JP3593599B2 - Burr processing method and device for storage disk - Google Patents

Description

[0001]
FIELD OF THE INVENTION
The present invention relates to a storage disk such as an optical disk, and more particularly, to a method and an apparatus for processing burrs generated on the surface of a storage disk.
[0002]
[Prior art]
Among storage disks such as optical disks, DVDs and the like are made by bonding two plastic circular resin substrates manufactured by injection molding.
FIG. 7 schematically shows a series of steps in which the two circular resin substrates are bonded to produce one optical disk.
[0003]
Briefly described for reference, manufacturing is performed by the following series of steps.
(1) Step of mounting first circular resin substrate D1 on mounting table X (2) Step of applying adhesive R to first circular resin substrate D1 (3) Second circular resin substrate on first circular resin substrate D1 (4) Step of spreading the adhesive R interposed between the two circular resin substrates D1 and D2 (5) Step of curing the spread adhesive R
The above process will be described more simply. First, in the process (1), the first circular resin substrate D1 having the signal surface coated with the reflective film and the protective film is uniformly suction-held on the mounting table X.
In the step (2), in a step of applying the adhesive R, the adhesive R, for example, an ultraviolet curable resin is discharged from the discharge nozzle N while the mounting table X on which the first circular resin substrate D1 is mounted is rotated at a low speed.
The trajectory of the adhesive to be discharged onto the first circular resin substrate D1 varies depending on the manner in which the discharge nozzle N moves. For example, it is preferable to form the adhesive as a donut-shaped trajectory as shown in the figure.
[0005]
In step (3), a transparent second circular resin substrate D2 is placed on the first circular resin substrate D1 to which the adhesive R has been applied, using a chuck or the like.
Next, in step (4), spreading is performed so that the adhesive R interposed between the two circular resin substrates D1 and D2 can be evenly and evenly distributed.
In this extension, the mounting table X is rotated at a high speed in a state where the combined circular resin substrate on which the two circular resin substrates D1 and D2 are superimposed, that is, the optical disc DK is mounted (the rotation speed is usually several thousand rpm or more, (Rotation time is about several seconds).
Due to this rotation, the excess adhesive R existing between the superposed circular resin substrates D1 and D2 is scattered outside together with the spread, and at the same time, air (air bubbles) trapped between the circular resin substrates D1 and D2 is closed. Etc.) are released outside.
[0006]
In the step (5), the first circular resin substrate D1 and the second circular resin substrate D2, which are superimposed and integrated, are irradiated with ultraviolet rays in a state where the first circular resin substrate D1 and the second circular resin substrate D2 are rotated (for example, about 60 rpm) or not, and For example, the ultraviolet curable resin layer is cured.
Specifically, curing is performed efficiently by irradiating an ultraviolet light source L having a reflecting mirror on the back surface.
The curing step differs depending on the type of the adhesive R used, and it is natural that a curing method suitable for the characteristics of the adhesive R used is adopted.
As described above, two circular resin substrates are adhered to each other to form one optical disk.
[0007]
By the way, in the above-mentioned manufacturing process, the spreading process (4) is a process that spreads the adhesive R evenly and uniformly over the entire optical disc, and is a particularly important process.
As described above, an appropriate amount of the adhesive R is discharged onto the circular resin substrate in the application step before the spreading step, but in the sense that the adhesive R is used as efficiently as possible. However, the spread is not performed after discharging a sufficient amount to the vicinity of the center hole DH of the optical disk.
Therefore, if the adhesive does not spread in the center direction and is viewed as a whole optical disc, the spread will be insufficient.
[0008]
For this reason, a method is employed in which the adhesive is sucked from the boss portion BS of the mounting table X inserted into the center hole DH of the optical disk DK.
At this time, it is important to take measures to prevent the sucked adhesive from being drawn too much and protruding from the center hole, that is, stopping at a certain position.
For this reason, the optical disk has a ring shape (for example, a diameter of about twenty and several millimeters) for defining the extension range of the adhesive, and a constant width and depth (for example, the width and depth are about several hundred microns). Is provided.
[0009]
By stopping at the position where the liquid stopping groove is reached, the adhesive can be formed clearly and uniformly along the liquid stopping groove line without disturbing the inner circumferential line of the extension.
