CN206806365U - It is easy to the EMC encapsulation lamp beads of processing - Google Patents

Abstract

It the utility model is related to LED lamp bead technical field, disclose the EMC encapsulation lamp beads for being easy to processing, including substrate and EMC base materials, EMC base materials enclose the edge of substrate and form a groove, and one end of substrate, which is extended to outside EMC base materials, forms elongated end, and the edge of elongated end is provided with aperture, when processing lamp bead described above, substrate can pass through aperture fixed position so that substrate will not walk because of processing and fabricating, so as to improve yield rate.

Description

It is easy to the EMC encapsulation lamp beads of processing

Technical field

The technical field of LED lamp bead is the utility model is related to, is especially easy for the EMC encapsulation lamp beads of processing.

Background technology

LED lamp bead enjoys every field to favor with the advantages that its is durable, environmentally friendly, energy-conservation, with people pursue it is more environmentally friendly, More energy efficient, more cost-effective technical scheme, EMC base materials have been widely used for LED lamp bead.

At present, the LED lamp bead of EMC encapsulation is usually to be embedded in EMC base materials by substrate and completed, and conductive plate shape is used as using substrate Into electric connection, but due in processing encapsulation process, easily making substrate walk, processing inconvenience is caused, so as to reduce product Yield rate.

Utility model content

The purpose of this utility model is to provide the EMC encapsulation lamp beads for being easy to processing, it is intended to solves EMC encapsulation lamp bead processing During, cause the not high technical problem of yield rate because substrate walks.

The utility model is achieved in that the EMC encapsulation lamp beads for being easy to processing, including substrate and EMC base materials, described EMC base materials enclose the edge of the substrate and form a groove, and fluorescent adhesive layer is filled with the groove, is glued on the substrate Multiple LED chips are connected to, the fluorescent adhesive layer is covered in the LED chip, and one end of the substrate extends to the EMC bases Elongated end is formed outside material, the edge of the elongated end is provided with aperture.

Further, the aperture is oval.

Further, the aperture is provided with three, and equilibrium is arranged in the edge of elongated end 102 side by side respectively.

Further, the elongated end has two, and is respectively disposed with aperture in edge.

Further, the substrate is square, and two elongated ends are separately positioned on the relative both ends of the substrate.

Further, the length of side of the substrate is arranged to 2mm-10mm.

Further, the LED chip is arranged in array.

Further, the groove is circular or fillet square.

Further, the substrate is made by copper is nickel-plated and silver-plated.

Compared with prior art, it is easy to the EMC encapsulation lamp beads of processing, including substrate and EMC base materials, EMC base materials to enclose base Edges of boards edge and form a groove, one end of substrate extends to outside EMC base materials and forms elongated end, and is provided with elongated end small Hole, when processing lamp bead described above, substrate can pass through aperture fixed position so that and substrate will not walk because of making, Processing is more convenient, so as to improve yield rate.

Brief description of the drawings

Fig. 1 is the diagrammatic cross-section for the EMC encapsulation lamp beads for being easy to processing that the utility model embodiment provides；

Fig. 2 is the elevational schematic view for the EMC encapsulation lamp beads for being easy to processing that the utility model embodiment provides.

Embodiment

In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining The utility model, it is not used to limit the utility model.

Realization of the present utility model is described in detail below in conjunction with specific embodiment.

Referring to figs. 1 to shown in Fig. 2, being preferred embodiment provided by the utility model.

In the present embodiment, it is easy to the EMC encapsulation lamp beads of processing, including substrate 101 and EMC base materials 103, substrate 101 to set To be square, the length of side of substrate 101 is arranged to 8mm, and the edge that EMC base materials 103 enclose substrate 101 forms a groove, groove Fillet square is shaped to, fluorescent adhesive layer 105 is filled with groove；Multiple LED chips 106 are bonded with substrate 101, it is glimmering Optical cement layer 105 is covered in LED chip 106, and one end of substrate 101 extends to outside EMC base materials 103 and forms elongated end 102, prolongs The edge for stretching end 102 is provided with aperture 107, and when processing lamp bead described above, substrate 101 can be fixed by aperture 107 Position so that substrate 101 will not walk because of processing and fabricating, so as to improve yield rate.

In the present embodiment, as shown in Fig. 2 aperture 107 is arranged to ellipse so that aperture 107 is more suitable for fixed position.

In the present embodiment, as shown in Fig. 2 to make the position of substrate 101 more be fixed, it is not easy to walk, in elongated end 102 The aperture 107 that edge is set has three, and is balancedly arranged in the edge of elongated end 102 side by side respectively.

In the present embodiment, as shown in Fig. 2 elongated end 102 is provided with two, the opposite end of substrate 101 is separately positioned on, And three apertures 107 are respectively arranged with edge.

In the present embodiment, as shown in figure 1, the upper surface of substrate 101 is bonded with multiple LED chips 106, to make such as above-mentioned lamp More preferably, multiple LED chips 106 are arranged in array the light efficiency of pearl, and fluorescent glue 105 is filled in groove, and is covered in LED chip On 106.

Specifically, the multiple arrangements of the rectangular array of LED chip 106 or circular array arrangement.

Because groove is fillet square, when LED chip 106 is luminous, some light is reflected by groove inner wall, so that Obtain light efficiency described above more preferably.

In the present embodiment, substrate 101 is made by copper is nickel-plated and silver-plated, and copper is nickel-plated and silver-plated than copper better heat-radiation effect, and conductive Performance is more preferable.

As other embodiment, it is easy to the EMC of processing to encapsulate lamp bead, including substrate 101 and EMC base materials 103, substrate 101 It is arranged to square, the length of side of substrate 101 is arranged to 3mm, and the edge that EMC base materials 103 enclose substrate 101 forms a groove, recessed Groove is shaped to circle, and fluorescent glue is filled with groove；Multiple LED chips 106, fluorescent adhesive layer are bonded with substrate 101 105 are covered in LED chip 106, and one end of substrate 101 extends to outside EMC base materials 103 and forms elongated end 102, elongated end 102 edge is provided with aperture 107, when processing lamp bead described above, substrate 101 can by the fixed position of aperture 107, So that substrate 101 will not walk because of processing and fabricating, so as to improve yield rate.

As other embodiment, to make aperture 107 be more suitable for fixed position, aperture 107 is it can also be provided that circle.

As other embodiment, because the length of side of substrate 101 only has 3mm, size is smaller, so the edge of elongated end 102 One aperture 107 is only set.

As other embodiment, because groove is circle, when LED chip 106 is luminous, some light is anti-by groove inner wall Penetrate, so that light efficiency described above is more preferably.

Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model Protection domain within.

Claims (9)

1. it is easy to the EMC encapsulation lamp beads of processing, it is characterised in that including substrate and EMC base materials, the EMC base materials enclose described The edge of substrate and form a groove, is filled with fluorescent adhesive layer in the groove, multiple LED cores is bonded with the substrate Piece, the fluorescent adhesive layer are covered in the LED chip, and one end of the substrate, which is extended to outside the EMC base materials, forms extension End, aperture is provided with the edge of the elongated end.

2. it is easy to the EMC encapsulation lamp beads of processing as claimed in claim 1, it is characterised in that the aperture is oval.

3. it is easy to the EMC encapsulation lamp beads of processing as claimed in claim 1, it is characterised in that the aperture is provided with three, and divides Equilibrium is not arranged in the edge of elongated end side by side.

4. it is easy to the EMC encapsulation lamp beads of processing as claimed in claim 1, it is characterised in that the elongated end is provided with two, and Aperture is respectively disposed with edge.

5. it is easy to the EMC encapsulation lamp beads of processing as claimed in claim 4, it is characterised in that the substrate is square, two extensions End is separately positioned on the relative both ends of the substrate.

6. it is easy to the EMC encapsulation lamp beads of processing as claimed in claim 5, it is characterised in that the length of side of the substrate is arranged to 2mm-10mm。

7. it is easy to the EMC encapsulation lamp beads of processing as described in any one of claim 1 to 6, it is characterised in that the LED chip is in Array arrangement.

8. it is easy to the EMC encapsulation lamp beads of processing as claimed in claim 7, it is characterised in that the groove is circular or fillet four It is square.

9. it is easy to the EMC encapsulation lamp beads of processing as claimed in claim 7, it is characterised in that the substrate is by the nickel-plated and silver-plated system of copper Into.