CN206892540U - A kind of heat dissipation equipment and projecting apparatus - Google Patents
A kind of heat dissipation equipment and projecting apparatus Download PDFInfo
- Publication number
- CN206892540U CN206892540U CN201720429101.XU CN201720429101U CN206892540U CN 206892540 U CN206892540 U CN 206892540U CN 201720429101 U CN201720429101 U CN 201720429101U CN 206892540 U CN206892540 U CN 206892540U
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- heat dissipation
- support frame
- dissipation equipment
- heat sink
- projecting apparatus
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Abstract
It the utility model is related to technical field of heat dissipation, more particularly to a kind of heat dissipation equipment and projecting apparatus, the heat dissipation equipment is applied to the projecting apparatus, the heat dissipation equipment is provided with circuit board, heat sink and support frame, the circuit board is connected with support frame as described above, the installation portion that radiating element is treated for installing is provided with the circuit board, the heat sink is arranged at support frame as described above and close to the installation portion.Effectively avoid treating that radiating element radiating effect is poor by above-mentioned setting, cause to treat the problem of damage of radiating element overheat or performance reduce.
Description
Technical field
Technical field of heat dissipation is the utility model is related to, in particular to a kind of heat dissipation equipment and projecting apparatus.
Background technology
Can all there are multiple chips on many electronic products at present, these chips play the role of different, processing in circuit
The output input of data.With requirement more and more higher of the people to properties of product, requirement to chip also more and more higher.Due to production
The application program of product installation is more and more, and this requires that chip processing speed is very fast, and the situation of high-frequency processing data must
It can cause the heating of chip.Heat such as fruit chip does not distribute timely, and temperature reaches to a certain degree, will result in
Chip performance it is not normal, influence the performance of product, can also cause EMI, so as to influence the sensitive signal of chip, cause data to be forbidden
True problem.Therefore, the heat dissipation problem of chip is urgent problem to be solved.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of heat dissipation equipment, by set circuit board, heat sink and
Support frame so that treat that radiating element can not design realization radiating by wind path, cause to treat the problem of radiating element overheat is damaged.
Another object of the present utility model is to provide a kind of projecting apparatus, includes circuit board, heat sink and branch by setting
The heat dissipation equipment of support so that treat that radiating element can not design realization radiating by wind path, cause to treat that radiating element crosses heat waste
The problem of ruining.
To achieve the above object, the utility model embodiment adopts the following technical scheme that：
A kind of heat dissipation equipment, including circuit board, heat sink and support frame, the circuit board are connected with support frame as described above, institute
The installation portion for being provided with circuit board and radiating element being treated for installing is stated, the heat sink is arranged at support frame as described above and close to institute
State installation portion.
Optionally, in above-mentioned heat dissipation equipment, the heat sink includes two connecting portions, and described two connecting portions distinguish position
In the both ends of the heat sink, the heat sink is connected by described two connecting portions with support frame as described above.
Optionally, in above-mentioned heat dissipation equipment, the heat sink also includes projection, the raised close circuit board
Installation portion.
Optionally, in above-mentioned heat dissipation equipment, support frame as described above includes base and two support members, described two supports
One end of part is respectively arranged at the both ends of the base, and the other end is connected with the heat sink respectively.
Optionally, in above-mentioned heat dissipation equipment, the heat dissipation equipment also includes fixture, and the circuit board passes through described solid
Determine part to be connected with support frame as described above.
Optionally, in above-mentioned heat dissipation equipment, support frame as described above is metal frame, and the circuit board is pcb board.
The utility model also provides a kind of projecting apparatus, including housing, treats radiating element and above-mentioned heat dissipation equipment, described
Treat that radiating element is arranged at the heat dissipation equipment, it is described to treat that radiating element and the heat dissipation equipment are arranged in the housing.
Optionally, in above-mentioned projecting apparatus, air intake vent and air outlet, the air intake vent and air-out are provided with the housing
Mouth is arranged at the diverse location of the housing.
Optionally, in above-mentioned projecting apparatus, the projecting apparatus also includes fan, and the fan is arranged in the housing simultaneously
Close to the air outlet.
Optionally, in above-mentioned projecting apparatus, the housing is spherical shell, and support frame as described above is arranged at the spherical shell
Bottom, the air intake vent is multiple and be respectively arranged at the spherical shell at the diverse location of support frame as described above, institute
Air outlet is stated for one and close to the top of the spherical shell.
