CN206921796U - A set of photoresist cull collection device - Google Patents
A set of photoresist cull collection device Download PDFInfo
- Publication number
- CN206921796U CN206921796U CN201720768755.5U CN201720768755U CN206921796U CN 206921796 U CN206921796 U CN 206921796U CN 201720768755 U CN201720768755 U CN 201720768755U CN 206921796 U CN206921796 U CN 206921796U
- Authority
- CN
- China
- Prior art keywords
- spin coating
- coating cavity
- membrane cover
- heart body
- photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Sampling And Sample Adjustment (AREA)
Abstract
The utility model provides a set of photoresist cull collection device, including spin coating cavity base Membrane cover, spin coating cavity epiphragma set, spin coating cavity heart body Membrane cover.Spin coating cavity base Membrane cover mutually agrees with spin coating cavity base inboard portion shape, part, which is brought into close contact, to be fixed on spin coating cavity base, spin coating cavity epiphragma set mutually agrees with spin coating cavity lid inner arc partial shape, part, which is brought into close contact, to be fixed on spin coating cavity lid, spin coating cavity heart body Membrane cover mutually agrees with spin coating cavity heart body upper end circular arc portion arc radius, its arc length is 12 times of spin coating cavity heart body upper end arc length, is locally brought into close contact fixation.The utility model only need to be by changing the present apparatus, you can efficiently solves the problems, such as each part cull cleaning of photoresist spin coating cavity device, eliminates the processing procedure of remaining photoresist on these parts substantially.
Description
Technical field
A set of photoresist cull collection device is the utility model is related to, applied to semiconductor chip manufacture and wafer processing neck
Domain, it is applied particularly to photoetching spin processes process steps in semiconductor process technique.
Background technology
At present, photoetching spin coating cavity device is spin coating cavity base in conventional semiconductor devices manufacturing process, spin coating cavity
Heart body, three, spin coating cavity lid part form, during spin coating at silicon chip below spin coating cavity lid with the spin coating cavity heart
Position between above body, because silicon chip is in high speed rotation state during spin coating, the photoresist for dropping to silicon chip surface exists
A part is uniformly coated to silicon chip surface in the presence of centrifugal force, and another part can be thrown to spin coating cavity lid arcwall face and spin coating
Arcwall face forms cull above cavity heart body, while cull, in the presence of gravity and bottom air draft, cull can progressively be covered with even
Glue chamer body base, over time, so that being covered with cull inside whole spin coating cavity device, need periodic cleaning entirely even
The cull of glue chamer body device, because photoetching adhesiveness is larger, the method for the cleaning spin coating cavity device generally used in the industry is to use
Immersion removal method, its principle are to first pass through photoresist developer and soak cull to soften to photoresist developer for a long time, Ran Houyong
Brush brushes the cull on each part of spin coating cavity device, because photoetching adhesion is stronger, thus it is more difficult thoroughly with this method
All culls on each part of spin coating cavity device are removed, simultaneously as to belong to volatile and smell pungent for photoresist developer
Organic solvent, the operation under air draft, operator also need to endure pungent smell, look for a kind of solution to the problems described above
It is the problem of each enterprise is both needed to consider.
Utility model content
In order to solve the above problems, the utility model provides a set of photoresist cull collection device, can effectively remove cull.
Technical scheme provided by the utility model:A set of photoresist cull collection device, including spin coating cavity base Membrane cover,
Spin coating cavity epiphragma set, spin coating cavity heart body Membrane cover, it is characterised in that:The spin coating cavity base Membrane cover and spin coating cavity base
Inner side, in addition to centre, both sides shape is mutually agreed with, and is brought into close contact and is fixed on spin coating cavity base, the spin coating cavity epiphragma
Set mutually agrees with spin coating cavity lid inner arc shape, is brought into close contact and is fixed on spin coating cavity lid, the spin coating cavity heart
Body Membrane cover mutually agrees with spin coating cavity heart body upper end circular arc portion arc radius, and its arc length is the 1- of spin coating cavity heart body upper end arc length
2 times, spin coating cavity heart body Membrane cover is brought into close contact fixation with spin coating cavity heart body since top.
Further, spin coating cavity base Membrane cover, spin coating cavity epiphragma set, spin coating cavity heart body Membrane cover, material is PET
Film, film thickness are 30-500 μm.
The beneficial effects of the utility model are:The utility model can mutually strain with the Adjusting Shape of spin coating cavity device
Change, be effectively isolated cull caused by spin coating and spin coating cavity device by this covering device, so as to efficiently reclaim cull,
So as to the reuse of cull, meanwhile, the subsequent treatment that spin coating cavity device leaves cull is eliminated, according to used in reality
Adhesiveness difference, it is actual according to present apparatus surface leave residual silkgum content number determine whether to change the present apparatus, present apparatus system
It is relatively low to make cost, it is shorter the time required to changing the present apparatus, a few minutes are typically only needed, it is convenient, efficient.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model;
Fig. 2 is that spin coating cavity epiphragma covers basic configuration figure;
Fig. 3 is spin coating cavity heart body Membrane cover basic configuration figure;
Fig. 4 is spin coating cavity base Membrane cover basic configuration figure.
Wherein, 1, spin coating cavity lid, 2, spin coating cavity heart body, 3, spin coating cavity base, 4, spin coating cavity epiphragma set, 5, even
Glue chamer body heart body Membrane cover, 6, spin coating cavity base Membrane cover.
Embodiment
In order to deepen, to understanding of the present utility model, the utility model to be done further below in conjunction with embodiment and accompanying drawing
It is described in detail.
As shown in Fig. 1-4, a set of photoresist cull collection device, including spin coating cavity base Membrane cover 6, spin coating cavity lid
Membrane cover 4, spin coating cavity heart body Membrane cover 5, material are PET film, and film thickness is 30-500 μm.Spin coating cavity base Membrane cover 6 with it is even
The inner side of glue chamer body base 3 is in addition to centre, and both sides shape is mutually agreed with, and is brought into close contact and is fixed on spin coating cavity base, spin coating chamber
Body epiphragma set 4 mutually agrees with the inner arc partial shape of spin coating cavity lid 1, is brought into close contact and is fixed on spin coating cavity lid 1, even
Glue chamer body heart body Membrane cover 4 mutually agrees with the upper end circular arc portion arc radius of spin coating cavity heart body 2, and its arc length is spin coating cavity heart body 2
1-2 times of upper end arc length, spin coating cavity heart body Membrane cover are brought into close contact fixation with spin coating cavity heart body since top.
By spin coating cavity base Membrane cover 6, locally it is brought into close contact admittedly using two-sided tape with the inboard portion of spin coating cavity base 3
Fixed, spin coating cavity epiphragma set 4 is locally brought into close contact fixation, spin coating with the inner arc part of spin coating cavity lid 1 using two-sided tape
Cavity heart body Membrane cover 5 is locally brought into close contact fixation with the upper end circular arc portion of spin coating cavity heart body 2 using two-sided tape, then will paste
Can normal use after three assembling components of the spin coating cavity device with described device Membrane cover.
After three components of spin coating cavity device are taken apart, described device is removed one by one respectively discarded, then taken a set of new
Described device.
Claims (2)
1. a set of photoresist cull collection device, including spin coating cavity base Membrane cover, spin coating cavity epiphragma set, spin coating cavity heart body
Membrane cover, it is characterised in that:The spin coating cavity base Membrane cover and spin coating cavity base inner side, in addition to centre, both sides shape phase contract
Close, be brought into close contact and be fixed on spin coating cavity base, the spin coating cavity epiphragma set and spin coating cavity lid inner arc shape
Mutually agree with, be brought into close contact and be fixed on spin coating cavity lid, the spin coating cavity heart body Membrane cover is justified with spin coating cavity heart body upper end
Arc portion point arc radius is mutually agreed with, and its arc length is 1-2 times of spin coating cavity heart body upper end arc length, spin coating cavity heart body Membrane cover and spin coating
Cavity heart body is brought into close contact fixation since top.
2. a set of photoresist cull collection device according to claim 1, it is characterised in that:The spin coating cavity base film
Set, spin coating cavity epiphragma set, spin coating cavity heart body Membrane cover, material are PET film, and film thickness is 30-500 μm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720768755.5U CN206921796U (en) | 2017-06-29 | 2017-06-29 | A set of photoresist cull collection device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720768755.5U CN206921796U (en) | 2017-06-29 | 2017-06-29 | A set of photoresist cull collection device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206921796U true CN206921796U (en) | 2018-01-23 |
Family
ID=61323177
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201720768755.5U Active CN206921796U (en) | 2017-06-29 | 2017-06-29 | A set of photoresist cull collection device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206921796U (en) |
-
2017
- 2017-06-29 CN CN201720768755.5U patent/CN206921796U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105628468B (en) | GaN base hetero-junctions transparent membrane transmission electron microscope cross-sectional sample preparation method | |
CN206921796U (en) | A set of photoresist cull collection device | |
JPH0774137A (en) | Method and apparatus for removing particle on substrate surface | |
JP2010040681A (en) | Chip storage tray | |
JPS6190434A (en) | Manufacture of electronic element | |
JPH04249343A (en) | Substrate separating method | |
JPH0356041Y2 (en) | ||
JPH0223324B2 (en) | ||
JP2537611B2 (en) | Coating material coating equipment | |
JPS6199336A (en) | Manufacture of electron element | |
TWI819958B (en) | Wafer fat edge removal device and method | |
JP2001085359A (en) | Method for manufacturing semiconductor device | |
JPH0341716A (en) | Manufacture of semiconductor device | |
JPH01316936A (en) | Etching treatment device for semiconductor substrate | |
JP3593599B2 (en) | Burr processing method and device for storage disk | |
JP2631754B2 (en) | Disc manufacturing method | |
JP4390623B2 (en) | Thin film formation method | |
JPS5888749A (en) | Developing device | |
CN104371413B (en) | A kind of for metal shell signal paint minimizing technology | |
SU917366A1 (en) | Method and device for forming protective coating | |
JPS5914891B2 (en) | Spin coating method and spin coating device | |
JPH04354333A (en) | Method for grinding rear surface of wafer | |
JPS63134076A (en) | Method and device for coating | |
CN114682451A (en) | Glue layer coating method | |
JPH0744142B2 (en) | Method for removing scattered photoresist |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP02 | Change in the address of a patent holder |
Address after: 226200 Jinggangshan Road, Jinggangshan Road, Sutong science and Technology Industrial Park, Nantong City, Jiangsu Province, No. 6 Patentee after: Agile Semiconductor Ltd Address before: 226200 Jiangsu city of Nantong province science and Technology Industrial Park of Su Tong Jiang Cheng Road No. 1088 Jiang Park Building 3, room 2159, R & D Patentee before: Agile Semiconductor Ltd |
|
CP02 | Change in the address of a patent holder |