CN207097804U - A kind of high-frequency inversion structure and programming dc source - Google Patents
A kind of high-frequency inversion structure and programming dc source Download PDFInfo
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- CN207097804U CN207097804U CN201721087697.6U CN201721087697U CN207097804U CN 207097804 U CN207097804 U CN 207097804U CN 201721087697 U CN201721087697 U CN 201721087697U CN 207097804 U CN207097804 U CN 207097804U
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Abstract
The utility model provides a kind of high-frequency inversion structure and programming dc source, it is related to high frequency electric source technical field, the programming dc source includes liquid cooling base and high-frequency inversion structure, the high-frequency inversion structure includes (PCC) power, drive component and heat-conductive assembly, (PCC) power includes power amplifier board and multiple power tubes, and multiple power tubes are removably attachable to the second face of power amplifier board.Heat-conductive assembly is connected to the second face of power amplifier board.Drive component includes driving plate and multiple support conductive poles, and driving plate be arranged in parallel with power amplifier board, and each one end for supporting conductive pole is removably attachable to the first face of power amplifier board, and the other end is connected to the fourth face of driving plate.Multiple support conductive poles are electrically connected with power amplifier board, and power amplifier board is electrically connected with multiple power tubes respectively.Compared to prior art, a kind of high-frequency inversion structure provided by the utility model, compact overall structure, small volume, while there is good radiating effect.
Description
Technical field
High frequency electric source technical field is the utility model is related to, in particular to a kind of high-frequency inversion structure and programming
Dc source.
Background technology
In the prior art, the inversion component of box-type high frequency switch power uses air-cooled structure more.As existing patent is (public
The number of opening：CN203645571U the inversion module and its structure of a kind of relative compact are disclosed in).Under equal volume, this knot
Structure adds air-cooled mode to meet the radiating of small-power inversion component, it is impossible to meets the radiating of more high power contravariant component.This
Outside, the blower fan type of cooling, dirt is easily tied after long-time use, influences radiating effect.
With development of the high frequency switch power to high power density trend, on the basis of existing box sizes, the work(of power supply
Rate will be bigger, and it is more compact that this make it that the structure of high-frequency inversion component needs.Therefore, a kind of good heat dissipation effect, small volume, knot need to be provided
Structure is simple, is easy to the high-frequency inversion component safeguarded.
Utility model content
The purpose of this utility model is to provide a kind of high-frequency inversion structure, its good heat dissipation effect, small volume, simple in construction
And it is easy to safeguard.
Another object of the present utility model is that providing one kind programs dc source, and radiating effect is good, small volume, structure
Simply and it is easy to safeguard.
The utility model is realized using following technical scheme.
A kind of high-frequency inversion structure, including (PCC) power, drive component and heat-conductive assembly, (PCC) power include power amplifier board
And there are the first face being oppositely arranged and the second face, multiple power tubes to be removably attachable to work(for multiple power tubes, power amplifier board
Second face of rate plate；Heat-conductive assembly is connected to the second face of power amplifier board, for taking away heat caused by power amplifier board.Drive component bag
Driving plate and multiple support conductive poles are included, driving plate be arranged in parallel with power amplifier board and with the 3rd face and the 4th being oppositely arranged
Face, each one end for supporting conductive pole are removably attachable to the first face of power amplifier board, and the other end is connected to the 4th of driving plate
Face, for supporting driving plate, be provided with drive circuit on the 3rd face of driving plate, drive circuit respectively with multiple support conductive poles
It is electrically connected with, multiple support conductive poles are electrically connected with power amplifier board, and power amplifier board is electrically connected with multiple power tubes respectively.
Further, there are multiple installation through-holes on power amplifier board, also there are the multiple first conductions on the first face of power amplifier board
Terminal pad, also there are multiple second conductive lands, each first conductive lands and each second on the second face of power amplifier board
Conductive lands are relative with installation through-hole and are electrically connected with power amplifier board, and multiple support conductive poles are correspondingly through more
Individual first conductive lands are simultaneously embedded in multiple installation through-holes correspondingly, and multiple support conductive poles are conductive by multiple first
Terminal pad is electrically connected with power amplifier board；Multiple power tubes are connected to multiple second conductive lands and by multiple correspondingly
Second conductive lands are electrically connected with power amplifier board.