A kind of heat dissipation equipment and projecting apparatus provided by the utility model, the projecting apparatus includes the heat dissipation equipment, described
Heat dissipation equipment effectively avoids treating that radiating element can not designed in fact by wind path by setting circuit board, heat sink and support frame
Now radiate, the problem of causing to treat radiating element overheat damage.
To enable above-mentioned purpose of the present utility model, feature and advantage to become apparent, preferred embodiment cited below particularly, and
Accompanying drawing appended by cooperation, is described in detail below.
Brief description of the drawings
, below will be to required use in embodiment in order to illustrate more clearly of the technical scheme of the utility model embodiment
Accompanying drawing be briefly described, it will be appreciated that the following drawings illustrate only section Example of the present utility model, therefore should not be by
Regard the restriction to scope of protection of the utility model as, for those of ordinary skill in the art, do not pay creative labor
On the premise of dynamic, other related accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of structural representation for heat dissipation equipment that the utility model embodiment provides.
Fig. 2 is a kind of structural representation for heat sink that the utility model embodiment provides.
Fig. 3 is a kind of another structural representation for heat dissipation equipment that the utility model embodiment provides.
Fig. 4 is a kind of structural representation for projecting apparatus that the utility model embodiment provides.
Fig. 5 is a kind of another structural representation for projecting apparatus that the utility model embodiment provides.
Icon：10- projecting apparatus；100- heat dissipation equipments；110- circuit boards；130- heat sinks；132- connecting portions；134- is convex
Rise；150- support frames；152- bases；154- support members；170- fixtures；300- treats radiating element；500- housings；510- enters
Air port；530- air outlets；700- fans.
Embodiment
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer
Accompanying drawing in type embodiment, the technical scheme applied to the utility model in example are clearly and completely described, it is clear that described
Embodiment be the utility model part of the embodiment, rather than whole embodiment.Generally describe and show in this figure
The component of the utility model embodiment can arrange and design with a variety of configurations.
Therefore, the detailed description of the embodiment of the present utility model to providing in the accompanying drawings is not intended to limit requirement below
The scope of the utility model of protection, but it is merely representative of selected embodiment of the present utility model.Based in the utility model
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all
Belong to the scope of the utility model protection.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent accompanying drawing in individual accompanying drawing.
In description of the present utility model, it is also necessary to which explanation, unless otherwise clearly defined and limited, term " are set
Put ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection；Can be joined directly together, can also be indirectly connected by intermediary, Ke Yishi
The connection of two element internals.For the ordinary skill in the art, with concrete condition above-mentioned term can be understood at this
Concrete meaning in utility model.
As shown in figure 1, the utility model provides a kind of heat dissipation equipment 100, the heat dissipation equipment 100 is used to treat radiator
Part 300 is radiated, described to treat that radiating element 300 is arranged at the heat dissipation equipment 100.
In the present embodiment, the heat dissipation equipment 100 includes circuit board 110, heat sink 130 and support frame 150, the electricity
Road plate 110 is connected with support frame as described above 150, and the installation that radiating element 300 is treated for installing is provided with the circuit board 110
Portion, the heat sink 130 are arranged at support frame as described above 150 and close to the installation portions.
When the heat dissipation equipment 100 is treated radiating element 300 and radiated, described to treat that radiating element 300 is installed on described
The installation portion of circuit board 110, the heat sink 130 treats that radiating element 300 contacts with described, described to treat radiating element 300 by heat
Amount, which is conducted by way of heat transfer to the heat sink 130, the heat sink 130, conducts heat to support frame 150, so that
The heat sink 130 and support frame 150 can increase area of dissipation and realize by way of radiation to ambient radiation energy
Heat transfer and heat radiation, and then good radiating effect.
Wherein, described to treat that radiating element 300 be arbitrary electronic component, this treats radiating element 300 in temperature mistake
It will cause to damage or influence its performance in the case of height.In the present embodiment, it is described to treat that radiating element 300 is chip.The core
Piece has multiple pins, and the chip is installed on the installation portion of the circuit board 110 by the pin.
