CN107548226A - A kind of printed circuit board (PCB) preparation technology and printed circuit board (PCB) - Google Patents
A kind of printed circuit board (PCB) preparation technology and printed circuit board (PCB) Download PDFInfo
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- CN107548226A CN107548226A CN201710726230.XA CN201710726230A CN107548226A CN 107548226 A CN107548226 A CN 107548226A CN 201710726230 A CN201710726230 A CN 201710726230A CN 107548226 A CN107548226 A CN 107548226A
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Abstract
The present invention, which provides a kind of printed circuit board (PCB) preparation technology and printed circuit board (PCB), this method, to be included：Etching forms spaced through hole unit and wiring channel on signal plate, wherein, the through hole unit includes via pad and the shielding construction positioned at the via pad the week side of boss, and the via pad includes at least one difference pad pair and at least one ground pad；Press earth plate, signal plate and sheet surface layer and form PCB；Through hole is drilled with the position of the difference pad pair He the ground pad；The through hole is metallized, forms Difference signal pair and ground hole.By technical scheme, the signal cross-talk between Difference signal pair can be reduced, improves high-speed link performance.
Description
Technical field
The present invention relates to printed-board technology field, more particularly to a kind of printed circuit board (PCB) preparation technology and printed circuit
Plate.
Background technology
The pin of high speed connector is realized by encapsulation and PCB (Printed Circuit Board, printed circuit board) plate
Connection, signal rate have reached 25Gbps (1000 megabits per second) even more high 56Gbps, and Signal coding mode is also from NRZ
(Non-Return to Zero, NRZ) is to PAM4 (Pulse Amplitude Modulation 4, pulse-amplitude modulation
4) change.The transformation of signal rate and coded system means that signal to noise ratio constantly reduces, it is desirable to controls as far as possible and optimizes letter
Crosstalk between number.
The content of the invention
In view of this, the present invention provides a kind of PCB preparation technologies and PCB, can reduce the signal between high speed signal pin
Crosstalk.
To achieve the above object, it is as follows to provide technical scheme by the present invention：
According to the first aspect of the invention, it is proposed that a kind of PCB preparation technologies, including：
Etching forms spaced through hole unit and wiring channel on signal plate, wherein, the through hole unit includes
Via pad and the shielding construction positioned at the via pad the week side of boss, the via pad include at least one difference pad pair and
At least one ground pad；
Press earth plate, signal plate and sheet surface layer and form PCB；
Through hole is drilled with the position of the difference pad pair He the ground pad；
The through hole is metallized, forms Difference signal pair and ground hole.
According to the second aspect of the invention, it is proposed that a kind of PCB, including earth plate, signal plate and sheet surface layer；Wherein：
Through hole unit and wiring channel are arranged at intervals with the signal plate；Wherein, the through hole unit welds including through hole
Disk and the shielding construction positioned at the via pad the week side of boss, the via pad include at least one difference pad pair and at least one
Individual ground pad；
Difference signal pair and ground hole are respectively formed with the position of the difference pad pair and the ground pad.
From above technical scheme, the present invention by the week side of boss for the Difference signal pair on PCB formed with shielding construction,
The signal cross-talk between Difference signal pair can be effectively reduced, and then high-speed link performance can be improved.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of PCB preparation technologies provided in an embodiment of the present invention；
Fig. 2 is a kind of schematic diagram of the signal plate formed with shielding construction provided in an embodiment of the present invention；
Fig. 3 is a kind of signal of signal plate for foring wiring breach and differential signal line provided in an embodiment of the present invention
Figure；
Fig. 4 is a kind of schematic diagram of the design parameter of shielding construction provided in an embodiment of the present invention；
Fig. 5 A and Fig. 5 B are the connection diagram of ground pad provided in an embodiment of the present invention and shielding line.
Embodiment
The present invention increases shielding construction by Difference signal pair on the signal plate for PCB, reduces between Difference signal pair
Signal cross-talk.
In order that those skilled in the art more fully understand technical scheme provided in an embodiment of the present invention, and make of the invention real
Apply the above-mentioned purpose of example, feature and advantage can be more obvious understandable, below in conjunction with the accompanying drawings to technical side in the embodiment of the present invention
Case is described in further detail.
Fig. 1 is referred to, is a kind of schematic flow sheet of PCB preparation technologies provided in an embodiment of the present invention, as shown in figure 1,
The PCB preparation technologies may comprise steps of：
Step 101, etching forms spaced through hole unit and wiring channel on signal plate, wherein, the through hole list
Member includes via pad and the shielding construction positioned at via pad the week side of boss, the via pad include at least one difference pad pair with
At least one ground pad.