Further, multiple mounting screws, multiple mounting screws and multiple support conductive poles one are additionally provided with driving plate
One correspondence, each mounting screw sequentially pass through driving plate, support conductive pole, the first conductive lands, power amplifier board, the second conduction even
Disk and power tube are connect, driving plate, support conductive pole, power amplifier board and power amplifier board are electrically connected with and fixed.
Further, it is copper post to support conductive pole.
Further, support conductive pole that there is connection boss close to one end of power amplifier board, connection boss has a stop surface,
Installation through-hole is stretched into one end of connection boss, and stop surface is connected to the first conductive lands and electrically connected with the first conductive lands
Connect.
Further, high-frequency inversion structure also includes multiple filter capacitors, and power amplifier board stretches out, multiple filter capacitor battle arrays
Row are arranged on power amplifier board, and have filter circuit on power amplifier board, and multiple filter capacitors are electrically connected with filter circuit, filtering
Loop is also electrically connected with power tube.
Further, power tube has input terminal and outlet terminal, and input terminal electrically connects with filter circuit
Connect, the circuit of output terminal connection of outlet terminal and power amplifier board.
Further, (PCC) power also includes auxiliary conductor, and auxiliary conductor is distributed on power amplifier board and electrical with power amplifier board
Connection, for the onboard stream of auxiliary power, electric current is exported to the output end of power amplifier board.
Further, heat-conductive assembly includes heat-radiating substrate and insulating heat-conductive pad, heat-radiating substrate are removably attachable to power
Second face of plate, insulating heat-conductive pad are arranged between heat-radiating substrate and power amplifier board, for transmit heat and completely cut off heat-radiating substrate with
Power amplifier board.
One kind programming dc source, including liquid cooling base and high-frequency inversion structure, the high-frequency inversion structure include power packages
Part, drive component and heat-conductive assembly, (PCC) power include power amplifier board and multiple power tubes, and power amplifier board has what is be oppositely arranged
First face and the second face, multiple power tubes are removably attachable to the second face of power amplifier board；Heat-conductive assembly is connected to power amplifier board
Second face, for taking away heat caused by power amplifier board.Drive component includes driving plate and multiple support conductive poles, driving plate and work(
Rate plate be arranged in parallel and is removably attachable to the 3rd face and fourth face being oppositely arranged, each one end for supporting conductive pole
First face of power amplifier board, the other end are connected to the fourth face of driving plate, for supporting driving plate, are set on the 3rd face of driving plate
There is drive circuit, drive circuit is electrically connected with multiple support conductive poles respectively, and multiple support conductive poles are electrical with power amplifier board
Connection, power amplifier board are electrically connected with multiple power tubes respectively.Liquid cooling base respectively with side of the heat-conductive assembly away from power amplifier board with
And side connection of the power tube away from power amplifier board.
The utility model has the advantages that：
A kind of high-frequency inversion structure provided by the utility model, multiple power tubes are removably attachable to the of power amplifier board
On two faces, and heat-conductive assembly is connected to the second face of power amplifier board, to take away heat caused by power amplifier board.Each support conductive pole
One end is removably attachable to the first face of power amplifier board, and the other end is connected to the fourth face of driving plate, for supporting driving plate.And
Drive circuit is electrically connected with multiple support conductive poles respectively, and multiple support conductive poles are electrically connected with power amplifier board, power amplifier board
It is electrically connected with respectively with multiple power tubes so that most power tube is electrically connected with drive circuit finally so that the drive in drive circuit
Dynamic signal is by supporting conductive pole to be transferred to power tube.Compared to prior art, a kind of high-frequency inversion provided by the utility model
Structure, it be arranged in parallel power amplifier board is relative with driving plate, and power tube is removably attachable on the second face of power amplifier board, makes
Compact overall structure, small volume are obtained, while there is good radiating effect.
Brief description of the drawings
, below will be to required use in embodiment in order to illustrate more clearly of the technical scheme of the utility model embodiment
Accompanying drawing be briefly described, it will be appreciated that the following drawings illustrate only some embodiments of the present utility model, therefore should not be by
Regard the restriction to scope as, for those of ordinary skill in the art, on the premise of not paying creative work, may be used also
To obtain other related accompanying drawings according to these accompanying drawings.
Fig. 1 is the structural representation at the visual angle of high-frequency inversion structure first that the utility model first embodiment provides；
Fig. 2 is the attachment structure schematic diagram of (PCC) power in Fig. 1；
Fig. 3 is the attachment structure schematic diagram that conductive pole is supported in Fig. 1；
Fig. 4 is the structural representation at the visual angle of high-frequency inversion structure second that the utility model first embodiment provides；
Fig. 5 is the overall structure diagram for the programming dc source that the utility model second embodiment provides.
Icon：100- high-frequency inversion structures；110- (PCC) powers；111- power tubes；113- power amplifier boards；1131- first is led
Electrically connect disk；The conductive lands of 1133- second；130- drive components；131- driving plates；133- supports conductive pole；1331- connections
Boss；150- filter capacitors；170- heat-conductive assemblies；171- heat-radiating substrates；173- insulating heat-conductive pads；200- programs dc source；
210- liquid cooling bases.
Embodiment
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer
Accompanying drawing in type embodiment, the technical scheme in the embodiment of the utility model is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model part of the embodiment, rather than whole embodiments.Generally here described in accompanying drawing and
The component of the utility model embodiment shown can be configured to arrange and design with a variety of.
Therefore, the detailed description of the embodiment of the present utility model to providing in the accompanying drawings is not intended to limit requirement below
The scope of the utility model of protection, but it is merely representative of selected embodiment of the present utility model.Based in the utility model
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all
Belong to the scope of the utility model protection.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent accompanying drawing in individual accompanying drawing.
, it is necessary to explanation, the side of the instruction such as term " " center ", " on ", " interior ", " outer " in description of the present utility model
Position or position relationship be based on orientation shown in the drawings or position relationship, or the utility model product using when usually put
Orientation or position relationship, be for only for ease of description the utility model and simplify and describe, rather than instruction or imply signified
Device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that new to this practicality
The limitation of type.In addition, term " first ", " second " etc. are only used for distinguishing description, and it is not intended that indicating or implying relatively heavy
The property wanted.
In description of the present utility model, it is also necessary to which explanation, unless otherwise clearly defined and limited, term " are set
Put ", " connected ", " installation ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected,
Or it is integrally connected；Can be mechanical connection or electrical connection；Can be joined directly together, intermediary can also be passed through
It is indirectly connected, can is the connection of two element internals.For the ordinary skill in the art, can be managed with concrete condition
Solve concrete meaning of the above-mentioned term in the utility model.
Below in conjunction with the accompanying drawings, some embodiments of the present utility model are elaborated.In the case where not conflicting, under
Feature in the embodiment stated can be mutually combined.
First embodiment
Reference picture 1, present embodiments provide a kind of high-frequency inversion structure 100, including (PCC) power 110, drive component
130th, multiple filter capacitors 150 and heat-conductive assembly 170, drive component 130 are connected with (PCC) power 110, for driving to be believed
(PCC) power 110 number is transferred to, multiple filter capacitors 150 are connected to (PCC) power 110, heat-conductive assembly 170 and (PCC) power 110
Connect and relative with multiple filter capacitors 150, heat caused by multiple filter capacitors 150 is transferred to by (PCC) power 110 leads
Hot component 170 is radiated, and effectively reduces the temperature rise of filter capacitor 150, extends the service life of filter capacitor 150.
(PCC) power 110 includes multiple power tubes 111, power amplifier board 113 and auxiliary conductor (not shown), auxiliary conductor point
Cloth is electrically connected with power amplifier board 113 and with power amplifier board 113, and for the current-carrying of auxiliary power plate 113, electric current is exported to power
The output end of plate 113.Power amplifier board 113 has the first face being oppositely arranged and the second face, multiple power tubes 111 detachably connected
In the second face of power amplifier board 113.Heat-conductive assembly 170 is connected to the second face of power amplifier board 113, is produced for taking away power amplifier board 113
Heat.
Power amplifier board 113 stretches out, and multiple arrays of filter capacitor 150 are arranged on power amplifier board 113, and on power amplifier board 113
With filter circuit, multiple filter capacitors 150 are electrically connected with filter circuit, and filter circuit also electrically connects with power tube 111
Connect.
In the present embodiment, power tube 111 has input terminal and outlet terminal, input terminal and filter circuit
It is electrically connected with, the output end of outlet terminal and power amplifier board 113 is electrically connected with.
Drive component 130 includes driving plate 131 and multiple support conductive poles 133, and driving plate 131 is parallel with power amplifier board 113
Set and be removably attachable to power with the 3rd face and fourth face being oppositely arranged, each one end for supporting conductive pole 133
First face of plate 113, the other end are connected to the fourth face of driving plate 131, for supporting driving plate 131.The 3rd of driving plate 131
Drive circuit is provided with face, drive circuit is electrically connected with multiple support conductive poles 133 respectively, multiple support conductive poles 133
It is electrically connected with power amplifier board 113, power amplifier board 113 is electrically connected with multiple power tubes 111 respectively, and drive signal is transferred to
Power tube 111.