The installation portion of the circuit board 110 can be but not limited to contact or pedestal, be not specifically limited herein, according to institute
The pin and its mounting means for stating chip are configured.Such as when the chip is dual inline type chip, then the peace
Dress portion is the pedestal to match with the chip, and the chip is installed on the circuit board 110 by the pedestal, when the core
Piece is when including the microchip of multiple feelers, the microchip multiple feelers respectively with multiple contacts by welding by way of
It is arranged at the circuit board 110.
The circuit board 110 can be but not limited to epoxy resin bonded fiber, paper base plate, copper base, aluminium base, high frequency plate,
Ceramic substrate or pcb board.Optionally, to make the better heat-radiation effect of the chip, so that the chip can pass through the electricity
Road plate 110 radiates, and in the present embodiment, the circuit board 110 is pcb board.
Incorporated by reference to Fig. 2, the shape of the heat sink 130 can be but not limited to cuboid, square or any irregular
Shape, it is not specifically limited herein.The size of the heat sink 130 can be arbitrary, as long as can reach good radiating
Effect, it is not specifically limited herein.
In the present embodiment, the heat sink 130 includes two connecting portions 132, and described two connecting portions 132 are located at respectively
The both ends of the heat sink 130, the heat sink 130 are connected by described two connecting portions 132 with support frame as described above 150.Institute
The shape size for stating connecting portion 132 is not specifically limited herein, as long as it is described to pass through the heat for treating radiating element 300
The connecting portion 132 of heat sink 130 conducts to support frame as described above 150 and can carry out heat radiation.
The mode that the connecting portion 132 is connected with support frame as described above 150 can be but not limited to weld or be threadedly coupled, only
Support frame as described above 150 can be made to be relatively fixed with the heat sink 130.In the present embodiment, the connecting portion 132 and institute
Support frame 150 is stated to be threadedly coupled.
To make the thermal conduction effect of the heat sink 130 more preferably.In the present embodiment, the heat sink 130 also includes convex
Rise 134, described raised 134 close to the circuit board 110 installation portion.Radiated when institute when radiating element 300 to described
State after radiating element 300 conducts heat to the heat sink 130 by described raised 134, will by the connecting portion 132
Heat is conducted to support frame 150, by realize heat transfer and by heat radiation in a manner of heat is radiated to surrounding environment, Jin Ershi
More preferably radiating effect is showed.
Raised 134 shape can be cylinder, cuboid or any irregular shape.Optionally, in this implementation
In example, described raised 134 are shaped as cuboid.Raised 134 area of section treats radiating element 300 described in being more than
Area of section, the area of section that treat radiating element 300 can also be equal to.To make the effect of raised 134 heat conduction more
Good, in the present embodiment, raised 134 area of section is more than the area of section for treating radiating element 300.
Incorporated by reference to Fig. 3, support frame as described above 150 includes base 152 and two support members 154, described two support members
154 one end is respectively arranged at the both ends of the base 152, and the other end is connected with the heat sink 130 respectively, so that the bottom
152 pairs of support members 154 of seat and heat sink 130 play a supportive role, in addition, when the chip cooling equipment 100 is used for
When in electronic equipment, the parts in the electronic equipment can be arranged at the base 152, so that the base 152 can be with
The parts are played with support and receiving effect.
The shape of the base 152 can be but not limited to cuboid, square or any irregular shape, not do herein
It is specific to limit, as long as fixation can be played to support member 154.The support member 154 can be but not limited to
Supporting plate, support bar or arbitrary shape, as long as can be played a supporting role to heat sink 130, it is not specifically limited herein.
It should be noted that in the present embodiment, support frame as described above 150 is by the material system with good heat conductivility
Into the material can be but not limited to silica gel, graphite or metal.In the present embodiment, the Heat Conduction Material is metal material, institute
It is metal frame to state support frame 150.
To avoid described treating radiating element 300 in use because by the crowded of the heat sink 130 and circuit board 110
Pressure, and then the performance of radiating element 300 is treated described in influence, in the present embodiment, the heat dissipation equipment 100 also includes fixture
170, the circuit board 110 is connected by the fixture 170 with support frame as described above 150, by setting the fixture
170 so that the circuit board 110 is connected with support frame as described above 150 or heat sink 130, and makes described to treat that radiating element 300 is bonded
In the heat sink 130.
