CN107548226B - Printed circuit board preparation process and printed circuit board - Google Patents
Printed circuit board preparation process and printed circuit board Download PDFInfo
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- CN107548226B CN107548226B CN201710726230.XA CN201710726230A CN107548226B CN 107548226 B CN107548226 B CN 107548226B CN 201710726230 A CN201710726230 A CN 201710726230A CN 107548226 B CN107548226 B CN 107548226B
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Abstract
The invention provides a printed circuit board preparation process and a printed circuit board, wherein the method comprises the following steps: etching through hole units and wiring channels which are arranged at intervals on a signal plate, wherein each through hole unit comprises a through hole pad and a shielding structure located on the peripheral side of the through hole pad, and each through hole pad comprises at least one differential pad pair and at least one grounding pad; pressing the grounding plate, the signal plate and the surface plate to form a PCB; drilling through holes at the positions of the differential bonding pad pair and the grounding bonding pad; and metalizing the through holes to form differential signal pairs and grounding holes. By the technical scheme of the invention, the signal crosstalk between the differential signal pairs can be reduced, and the performance of a high-speed link is improved.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board preparation process and a printed circuit board.
Background
Pins of the high-speed connector are connected with a Printed Circuit Board (PCB) Board through packaging, the signal rate reaches 25Gbps (1000 megabits per second) or even higher 56Gbps, and the signal coding mode is also changed from Non-Return to Zero (NRZ) to Pulse Amplitude Modulation (PAM) 4(Pulse Amplitude Modulation 4, 4). The transition in signal rate and coding means that the signal-to-noise ratio is constantly decreasing, requiring that the cross-talk between signals be controlled and optimized as much as possible.
Disclosure of Invention
In view of the above, the present invention provides a PCB manufacturing process and a PCB, which can reduce signal crosstalk between high-speed signal pins.
In order to achieve the purpose, the invention provides the following technical scheme:
according to a first aspect of the present invention, there is provided a PCB preparation process, comprising:
etching through hole units and wiring channels which are arranged at intervals on a signal plate, wherein each through hole unit comprises a through hole pad and a shielding structure located on the peripheral side of the through hole pad, and each through hole pad comprises at least one differential pad pair and at least one grounding pad;
pressing the grounding plate, the signal plate and the surface plate to form a PCB;
drilling through holes at the positions of the differential bonding pad pair and the grounding bonding pad;
and metalizing the through holes to form differential signal pairs and grounding holes.
According to a second aspect of the present invention, there is provided a PCB comprising a ground plate, a signal plate and a surface plate; wherein:
through hole units and wiring channels are arranged on the signal board at intervals; the through hole unit comprises a through hole pad and a shielding structure positioned on the peripheral side of the through hole pad, and the through hole pad comprises at least one differential pad pair and at least one grounding pad;
and the positions of the differential bonding pad pair and the grounding bonding pad are respectively provided with a differential signal pair and a grounding hole.
According to the technical scheme, the shielding structure is formed on the peripheral side of the differential signal pair on the PCB, so that signal crosstalk between the differential signal pair can be effectively reduced, and the performance of a high-speed link can be improved.
Drawings
Fig. 1 is a schematic diagram of a PCB manufacturing process according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a signal plate formed with a shielding structure according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a signal board with wiring gaps and differential signal lines formed therein according to an embodiment of the present invention;
fig. 4 is a schematic diagram illustrating design parameters of a shielding structure according to an embodiment of the present invention;
fig. 5A and 5B are schematic diagrams illustrating a connection between a ground pad and a shielding line according to an embodiment of the present invention.
Detailed Description
According to the invention, the differential signal pairs on the signal board of the PCB are additionally provided with the shielding structures, so that the signal crosstalk between the differential signal pairs is reduced.
In order to make the technical solutions provided by the embodiments of the present invention better understood and make the above objects, features and advantages of the embodiments of the present invention more comprehensible, the technical solutions in the embodiments of the present invention are described in further detail below with reference to the accompanying drawings.
Referring to fig. 1, a schematic flow chart of a PCB preparation process according to an embodiment of the present invention is shown in fig. 1, where the PCB preparation process may include the following steps:
In the embodiment of the invention, considering that signal crosstalk exists between transmission lines of the high-speed connector, in order to reduce the signal crosstalk between the transmission lines of the high-speed connector, a shielding structure can be arranged on the periphery side of a differential signal pair on a signal board of a PCB to reduce the signal crosstalk between adjacent differential signal pairs, so as to reduce the signal crosstalk between the transmission lines of the high-speed connector.
