installed on
On one guide rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720980027.0U CN207358383U (en) | 2017-08-08 | 2017-08-08 | A kind of brittle transparent material laser processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720980027.0U CN207358383U (en) | 2017-08-08 | 2017-08-08 | A kind of brittle transparent material laser processing device |
Publications (1)
| Publication Number | Publication Date |
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| CN207358383U true CN207358383U (en) | 2018-05-15 |
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| CN201720980027.0U Active CN207358383U (en) | 2017-08-08 | 2017-08-08 | A kind of brittle transparent material laser processing device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107350628A (en) * | 2017-08-08 | 2017-11-17 | 上海致凯捷激光科技有限公司 | A kind of brittle transparent material laser processing device and processing method |
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2017
- 2017-08-08 CN CN201720980027.0U patent/CN207358383U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107350628A (en) * | 2017-08-08 | 2017-11-17 | 上海致凯捷激光科技有限公司 | A kind of brittle transparent material laser processing device and processing method |
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