The shape size of the fixture 170 is not specifically limited herein, is configured according to the actual requirements.It is described
Fixture 170 can be one or multiple, be not specifically limited herein, if can make the heat sink 130 with it is described
Circuit board 110 is relatively fixed.The connected mode of the fixture 170 and support frame as described above 150 can be but not limited to spiral shell
Line connects or welding.In the present embodiment, the fixture 170 is threadedly coupled with support frame as described above 150.
Incorporated by reference to Fig. 4 and Fig. 5, on the basis of the above, the utility model also provides a kind of projecting apparatus 10, the projecting apparatus 10
Including housing 500, radiating element 300 and above-mentioned heat dissipation equipment 100 are treated, it is described to treat that radiating element 300 is arranged at described dissipate
Hot equipment 100, it is described to treat that radiating element 300 and the heat dissipation equipment 100 are arranged in the housing 500.
Because the projecting apparatus 10 includes the heat dissipation equipment 100, therefore the projecting apparatus 10 has the heat dissipation equipment
100 corresponding features, do not do repeat one by one herein.
In the present embodiment, air intake vent 510 and air outlet 530, the He of air intake vent 510 are provided with the housing 500
The air outlet 530 is arranged at the diverse location of the housing 500, passes through the above-mentioned setting spoke of heat dissipation equipment 100
The heat being incident upon in surrounding environment can be taken away by the air intake vent 510 and then by the air outlet 530, and then realizes and dissipate
Heat.
The air intake vent 510 can be one or multiple, be configured according to the actual requirements, herein not
It is specifically limited.It can also be multiple that the air outlet 530, which can be one, be configured according to the actual requirements, herein
It is not specifically limited.
, can be by accelerating speed air flow in the housing 500 to make the better heat-radiation effect of the projecting apparatus 10
Mode.In the present embodiment, the projecting apparatus 10 also includes fan 700, and the fan 700 can be arranged at the air intake vent
Any position at 510, at air outlet 530 or in the housing 500.To make the fan 700 reach more preferably radiating effect
Fruit, in the present embodiment, the fan 700 are arranged at the air outlet 530.
The shape of the housing 500 can be square, cuboid, spheroid or any irregular shape.Do not do and have herein
Body is limited, and according to the actual requirements and visual effect is configured.
In the present embodiment, the housing 500 is spherical shell, and support frame as described above 150 is arranged at the spherical shell
Bottom, the air intake vent 510 are multiple and be respectively arranged at diverse location of the spherical shell close to support frame as described above 150
Place, the air outlet 530 are one and close to the tops of the spherical shell.
By above-mentioned setting to described when heat dissipation equipment 100 radiates, it is described to treat radiating element 300 by heat
Amount conduction increases area of dissipation, the fan 700 is by described in the circuit board 110, heat sink 130 and support frame 150
It is outer so that the air around the projecting apparatus 10 is entered by the air intake vent 510 that air in housing 500 is expelled to housing 500
In the housing 500, speed air flow is increased, and then reaches the radiating effect of the heat dissipation equipment 100 and projecting apparatus 10
To optimum state.
To sum up, a kind of heat dissipation equipment 100 and projecting apparatus 10 that the utility model embodiment provides, the projecting apparatus 10 include
The heat dissipation equipment 100, the heat dissipation equipment 100 are effectively increased by setting circuit board 110, heat sink 130 and support frame 150
Area of dissipation is added, and then has avoided treating to treat the damage of the overheat of radiating element 300 or performance caused by the radiating effect difference of radiating element 300
The problem of reduction.Cause the radiating secondly by support frame 150 is arranged into metal frame, circuit board 110 is arranged to PCD plates
The better heat-radiation effect of equipment 100.The projecting apparatus 10 includes housing 500, by setting the He of air intake vent 510 on housing 500
The radiating effect of projecting apparatus 10 described in the effective guarantee of air outlet 530, further, by setting wind at the air outlet 530
Fan 700, increases the air passage rates in housing 500, greatly improves radiating effect, and then be effectively ensured and treat radiator
Part 300 is operated under preferable states.
It should be noted that herein, term " comprising " or any other variant are intended to the bag of nonexcludability
Contain, so that process, article or equipment including a series of elements not only include those key elements, but also including not bright
The other element really listed, or also include for this process, article or the intrinsic key element of equipment.Do not limiting more
In the case of system, the key element that is limited by sentence "including a ...", it is not excluded that the process including the key element, article or
Other identical element in person's equipment also be present.
