CN207124209U - A kind of new point-like COB light source LED encapsulating structure - Google Patents

A kind of new point-like COB light source LED encapsulating structure Download PDF

Info

Publication number
CN207124209U
CN207124209U CN201721051243.3U CN201721051243U CN207124209U CN 207124209 U CN207124209 U CN 207124209U CN 201721051243 U CN201721051243 U CN 201721051243U CN 207124209 U CN207124209 U CN 207124209U
Authority
CN
China
Prior art keywords
wiring board
light source
encapsulating structure
new point
cob light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201721051243.3U
Other languages
Chinese (zh)
Inventor
王永伟
何德成
陈星华
张永辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Elektra Industrial China Co Ltd
Original Assignee
Elektra Industrial China Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elektra Industrial China Co Ltd filed Critical Elektra Industrial China Co Ltd
Priority to CN201721051243.3U priority Critical patent/CN207124209U/en
Application granted granted Critical
Publication of CN207124209U publication Critical patent/CN207124209U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Led Device Packages (AREA)

Abstract

The utility model provides a kind of new point-like COB light source LED encapsulating structure, including is provided with the wiring board of conducting wire and several LED chips that matrix form is fitted on the wiring board;Phosphor powder layer and outermost glue layer are externally formed with each LED chip;And the phosphor powder layer and glue layer are integrally raised in arc-shaped;The positive source connection sheet and power cathode connection sheet for being electrically connected with external power source are also provided with simultaneously in described wiring board one end;The LED chip forms the middle part of protective layer in phosphor powder layer and glue layer; the design design is directly anchored on wiring board compared to traditional design, LED chip, eliminates LED package supports; save the cost of most of fluorescent material and glue; the glue covered on wiring board is tailed off, and the heat dispersion of LED light source is effectively lifted, the design flexible structure; volume can be done seldom; encapsulation is convenient, quickly, and can flexibly allocate up to required colour temperature.

Description

A kind of new point-like COB light source LED encapsulating structure
[technical field]
LED encapsulating structure technical field is the utility model is related to, more particularly to one kind can effectively save cost, carry The new point-like COB light source LED encapsulating structure of high heat dispersion.
[background technology]
LED is light emitting diode, is a kind of Sony ericsson mobile comm ab of semi-conductor type, common to have feux rouges, green glow, blue-ray LED Chip, blue-light LED chip can send white light by excitated fluorescent powder, and COB is English CHIP ON BOARD (chip is onboard) Abbreviation, COB light source be by multiple blue-light LED chips encapsulation on circuit boards, send white light through fluorescent material, glue, adjust The proportioning of fluorescent material and glue obtains the different-colour white light that people want, and COB light source is because equal with soft color, heat conduction The advantages that even, easy luminous intensity distribution, was widely used in LED illumination industry in recent years.
Traditional COB light source is to fix LED chip in the circuit board, with wire by LED positive and negative electrode and wiring board Pad it is corresponding connect, LED chip periphery box dam in the circuit board, the mixture of fluorescent material and glue is injected in box dam area, Baking dry after COB light source.This light source glue and fluorescent material are more, and cost is of a relatively high, and is unfavorable for radiating, no Beneficial to the matters of reality.
Based on above mentioned problem, those skilled in the art has carried out substantial amounts of research and development and experiment, from the specific of LED encapsulation Start with terms of structure and principle and be improved and improve, and achieve preferable achievement.
[utility model content]
To overcome the problems of prior art, the utility model, which provides one kind, can effectively save cost, improve The new point-like COB light source LED encapsulating structure of heat dispersion.
The scheme that the utility model solves technical problem is to provide a kind of new point-like COB light source LED encapsulating structure, wraps Include the wiring board for being provided with conducting wire and several LED chips that matrix form is fitted on the wiring board;Described each LED chip is externally formed with phosphor powder layer and outermost glue layer;And the phosphor powder layer and glue layer are in integrally circular arc Shape is raised;The positive source connection sheet and electricity for being electrically connected with external power source are also provided with simultaneously in described wiring board one end Source negative straps;The LED chip forms the middle part of protective layer in phosphor powder layer and glue layer.
Preferably, the LED chip is set in two row parallel side-by-sides.
Preferably, the power cathode connection sheet is rounded;Positive source connection sheet is square.
Preferably, described wiring board one end is additionally provided with the green indicating lamp that can produce blinking light.
Preferably, it is additionally provided with temperature sensor on the wiring board.
Preferably, the thickness of the phosphor powder layer is less than the thickness of glue layer.
Preferably, the circuit back is provided with adhesive.
Preferably, it is welded with power switch on the wiring board.
Compared with prior art, a kind of new point-like COB light source LED encapsulating structure of the utility model by by each LED chip 12 is fitted on the wiring board 11, and phosphor powder layer and glue layer are formed outside each LED chip 12, so Design be directly anchored to compared to traditional design, LED chip 12 on wiring board 11, eliminate LED package supports, save big portion Divide the cost of fluorescent material and glue, the glue covered on wiring board 11 is tailed off, and the heat dispersion of LED light source is effectively carried Rise, the design flexible structure, volume can be done seldom, and encapsulation is convenient, quickly, and can flexibly be allocated up to required colour temperature.
[brief description of the drawings]
Fig. 1 is that a kind of the utility model new point-like COB light source LED encapsulating structure faces status architecture schematic diagram.
Fig. 2 is a kind of section status architecture schematic diagram of new point-like COB light source LED encapsulating structure of the utility model.
[embodiment]
To make the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with drawings and Examples, The utility model is further elaborated.It should be appreciated that specific embodiment described herein is used only for explaining this Utility model, it is not used to limit this utility model.
Fig. 1 and Fig. 2 are referred to, a kind of new point-like COB light source LED encapsulating structure 1 of the utility model includes being provided with Several LED chips 12 that the wiring board 11 and matrix form of conducting wire are fitted on the wiring board 11;In each LED Chip 12 is externally formed with phosphor powder layer and outermost glue layer;And the phosphor powder layer and glue layer are in integrally arc-shaped It is raised;The positive source connection sheet 113 for being electrically connected with external power source is also provided with simultaneously in described one end of wiring board 11 With power cathode connection sheet 111;The LED chip 12 is located at phosphor powder layer and glue layer forms the pars intermedia of protective layer 13 Position.
By the way that each LED chip 12 is fitted on the wiring board 11, and fluorescent material is formed outside each LED chip 12 Layer and glue layer, such design are directly anchored on wiring board 11 compared to traditional design, LED chip 12, eliminate LED Package support, the cost of most of fluorescent material and glue is saved, the glue covered on wiring board 11 tails off, and LED light source dissipates Hot property is effectively lifted, the design flexible structure, and volume can be done seldom, and encapsulation is convenient, quickly, and can flexibly allocate and reach Required colour temperature.
Preferably, the LED chip 12 is set in two row parallel side-by-sides.It is reasonable in design, it is convenient for the tune of colour temperature It is whole.
Preferably, the power cathode connection sheet 111 is rounded;Positive source connection sheet 113 is square.
Preferably, described one end of wiring board 11 is additionally provided with the green indicating lamp that can produce blinking light.Improve safety Performance.
Preferably, it is additionally provided with temperature sensor on the wiring board 11.Be advantageous to carry out accurate stable detection.
Preferably, the thickness of the phosphor powder layer is less than the thickness of glue layer.
Preferably, the back side of wiring board 11 is provided with adhesive.
Preferably, it is welded with power switch on the wiring board 11.
Compared with prior art, a kind of new point-like COB light source LED encapsulating structure 1 of the utility model by by each LED chip 12 is fitted on the wiring board 11, and phosphor powder layer and glue layer are formed outside each LED chip 12, so Design be directly anchored to compared to traditional design, LED chip 12 on wiring board 11, eliminate LED package supports, save big portion Divide the cost of fluorescent material and glue, the glue covered on wiring board 11 is tailed off, and the heat dispersion of LED light source is effectively carried Rise, the design flexible structure, volume can be done seldom, and encapsulation is convenient, quickly, and can flexibly be allocated up to required colour temperature.
Above-described the utility model embodiment, does not form the restriction to scope of protection of the utility model.It is any Made within spirit of the present utility model and principle modifications, equivalent substitutions and improvements etc., should be included in the utility model Claims within.

Claims (8)

  1. A kind of 1. new point-like COB light source LED encapsulating structure, it is characterised in that:Wiring board including being provided with conducting wire And several LED chips that matrix form is fitted on the wiring board;Phosphor powder layer is externally formed with each LED chip And outermost glue layer;And the phosphor powder layer and glue layer are integrally raised in arc-shaped;In described wiring board one end also The positive source connection sheet and power cathode connection sheet for being electrically connected with external power source are provided with simultaneously;The LED chip The middle part of protective layer is formed positioned at phosphor powder layer and glue layer.
  2. A kind of 2. new point-like COB light source LED encapsulating structure as claimed in claim 1, it is characterised in that:The LED core Piece is set in two row parallel side-by-sides.
  3. A kind of 3. new point-like COB light source LED encapsulating structure as claimed in claim 1, it is characterised in that:The power supply is born Pole connection sheet is rounded;Positive source connection sheet is square.
  4. 4. a kind of new point-like COB light source LED encapsulating structure as described in any one claim in claims 1 to 3, It is characterized in that:Described wiring board one end is additionally provided with the green indicating lamp that can produce blinking light.
  5. A kind of 5. new point-like COB light source LED encapsulating structure as claimed in claim 4, it is characterised in that:The wiring board On be additionally provided with temperature sensor.
  6. A kind of 6. new point-like COB light source LED encapsulating structure as claimed in claim 1, it is characterised in that:The fluorescent material The thickness of layer is less than the thickness of glue layer.
  7. A kind of 7. new point-like COB light source LED encapsulating structure as claimed in claim 1, it is characterised in that:The wiring board The back side is provided with adhesive.
  8. A kind of 8. new point-like COB light source LED encapsulating structure as described in claim 1 or 7, it is characterised in that:The line Power switch is welded with the plate of road.
CN201721051243.3U 2017-08-22 2017-08-22 A kind of new point-like COB light source LED encapsulating structure Active CN207124209U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721051243.3U CN207124209U (en) 2017-08-22 2017-08-22 A kind of new point-like COB light source LED encapsulating structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721051243.3U CN207124209U (en) 2017-08-22 2017-08-22 A kind of new point-like COB light source LED encapsulating structure

Publications (1)

Publication Number Publication Date
CN207124209U true CN207124209U (en) 2018-03-20

Family

ID=61602435

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721051243.3U Active CN207124209U (en) 2017-08-22 2017-08-22 A kind of new point-like COB light source LED encapsulating structure

Country Status (1)

Country Link
CN (1) CN207124209U (en)

Similar Documents

Publication Publication Date Title
US20130155664A1 (en) Led lighting apparatus
CN201190979Y (en) LED light-emitting device with high thermal diffusivity
CN207124209U (en) A kind of new point-like COB light source LED encapsulating structure
CN102810620A (en) Light emitting diode (LED) encapsulated by adopting semiconductor refrigeration plate as support
CN211600348U (en) Make things convenient for COB light source of line design
CN213394676U (en) LED lamp bead
CN209026542U (en) A kind of dual wavelength white LED lamp
CN201103857Y (en) Integrated LED light source component
CN203659925U (en) High brightness surface mount device light-emitting diode
CN209213801U (en) LED lamp shell
CN202888237U (en) LED (Light Emitting Diode) packaging structure
CN207230198U (en) A kind of COB light source
CN206504140U (en) A kind of light-source structure
CN203895451U (en) Large power led packaging structure
CN214625038U (en) Built-in integrated IC self-changing full-color LED device
CN210379043U (en) Luminous even flip-chip COB packaging structure
CN203336295U (en) LED lamp convenient to install and dismantle
CN203398152U (en) Led
CN202674897U (en) A white light LED light source module
CN107123644A (en) A kind of high heat conduction glass fibre basal plate LED integrated packaging power sources
CN216288441U (en) Heat dissipation type LED paster packaging structure
CN201946592U (en) White light emitting diode (LED) packaging structure
CN202747042U (en) Light-emitting diode (LED) fluorescent lamp
CN201289009Y (en) Oval-shaped LED module with lamp cup
CN209766414U (en) Side light-emitting lamp bead

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant