CN209213801U - Housing for LED lamps - Google Patents

Housing for LED lamps Download PDF

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Publication number
CN209213801U
CN209213801U CN201821968985.7U CN201821968985U CN209213801U CN 209213801 U CN209213801 U CN 209213801U CN 201821968985 U CN201821968985 U CN 201821968985U CN 209213801 U CN209213801 U CN 209213801U
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cover
cover body
heat dissipation
led
installation cavity
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范继良
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Abstract

The utility model discloses a shell for LED lamps and lanterns, it includes the lid and the cover body that all are the rectangle structure, the lid is transparent sunk structure, the lid is detachable joint on the cover body and the interval certain distance between the two, this interval forms the heat dissipation chamber, the cover body is sunken to form the installation cavity that supplies the installation of LED light source module, the cover body is still sunken to form the reflection cup, the bottom of reflection cup runs through the cover body and sets up the mounting hole that supplies the LED chip of LED light source module to get into in the reflection cup, the lateral wall of the cover body runs through from the installation cavity and sets up the louvre towards its edge is the slope, still be the even through on the cover body and set up the through-hole, the heat dissipation chamber is by the through-hole with the installation cavity intercommunication, the installation cavity is by the louvre with external intercommunication, thereby lead to the heat that LED chip; therefore, the utility model discloses can protect LED light source module, can carry out quick heat dissipation again, simple structure and practicality.

Description

LED灯具用壳体Housing for LED lamps

技术领域technical field

本实用新型涉及一种灯具的配件,尤其涉及一种LED灯具的壳体。The utility model relates to an accessory of a lamp, in particular to a housing of an LED lamp.

背景技术Background technique

现有的LED灯具的基本结构是一块电致发光的半导体材料芯片,用银胶或白胶固化到支架上,然后用银线或金线连接芯片和电路板,然后四周用环氧树脂密封,起到保护内部芯线的作用,最后安装外壳,所以LED灯具的抗震性能好。是一种能够将电能转化为可见光的固态的半导体器件,它可以直接把电转化为光。LED灯具的心脏是一个半导体的LED芯片,LED芯片的一端附在一个支架上,一端是负极,另一端连接电源的正极,使整个LED芯片被环氧树脂封装起来。The basic structure of the existing LED lamps is an electroluminescent semiconductor material chip, which is cured on the bracket with silver glue or white glue, and then the chip and the circuit board are connected with silver or gold wires, and then sealed with epoxy resin around. It plays the role of protecting the inner core wire, and finally installs the shell, so the shock resistance of the LED lamp is good. It is a solid-state semiconductor device that can convert electrical energy into visible light, and it can directly convert electricity into light. The heart of the LED lamp is a semiconductor LED chip. One end of the LED chip is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply, so that the entire LED chip is encapsulated by epoxy resin.

半导体的LED芯片由两部分组成,一部分是P型半导体,在它里面空穴占主导地位,另一端是N型半导体,在这边主要是电子。但这两种半导体连接起来的时候,它们之间就形成一个P-N结。当电流通过导线作用于这个LED芯片的时候,电子就会被推向P区,在P区里电子跟空穴复合,然后就会以光子的形式发出能量,这就是LED芯片发光的原理。而光的波长也就是光的颜色,是由形成P-N结的材料决定的。The LED chip of semiconductor is made up of two parts, and a part is P-type semiconductor, and inside it occupies an leading position in hole, and the other end is N-type semiconductor, is mainly electron here. But time these two kinds of semiconductors couple together, between them, just form a P-N junction. When the current acts on the LED chip through the wire, the electrons will be pushed to the P area, and in the P area, the electrons will recombine with the holes, and then energy will be emitted in the form of photons, which is the principle of the LED chip to emit light. And the wavelength of light i.e. the color of light, be determined by the material forming P-N junction.