In the present embodiment, power tube 111 is metal-oxide-semiconductor, and more metal-oxide-semiconductors are connected to the second face of power amplifier board 113.It is worth note
Meaning, power tube 111 can also use IGBT herein.
Metal-oxide-semiconductor is metal (metal)-oxide (oxide)-semiconductor (semiconductor) field-effect transistor, or
Person claims to be metal-insulator-semiconductor field effect transistor.IGBT (Insulated Gate Bipolar Transistor),
Insulated gate bipolar transistor, the compound full control being made up of BJT (double pole triode) and MOS (insulating gate type field effect tube)
Type voltage driven type power semiconductor, have concurrently excellent of both MOSFET high input impedance and GTR low conduction voltage drop
Point.GTR saturation pressures reduce, and current carrying density is big, but driving current is larger；MOSFET driving power very littles, switching speed is fast, but leads
Logical pressure drop is big, and current carrying density is small.
In the present embodiment, it is copper post to support conductive pole 133.It is worth noting that, conductive pole 133 and not only is supported herein
It is only limitted to be made of copper, can also be made of aluminium, silver or other alloys, as long as is that can play a supporting role while energy
Enough materials of conducting driving plate 131 and power tube 111 are within the scope of protection of the utility model.
Fig. 2 is participated in, there are on power amplifier board 113 multiple installation through-holes, close driving plate 131 on the first face of power amplifier board 113
One end also there are multiple first conductive lands 1131, the second face of power amplifier board 113 also has on one end of driving plate 131
Have multiple second conductive lands 1133, each first conductive lands 1131 and each second conductive lands 1133 with peace
Dress through hole is relative and is electrically connected with power amplifier board 113, and multiple support conductive poles 133 are conductive through multiple first correspondingly
Terminal pad 1131 is simultaneously embedded in multiple installation through-holes correspondingly, and multiple support conductive poles 133 are connected by the multiple first conductions
Disk 1131 is connect to be electrically connected with power amplifier board 113.Multiple power tubes 111 are connected to multiple second conductive lands correspondingly
1133 and it is electrically connected with by multiple second conductive lands 1133 with power amplifier board 113.
In the present embodiment, multiple mounting screws are additionally provided with driving plate 131, multiple mounting screws are led with multiple supports
Electric post 133 corresponds, and each mounting screw sequentially passes through driving plate 131, support conductive pole 133, the first conductive lands
1131st, power amplifier board 113, the second conductive lands 1133 and power tube 111, by driving plate 131, support conductive pole 133, work(
Rate plate 113 and power amplifier board 113 are electrically connected with and fixed.Preferably, mounting screw uses copper screw, has good conduction
Performance, certainly, be not restricted to this, the material of mounting screw can also be other conductive materials such as aluminium or zinc,
This is not especially limited.
In the present embodiment, the first conductive lands 1131 are made of copper with the second conductive lands 1133, and the
One conductive lands 1131 are respectively provided with the center of the second conductive lands 1133 and are connected through hole, facilitate mounting screw or support
Conductive pole 133 passes through.
Referring to Fig. 3, support conductive pole 133 has connection boss 1331 close to one end of power amplifier board 113, connects boss 1331
With a stop surface, installation through-hole is stretched into one end of connection boss 1331, and stop surface is connected to the first conductive lands 1131 simultaneously
It is electrically connected with the first conductive lands 1131.
In the present embodiment, connecting on boss 1331 has screwed hole, facilitates second face of the mounting screw from power amplifier board 113
It extend into installation through-hole and extends to screwed hole, support conductive pole 133 is firmly attached to power amplifier board 113.
Referring to Fig. 4, heat-conductive assembly 170 includes heat-radiating substrate 171 and insulating heat-conductive pad 173, and heat-radiating substrate 171 is removably
The second face of power amplifier board 113 is connected to, insulating heat-conductive pad 173 is arranged between heat-radiating substrate 171 and power amplifier board 113, for passing
Pass heat and completely cut off heat-radiating substrate 171 and power amplifier board 113.
In the present embodiment, multiple first mounting holes are offered on heat-radiating substrate 171, the correspondence position of power amplifier board 113 is opened
Provided with multiple second mounting holes, multiple first mounting holes are corresponded with multiple second mounting holes and bearing of trend is consistent, radiating
Substrate 171 passes through multiple first mounting holes and multiple second mounting holes and the bolt connection of power amplifier board 113.And heat-radiating substrate 171, absolutely
Edge heat conductive pad 173 and power amplifier board 113 are brought into close contact setting, and multiple filter capacitors are bonded setting with power amplifier board 113, will be multiple
Heat caused by filter capacitor is transferred to insulating heat-conductive pad 173 by power amplifier board 113, and then is transferred to heat-radiating substrate 171 and carries out
Radiating.
In summary, a kind of high-frequency inversion structure 100 is present embodiments provided, by the way that driving plate 131 is placed in into power amplifier board
Hierarchy arrangement on 113, and it is installed on power amplifier board 113 second by supporting conductive pole 133 to be transferred to drive signal
The power tube 111 in face.Cooling is carried out with reference to insulating heat-conductive pad 173 and heat-radiating substrate 171.Layer-stepping arrangement, inversion component
Compact-sized, small volume.Power tube 111 radiates directly to be connected with heat-radiating substrate 171 substantially, good heat dissipation effect.Filter capacitor 150
Caused heat is taken away through power amplifier board 113 by heat-radiating substrate 171, effectively reduces the temperature rise of filter capacitor 150, extends filtering
The service life of electric capacity 150.Compared to prior art, a kind of high-frequency inversion structure 100 of the present embodiment offer, compact-sized,
Small volume, while there is good radiating effect, the temperature of filter capacitor 150 is effectively reduced, and extend filter capacitor 150
Service life.
Second embodiment
Referring to Fig. 5, a kind of programming dc source 200, including liquid cooling base 210 and high-frequency inversion knot are present embodiments provided
Structure 100, the wherein basic structure of high-frequency inversion structure 100 are identical with first embodiment with principle and caused technique effect, are
Briefly describe, the present embodiment part does not refer to part, refers to corresponding contents in first embodiment.
The high-frequency inversion structure 100 includes (PCC) power 110, drive component 130 and heat-conductive assembly 170, (PCC) power
110 include multiple power tubes 111 and power amplifier board 113, and power amplifier board 113 has the first face and the second face being oppositely arranged, multiple
Power tube 111 is removably attachable to the second face of power amplifier board 113.Heat-conductive assembly 170 is connected to the second face of power amplifier board 113,
For taking away heat caused by power amplifier board 113.Liquid cooling base 210 respectively with side of the heat-conductive assembly 170 away from power amplifier board 113 with
And side connection of the power tube 111 away from power amplifier board 113.To take away the heat on heat-conductive assembly 170 and power tube 111.
Heat-conductive assembly 170 includes heat-radiating substrate 171 and insulating heat-conductive pad 173, and heat-radiating substrate 171 is removably attachable to work(
Second face of rate plate 113, insulating heat-conductive pad 173 are arranged between heat-radiating substrate 171 and power amplifier board 113, for transmitting heat simultaneously
Completely cut off heat-radiating substrate 171 and power amplifier board 113.Liquid cooling base 210 is connected with the bottom of heat-radiating substrate 171, for taking away radiating base
Heat on plate 171.
A kind of programming dc source 200 that the present embodiment provides, liquid cooling base is connected with the bottom of heat-radiating substrate 171
210, while multiple power tubes 111 are connected with the liquid cooling base 210, the heat that heat-radiating substrate 171 can be carried and filtering
Heat is taken away rapidly caused by pipe, drastically increases the heat-sinking capability of the programming dc source 200.
Preferred embodiment of the present utility model is the foregoing is only, is not limited to the utility model, for this
For the technical staff in field, the utility model can have various modifications and variations.It is all in the spirit and principles of the utility model
Within, any modification, equivalent substitution and improvements made etc., it should be included within the scope of protection of the utility model.
Claims (10)
- A kind of 1. high-frequency inversion structure, it is characterised in that including (PCC) power, drive component and heat-conductive assembly, the power Component includes power amplifier board and multiple power tubes, and the power amplifier board has the first face and the second face being oppositely arranged, multiple described Power tube is removably attachable to second face；The heat-conductive assembly is connected to second face；The drive component includes driving plate and multiple support conductive poles, and the driving plate be arranged in parallel with the power amplifier board, institute Stating driving plate has the 3rd face being oppositely arranged and fourth face, and one end of each support conductive pole is removably attachable to institute The first face is stated, the other end is connected to the fourth face, and for supporting the driving plate, driving electricity is provided with the 3rd face Road, the drive circuit respectively with it is multiple it is described support conductive poles be electrically connected with, it is multiple it is described support conductive poles with the work( Rate plate is electrically connected with, and the power amplifier board is electrically connected with multiple power tubes respectively.