In the embodiment of the present invention, it is contemplated that can have signal cross-talk between the transmission cabling of high speed connector, in order to reduce
Signal cross-talk between the transmission cabling of high speed connector, screen can be set in the Difference signal pair the week side of boss on PCB signal plate
Shield structure, to reduce the signal cross-talk between adjacent differential signal pair, and then between the transmission cabling of reduction high speed connector
Signal cross-talk.
Correspondingly, as shown in Fig. 2 in embodiments of the present invention, in PCB preparation process, can be etched on signal plate
During via pad, shielding construction can be formed in via pad the week side of boss, the shielding construction is used between shielding high-speed signal pin
Signal cross-talk；Wherein, via pad can include at least one difference pad pair and at least one ground pad.
Step 102, pressing earth plate, signal plate and sheet surface layer form PCB.
In PCB preparation process, after being handled in the way of being described by step 101 signal plate, it can dock
Floor, signal plate and sheet surface layer are pressed, to form PCB.
Step 103, in the position of difference pad pair and ground pad it is drilled with through hole.
Step 104, through hole is metallized, form Difference signal pair and ground hole.
Carried out by pressing earth plate, signal plate and sheet surface layer after pressing forms PCB, can on PCB difference pad
Pair and the position of ground pad be drilled with through hole, and the through hole to being drilled with metallizes, and forms Difference signal pair and ground hole.
It can be seen that by the PCB preparation technologies shown in Fig. 1, the week side of boss of the Difference signal pair on PCB formed with shielding construction,
The signal cross-talk between Difference signal pair can be effectively reduced.
Further, for the Difference signal pair for demand occur be present, formed in pressing earth plate, signal plate and sheet surface layer
Before PCB, wiring breach can also be etched between target difference pad pair and wiring channel on signal plate, and in signal plate
Upper etching is formed with target difference pad to the differential signal line that is connected, so as to realize target difference pad to corresponding difference
The cabling demand of signal pair.
Wherein, the target difference pad is to at least one (true according to actual cabling demand of above-mentioned difference pad centering
It is fixed)；The differential signal line that is connected is included with target difference pad to go out line segment and along wiring channel by wiring breach
The span line of extension.
By taking signal plate shown in Fig. 3 as an example, target difference pad to that can include the 2nd row, (from left to right, similarly hereinafter) weld by difference
2nd (from top to bottom, similarly hereinafter) difference pad of disk centering is to, the 1st difference pad pair of the 4th row difference pad centering and
3 difference pads to, the 2nd difference pad pair of the 5th row difference pad pair and the 4th difference pad to etc.；With above-mentioned mesh
Mark pad is respective objects difference pad to the black thick lines of connection to the differential signal line being connected.
Further, difference pad includes two screens formed along the bearing of trend of wiring channel to the shielding construction of the week side of boss
Cover line and connect the connection shielding line of two shielding lines, its schematic diagram can be as shown in Figure 2.
Wherein, in order to optimize the shield effectiveness of signal cross-talk, target land is to the side with wiring breach on signal plate
Shielding line size be more than opposite side (i.e. without wiring breach) side size.
By taking the 2nd row difference pad pair in the signal plate shown in Fig. 3 as an example, because the row difference pad exists to right side
Line, and cabling is not present in left side, therefore, the width of the shielding line on the right side of the row difference pad pair can be more than the shielding in left side
The width of line.
It should be noted that when target land is respectively provided with wiring breach to both sides, the size of the shielding line of both sides can be with
Unanimously.
By taking the 4th row difference pad pair in signal plate shown in Fig. 3 as an example, because the row difference pad is deposited to left side and right side
In wiring breach, therefore, the row difference pad can be consistent with the size of the shielding line on right side to left side.
In the embodiment of the present invention, in shielding construction of the formation difference pad to the week side of boss, it is necessary to according to high-speed-differential link
Cabling space demand and high speed connector parameter, determine the wiring space of shielding construction, and then determine setting for shielding construction
Count parameter, such as minimum spacing between shielding line minimum feature, shielding line and difference pad.
Wherein, the minimum spacing between the minimum feature of shielding construction and shielding construction and difference pad pair can be such as figure
(wherein, w is the minimum feature of the shielding line of shielding construction, and d is between the shielding line and difference pad pair of shielding construction shown in 4
Minimum spacing).
Further, after the design parameter of shielding construction is determined, in the design parameter shape according to the shielding construction
Into before shielding construction, it is also necessary to judge whether the design parameter of shielding construction meets PCB design demand, i.e., used in judgement
Whether PCB preparation technologies can form shielding knot to the week side of boss according to the design parameter of identified shielding construction in difference pad
Structure.
For example, when the minimum feature of the shielding line of identified shielding construction is too small, used PCB preparation technologies can
It is able to not can be processed.
In the one of embodiment of the present invention, above-mentioned at least one ground pad along wiring channel bearing of trend with forming
Two shielding lines connection, its schematic diagram is as shown in Figure 5A.
In this embodiment, ground pad is provided separately between two neighboring difference pad pair, and the two of ground pad
The shielding line of side and shielding construction connects, so that difference pad realizes crosstalk to the shielding construction of the week side of boss by the form of ground connection
Shielding.
In another embodiment, above-mentioned at least one ground pad with along wiring channel bearing of trend formed
Two shielding line is integrally connected shaping, and its schematic diagram is as shown in Figure 5 B.
In this embodiment, ground pad and shielding construction are wholely set, for example, adjacent two on the signal plate shown in Fig. 5 B
Setting between individual difference pad pair is the ground pad and shielding construction being wholely set, and similarly, shielding construction passes through with connecing
Ground pad connection is grounded, and crosstalk shields are realized in the form of ground connection.
Further, the embodiment of the present invention also provides a kind of PCB, wherein, the PCB includes：Earth plate, signal plate and top layer
Plate；Wherein：
Through hole unit and wiring channel are arranged at intervals with the signal plate；Wherein, the through hole unit include via pad and
Positioned at the shielding construction of via pad the week side of boss, via pad includes at least one difference pad pair and at least one ground pad；
Wherein, the schematic diagram of the signal plate can be as shown in Figure 2；
Difference signal pair and ground hole are respectively formed with the position of the difference pad pair and ground pad.
Further, in embodiments of the present invention, set on above-mentioned signal plate between target difference pad pair and wiring channel
It is equipped with wiring breach；Wherein, target difference pad is to at least one of the difference pad centering；
It is provided with above-mentioned signal plate with target difference pad to the differential signal line that is connected, wherein, differential signal line
Including going out line segment and the span line extended along wiring channel by wiring breach.
By taking signal plate shown in Fig. 3 as an example, target difference pad is to that can include the 2nd difference of the 2nd row difference pad centering
Point pad is to, the 1st difference pad pair of the 4th row difference pad centering and the 3rd difference pad to, the 5th row difference pad pair
The 2nd difference pad pair and the 4th difference pad to etc.；It is as corresponding to the black thick lines of connection to above-mentioned target land
Target difference pad is to the differential signal line that is connected.
Further, in embodiments of the present invention, above-mentioned shielding construction includes what is formed along the bearing of trend of wiring channel
Two shielding lines and the connection shielding line for connecting two shielding lines；
Wherein, there is size of the size more than the shielding line of opposite side of the shielding line of wiring breach side.
By taking the 2nd row difference pad pair in the signal plate shown in Fig. 3 as an example, because the row difference pad exists to right side
Line, and cabling is not present in left side, therefore, the width of the shielding line on the right side of the row difference pad pair can be more than the shielding in left side
The width of line.
Further, in one of the embodiments, above-mentioned at least one ground pad is connected with two shielding lines, and it shows
Intention can be as shown in Figure 5A.
In this embodiment, ground pad is provided separately between two neighboring difference pad pair, and the two of ground pad
The shielding line of side and shielding construction connects, so that difference pad realizes crosstalk to the shielding construction of the week side of boss by the form of ground connection
Shielding.
Further, in another embodiment, above-mentioned at least one ground pad and two shielding lines are integrally connected into
Type its schematic diagram is as shown in Figure 5 B.
In this embodiment, ground pad and shielding construction are wholely set, for example, adjacent two on the signal plate shown in Fig. 5 B
Setting between individual difference pad pair is the ground pad and shielding construction being wholely set, and similarly, shielding construction passes through with connecing
Ground pad connection is grounded, and crosstalk shields are realized in the form of ground connection.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
God any modification, equivalent substitution and improvements done etc., should be included within the scope of protection of the invention with principle.
Claims (10)
- A kind of 1. printing board PCB preparation technology, it is characterised in that including：Etching forms spaced through hole unit and wiring channel on signal plate, wherein, the through hole unit includes through hole Pad and the shielding construction positioned at the via pad the week side of boss, the via pad is including at least one difference pad pair and at least One ground pad；Press earth plate, signal plate and sheet surface layer and form PCB；Through hole is drilled with the position of the difference pad pair He the ground pad；The through hole is metallized, forms Difference signal pair and ground hole.
- 2. PCB preparation technologies according to claim 1, it is characterised in that on pressing earth plate, signal plate and the top layer Plate shape into before PCB, in addition to：Wiring breach is etched between target difference pad pair and wiring channel on signal plate, its In, the target difference pad is to at least one of the difference pad centering；Etching is formed with the target difference pad to the differential signal line that is connected on signal plate, wherein, the difference is believed Number line includes going out line segment and the span line extended along wiring channel by the wiring breach.
- 3. PCB preparation technologies according to claim 2, it is characterised in that the shielding construction is included along wiring channel Two shielding lines and the connection shielding line of connection two shielding lines that bearing of trend is formed；Wherein, there is size of the size more than the shielding line of opposite side of the shielding line of the wiring breach side.
- 4. PCB preparation technologies according to claim 3, it is characterised in that at least one ground pad and described two Bar shielding line connects.
- 5. PCB preparation technologies according to claim 3, it is characterised in that at least one ground pad and described two Bar shielding line is integrally connected shaping.
- 6. a kind of printing board PCB, it is characterised in that including earth plate, signal plate and sheet surface layer；Wherein：Through hole unit and wiring channel are arranged at intervals with the signal plate；Wherein, the through hole unit include via pad and Positioned at the shielding construction of the via pad the week side of boss, the via pad includes at least one difference pad pair and connect with least one Ground pad；Difference signal pair and ground hole are respectively formed with the position of the difference pad pair and the ground pad.
- 7. PCB according to claim 6, it is characterised in that target difference pad pair and wiring channel on the signal plate Between be provided with wiring breach；Wherein, the target difference pad is to at least one of the difference pad centering；It is provided with the signal plate with the target difference pad to the differential signal line that is connected, wherein, the difference letter Number line includes going out line segment and the span line extended along wiring channel by the wiring breach.
- 8. PCB according to claim 7, it is characterised in that the shielding construction includes the bearing of trend along wiring channel Two shielding lines and the connection shielding line of connection two shielding lines formed；Wherein, there is size of the size more than the shielding line of opposite side of the shielding line of the wiring breach side.
- 9. PCB according to claim 8, it is characterised in that at least one ground pad and two shielding lines Connection.
- 10. PCB according to claim 8, it is characterised in that at least one ground pad and two shielding lines It is integrally connected shaping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710726230.XA CN107548226B (en) | 2017-08-22 | 2017-08-22 | Printed circuit board preparation process and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710726230.XA CN107548226B (en) | 2017-08-22 | 2017-08-22 | Printed circuit board preparation process and printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107548226A true CN107548226A (en) | 2018-01-05 |
| CN107548226B CN107548226B (en) | 2020-05-12 |
Family
ID=60959020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710726230.XA Active CN107548226B (en) | 2017-08-22 | 2017-08-22 | Printed circuit board preparation process and printed circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN107548226B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113133186A (en) * | 2021-04-15 | 2021-07-16 | 山东英信计算机技术有限公司 | High-density connector PCB structure based on PCIe 5.0 protocol |
| CN113473724A (en) * | 2021-08-16 | 2021-10-01 | 展讯通信（上海）有限公司 | Printed circuit board and wiring method thereof |
| WO2023045276A1 (en) * | 2021-09-23 | 2023-03-30 | 中兴通讯股份有限公司 | Printed circuit board and signal transmission system |
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| CN102110920A (en) * | 2009-12-23 | 2011-06-29 | 上海贝尔股份有限公司 | High-speed connector package and packaging method |
| JP2011211147A (en) * | 2010-03-12 | 2011-10-20 | Fuji Electric Co Ltd | Printed board |
| CN103260348A (en) * | 2013-04-01 | 2013-08-21 | 广州兴森快捷电路科技有限公司 | High-speed PCB and difference via hole impedance control method |
| CN204090285U (en) * | 2014-09-12 | 2015-01-07 | 杭州华三通信技术有限公司 | Circuit board and via structure thereof |
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2017
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102110920A (en) * | 2009-12-23 | 2011-06-29 | 上海贝尔股份有限公司 | High-speed connector package and packaging method |
| JP2011211147A (en) * | 2010-03-12 | 2011-10-20 | Fuji Electric Co Ltd | Printed board |
| CN103260348A (en) * | 2013-04-01 | 2013-08-21 | 广州兴森快捷电路科技有限公司 | High-speed PCB and difference via hole impedance control method |
| CN204090285U (en) * | 2014-09-12 | 2015-01-07 | 杭州华三通信技术有限公司 | Circuit board and via structure thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113133186A (en) * | 2021-04-15 | 2021-07-16 | 山东英信计算机技术有限公司 | High-density connector PCB structure based on PCIe 5.0 protocol |
| CN113473724A (en) * | 2021-08-16 | 2021-10-01 | 展讯通信（上海）有限公司 | Printed circuit board and wiring method thereof |
| WO2023045276A1 (en) * | 2021-09-23 | 2023-03-30 | 中兴通讯股份有限公司 | Printed circuit board and signal transmission system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107548226B (en) | 2020-05-12 |
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