CN207338427U - Quantum dot LED packagings and lamps and lanterns - Google Patents
Quantum dot LED packagings and lamps and lanterns Download PDFInfo
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- CN207338427U CN207338427U CN201721008483.5U CN201721008483U CN207338427U CN 207338427 U CN207338427 U CN 207338427U CN 201721008483 U CN201721008483 U CN 201721008483U CN 207338427 U CN207338427 U CN 207338427U
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- quantum dot
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Abstract
It the utility model is related to LED encapsulation technologies field, it is related to quantum dot LED packagings and lamps and lanterns, to improve the illuminating effect of LED light, fluorescence coating is disposed with the top of LED chip, heat-insulated glue-line, quantum dot layer and barrier water oxygen layer, heat-insulated glue-line is wherein provided between quantum dot layer and fluorescence coating, because LED chip is at work, a large amount of thermal energy can be distributed, and this partial heat transmit downwards can by substrate eliminate a part, another part can be communicated up, cause the quantum point failure in the quantum dot layer of upper strata, therefore it is protection quantum dot, heat-insulated glue-line is provided between quantum dot layer and fluorescence coating, by setting quantum dot layer, improve the illuminating effect of LED light；Lamps and lanterns include lamp holder, lamp stand, lamp cap and quantum dot LED packagings；Lamps and lanterns have above-mentioned advantage compared with prior art.
Description
Technical field
LED encapsulation technologies field is the utility model is related to, in particular to quantum dot LED packagings and lamps and lanterns.
Background technology
In recent years, the back light unit as liquid crystal display devices such as TV, monitors, the use of LED have obtained rapidly
Development.LED has become the light source of various uses (for example, the light source of back light unit or the light for commonly shining or illuminating
Source) mainstream.By the way that the LED chip of semiconductor type is installed in substrate and coats printing opacity tree to semiconductor type LED chip
Fat, LED is used in the form of packaging part, and the light-transmissive resin for LED encapsulation piece can be included according to the output that will be realized
The phosphor of the desired color of light.
But the color developing effect of LED of the prior art is poor.
Therefore it provides a kind of preferable quantum dot LED packagings of color developing effect and lamps and lanterns become those skilled in the art
Important technological problems to be solved.
Utility model content
First purpose of the utility model is to provide a kind of quantum dot LED packagings, is shown in the prior art with alleviating
The technical problem of color effect difference.
A kind of quantum dot LED packagings provided by the utility model, including substrate and the LED core on the substrate
Piece；
Fluorescence coating, heat-insulated glue-line, quantum dot layer and barrier water oxygen layer are successively set on the LED chip top from top to bottom
Portion.
Further, the upper surface of base plate is provided with the reflection sloping platform around the LED chip, and the reflection is oblique
Platform is in symmetry shape.
Further, the reflection sloping platform inner wall is provided with concaveconvex structure, and the concaveconvex structure is surrounded on the LED chip
Around.
Further, it is provided with connected unit at the top of the reflection sloping platform.
Further, it is provided with transparent rack in the connected unit.
Further, the rack side wall is provided with mounting groove.
Further, it is provided with light-transmitting plate in the mounting groove.
Further, the light-transmitting plate is sapphire plate, glass or plastics.
Further, the barrier water oxygen layer outer wall is covered with layer of transparent glue-line.
Second purpose of the utility model is to provide a lamps and lanterns, is asked with alleviating the technology of color developing effect difference in the prior art
Topic.
A kind of lamps and lanterns provided by the utility model, including lamp holder, lamp stand, lamp cap and the quantum dot LED packagings；
The lamp cap is connected by the lamp stand with the lamp holder, and the quantum dot LED packagings are located at the lamp cap
It is internal.
Beneficial effect：
A kind of quantum dot LED packagings provided by the utility model, including substrate and the LED chip on substrate,
LED chip is disposed on the substrate, and substrate is energized for LED chip, and when in use, LED chip can produce larger heat,
This heat can quickly be excluded by substrate, it is ensured that safety of the LED chip under long-time service, if what LED chip produced
Larger heat cannot be excluded quickly, it will LED chip is impacted, or even directly damages LED chip；To improve LED light
Illuminating effect, in LED encapsulation structure, is disposed with fluorescence coating, heat-insulated glue-line, quantum dot layer and barrier at the top of LED chip
Water oxygen layer, fluorescence coating are directly contacted with LED chip, and barrier water oxygen layer is located at top, wherein between quantum dot layer and fluorescence coating
Heat-insulated glue-line is provided with, because LED chip is at work, a large amount of thermal energy can be distributed, and this partial heat transmits can pass through downwards
Substrate eliminates a part, and another part can be communicated up, and cause the quantum point failure in the quantum dot layer of upper strata, therefore be protective number
It is sub-, heat-insulated glue-line is provided between quantum dot layer and fluorescence coating, by setting quantum dot layer, improves the illumination effect of LED light
Fruit.
A kind of lamps and lanterns provided by the utility model, including lamp holder, lamp stand, lamp cap and quantum dot LED packagings；Lamp cap leads to
Cross lamp stand to be connected with lamp holder, quantum dot LED packagings are located inside lamp cap, and lamps and lanterns have above-mentioned excellent compared with prior art
Gesture, it is no longer superfluous herein to chat.
Brief description of the drawings
, below will be right in order to illustrate more clearly of the utility model embodiment or technical solution of the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, describe below
In attached drawing be the utility model some embodiments, for those of ordinary skill in the art, do not paying creativeness
On the premise of work, other attached drawings can also be obtained according to these attached drawings.
Fig. 1 is a kind of embodiment for the quantum dot LED packagings that the utility model embodiment provides；
Fig. 2 is the another embodiment for the quantum dot LED packagings that the utility model embodiment provides；
Fig. 3 is the another embodiment for the quantum dot LED packagings that the utility model embodiment provides；
Fig. 4 is the another embodiment for the quantum dot LED packagings that the utility model embodiment provides；
Fig. 5 is the another embodiment for the quantum dot LED packagings that the utility model embodiment provides；
Fig. 6 is the another embodiment for the quantum dot LED packagings that the utility model embodiment provides；
Fig. 7 is the another embodiment for the quantum dot LED packagings that the utility model embodiment provides；
Fig. 8 is the another embodiment for the quantum dot LED packagings that the utility model embodiment provides.
Icon：100- substrates；101- fluorescence coatings；The heat-insulated glue-lines of 102-；103- quantum dot layers；104- obstructs water oxygen
Layer；200-LED chips；300- reflects sloping platform；301- concaveconvex structures；302- connected units；400- transparent racks；500- is saturating
Tabula rasa；600- substratum transparents.
Embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, it is clear that described
Embodiment is the utility model part of the embodiment, instead of all the embodiments.Based on the embodiment in the utility model, sheet
Field those of ordinary skill all other embodiments obtained without making creative work, belong to this practicality
Novel protected scope.
, it is necessary to explanation in the description of the utility model, term " " center ", " on ", " under ", it is "left", "right", " perpendicular
Directly ", the orientation of the instruction such as " level ", " interior ", " outer " or position relationship are based on orientation shown in the drawings or position relationship, are only
Described for the ease of description the utility model and simplifying, rather than instruction or imply signified device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore it is not intended that limitation to the utility model.In addition, term " the
One ", " second ", " the 3rd " are only used for description purpose, and it is not intended that instruction or hint relative importance.
, it is necessary to which explanation, unless otherwise clearly defined and limited, term " are pacified in the description of the utility model
Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integratedly
Connection；Can mechanically connect or be electrically connected；It can be directly connected, can also be indirectly connected by intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
Concrete meaning of the language in the utility model.
The utility model is further described in detail below through specific implementation examples and in conjunction with the accompanying drawings.
Fig. 1 is a kind of embodiment for the quantum dot LED packagings that the utility model embodiment provides；Fig. 2 is this reality
The another embodiment of the quantum dot LED packagings provided with new embodiment；Fig. 3 provides for the utility model embodiment
Quantum dot LED packagings another embodiment；Fig. 4 is the quantum dot LED encapsulation that the utility model embodiment provides
The another embodiment of device；Fig. 5 is another implementation for the quantum dot LED packagings that the utility model embodiment provides
Mode；Fig. 6 is the another embodiment for the quantum dot LED packagings that the utility model embodiment provides；Fig. 7 is this practicality
The another embodiment for the quantum dot LED packagings that new embodiment provides；Fig. 8 is what the utility model embodiment provided
The another embodiment of quantum dot LED packagings.