Incidentally, the liquid stopping groove is formed at the same time as injection molding of a single circular resin substrate.
Although it depends on the structure of the mold, usually, the outer end of the liquid stopping groove is located at a position where it comes into contact with the boundary of the mold during injection molding. , A plastic flake or projection, commonly called "burr", remains.
[0010]
This burr is formed continuously or discontinuously at the outer end of the liquid stopping groove.
Although its height and thickness are extremely small (on the order of tens of microns), it occurs in an upright state with a substantially isosceles triangular cross section.
In the extending step, the surface of the circular resin substrate having the liquid stopping groove is the inner side and serves as a bonding surface. Therefore, if a burr is generated, the suction force at that portion is extremely reduced.
Then, the spreading of the adhesive in the center direction is insufficient.
[0011]
FIG. 5 is a diagram schematically showing the state of extension of the adhesive in the vicinity of the liquid retaining groove in the circular resin substrate on which the burrs are not crushed.
Even when suction is performed as shown in FIG. 7A (the arrow indicates the suction direction), a phenomenon occurs in which the burrs hinder and the adhesive stops before the liquid stopping groove.
(B) schematically shows an extended state when a burr is discontinuously generated at an end of the liquid stopping groove.
As described above, in the spreading process, the portion where the burr is generated does not reach the liquid stopping groove even by the suction action from the center, so that the bubble portion remains outside the liquid stopping groove, and the inner circumferential line of the adhesive is removed. The optical disk does not spread uniformly as a whole.
[0012]
By the way, if the suction force is extremely increased as a countermeasure, as shown in (c), the portion where there is no burr gets over the liquid stopping groove and the adhesive is drawn in.
Also in this case, the inner peripheral line of the adhesive is disturbed and the entire optical disc is not uniformly spread.
In order to eliminate such adverse effects, the burrs themselves must be removed. However, the burrs are extremely small and are relatively soft and difficult to remove in view of the characteristics of the polycarbonate material.
In order to remove the burrs, there is a method of cutting or cutting burrs by using a blade, a cutter, or the like, but this is not appropriate because it may damage the surface of the optical disk.
[0013]
[Problems to be solved by the invention]
The present invention has been made to solve the problems in the background described above.
That is, an object of the present invention is to provide a method and an apparatus for processing a burr P1 generated on a storage disk so as not to hinder the extension.
[0014]
[Means for Solving the Problems]
However, the present inventors have conducted intensive studies on such a problem, and as a result, the burrs are not removed from the surface of the circular resin substrate by using a blade or the like, but the burrs are used to spread the adhesive. The present inventors have found that it is only necessary to prevent any trouble, that is, that the suction is performed without any trouble by crushing the burrs and the adhesive is reliably spread, and the present invention has been completed based on this finding.
[0015]
That is, the present invention provides (1) a method for treating burrs generated on a circular resin substrate constituting a storage disk, wherein the step of receiving the circular resin substrate by the receiving table and the state of receiving the circular resin substrate by the receiving table are described. And a step of crushing the burrs by applying a pressure from above with a pressing body, and a step of sucking and removing attached matter including small flakes of the separated burrs.
[0016]
And (2) a method of processing burrs generated on a circular resin substrate constituting a storage disk, comprising: a step of moving a receiving table by positioning a circular resin substrate positioned on a carrier; A step of applying pressure from above with a pressing body to crush the burrs while receiving the burrs, a step of sucking and removing extraneous matter including small flakes of the burrs, and transporting the circular resin substrate on the cradle The method includes a step of returning to a table and a method of processing burrs on a storage disk.
And (3) a method for treating burrs generated on a circular resin substrate constituting a storage disk, wherein the step of receiving the circular resin substrate by the receiving table and the step of receiving the circular resin substrate by the receiving table from above are performed. A step of applying pressure by a pressing body to crush the burrs, a step of sucking and removing attached matter including small flakes of the separated burrs, and a step of blowing static elimination air onto the surface of the circular resin substrate during the suction removal. In a flash disk.
[0018]
(4) An apparatus for processing burrs generated on a circular resin substrate constituting a storage disk, comprising: a receiving table on which the circular resin substrate is mounted; and a pressure applied to the circular resin substrate mounted on the receiving table from above. In addition, the present invention resides in a device for processing burrs in a storage disk, which comprises a pressing body for crushing the burrs and a suction device for suctioning and removing attached matter including small flakes of the separated burrs.
[0019]
(5) The apparatus for processing burrs on a storage disk according to (4), wherein the pressing surface of the pressing body has a shape corresponding to the burring forming line of the circular resin substrate.
(6) The apparatus for processing burrs on a storage disk according to the above (4 ), wherein the receiving base is provided with a boss portion for positioning the storage disk at the center.
[0020]
(7) An apparatus for treating burrs generated on a circular resin substrate constituting a storage disk, comprising: a receiving table on which the circular resin substrate is mounted; and a pressure applied to the circular resin substrate mounted on the receiving table from above. In addition, a pressing body for crushing the burrs, a suction device for suctioning and removing attached matter including small flakes of the separated burrs, and a carrier table for loading or unloading the circular resin substrate are provided. And a through-hole through which a circular resin substrate placed around the through-hole is pushed up by a receiving table to receive the flash.
[0021]
(8) An apparatus for processing burrs generated on a circular resin substrate constituting a storage disk, comprising: a receiving table on which the circular resin substrate is mounted; and a pressure applied to the circular resin substrate mounted on the receiving table from above. In addition, a pressing body that crushes the burrs, a suction device that suctions and removes attached matter including small flakes of the separated burrs, a static eliminator that blows static elimination air onto the surface of the circular resin substrate, and a circular resin substrate is loaded or unloaded. A burr processing device for a storage disk, comprising a carrier, having a through-hole through which the carrier passes through the carrier, and pushing up and receiving the circular resin substrate placed around the through-hole by the carrier. Exist.
[0022]
BEST MODE FOR CARRYING OUT THE INVENTION
Embodiment (I) [Burr treatment method]
Hereinafter, a method of treating burrs will be described first.
FIG. 1 illustrates a method of treating burrs in a liquid stopping groove.
[0023]
1. Step of Receiving Circular Resin Substrate D at Cradle Circular resin substrate D is carried by carrier C and stopped at a position directly above cradle A.
Next, the receiving table A waiting under the transfer table C rises.
Since the through-hole C1 is vacant in the transfer table C, the receiving table A goes up and passes through the through-hole C1 of the transfer table C.
In this passing process, the receiving table A receives the circular resin substrate D on the transfer table C on the upper surface 2 thereof.
The center hole DH of the received circular resin substrate D is inserted into the boss 1 provided on the pedestal A, and is accurately positioned.
The raised cradle A stops at a predetermined position.
[0024]
2. A process of applying pressure from above to the circular resin substrate D by the pressing body B to crush the burr. The pressing body B reciprocates up and down from above to the circular resin substrate D on the pedestal A. Crush from above.
The upright burrs P1 are pressed by the surface of the pressing body B to be lowered to be in a trouble-free state. FIG. 4 shows some examples of the crushing process of the burrs P1 in the liquid stopping grooves P. Things.
In many cases, the side wall of the liquid stopping groove P is vertical on the outside and slightly inclined on the inside, and the burr P1 is formed on the extension of the vertical side wall.
The method of crushing differs depending on the state in which burrs are generated. For example, there are the following modes.
[0025]
[Case 1] When the burr P1 faces slightly outward, it is pressed and falls outward [(a) → (b)].
[Case 2] When the burr P1 is slightly facing inward, it is pressed down and falls down [(c) → (d)].
[Case 3] When the burr P1 is almost straight, it is pressed and flattened as a whole [(e) → (f)].
Incidentally, there is naturally a case where two or more cases of the cases 1 to 3 overlap.
The meaning of “crushing” in the present invention includes at least the above-described processing states.
[0026]
3. Step of sucking the attached matter including the stripped burrs P1 etc. In the process of pressing and crushing the burrs P1, the burrs P1 may be separated into small thin pieces and attached to the surface of the circular resin substrate.
Further, in many cases, dust or the like is attached to the circular resin substrate.
