CN206775827U - A kind of turmeric PCB - Google Patents
A kind of turmeric PCB Download PDFInfo
- Publication number
- CN206775827U CN206775827U CN201720620384.6U CN201720620384U CN206775827U CN 206775827 U CN206775827 U CN 206775827U CN 201720620384 U CN201720620384 U CN 201720620384U CN 206775827 U CN206775827 U CN 206775827U
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- solder mask
- circuit
- turmeric
- welding resistance
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Abstract
The utility model discloses a kind of turmeric PCB, including lower floor, windowing circuit, lid welding resistance sandwich circuit, the first solder mask, turmeric layer and the second solder mask；The windowing circuit and lid welding resistance sandwich circuit are located at the upper surface of lower floor, and the first solder mask is located at the upper surface of lower floor and lid welding resistance sandwich circuit, and interval be present between the windowing circuit and the first solder mask of surrounding；A part of turmeric layer is located at the upper surface of part lid welding resistance sandwich circuit positioned at the upper surface of windowing circuit, another part turmeric layer；Interval between the second solder mask filling lid welding resistance sandwich circuit and the first solder mask, and second solder mask is covered in the upper surface of the first solder mask and the turmeric layer on lid welding resistance sandwich circuit.The utility model because turmeric layer processing and have two layers of solder mask, circuit and the lid welding resistance sandwich circuit spacing of opening a window from it is smaller when ooze gold it is bad caused by short circuit improved.
Description
Technical field
It the utility model is related to PCB technical fields, and in particular to a kind of turmeric PCB.
Background technology
In being surface-treated the pcb board for turmeric and producing, when windowing distance of the circuit away from lid welding resistance sandwich circuit is too small, turmeric
Technique tend to have ooze gold it is bad, particularly solder mask requirement for black ink when, because light is difficult to reach when black ink exposes
To the bottom of ink, and lateral erosion is bigger than normal, it is easier to which it is bad that gold is oozed in generation, such to ooze that gold is bad to be caused lid welding resistance sandwich circuit and to hold
It is short-circuit between window circuit, so as to cause PCB to scrap.
Utility model content
The technical problem that the utility model solves is to find a kind of turmeric PCB of more reasonable structure, and turmeric PCB can improve
It is bad to ooze gold.
To achieve the above object, the utility model provides a kind of turmeric PCB, including lower floor, windowing circuit, lid welding resistance layer line
Road, the first solder mask, turmeric floor and the second solder mask；The windowing circuit and lid welding resistance sandwich circuit are located at the upper surface of lower floor,
First solder mask is located at the upper surface of lower floor and lid welding resistance sandwich circuit, and between the windowing circuit and the first solder mask of surrounding
In the presence of interval；A part of turmeric layer is located at part lid welding resistance sandwich circuit positioned at the upper surface of windowing circuit, another part turmeric layer
Upper surface；Interval between the second solder mask filling lid welding resistance sandwich circuit and the first solder mask, and second welding resistance
Layer is covered in the upper surface of the first solder mask and the turmeric layer on lid welding resistance sandwich circuit.
Further, the interval width between the lid welding resistance sandwich circuit and the first solder mask is in more than 15mil.
Further, the turmeric layer is heavy nickel-gold layer or heavy NiPdAu layer.
Further, the lower floor is basic unit.
Further, the lower floor is basic unit and some line layers.
Further, first solder mask and the second solder mask are black ink layer or the ink layer of other colors.
What the utility model was realized has the beneficial effect that：Because turmeric layer processing and have two layers of solder mask, open a window circuit and lid
Welding resistance sandwich circuit spacing from it is smaller when ooze gold it is bad caused by short circuit improved.
Brief description of the drawings
Fig. 1 is the utility model turmeric PCB construction schematic diagram.
Tu Zhong 1- lower floors, 21- windowing circuits, 22- lid welding resistance sandwich circuits, the solder masks of 3- first, 4- turmeric layers, 5- second hinder
Layer.
Accompanying drawing being given for example only property explanation, it is impossible to be interpreted as the limitation to this patent；It is attached in order to more preferably illustrate the present embodiment
Scheme some parts to have omission, zoom in or out, do not represent the size of actual product；To those skilled in the art,
Some known features and its explanation may be omitted and will be understood by accompanying drawing；Same or analogous label corresponds to same or similar
Part；Term the being given for example only property explanation of position relationship described in accompanying drawing, it is impossible to be interpreted as the limitation to this patent.
Embodiment
For the ease of it will be appreciated by those skilled in the art that entering to advance to the utility model below in conjunction with accompanying drawing and embodiment
One step is described in detail.
Embodiment 1
Referring to Fig. 1, a kind of turmeric PCB, including lower floor 1, windowing circuit 21, lid welding resistance sandwich circuit 22, the first solder mask
3rd, the solder mask 5 of turmeric layer 4 and second；The windowing circuit 21 and lid welding resistance sandwich circuit 22 are located at the upper surface of lower floor 1, the first resistance
Layer 3 is located at the upper surface of lower floor 1 and lid welding resistance sandwich circuit 22, and the first solder mask 3 of the windowing circuit 21 and surrounding it
Between exist interval；A part of turmeric layer 4 is located at part lid welding resistance positioned at the upper surface of windowing circuit 21, another part turmeric layer 4
The upper surface of sandwich circuit 22；Second solder mask 5 is filled in the interval between lid welding resistance sandwich circuit 22 and the first solder mask 3
It is interior, and second solder mask 5 is covered in the upper surface of the first solder mask 3 and the turmeric layer 4 on lid welding resistance sandwich circuit 22.