A kind of quantum dot LED packagings provided as Figure 1-Figure 8 for the utility model embodiment, including substrate
100 and the LED chip 200 on substrate 100；Fluorescence coating 101, heat-insulated glue-line 102, quantum dot layer 103 and barrier water oxygen layer
104 are successively set on the top of LED chip 200 from top to bottom.
A kind of quantum dot LED packagings that the utility model embodiment provides, including substrate 100 and arranged on substrate 100
On LED chip 200, LED chip 200 sets on the substrate 100, and substrate 100 is energized for LED chip 200, and is made
Used time, LED chip 200 can produce larger heat, can quickly be excluded this heat by substrate 100, it is ensured that LED chip 200
Safety under long-time service, if the larger heat that LED chip 200 produces cannot be excluded quickly, it will to LED chip 200
Impact, or even directly damage LED chip 200；To improve the illuminating effect of LED light, in LED encapsulation structure, LED chip
200 top is disposed with fluorescence coating 101, heat-insulated glue-line 102, quantum dot layer 103 and barrier water oxygen layer 104, fluorescence coating 101
Directly contacted with LED chip 200, barrier water oxygen layer 104 is located at top, is wherein set between quantum dot layer 103 and fluorescence coating 101
Heat-insulated glue-line 102 is equipped with, because LED chip 200 is at work, a large amount of thermal energy can be distributed, and this partial heat transmits downwards meeting
A part is eliminated by substrate 100, another part can be communicated up, and cause the quantum point failure in upper strata quantum dot layer 103, because
This is protection quantum dot, heat-insulated glue-line 102 is provided between quantum dot layer 103 and fluorescence coating 101, by setting quantum dot layer
103, improve the illuminating effect of LED light.
Because water, oxygen have a great influence quanta point material, or even cause quanta point material to fail, therefore in quantum dot layer
Barrier water oxygen layer 104 is set on 103, and setting in this way can make 103 long-time normal use of quantum dot layer.
Specifically, barrier water oxygen glue is both provided with fluorescence coating 101, heat-insulated glue-line 102 and quantum dot layer 103, to ensure
The long-term normal work of quantum dot.
Wherein, stimulated whenever be subject to light or electricity, quantum dot will send coloured light, and the color of light is by quantum dot
Composition material and size shape determine, if general particle is smaller, can absorb long wave, particle is bigger, can absorb shortwave.It is 2 nanometers big
Small quantum dot, can absorb the red of long wave, shows blueness, the quantum dot of 8 nanosizeds, can absorb the blueness of shortwave, be in
Reveal red.This characteristic enables quantum dot to change the light color that light source is sent.Therefore it is glimmering using quantum dot layer 103-
Photosphere 101-LED chips 200 can obtain default requirement.
Quantum dot is the nanocrystal of quasi-zero dimension at the same time, and between 2-10 nanometers, quantum dot is subject to electrically or optically crystal grain diameter
Stimulation the pure monochromatic light of the high quality of various different colours can be sent according to the diameter of quantum dot, therefore can carry
High color developing effect.
Quantum dot has narrow and symmetrical fluorescence emission peak, and without hangover, is not easy when color quantum point uses at the same time
Existing spectrum overlaps, it is possible to increase color developing effect.
Wherein, built-in microarray cavity is equipped with heat-radiating substrate 100, heat radiation working medium is filled in built-in microarray cavity, it is interior
It is built-in microarray cavity made of hot channel to put microarray cavity, and pipe thickness is 5 μm.
Meanwhile heat-radiating substrate 100 can be made of highly heat-conductive material, for example, by two kinds of diamond dusts according to quality
Ratio 7：3 with binding agent polyvinyl alcohol by volume 5：1 is uniformly mixed, and is put into cold isostatic press, and pressurize 400MPB, pressurize
5min, removes binding agent under inert gas conditions, is wrapped up with chromiumcopper powder and loads graphite jig, vacuumizes 20min, pressurizes
25MPB and in a manner of gradient increased temperature, is first heated to 600 DEG C with uniform programming rate 1min, keeps the temperature 1h, then uniformly to rise
Warm speed 1min is heated to 1150 DEG C, keeps the temperature 10min.Cooling procedure uses annealing process, is initially cooled to 600 DEG C, keeps the temperature 5h, then
Natural cooling, finally the sampling demoulding.HIP sintering is carried out to sample again, is forced into 400MPB, temperature is risen to by room temperature
1200 DEG C, soaking time 5h.Cooling procedure is handled using annealing process, is initially cooled to 600 DEG C, keeps the temperature 6h, then natural cooling
Sample is made.For consistency up to 99%, thermal conductivity is 750W/ (mk).