- 2. high-frequency inversion structure according to claim 1, it is characterised in that have multiple installations logical on the power amplifier board Hole, also there are multiple first conductive lands on first face, also there are multiple second conductive lands on second face, Each first conductive lands it is relative with the installation through-hole with each second conductive lands and with it is described Power amplifier board is electrically connected with, and multiple support conductive poles are correspondingly through simultaneously one a pair of multiple first conductive lands Should the embedded multiple installation through-holes in ground, and multiple support conductive poles by multiple first conductive lands with it is described Power amplifier board is electrically connected with；Multiple power tubes are connected to multiple second conductive lands and by multiple correspondingly Second conductive lands are electrically connected with the power amplifier board.
- 3. high-frequency inversion structure according to claim 2, it is characterised in that multiple installations are additionally provided with the driving plate Screw, multiple mounting screws correspond with multiple support conductive poles, and each mounting screw sequentially passes through institute State driving plate, it is described support conductive pole, first conductive lands, the power amplifier board, second conductive lands and The power tube, the driving plate, support conductive pole, the power amplifier board and the power amplifier board are electrically connected with and consolidated It is fixed.
- 4. high-frequency inversion structure according to claim 3, it is characterised in that the support conductive pole is copper post.
- 5. high-frequency inversion structure according to claim 3, it is characterised in that the support conductive pole is close to the power amplifier board One end there is connection boss, the connection boss has a stop surface, and one end of the connection boss is stretched into the installation and led to Hole, the stop surface are connected to first conductive lands and are electrically connected with first conductive lands.
- 6. high-frequency inversion structure according to claim 1, it is characterised in that the high-frequency inversion structure also includes multiple filters Ripple electric capacity, the power amplifier board stretch out, and multiple filter capacitor arrays are arranged on the power amplifier board, and the power amplifier board Upper have a filter circuit, multiple filter capacitors with filter circuit electric connection, the filter circuit also with it is described Power tube is electrically connected with.
- 7. high-frequency inversion structure according to claim 6, it is characterised in that the power tube have input terminal with it is defeated Go out terminals, the input terminal is electrically connected with the filter circuit, and the outlet terminal is defeated with the power amplifier board Go out terminal circuit connection.
- 8. high-frequency inversion structure according to claim 1, it is characterised in that the (PCC) power also includes auxiliary conductor, The auxiliary conductor is distributed on the power amplifier board and is electrically connected with the power amplifier board, for aiding in the power amplifier board current-carrying, So that electric current is exported to the output end of the power amplifier board.
- 9. high-frequency inversion structure according to claim 1, it is characterised in that the heat-conductive assembly is including heat-radiating substrate and absolutely Edge heat conductive pad, the heat-radiating substrate are removably attachable to second face, and the insulating heat-conductive pad is arranged on the radiating base Between plate and the power amplifier board, for transmitting heat and completely cutting off the heat-radiating substrate and the power amplifier board.
- 10. one kind programming dc source, it is characterised in that the height including liquid cooling base and as described in claim any one of 1-9 Frequency inverter structure, the liquid cooling base are remote with side of the heat-conductive assembly away from the power amplifier board and the power tube respectively Side from the power amplifier board connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721087697.6U CN207097804U (en) | 2017-08-28 | 2017-08-28 | A kind of high-frequency inversion structure and programming dc source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721087697.6U CN207097804U (en) | 2017-08-28 | 2017-08-28 | A kind of high-frequency inversion structure and programming dc source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207097804U true CN207097804U (en) | 2018-03-13 |
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ID=61540425
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| Application Number | Title | Priority Date | Filing Date |
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| CN201721087697.6U Active CN207097804U (en) | 2017-08-28 | 2017-08-28 | A kind of high-frequency inversion structure and programming dc source |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110896602A (en) * | 2018-12-29 | 2020-03-20 | 研祥智能科技股份有限公司 | Power supply structure |
-
2017
- 2017-08-28 CN CN201721087697.6U patent/CN207097804U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110896602A (en) * | 2018-12-29 | 2020-03-20 | 研祥智能科技股份有限公司 | Power supply structure |
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