Above-mentioned turmeric PCB technology method is as follows, after the completion of sawing sheet to surface line etches these preceding process,
I.e. surface line has been completed to make, and next need to complete is that PCB surface route protection and pad are handled, surface line bag
Windowing circuit 21 and lid welding resistance sandwich circuit 22 are included, lid welding resistance sandwich circuit 22 needs printing solder mask to make protective layer, windowed thread above
It is pad locations at road 21, pad needs to do anti-oxidant treatment, and turmeric is a kind of preferable anti-oxidation treatment method of effect, therefore
Turmeric layer 4 is done on window circuit 21.When distance is less than 3mil between PCB windowing circuit 21 and lid welding resistance sandwich circuit 22, for this
Kind of PCB, the first solder mask 3 is first printed on the PCB for completing previous step, and in the range of the surrounding 15mil of circuit 21 that opens a window under
The first solder mask 3 is not printed on layer 1 and the surface of lid welding resistance sandwich circuit 22；Turmeric layer 4 is done after the first solder mask 3 completes, is sunk
Layer gold 4 is deposited on the upper surface of lower cover welding resistance sandwich circuit 22 in the range of windowing circuit 21 and windowing circuit 21 surrounding 15mil；Turmeric
Layer 4 prints the second solder mask 5 after completing, and second solder mask 5 is covered in the turmeric layer 4 on the surface of lid welding resistance sandwich circuit 22
With the upper surface of the first solder mask 3, and second solder mask 5 filling welding resistance sandwich circuit 22 and the first solder mask 3 between
Gap.Abovementioned steps complete turmeric PCB making, and because of the method for turmeric and using two layers of solder mask, open a window circuit and lid solder mask
The bad caused short circuit of gold of oozing when distance is smaller between circuit is improved.
Preferably, the turmeric layer 4 is heavy nickel-gold layer or heavy NiPdAu layer.
Preferably, the lower floor 1 is basic unit.
Preferably, the lower floor 1 is basic unit and some line layers.
Preferably, the solder mask 5 of the first solder mask 3 and second is black ink layer or green oil layer of ink.
Obviously, above-described embodiment of the present utility model is only intended to clearly illustrate the utility model example, and
It is not the restriction to embodiment of the present utility model.For those of ordinary skill in the field, in described above
On the basis of can also make other changes in different forms.There is no need and unable to give all embodiments
It is exhaustive.All made within spirit of the present utility model and principle all any modification, equivalent and improvement etc., should be included in
Within the protection domain of the utility model claims.
Claims (6)
1. a kind of turmeric PCB, including lower floor（1）, windowing circuit（21）, lid welding resistance sandwich circuit（22）, the first solder mask（3）With it is heavy
Layer gold（4）, it is characterised in that also including the second solder mask（5）；The windowing circuit（21）With lid welding resistance sandwich circuit（22）It is located at
Lower floor（1）Upper surface, the first solder mask（3）Positioned at lower floor（1）With lid welding resistance sandwich circuit（22）Upper surface, and the windowing
Circuit（21）With the first solder mask of surrounding（3）Between exist interval；A part of turmeric layer（4）Positioned at windowing circuit（21）It is upper
Surface, another part turmeric layer（4）Positioned at part lid welding resistance sandwich circuit（22）Upper surface；Second solder mask（5）Filling
Lid welding resistance sandwich circuit（22）With the first solder mask（3）Between interval, and second solder mask（5）It is covered in the first solder mask
（3）With positioned at lid welding resistance sandwich circuit（22）On turmeric layer（4）Upper surface.
2. turmeric PCB according to claim 1, it is characterised in that the lid welding resistance sandwich circuit（22）With the first solder mask
（3）Between interval width in more than 15mil.
3. turmeric PCB according to claim 1, it is characterised in that the turmeric layer（4）For heavy nickel-gold layer or heavy NiPdAu
Layer.
4. turmeric PCB according to claim 1, it is characterised in that the lower floor（1）For basic unit.
5. turmeric PCB according to claim 1, it is characterised in that the lower floor（1）For basic unit and some line layers.
6. turmeric PCB according to claim 1, it is characterised in that first solder mask（3）With the second solder mask（5）
For the ink layer of black ink layer or other colors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720620384.6U CN206775827U (en) | 2017-05-31 | 2017-05-31 | A kind of turmeric PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720620384.6U CN206775827U (en) | 2017-05-31 | 2017-05-31 | A kind of turmeric PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206775827U true CN206775827U (en) | 2017-12-19 |
Family
ID=60638681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720620384.6U Active CN206775827U (en) | 2017-05-31 | 2017-05-31 | A kind of turmeric PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206775827U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770525A (en) * | 2020-12-18 | 2021-05-07 | 珠海杰赛科技有限公司 | Manufacturing method of printed circuit board |
-
2017
- 2017-05-31 CN CN201720620384.6U patent/CN206775827U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770525A (en) * | 2020-12-18 | 2021-05-07 | 珠海杰赛科技有限公司 | Manufacturing method of printed circuit board |
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