Wherein, substrate 100 can be aluminum nitride ceramic substrate 100, aluminium oxide ceramic substrate 100, gold base 100, silver-based
Plate 100, copper base 100, iron substrate 100, billon substrate 100, silver alloy substrate 100, copper alloy substrate 100, ferroalloy base
Any of plate 100, PPB substrates 100, PCT substrates 100, HTN substrates 100, EMC substrates 100 or SMC substrates 100.
In the alternative of the present embodiment, 100 upper surface of substrate is provided with the reflection sloping platform around LED chip 200
300, reflection sloping platform 300 is in symmetry shape.
100 upper surface of substrate is additionally provided with reflection sloping platform 300, and reflection sloping platform 300 is located at around LED chip 200, and reflects
The height of sloping platform 300 is 1-1.5 times of 200 height of LED chip.
When LED chip 200 works, the light of excitation can increase irradiating angle by reflecting sloping platform 300, improve out light efficiency
Rate, and change light-emitting angle, so as to improve illuminating effect.
In the alternative of the present embodiment, reflection 300 inner wall of sloping platform is provided with concaveconvex structure 301, and concaveconvex structure 301 is surround
Around LED chip 200.
During the use of LED light, it might have certain moisture and enter in LED packagings, the moisture meeting of entrance
The quality of LED chip 200 is influenced, therefore reflection 300 inner wall of sloping platform is provided with concaveconvex structure 301, concaveconvex structure 301 is surrounded on
Around LED chip 200, the moisture of entrance can be deposited in concaveconvex structure 301.
Specifically, concaveconvex structure 301 can be groove structure, i.e., 300 inner wall of reflection sloping platform is set fluted, and groove
Opening is smaller, the reflecting effect of the influence reflection sloping platform 300 of minimum degree.
In the alternative of the present embodiment, 300 top of reflection sloping platform is provided with connected unit 302.
Connected unit 302 is provided with the top of reflection 300 outer wall of sloping platform, can be set by connected unit 302 in reflection sloping platform 300
Other assemblies.
Specifically, offering ladder platform at the top of the outer wall of reflection sloping platform 300, this ladder platform is connected unit 302, is being connected
During miscellaneous part, connected unit 302 not only plays connection function, moreover it is possible to plays a supporting role.
In the alternative of the present embodiment, transparent rack 400 is provided with connected unit 302.
Support fluorescence coating 101, heat-insulated glue-line 102, quantum dot layer 103 and barrier water oxygen layer 104 are provided with connected unit 302
Transparent rack 400, by stent set be transparent, improve light-out effect.
Wherein, fluorescence coating 101, heat-insulated glue-line 102, quantum dot layer 103 and barrier water oxygen layer 104 can pass through transparent rack
Then 400 supports, can also remove auxiliary mould bases in encapsulation process by aiding in mould bases to support.
Air port is offered on stent at the same time, when in use, extraneous air can be passed in and out by air port, to quantum dot LED
Packaging cools down.
In the alternative of the present embodiment, rack side wall is provided with mounting groove.
In actual use, miscellaneous part can be set on transparent rack 400, therefore be provided with rack side wall
Mounting groove.
Mounting groove can be arranged to the groove of the other forms such as card slot, be as long as miscellaneous part can be installed by mounting groove
Can.
Light-transmitting plate 500 is provided with the alternative of the present embodiment, in mounting groove.
To improve the quality of quantum dot LED light, light-transmitting plate 500 can be set in mounting groove, can be with by light-transmitting plate 500
The light sent is more uniform.
In the alternative of the present embodiment, light-transmitting plate 500 is sapphire plate, glass or plastics.
Since LED light source is point light source, irradiating to be a bright spot afterwards, this amount point very little and very bright is very dazzling,
Be not easy to do room lighting light source, thus need with spread light-transmitting plate 500 by point light source intralamellar part occur repeatedly refraction after it is right
Light is disperseed, and allows point light source to be changed into area source, and since the organosilicon material in material can allow shaped article to produce necessarily
Mist degree, can cover point light source, which makes overall light efficiency become soft.
In the alternative of the present embodiment, 104 outer wall of barrier water oxygen layer is covered with layer of transparent glue-line 600.
For protection LED chip 200, fluorescence coating 101, heat-insulated glue-line 102, quantum dot layer 103 and barrier water oxygen layer 104, make
It can long-term work, in its outer wall covered with layer of transparent glue-line 600.
Substratum transparent 600 preferably can come quantum dot layer 103 with air exclusion, avoid oxygen and moisture in air
Quantum dot performance is influenced, on the other hand, silica gel can be preferably heat-insulated, can better ensure that the service life of quantum dot.
A kind of lamps and lanterns that the utility model embodiment provides, including lamp holder, lamp stand, lamp cap and quantum dot LED packagings；
Lamp cap is connected by lamp stand with lamp holder, and quantum dot LED packagings are located inside lamp cap.
A kind of lamps and lanterns that the utility model embodiment provides, including lamp holder, lamp stand, lamp cap and quantum dot LED packagings；
Lamp cap is connected by lamp stand with lamp holder, and quantum dot LED packagings are located inside lamp cap, and lamps and lanterns have upper compared with prior art
The advantage stated, it is no longer superfluous herein to chat.
Finally it should be noted that：Various embodiments above is only to illustrate the technical solution of the utility model, rather than it is limited
System；Although the utility model is described in detail with reference to foregoing embodiments, those of ordinary skill in the art should
Understand：It can still modify the technical solution described in foregoing embodiments, either to which part or whole
Technical characteristic carries out equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from this practicality newly
The scope of each embodiment technical solution of type.
Claims (10)
- A kind of 1. quantum dot LED packagings, it is characterised in that including：Substrate and the LED chip on the substrate；Fluorescence coating, heat-insulated glue-line, quantum dot layer and barrier water oxygen layer are successively set at the top of the LED chip from top to bottom.
- 2. quantum dot LED packagings according to claim 1, it is characterised in that the upper surface of base plate is provided with position Reflection sloping platform around the LED chip, the reflection sloping platform is in symmetry shape.
- 3. quantum dot LED packagings according to claim 2, it is characterised in that the reflection sloping platform inner wall is provided with Concaveconvex structure, the concaveconvex structure are surrounded on around the LED chip.
- 4. quantum dot LED packagings according to claim 2, it is characterised in that be provided with the top of the reflection sloping platform Connected unit.
- 5. quantum dot LED packagings according to claim 4, it is characterised in that be provided with the connected unit transparent Stent.
- 6. quantum dot LED packagings according to claim 5, it is characterised in that the rack side wall is provided with installation Groove.
- 7. quantum dot LED packagings according to claim 6, it is characterised in that be provided with printing opacity in the mounting groove Plate.
- 8. quantum dot LED packagings according to claim 7, it is characterised in that the light-transmitting plate is sapphire plate, glass Glass or plastics.
- 9. quantum dot LED packagings according to claim 1, it is characterised in that the barrier water oxygen layer outer wall covering There is layer of transparent glue-line.
- 10. a kind of lamps and lanterns, it is characterised in that including lamp holder, lamp stand, lamp cap and claim 1-9 any one of them quantum dots LED packagings；The lamp cap is connected by the lamp stand with the lamp holder, and the quantum dot LED packagings are located inside the lamp cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721008483.5U CN207338427U (en) | 2017-08-14 | 2017-08-14 | Quantum dot LED packagings and lamps and lanterns |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721008483.5U CN207338427U (en) | 2017-08-14 | 2017-08-14 | Quantum dot LED packagings and lamps and lanterns |
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| CN207338427U true CN207338427U (en) | 2018-05-08 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109945144A (en) * | 2019-04-17 | 2019-06-28 | 陕西科技大学 | A kind of heat absorption decompression thermal conductivity heat-insulating structure for liquid quantum dot LED light |
-
2017
- 2017-08-14 CN CN201721008483.5U patent/CN207338427U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109945144A (en) * | 2019-04-17 | 2019-06-28 | 陕西科技大学 | A kind of heat absorption decompression thermal conductivity heat-insulating structure for liquid quantum dot LED light |
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