最初LED用作仪器仪表的指示光源,后来各种光色的LED在交通信号灯和大面积显示屏中得到了广泛应用,产生了很好的经济效益和社会效益。以12英寸的红色交通信号灯为例,在美国本来是采用长寿命,低光视效能的140瓦白炽灯作为光源,它产生2000流明的白光。经红色滤光片后,光损失90%,只剩下200流明的红光。而在新设计的灯中,Lumileds公司采用了18个红色LED光源,包括电路损失在内,共耗电14瓦,即可产生同样的光效。汽车信号灯也是LED光源应用的重要领域。Initially, LEDs were used as indicating light sources for instruments and meters. Later, LEDs of various light colors were widely used in traffic lights and large-area display screens, resulting in good economic and social benefits. Take the 12-inch red traffic light as an example. In the United States, a long-life, low-light 140-watt incandescent lamp was originally used as the light source, which produces 2000 lumens of white light. After passing through the red filter, 90% of the light is lost, leaving only 200 lumens of red light. In the newly designed lamp, Lumileds uses 18 red LED light sources, including circuit loss, and consumes a total of 14 watts of power to produce the same light effect. Automobile signal lights are also an important field of application of LED light sources.

对于一般照明而言,人们更需要白色的光源。GaN芯片发蓝光(λp=465nm,Wd=30nm),高温烧结制成的含Ce3+的YAG荧光粉受此蓝光激发后发出黄色光射,峰值550nLED灯m。蓝光LED芯片安装在碗形反射腔中,覆盖以混有YAG的树脂薄层,约200-500nm。LED芯片发出的蓝光部分被荧光粉吸收,另一部分蓝光与荧光粉发出的黄光混合,可以得到白光。For general lighting, people need more white light sources. The GaN chip emits blue light (λp=465nm, Wd=30nm), and the YAG phosphor powder containing Ce3+ produced by high-temperature sintering is excited by the blue light and emits yellow light with a peak value of 550nm. The blue LED chip is installed in a bowl-shaped reflective cavity, covered with a thin layer of resin mixed with YAG, about 200-500nm. Part of the blue light emitted by the LED chip is absorbed by the phosphor, and the other part of the blue light is mixed with the yellow light emitted by the phosphor to obtain white light.

目前,现有的LED灯具的LED安装时,LED芯片首先焊接PCB板上,随后固定在铝基板上从而形成LED光源模组,在将该LED光源模组安装于壳体中,之后再通过螺钉将壳体固定到其他构件(如灯体)上,而且还需要在铝基板和散热器之间涂散热树脂(如硅胶)进行散热,但是散热树脂经常涂抹不均而导致铝基板与散热器之间粘合不好,进而导致LED的散热效果差,降低了LED的寿命。另外,LED的散热结构不是一体式结构,从成本上考虑比较浪费材料,从管理上考虑还多三到四个物料的管理成本。因此LED灯具的散热效果对其寿命是至关重要的。At present, when installing LEDs in existing LED lamps, the LED chips are first welded on the PCB, and then fixed on the aluminum substrate to form an LED light source module. Fix the shell to other components (such as the lamp body), and it is also necessary to apply heat dissipation resin (such as silica gel) between the aluminum substrate and the heat sink for heat dissipation, but the heat dissipation resin is often applied unevenly, resulting in a gap between the aluminum substrate and the heat sink. The adhesion between the LEDs is not good, which leads to poor heat dissipation of the LED and reduces the life of the LED. In addition, the heat dissipation structure of the LED is not a one-piece structure, which wastes materials in terms of cost, and also costs three to four more materials in terms of management. Therefore, the heat dissipation effect of LED lamps is crucial to its life.

现有的LED灯具的壳体基本上只是起保护LED光源模组作用,其散热主要是通过增加散热鳍片等散热器来实现散热的。The housing of the existing LED lamp basically only serves to protect the LED light source module, and its heat dissipation is mainly realized by adding heat sinks such as heat dissipation fins.

因此,亟需一种既能保护LED光源模组又能进行快速散热的壳体。Therefore, there is an urgent need for a housing that can not only protect the LED light source module but also quickly dissipate heat.

实用新型内容Utility model content

本实用新型的目的是提供一种能保护LED光源模组又能进行快速散热的LED灯具用壳体。The purpose of the utility model is to provide a housing for LED lamps that can protect the LED light source module and quickly dissipate heat.

为了实现上有目的,本实用新型提供了一种LED灯具用壳体,其包括均呈矩形结构的盖体及罩体,所述盖体呈透明的凹陷结构,所述盖体的侧壁呈可拆卸的卡接于所述罩体的正面上,卡接于所述罩体上的盖体与所述罩体的正面之间间距一定距离,所述盖体与所述罩体的正面之间的间距形成散热腔,所述罩体的背面凹陷形成供LED光源模组安装的安装腔,所述罩体的正面朝所述安装腔方向凹陷形成锥形结构的反射杯,所述反射杯呈矩阵的分布于所述罩体上,所述反射杯的底部贯穿所述罩体开设有供LED光源模组的LED芯片进入所述反射杯内的安装孔,所述罩体的侧壁自所述安装腔内朝其边缘呈倾斜的贯穿开设有散热孔,所述罩体上还呈均匀的贯穿开设有通孔,所述散热腔借由所述通孔与所述安装腔连通,所述安装腔借由所述散热孔与外界连通。In order to realize the purpose, the utility model provides a housing for LED lamps, which includes a cover body and a cover body in a rectangular structure, the cover body is in a transparent concave structure, and the side wall of the cover body is in the shape of It is detachably clamped on the front of the cover, and there is a certain distance between the cover clamped on the cover and the front of the cover, and the distance between the cover and the front of the cover is The distance between them forms a heat dissipation cavity, the back of the cover body is recessed to form an installation cavity for the LED light source module to be installed, and the front of the cover body is recessed toward the direction of the installation cavity to form a reflective cup with a tapered structure. The reflective cup Distributed in a matrix on the cover body, the bottom of the reflective cup penetrates the cover body to open installation holes for the LED chips of the LED light source module to enter the reflective cup, and the side wall of the cover body The inside of the installation cavity is obliquely opened with heat dissipation holes towards its edge, and the cover body is also uniformly penetrated with through holes, and the heat dissipation cavity communicates with the installation cavity through the through holes. The installation cavity communicates with the outside through the heat dissipation hole.

较佳地,本实用新型的LED灯具用壳体中罩体的正面开设有卡槽,所述盖体呈可拆卸的插入所述卡槽中。Preferably, in the housing for LED lamps of the present invention, a card slot is opened on the front of the cover body, and the cover body is detachably inserted into the card slot.

较佳地,本实用新型的LED灯具用壳体中相邻的四个所述反射杯的中心处设置一所述通孔。Preferably, a through hole is provided at the center of the four adjacent reflective cups in the LED lamp housing of the present invention.

与现有技术相比,由于本实用新型散热腔借由通孔与安装腔连通,安装腔借由散热孔与外界连通,因此使得无论是反射杯中的LED芯片产生的热量,还是安装腔中LED光源模组产生的热量,最后都能通过散热孔而散失于外界环境中,并且借由不同位置处开设的散热孔与安装腔之间的对流、以及不同位置处开设的通孔与散热腔之间的对流,能快速有效将LED芯片及LED光源模组工作时产生的热量导出到外界环境中散失掉;同时,由于在悬挂使用时,LED芯片需要朝下进而进行照明,如户外路灯等,因此散热孔将呈现出倾斜朝下的使用状态,确保具有良好的散热作用情况下,还有效的防止了雨水通过该散热孔进入壳体内,结构简单且使用;另,通过盖体与罩体的可拆卸设计,可快速方便的进行维护和安装,将LED光源模组安装于罩体凹陷形成的安装腔内,有效的实现了对LED光源模组的保护;由此可见,本实用新型的LED灯具用壳体,既能保护LED光源模组,又能进行快速的散热,结构简单且实用。Compared with the prior art, since the heat dissipation cavity of the utility model communicates with the installation cavity through the through hole, and the installation cavity communicates with the outside world through the heat dissipation hole, no matter the heat generated by the LED chip in the reflection cup or the heat generated in the installation cavity The heat generated by the LED light source module can finally be dissipated into the external environment through the heat dissipation holes, and through the convection between the heat dissipation holes and the installation cavity at different positions, as well as the through holes and heat dissipation cavity at different positions The convection between the LED chips and the LED light source module can quickly and effectively export the heat generated by the LED chip and the LED light source module to the external environment and dissipate it; at the same time, because the LED chip needs to face down for lighting when it is suspended, such as outdoor street lamps, etc. , so the heat dissipation holes will be in a state of use inclined downwards, ensuring good heat dissipation, and effectively preventing rainwater from entering the housing through the heat dissipation holes, the structure is simple and easy to use; in addition, through the cover and the cover The detachable design can be quickly and conveniently maintained and installed, and the LED light source module is installed in the installation cavity formed by the recess of the cover body, which effectively realizes the protection of the LED light source module; it can be seen that the utility model The housing for the LED lamp can not only protect the LED light source module, but also quickly dissipate heat, and has a simple and practical structure.

附图说明Description of drawings

图1是本实用新型LED灯具用壳体的结构示意图。Fig. 1 is a structural schematic diagram of a housing for an LED lamp of the present invention.

图2是图1的分解结构示意图。FIG. 2 is a schematic diagram of the exploded structure of FIG. 1 .

图3是图2的另一角度结构示意图。FIG. 3 is a schematic structural diagram of another angle of FIG. 2 .

图4是沿图1中A-A线的剖视结构示意图。Fig. 4 is a schematic cross-sectional structural diagram along line A-A in Fig. 1 .

图5是本实用新型的罩体的结构示意图。Fig. 5 is a schematic structural view of the cover body of the present invention.

具体实施方式Detailed ways

为详细说明本实用新型的技术内容、构造特征、所实现目的及效果,以下结合实施方式并配合附图详予说明。In order to describe the technical content, structural features, achieved goals and effects of the present utility model in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

如图1-图5所示,本实用新型的LED灯具用壳体100,包括均呈矩形结构的盖体2及罩体3,所述盖体2呈透明的凹陷结构21,盖体2的侧壁22呈可拆卸的卡接于罩体3的正面上,卡接于罩体3上的盖体2与罩体3的正面之间间距一定距离,盖体2与罩体3的正面之间的间距形成散热腔23,罩体3的背面凹陷形成供LED光源模组(图中未示)安装的安装腔31,罩体3的正面朝安装腔31方向凹陷形成锥形结构的反射杯32,反射杯32呈矩阵的分布于罩体3上,反射杯32的底部贯穿罩体3开设有供LED光源模组的LED芯片进入反射杯32内的安装孔33,罩体3的侧壁34自安装腔31内朝该侧壁34的边缘35呈倾斜的贯穿开设有散热孔36,罩体3上还呈均匀的贯穿开设有通孔37,所述散热腔23借由通孔37与安装腔31连通,安装腔31借由散热孔36与外界连通;具体地,由于本实用新型散热腔23借由通孔37与安装腔31连通,安装腔31又借由散热孔36与外界连通,从而使得LED芯片所在的散热腔23在通孔36、安装腔31及散热孔36的连通作用下与外界连通,即LED芯片工作时(即通电发光)产生的热量首先积聚在散热腔23中,由于散热腔23具有较大的空间面积,因此会有效的降低LED芯片的温度,积聚在散热腔23中的热量在通孔37的作用下排出到安装腔31中,进入到安装腔31中的热量再通过散热孔36排出到外界,从而将散热腔23中的LED芯片产生的热量和安装腔31中的LED光源模组产生的热量排出到外界中散失;并且借由不同位置处开设的散热孔36与安装腔31之间的对流、以及不同位置处开设的通孔37与散热腔23之间的对流,能更加快速有效将LED芯片及LED光源模组工作时产生的热量导出到外界环境中散失掉。以下继续结合图1-图5对本实用新型的LED灯具用壳体100作进一步详细的说明:As shown in Figures 1 to 5, the LED lamp housing 100 of the present invention includes a cover body 2 and a cover body 3 both in a rectangular structure, the cover body 2 is a transparent concave structure 21, and the cover body 2 The side wall 22 is detachably clamped on the front of the cover body 3, and there is a certain distance between the cover body 2 clamped on the cover body 3 and the front surface of the cover body 3, and the distance between the cover body 2 and the front surface of the cover body 3 The distance between them forms a cooling cavity 23, the back of the cover body 3 is recessed to form an installation cavity 31 for the LED light source module (not shown in the figure) to be installed, and the front of the cover body 3 is recessed toward the installation cavity 31 to form a reflective cup with a conical structure 32. The reflective cups 32 are distributed on the cover body 3 in a matrix. The bottom of the reflective cups 32 penetrates the cover body 3 to provide mounting holes 33 for the LED chips of the LED light source module to enter the reflective cup 32. The side walls of the cover body 3 34 from the inside of the installation cavity 31 toward the edge 35 of the side wall 34 is obliquely opened with a heat dissipation hole 36, and the cover body 3 is also uniformly penetrated with a through hole 37, and the heat dissipation cavity 23 is connected with the through hole 37. The installation chamber 31 communicates, and the installation chamber 31 communicates with the outside world through the cooling holes 36; , so that the heat dissipation cavity 23 where the LED chip is located is communicated with the outside world under the communication effect of the through hole 36, the mounting cavity 31 and the heat dissipation hole 36, that is, the heat generated by the LED chip when it is working (that is, energized and illuminated) first accumulates in the heat dissipation cavity 23 , because the heat dissipation cavity 23 has a larger space area, it will effectively reduce the temperature of the LED chip, and the heat accumulated in the heat dissipation cavity 23 will be discharged into the installation cavity 31 under the action of the through hole 37, and enter the installation cavity 31 The heat is then discharged to the outside world through the cooling holes 36, so that the heat generated by the LED chip in the cooling cavity 23 and the heat generated by the LED light source module in the mounting cavity 31 are discharged to the outside and dissipated; The convection between the heat dissipation holes 36 and the installation cavity 31, and the convection between the through holes 37 opened at different positions and the heat dissipation cavity 23 can more quickly and effectively export the heat generated by the LED chip and the LED light source module to the outside world. lost in the environment. The housing 100 for LED lamps of the present invention will be further described in detail in conjunction with FIGS. 1-5 below:

如图2所示,较佳者,本实用新型的LED灯具用壳体100中罩体3的正面开设有卡槽38,所述盖体2的侧壁22呈可拆卸的插入所述卡槽38中;借由盖体3的侧壁22与卡槽38的插接实现盖体2与罩体3的可拆卸连接,组装及拆解均方便,还有效的避免了采用螺钉等进行固定所带来的繁琐操作。As shown in Figure 2, preferably, the front of the cover body 3 in the LED lamp housing 100 of the present utility model is provided with a card slot 38, and the side wall 22 of the cover body 2 is detachably inserted into the card slot. 38; the detachable connection between the cover body 2 and the cover body 3 is realized through the insertion of the side wall 22 of the cover body 3 and the card slot 38, which is convenient for assembly and disassembly, and effectively avoids the use of screws and the like for fixing. cumbersome operations.

如图2、图3及图5所示,较佳者,本实用新型的LED灯具用壳体100中相邻的四个所述反射杯32的中心处设置一所述通孔37。As shown in FIG. 2 , FIG. 3 and FIG. 5 , preferably, a through hole 37 is provided at the center of the four adjacent reflective cups 32 in the LED lamp housing 100 of the present invention.

结合图1-图5所示,由于本实用新型散热腔23借由通孔37与安装腔31连通,安装腔31借由散热孔36与外界连通,因此使得无论是反射杯32中的LED芯片产生的热量,还是安装腔31中LED光源模组产生的热量,最后都能通过散热孔36而散失于外界环境中,并且借由不同位置处开设的散热孔36与安装腔31之间的对流、以及不同位置处开设的通孔37与散热腔23之间的对流,能快速有效将LED芯片及LED光源模组工作时产生的热量导出到外界环境中散失掉;同时,由于在悬挂使用时,LED芯片需要朝下进而进行照明,如户外路灯等,因此散热孔36将呈现出倾斜朝下的使用状态(图3所示状态),确保具有良好的散热作用情况下,还有效的防止了雨水通过该散热孔36进入壳体内,结构简单且使用;另,通过盖体2与罩体3的可拆卸设计,可快速方便的进行维护和安装,将LED光源模组安装于罩体3凹陷形成的安装腔31内,有效的实现了对LED光源模组的保护;由此可见,本实用新型的LED灯具用壳体,既能保护LED光源模组,又能进行快速的散热,结构简单且实用。1-5, since the cooling cavity 23 of the present invention communicates with the mounting cavity 31 through the through hole 37, and the mounting cavity 31 communicates with the outside world through the cooling hole 36, no matter the LED chip in the reflective cup 32 The heat generated, or the heat generated by the LED light source module in the installation cavity 31, can finally be dissipated to the external environment through the heat dissipation holes 36, and through the convection between the heat dissipation holes 36 opened at different positions and the installation cavity 31 , and the convection between the through holes 37 set at different positions and the cooling cavity 23, can quickly and effectively export the heat generated by the LED chip and the LED light source module to the external environment for dissipation; , the LED chip needs to be illuminated downwards, such as outdoor street lamps, etc., so the heat dissipation holes 36 will show an inclined downward use state (state shown in Figure 3), to ensure good heat dissipation, and effectively prevent the Rainwater enters the casing through the heat dissipation hole 36, and the structure is simple and easy to use; in addition, through the detachable design of the cover body 2 and the cover body 3, maintenance and installation can be performed quickly and conveniently, and the LED light source module is installed in the recess of the cover body 3 The formed installation cavity 31 effectively realizes the protection of the LED light source module; it can be seen that the housing for the LED lamp of the present invention can not only protect the LED light source module, but also quickly dissipate heat, and has a simple structure And practical.

另,本实用新型所涉及的LED光源模组及其LED芯片的具体结构及发光原理,均为本领域普通技术人员所熟知的,在此不再作详细的说明。In addition, the specific structure and light-emitting principle of the LED light source module and its LED chips involved in the present invention are well known to those skilled in the art, and will not be described in detail here.

以上所揭露的仅为本实用新型的优选实施例而已,当然不能以此来限定本实用新型之权利范围,因此依本实用新型申请专利范围所作的等同变化,仍属本实用新型所涵盖的范围。What is disclosed above is only the preferred embodiment of the present utility model, and of course the scope of rights of the present utility model cannot be limited with this. Therefore, the equivalent changes made according to the patent scope of the utility model still belong to the scope covered by the utility model .

Claims (3)

1. a kind of LED lamp shell, which is characterized in that including lid and cover in rectangular configuration, the lid is in saturating Bright sunk structure, the side wall of the lid are connected on the cover in being removably connected on the front of the cover Lid and the cover front between spacing certain distance, the spacing between the lid and the front of the cover formed Heat dissipation cavity, the back side recess of the cover form the installation cavity installed for LED light source mould group, and the cover just faces the peace The reflector for the tapered structure of direction concave shape of behaveing affectedly, the reflector are distributed on the cover in matrix, the reflection Cup bottom through the cover offer for LED light source mould group LED chip enter the reflector in mounting hole, it is described The side wall of cover offers heat release hole towards inclined the running through in its edge from the installation cavity, also in uniform on the cover Through through-hole is offered, the heat dissipation cavity is connected to by the through-hole with the installation cavity, and the installation cavity is by the heat dissipation Hole is in communication with the outside.
2. LED lamp shell as described in claim 1, which is characterized in that the front of the cover offers card slot, described The side wall of lid is in removably to be inserted into the card slot.
3. LED lamp shell as described in claim 1, which is characterized in that at the center of four adjacent reflectors One through-hole is set.
CN201821968985.7U 2018-11-27 2018-11-27 Housing for LED lamps Expired - Fee Related CN209213801U (en)

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CN201821968985.7U CN209213801U (en) 2018-11-27 2018-11-27 Housing for LED lamps

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111862842A (en) * 2020-08-11 2020-10-30 深圳市锐拓显示技术有限公司 LED display assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111862842A (en) * 2020-08-11 2020-10-30 深圳市锐拓显示技术有限公司 LED display assembly

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