Here, the attached matter including the small thin pieces of the burr P1 is removed by suction.
It utilizes the principle of removing adhering matter by suctioning the upper portion of the circular resin substrate D with a negative pressure. Specifically, the suction is performed in a state where the cover body E1 is put around the circular resin substrate D. Is adopted.
At the same time, when the static elimination device F simultaneously blows the static elimination air onto the surface of the circular resin substrate D, the cleaning effect is further improved.
As the static elimination air, air containing ions for erasing the charged state is often used.
[0027]
4. Step of returning the circular resin substrate D on the receiving table to the transfer table C After suctioning and removing the deposits on the surface of the circular resin substrate D, the receiving table A descends, but the transfer table is moved in the process of passing through the through hole C1. Transfer the circular resin substrate D to C.
Then, the lowered receiving table A returns to its original position and stops, and then the transfer table C moves to move the circular resin substrate D to the next step.
The burr treatment method is completed as described above. However, the burr treatment method of the present invention can be sufficiently achieved by the steps 1 and 2, and more effects can be obtained by passing through the steps 3 and 4. Is obtained.
[0028]
Embodiment (II) [Burr processing device]
Hereinafter, the burr processing apparatus will be described.
FIG. 2 shows an apparatus for processing the burrs P1 of the liquid stopping grooves P.
FIGS. 3A and 3B are enlarged views of the main parts, in which FIG. 3A is a side view and FIG. 3B is a plan view.
The apparatus of the present invention mainly includes a receiving base A for receiving and placing the circular resin substrate D, and a pressing body B for crushing the burr P1.
The receiving table A is a circular table on which the circular resin substrate D is placed and held by suction.
[0029]
A large number of suction holes (not shown) are provided on the upper surface 2 of the cradle A, and the circular resin substrate D is securely held by suction from the suction holes.
At the center, a protruding boss 1 is provided, and the boss 1 is a portion to be inserted into the center hole DH of the circular resin substrate D.
The lower part of the receiving base A is directly connected to a motor installed on the movable base 4 and is rotatable.
[0030]
The movable base 4 is slid up and down by the cylinder 3 along the guide portion 51 of the bracket 5 installed on the base 6, so that the receiving base itself can be moved up and down.
On the other hand, the pressing body B presses the circular resin substrate D with the receiving base A to crush the burrs P1, and is attached to the stand 7 mounted on the base 6 via the bracket 71, The cylinder 11 can reciprocate up and down.
The pressing body B is provided at the center thereof with a space 8 large enough to receive the boss 1 of the cradle A.
[0031]
The lower surface 9 of the pressing body B has a size large enough to abut at least the formation line of the burrs P1 formed on the circular resin substrate D.
However, care must be taken since an excessively large size will damage the information recording surface of the circular resin substrate D.
Further, a contact portion having a shape corresponding to the line on which the burr P1 is formed may be provided on the lower surface 9.
A transfer table C is used as a means for transferring a circular resin substrate D to be subjected to burr processing between the receiving table A and the pressing body B.
[0032]
The transfer table C transfers the circular resin substrate D in a state of being placed thereon. The transport table C is usually a rotary table table that performs rotation indexing, but may be a table that performs indexing by linear movement.
The transfer table C is provided with a through hole C1 large enough to allow the above-mentioned receiving table A to pass therethrough, and the diameter of the through hole C1 is larger than the outer diameter of the circular resin substrate D. It has a small diameter.
The periphery of the through hole C1 is slightly concave, and the circular resin substrate D is positioned and placed on the carrier while being fitted in the concave 10 around the through hole C1.
[0033]
By the way, it is convenient to further provide the suction device E in the burr treatment device so as to have a function of removing miscellaneous substances adhered to the circular resin substrate D, small flakes of peeled burr, dust and the like. As described above, the suction device E suctions and removes attached matter by applying a negative pressure around the circular resin substrate D. Specifically, the suction device E covers the periphery of the circular resin substrate D with a cover body E1. The suction is performed through the hole E2.
At the time of suction, in order to eliminate the charge, it is preferable to blow the charge removing air containing ions for erasing the charged state on the upper surface 2 of the circular resin substrate D using the charge removing device F.
[0034]
Next, the operation of the burr processing apparatus will be described.
First, the circular resin substrate D placed on the transfer table C is transported from another place between the receiving table A and the pressing body and positioned.
Here, the circular resin substrate D is in a state of being fitted into the recess 10 around the through hole C1 of the carrier C.
Thereafter, the receiving table A rises and passes through the through hole C1 of the transport table C.
In this process, the circular resin substrate D is transferred from the transfer table C to the receiving table A, and is received by the receiving table.
[0035]
Since the receiving base A is provided with the boss 1, the center hole DH of the circular resin substrate D is inserted into the boss 1 so that accurate positioning is performed.
Thereafter, the cradle A rises to a predetermined position and stops its movement.
Next, the pressing body B reciprocates up and down with respect to the circular resin substrate D positioned on the receiving table, and crushes the burrs P1 of the circular resin substrate D from above.
The burr P1 is crushed and deformed flat by receiving pressure from above.
The processing state of the burr P1 has already been described in the description of FIG.
[0036]
Next, with the suction device E, the attached matter including the small flakes of the separated burrs is suctioned and removed from the surface of the circular resin substrate D.
At the time of suction, static elimination air is blown toward the circular resin substrate D by the static eliminator F.
After the surface of the circular resin substrate D is cleaned by suction, the receiving table A descends and returns to the original position below the conveying table C.
In this process, the circular resin substrate D on the receiving table is weakened in its attraction force and transferred to the transfer table C.
The empty cradle A waits at this position for the next crushing operation.
The circular resin substrate D on which the burrs have been crushed is carried out to the next process by the carrier C, and at the same time, a new circular resin substrate D (having burrs P1) is carried in again from the previous process.
[0037]
The method and apparatus for processing the burrs P1 have been described above. However, by performing such processing, the burrs have no adverse effect, and in the extension process, the suction from the boss 1 is accurately performed. Then, the adhesive can sufficiently reach the liquid stopping groove P.
FIG. 6 is a cross-sectional view schematically showing the state of extension of the adhesive near the liquid retaining groove in the circular resin substrate treated according to the present invention (arrows indicate the suction direction).
Conventionally, the burr P1 hinders, the adhesive does not reach the liquid stopping groove P, and the inner circumferential line of the adhesive is disturbed (see FIG. 5). In the present invention, the burr P1 is crushed. Therefore, it can be understood that the adhesive can sufficiently reach the liquid stopping groove P.
[0038]
Although the present invention has been described above, the present invention is not limited to the embodiment, and it goes without saying that other various modifications can be made without departing from the essence of the present invention.
For example, although the processing method and the apparatus used in the present invention are described with respect to the burrs P1 generated at the outer peripheral end of the liquid stopping groove P, it is possible to apply burrs generated at other portions.
Although the burrs P1 are crushed by pushing down the pressing body B with respect to the cradle A, the burrs P1 may be crushed by pushing up the cradle A with respect to the pressing body B.
No.
The device of the present invention is mainly composed of the cradle A and the pressing body B, but more effects can be expected by adding the suction device E and further the static elimination device F.
[0039]
【The invention's effect】
In the present invention, burrs which are inevitably generated in the manufacture of the circular resin substrate D constituting the storage disk (optical disk) can be changed by a simple operation so as not to hinder the extension.
Even in the processed circular resin substrate, since the burrs do not protrude, the adhesive can sufficiently reach the liquid stopping groove in the extension step.
Since the method can be applied only by applying pressure to the burrs from above while receiving the circular resin substrate, both the method and the apparatus may be very simple.
[Brief description of the drawings]
FIG. 1 is a diagram showing a series of steps of a burr treatment method.
FIG. 2 is a diagram illustrating a burr processing apparatus.
FIGS. 3A and 3B are enlarged views of a main part of the burr processing apparatus, in which FIG. 3A is a side view and FIG. 3B is a plan view.
FIG. 4 is an enlarged schematic view of a liquid stopping groove, wherein (a), (c) and (e) show a state before processing, and (b), (d) and (f) show This shows the state after the processing.
FIG. 5 is a diagram schematically showing the state of extension of an adhesive near a liquid stopping groove in a circular resin substrate not subjected to the treatment of the present invention. (A) is a cross-sectional view of a portion where burrs are generated. (B) shows the extended state when burrs are generated discontinuously in the liquid stopping groove, and (c) shows the extended state when suction is increased.
FIG. 6 is a cross-sectional view schematically showing the state of extension of an adhesive near a liquid retaining groove in a circular resin substrate treated according to the present invention.
FIG. 7 shows a series of steps for bonding two circular resin substrates to form one optical disk.
[Explanation of symbols]
A: Receiving stand B: Pressing body BS ... Boss part C ... Carriage C1 ... Through hole E ... Suction device E1 ... Cover body E2 ... Suction hole F ... Static eliminator D1 ... First circular resin substrate D2 ... Second circular resin substrate D: circular resin substrate DK: storage disk (optical disk)
DH: center hole X: mounting table P: liquid retaining groove P1: burr 1: boss portion 2: upper surface 3, cylinder 4, moving base 5, bracket 51, guide portion 6, base 7, stand 71, bracket 8, bracket 8 Space 9 Bottom surface 10 Depression 11 Cylinder

Claims (8)

A method for treating burrs generated on a circular resin substrate constituting a storage disk, comprising the steps of receiving a circular resin substrate by a receiving table, and applying pressure by a pressing body from above while receiving the circular resin substrate by the receiving table. A method of treating burrs on a storage disk, comprising: a step of crushing burrs; and a step of sucking and removing extraneous matters including small flakes of peeled burrs. A method for treating burrs generated on a circular resin substrate constituting a storage disk, comprising: a step of moving a receiving position of a circular resin substrate positioned on a carrier and receiving the circular resin substrate; A step of crushing the burrs by applying pressure from above with a pressing body, a step of sucking and removing attached matter including small flakes of the separated burrs, and a step of returning the circular resin substrate on the receiving table to the transfer table, A method for processing burrs in a storage disk, comprising: A method for treating burrs generated on a circular resin substrate constituting a storage disk, comprising the steps of receiving a circular resin substrate by a receiving table, and applying pressure by a pressing body from above while receiving the circular resin substrate by the receiving table. A step of crushing burrs, a step of sucking and removing attached matter including small flakes of peeled burrs, and a step of blowing static elimination air onto the surface of the circular resin substrate when the suction is removed. How to handle burrs on the disk. An apparatus for processing burrs generated on a circular resin substrate constituting a storage disk, comprising: a receiving table on which the circular resin substrate is mounted; and a pressing force for applying pressure from above to the circular resin substrate mounted on the receiving table to crush the burrs. A burr processing device for a storage disk, comprising: a body; and a suction device that suctions and removes an attached matter including a small thin piece of burr that has been peeled off. 5. The apparatus according to claim 4, wherein the pressing surface of the pressing body has a shape corresponding to a burr forming line of the circular resin substrate. 5. The apparatus for processing burrs in a storage disk according to claim 4, wherein the pedestal is provided with a boss portion for positioning the storage disk at the center. An apparatus for processing burrs generated on a circular resin substrate constituting a storage disk, comprising: a receiving table on which the circular resin substrate is mounted; and a pressing force for applying pressure from above to the circular resin substrate mounted on the receiving table to crush the burrs. Body, a suction device that sucks and removes attached matter including small flakes and the like of the peeled burrs, and a carrier table for loading or unloading the circular resin substrate, and the carrier table has a through hole through which the receiving table passes. A burr processing device for a storage disk, wherein a circular resin substrate placed around the through hole is pushed up by a receiving table and received.   An apparatus for processing burrs generated on a circular resin substrate constituting a storage disk, comprising: a receiving table on which the circular resin substrate is mounted; and a pressing force for applying pressure from above to the circular resin substrate mounted on the receiving table to crush the burrs. Body, a suction device for sucking and removing attached matter including small flakes of peeled burrs, a static eliminator for blowing static elimination air onto the surface of the circular resin substrate, and a carrier table for loading or unloading the circular resin substrate, A burr processing device for a storage disk, wherein a through-hole through which the pedestal passes is provided on the carrier, and the circular resin substrate placed around the through-hole is pushed up by the pedestal and received.

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