CN207255930U - 双头减薄机 - Google Patents
双头减薄机 Download PDFInfo
- Publication number
- CN207255930U CN207255930U CN201721075124.1U CN201721075124U CN207255930U CN 207255930 U CN207255930 U CN 207255930U CN 201721075124 U CN201721075124 U CN 201721075124U CN 207255930 U CN207255930 U CN 207255930U
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- axis
- driving mechanism
- grinding
- feeding driving
- spindle motor
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- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
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Claims (10)
Priority Applications (1)
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CN201721075124.1U CN207255930U (zh) | 2017-08-25 | 2017-08-25 | 双头减薄机 |
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CN201721075124.1U CN207255930U (zh) | 2017-08-25 | 2017-08-25 | 双头减薄机 |
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CN207255930U true CN207255930U (zh) | 2018-04-20 |
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CN201721075124.1U Active CN207255930U (zh) | 2017-08-25 | 2017-08-25 | 双头减薄机 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110340784A (zh) * | 2019-07-23 | 2019-10-18 | 泉州市坤瀚精密机械有限公司 | 一种一体式陶瓷茶海底部磨平磨亮设备 |
CN112296830A (zh) * | 2019-07-30 | 2021-02-02 | 均豪精密工业股份有限公司 | 研磨装置 |
CN113427370A (zh) * | 2021-06-11 | 2021-09-24 | 深圳市友创智能设备有限公司 | 一种双砂轮定位方法 |
CN113910010A (zh) * | 2021-11-11 | 2022-01-11 | 哈尔滨工业大学 | 一种硬脆半导体材料的加工方法及其磨削机床 |
CN114211329A (zh) * | 2021-12-10 | 2022-03-22 | 浙江芯晖装备技术有限公司 | 一种应用于硬脆薄片材料的双面减薄设备 |
-
2017
- 2017-08-25 CN CN201721075124.1U patent/CN207255930U/zh active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110340784A (zh) * | 2019-07-23 | 2019-10-18 | 泉州市坤瀚精密机械有限公司 | 一种一体式陶瓷茶海底部磨平磨亮设备 |
CN112296830A (zh) * | 2019-07-30 | 2021-02-02 | 均豪精密工业股份有限公司 | 研磨装置 |
CN113427370A (zh) * | 2021-06-11 | 2021-09-24 | 深圳市友创智能设备有限公司 | 一种双砂轮定位方法 |
CN113910010A (zh) * | 2021-11-11 | 2022-01-11 | 哈尔滨工业大学 | 一种硬脆半导体材料的加工方法及其磨削机床 |
CN114211329A (zh) * | 2021-12-10 | 2022-03-22 | 浙江芯晖装备技术有限公司 | 一种应用于硬脆薄片材料的双面减薄设备 |
CN114211329B (zh) * | 2021-12-10 | 2022-08-26 | 浙江芯晖装备技术有限公司 | 一种应用于硬脆薄片材料的双面减薄设备 |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210331 Address after: 518000 floor 1-2, building 1, Baotang hi tech Industrial Park, Tangwei village, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Fonda Semiconductor Equipment Co.,Ltd. Address before: 518000 1-2 / F, building 1, Baotang hi tech Industrial Park, Tangwei village, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN FONDA GRINDING TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210423 Address after: 518000 Room 201, building 34, block B, Yuanshan Industrial Zone, Shangcun community, Gongming street, Guangming District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Mengqi Semiconductor Equipment Co.,Ltd. Address before: 518000 floor 1-2, building 1, Baotang hi tech Industrial Park, Tangwei village, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Fonda Semiconductor Equipment Co.,Ltd. |