It is described above, only specific embodiment of the present utility model, but the scope of protection of the utility model is not limited to
In this, any one skilled in the art can readily occur in change in the technical scope that the utility model discloses
Or replace, it should all cover within the scope of protection of the utility model.Therefore, the scope of protection of the utility model should be described with power
The protection domain that profit requires is defined.
Claims (10)
- A kind of 1. heat dissipation equipment, it is characterised in that including circuit board, heat sink and support frame, the circuit board and the support Frame is connected, and the installation portion that radiating element is treated for installing is provided with the circuit board, and the heat sink is arranged at the support Frame and the close installation portion.
- 2. heat dissipation equipment according to claim 1, it is characterised in that the heat sink includes two connecting portions, and described two Individual connecting portion is located at the both ends of the heat sink respectively, and the heat sink is connected by described two connecting portions and support frame as described above Connect.
- 3. heat dissipation equipment according to claim 2, it is characterised in that the heat sink also includes projection, and the projection is leaned on The installation portion of the nearly circuit board.
- 4. heat dissipation equipment according to claim 1, it is characterised in that support frame as described above includes base and two supporting parts Part, one end of described two support members are respectively arranged at the both ends of the base, and the other end is connected with the heat sink respectively.
- 5. heat dissipation equipment according to claim 1, it is characterised in that the heat dissipation equipment also includes fixture, the electricity Road plate is connected by the fixture with support frame as described above.
- 6. heat dissipation equipment according to claim 1, it is characterised in that support frame as described above is metal frame, and the circuit board is Pcb board.
- 7. a kind of projecting apparatus, it is characterised in that including housing, treat described in radiating element and claim 1-6 any one Heat dissipation equipment, it is described to treat that radiating element is arranged at the heat dissipation equipment, it is described to treat that radiating element and the heat dissipation equipment are arranged at In the housing.
- 8. projecting apparatus according to claim 7, it is characterised in that air intake vent and air outlet, institute are provided with the housing State air intake vent and air outlet is arranged at the diverse location of the housing.
- 9. projecting apparatus according to claim 8, it is characterised in that the projecting apparatus also includes fan, and the fan is set In in the housing and close to the air outlet.
- 10. projecting apparatus according to claim 8, it is characterised in that the housing is spherical shell, and support frame as described above is set In the bottom of the spherical shell, the air intake vent is multiple and is respectively arranged at the spherical shell close to support frame as described above At diverse location, the air outlet is one and close to the top of the spherical shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720429101.XU CN206892540U (en) | 2017-04-21 | 2017-04-21 | A kind of heat dissipation equipment and projecting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720429101.XU CN206892540U (en) | 2017-04-21 | 2017-04-21 | A kind of heat dissipation equipment and projecting apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206892540U true CN206892540U (en) | 2018-01-16 |
Family
ID=61324966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720429101.XU Active CN206892540U (en) | 2017-04-21 | 2017-04-21 | A kind of heat dissipation equipment and projecting apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206892540U (en) |
-
2017
- 2017-04-21 CN CN201720429101.XU patent/CN206892540U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Heat rejection apparatus and projecting apparatus Effective date of registration: 20181109 Granted publication date: 20180116 Pledgee: Pudong Development Silicon Valley Bank Co., Ltd. Beijing branch Pledgor: CHENGDU XGIMI TECHNOLOGY CO., LTD. Registration number: 2018990001052 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| CP03 | Change of name, title or address |
Address after: 610000 Tianfu Software Park Area A, 1129 Century City Road, Chengdu High-tech Zone, Sichuan Province Patentee after: Chengdu Jimi Technology Co., Ltd. Address before: No. 1129 Tianfu Software Park A District Century City high tech Zone of Chengdu City, Sichuan Province Road 610000 7 5 storey building No. 501 Patentee before: CHENGDU XGIMI TECHNOLOGY CO., LTD. |
|
| CP03 | Change of name, title or address | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20200616 Granted publication date: 20180116 Pledgee: Pudong Development Silicon Valley Bank Co.,Ltd. Beijing branch Pledgor: CHENGDU XGIMI TECHNOLOGY Co.,Ltd. Registration number: 2018990001052 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |