CN207262072U - A kind of flexible LED lamp silk - Google Patents
A kind of flexible LED lamp silk Download PDFInfo
- Publication number
- CN207262072U CN207262072U CN201721001633.XU CN201721001633U CN207262072U CN 207262072 U CN207262072 U CN 207262072U CN 201721001633 U CN201721001633 U CN 201721001633U CN 207262072 U CN207262072 U CN 207262072U
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- CN
- China
- Prior art keywords
- chip
- insulating layer
- conducting wire
- substrate
- placement platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims abstract description 33
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000006071 cream Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 239000013078 crystal Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- 229910021389 graphene Inorganic materials 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 241001465382 Physalis alkekengi Species 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 3
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 239000008710 crystal-8 Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- -1 graphite Alkene Chemical class 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of flexible LED lamp silk, including substrate, insulating layer, conducting wire, at least two LED chips, the conducting wire is made of grapheme material, the insulating layer into coating on the substrate, chip placement platform is provided with the insulating layer, the LED chip is placed on the chip placement platform, and the conducting wire is arranged on the insulating layer of the chip placement platform both sides, and the LED chip is directly welded in the conducting wire by tin cream.LED chip is directly welded in conducting wire by tin cream, it is small, and be metal after tin cream welding, its heat transfer that is connected with chip, graphene is fast, good heat dissipation effect.
Description
Technical field
LED light illuminator technical field is the utility model is related to, more particularly to a kind of flexible LED lamp silk.
Background technology
In lamps and lanterns improved, process, miniaturization, lamps and lanterns heat dissipation, the use of the luminous efficiency of lamps and lanterns, lamps and lanterns of lamps and lanterns volume
Service life is all the target that designer pursues.Traditional LED illumination lamp generally comprise lamp cap, the lampshade at the top of lamp cap,
Power supply in lamp cap, is provided with LED light conducting wire, LED chip and radiator structure in lampshade, LED light conducting wire with
Power electric connection in lamp cap, its volume is larger, and when LED light conducting wire electrified light emitting, its light sent passes through lampshade
To achieve the purpose that illumination or decoration.During LED light electrified light emitting, LED chip, conducting wire can send certain heat, cause
Lamp case temperature is raised, influences the luminous quantity and service life of LED chip, therefore radiator structure heat dissipation effect is fine or not right
The performance and used life of LED light has a very big impact.
Utility model content
The utility model is intended at least solve one of technical problem existing in the prior art.For this reason, the utility model carries
A kind of flexible LED lamp silk, including substrate, insulating layer, conducting wire, at least two LED chips are gone out, the conducting wire is by graphite
Alkene material is made, and the insulating layer on the substrate, is provided with chip placement platform, the LED into coating on the insulating layer
For chip mount on the chip placement platform, the conducting wire is arranged on the insulating layer of the chip placement platform both sides
On, the LED chip is directly welded in the conducting wire by tin cream.LED chip is directly welded at by tin cream and is led
It is small in electric line, and be metal after tin cream welding, its heat transfer that is connected with chip, graphene is fast, good heat dissipation effect.
Further, the substrate is tablet, and the chip placement platform is the boss one that the insulating layer is formed, described convex
Fluted one is set on the insulating layer of one both sides of platform, the conducting wire is arranged in the groove one.
Further, the substrate is provided with boss two, and the substrate of two both sides of boss sets fluted two, institute
State and the insulating layer is coated on boss two form the chip placement platform, the insulating layer is coated with the groove two.
Further, the chip placement platform is higher than the substrate, and the width of the chip placement platform is less than the LED
The distance between the two poles of the earth of chip.
Further, the substrate is aluminum substrate, and the material of the insulating layer is insulating ceramics.
Further, bare crystalline rectifier diode, driving integrated chip, pad are further included, the bare crystalline rectifier diode is straight
Connect and be welded in the conducting wire and be connected with the pad, the driving integrated chip is made of bare crystalline chip, described naked
Brilliant direct chip attachment is in the conducting wire.
Further, YAG crystal is further included, the YAG crystal is used for the LED chip, conducting wire, brilliant rectification two
Pole pipe, driving integrated chip package are on the substrate.
Further, the substrate is in the shape of a spiral.
Brief description of the drawings
Fig. 1 is a kind of structure diagram of flexible LED lamp silk provided by the utility model；
Fig. 2 is a kind of flexible LED lamp silk top view provided by the utility model；
Fig. 3 is a kind of flexible LED lamp silk partial structural diagram provided by the utility model；
Fig. 4 is another flexible LED lamp silk partial structural diagram provided by the utility model；
Wherein, 1, substrate；2nd, insulating layer；21st, chip placement platform；3rd, conducting wire；4th, tin cream；5th, LED chip；6th, bare crystalline
Rectifier diode；7th, integrated chip is driven；8th, YAG crystal；9th, pad
Embodiment
The embodiment of the utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element is represented to same or similar label eventually or there is same or like element.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the utility model, and it is not intended that to the utility model
Limitation.
In the description of the utility model, it is to be understood that term " " center ", " on ", " under ", "front", "rear",
The orientation or position relationship of the instruction such as "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer " is based on attached drawing institutes
The orientation or position relationship shown, is for only for ease of description the utility model and simplifies description, rather than indicates or imply and is signified
Device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to this practicality
New limitation.
, it is necessary to which explanation, unless otherwise clearly defined and limited, term " are pacified in the description of the utility model
Dress ", " connected ", " setting " should be interpreted broadly, for example, it may be being fixedly linked, setting or be detachably connected, set
Put, or be integrally connected, set.For the ordinary skill in the art, it can understand that above-mentioned term exists with concrete condition
Concrete meaning in the utility model.
Embodiment one, as shown in Figure 1 to Figure 3, the utility model proposes a kind of flexible LED lamp silk, including substrate 1, insulation
Layer 2, conducting wire 3, at least two LED chips 5, the conducting wire is made of grapheme material, and the insulating layer is into coating
On the substrate, chip placement platform 21 is provided with the insulating layer, the LED chip is placed in the chip placement platform
On, the conducting wire is arranged on the insulating layer of the chip placement platform both sides, and the LED chip is straight by tin cream 4
Connecing and be welded in the conducting wire, tin cream contains Tin Silver Copper Alloy, after the completion of tin cream welding, LED chip and conducting wire
Between be connected by Tin Silver Copper Alloy；Tin Silver Copper Alloy has good conduction, thermal conductivity；
The substrate is tablet, and the chip placement platform is the boss one that the insulating layer is formed, one both sides of boss
The insulating layer on set fluted one, the conducting wire is arranged in the groove one；
See on the whole, in the shape of a spiral, the substrate is that material is aluminium to the substrate, and the material of the insulating layer is insulation
Ceramics；
Bare crystalline rectifier diode 6, driving integrated chip 7, pad 9 are further included, the bare crystalline rectifier diode directly welds
It is connected in the conducting wire and with the pad, the driving integrated chip is made of bare crystalline chip, the bare crystalline chip
It is directly welded in the conducting wire；
YAG crystal 8 is further included, the YAG crystal is for encapsulating the LED chip in addition to pad, conducting wire, driving
All parts that integrated chip etc. is disposed on the substrate, make the LED chip, conducting wire, driving integrated chip etc. zero
Part and air exclusion, avoid the generation of oxidation reaction.
Embodiment two, the substrate unlike embodiment one are not tablets, and the substrate is provided with boss two, the boss
The substrate of two both sides sets fluted two, and coating the insulating layer on the boss two forms the chip placement platform, institute
State and the insulating layer is coated with groove two.Using molding substrate boss two and groove two, its intensity is higher, lasts a long time.
Embodiment three, as shown in figure 4, on the basis of embodiment one, the chip placement platform 21 is higher than the substrate, institute
The width for stating chip placement platform is less than the distance between the two poles of the earth of the LED chip.LED chip installation site is higher, it sends
Light be blocked less, the utilization rate of light is high.
While there has been shown and described that the embodiment of the utility model, it will be understood by those skilled in the art that：
These embodiments can be carried out with a variety of changes, modification in the case where not departing from the principle and objective of the utility model, replaced
And modification, the scope of the utility model are limited by claim and its equivalent.
Claims (8)
1. a kind of flexible LED lamp silk, it is characterised in that described including substrate, insulating layer, conducting wire, at least two LED chips
Conducting wire is made of grapheme material, and the insulating layer on the substrate, chip is provided with the insulating layer into coating
Placement platform, the LED chip are placed on the chip placement platform, and the conducting wire is arranged on the chip placement platform both sides
The insulating layer on, the LED chip is directly welded in the conducting wire by tin cream.
2. flexible LED lamp silk according to claim 1, it is characterised in that the substrate is tablet, and the chip placement platform is
The boss one that the insulating layer is formed, sets fluted one on the insulating layer of one both sides of boss, the conducting wire
It is arranged in the groove one.
3. flexible LED lamp silk according to claim 1, it is characterised in that the substrate is provided with boss two, the boss two
The substrate of both sides sets fluted two, and coating the insulating layer on the boss two forms the chip placement platform, described
The insulating layer is coated with groove two.
4. the flexible LED lamp silk according to Claims 2 or 3, it is characterised in that the chip placement platform 21 is higher than the base
Plate, the width of the chip placement platform are less than the distance between the two poles of the earth of the LED chip.
5. flexible LED lamp silk according to claim 1, it is characterised in that the substrate is aluminum substrate, the material of the insulating layer
Expect for insulating ceramics.
6. flexible LED lamp silk according to claim 1, it is characterised in that further include bare crystalline rectifier diode, the integrated core of driving
Piece, pad, the bare crystalline rectifier diode are directly welded in the conducting wire and are connected with the pad, the driving collection
It is made of into chip bare crystalline chip, the bare crystalline direct chip attachment is in the conducting wire.
7. flexible LED lamp silk according to claim 6, it is characterised in that further include YAG crystal, the YAG crystal is used for will
The LED chip, conducting wire, brilliant rectifier diode, driving integrated chip package are on the substrate.
8. according to any flexible LED lamp silk of claims 1 to 3 or claim 5 to 7, it is characterised in that the substrate is in
Helical form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721001633.XU CN207262072U (en) | 2017-08-11 | 2017-08-11 | A kind of flexible LED lamp silk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721001633.XU CN207262072U (en) | 2017-08-11 | 2017-08-11 | A kind of flexible LED lamp silk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207262072U true CN207262072U (en) | 2018-04-20 |
Family
ID=61924566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721001633.XU Active CN207262072U (en) | 2017-08-11 | 2017-08-11 | A kind of flexible LED lamp silk |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207262072U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109084192A (en) * | 2018-08-01 | 2018-12-25 | 浙江睦田装备科技有限公司 | A kind of LED integrated optical source |
-
2017
- 2017-08-11 CN CN201721001633.XU patent/CN207262072U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109084192A (en) * | 2018-08-01 | 2018-12-25 | 浙江睦田装备科技有限公司 | A kind of LED integrated optical source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180823 Address after: 430074 No.103, Building B, Wuhan Guanggu International Business Center, 10 Floors, North of Chuangcheng Street, East Guanshan Avenue, Wuhan East Lake Development Zone, Hubei Province Patentee after: Optical energy technology Co., Ltd. Address before: 430074 Wuhan Donghu Development Zone, Hubei Province, east of Guanshan Avenue, north of Chuangcheng Street, Wuhan Guanggu International Business Center, Building D, 10th floor, 1003 Patentee before: Zhang Bowen |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190618 Address after: 18th Floor, Golden Bell Hui Center, 28 Queen's Avenue East, Wanchai, Hong Kong, China Patentee after: Yundeng Industry (Hong Kong) Co., Ltd. Address before: 430074 No.103, Building B, Wuhan Guanggu International Business Center, 10 Floors, North of Chuangcheng Street, East Guanshan Avenue, Wuhan East Lake Development Zone, Hubei Province Patentee before: Optical energy technology Co., Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191023 Address after: No. 524-4-278, floor 5, building B, Yunnan Software Park (industrial R & D base of high tech Zone), No. 220, Erhuan West Road, high tech Zone, Kunming City, Yunnan Province Patentee after: Yundeng photoelectric (Kunming) Co., Ltd. Address before: 18 / F, Admiralty centre, 28 Queen's Road East, Wanchai, Hong Kong, China Patentee before: Yundeng Industry (Hong Kong) Co., Ltd. |
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| TR01 | Transfer of patent right |