Correspondingly, as shown in fig. 2, in the embodiment of the present invention, in the PCB manufacturing process, when the through hole pad can be etched on the signal board, a shielding structure can be formed around the through hole pad, and the shielding structure is used for shielding signal crosstalk between the high-speed signal pins; wherein the via pads may include at least one differential pad pair and at least one ground pad.
And 102, pressing the grounding plate, the signal plate and the surface plate to form the PCB.
During the PCB manufacturing process, after the signal board is processed as described in step 101, the floor board, the signal board, and the skin board may be laminated to form a PCB.
And 103, drilling through holes at the positions of the differential bonding pad pairs and the grounding bonding pads.
And 104, metalizing the through holes to form differential signal pairs and grounding holes.
After the PCB is formed by laminating the laminated grounding plate, the signal plate and the surface plate, through holes can be drilled in the positions of the differential bonding pad pairs and the grounding bonding pads on the PCB, and the drilled through holes are metallized to form differential signal pairs and grounding holes.
Therefore, through the PCB manufacturing process shown in fig. 1, the shielding structure is formed on the peripheral side of the differential signal pair on the PCB, so that the signal crosstalk between the differential signal pair can be effectively reduced.
Further, for the differential signal pair with the requirement, before the PCB is formed by pressing the ground plate, the signal plate and the surface plate, a wiring gap can be etched between the target differential pad pair and the wiring channel on the signal plate, and the differential signal line connected with the target differential pad pair is etched on the signal plate, so that the wiring requirement of the differential signal pair corresponding to the target differential pad pair is met.
Wherein the target differential pad pair is at least one of the differential pad pairs (determined according to actual routing requirements); the differential signal line connected to the target differential pad pair includes an outgoing line section passing through the wiring gap and a transmission section extending along the wiring channel.
Taking the signal board shown in fig. 3 as an example, the target differential pad pair may include a 2 nd (top to bottom, bottom to same) differential pad pair in a 2 nd column (left to right, bottom to same) differential pad pair, a 1 st and 3 rd differential pad pair in a 4 th column of differential pad pairs, a 2 nd and 4 th differential pad pair in a 5 th column of differential pad pairs, and so on; and the black thick lines connected with the target bonding pad pairs are the differential signal lines connected with the corresponding target differential bonding pad pairs.
Further, the shielding structure on the peripheral side of the differential pad pair includes two shielding lines formed along the extending direction of the routing channel and a connecting shielding line connecting the two shielding lines, and a schematic diagram thereof may be as shown in fig. 2.
In order to optimize the shielding effect of signal crosstalk, the size of the target pad on the signal board to the shielding wire on one side with the wiring notch is larger than that on the other side (i.e. without the wiring notch).
Taking the 2 nd column of differential pad pairs in the signal board shown in fig. 3 as an example, since there is a trace on the right side of the column of differential pad pairs and no trace on the left side, the width of the shielding line on the right side of the column of differential pad pairs may be greater than that on the left side.
It should be noted that, when the target pad pair has wiring notches on both sides, the sizes of the shield lines on both sides may be the same.
Taking the 4 th column of differential pad pairs in the signal board shown in fig. 3 as an example, the sizes of the shielding lines on the left side and the right side of the column of differential pad pairs can be consistent because the wiring gaps are formed on the left side and the right side of the column of differential pad pairs.
In the embodiment of the present invention, when forming the shielding structure on the peripheral side of the differential pad pair, the wiring space of the shielding structure needs to be determined according to the routing space requirement of the high-speed differential link and the parameters of the high-speed connector, so as to determine the design parameters of the shielding structure, such as the minimum line width of the shielding line, the minimum distance between the shielding line and the differential pad, and the like.
The minimum line width of the shielding structure and the minimum distance between the shielding structure and the differential pad pair may be as shown in fig. 4 (where w is the minimum line width of the shielding line of the shielding structure, and d is the minimum distance between the shielding line of the shielding structure and the differential pad pair).
Further, after the design parameters of the shielding structure are determined, before the shielding structure is formed according to the design parameters of the shielding structure, it is further required to determine whether the design parameters of the shielding structure meet the design requirements of the PCB, that is, whether the used PCB manufacturing process can form the shielding structure on the peripheral side of the differential pad pair according to the determined design parameters of the shielding structure.
For example, when the determined minimum line width of the shield line of the shield structure is too small, the PCB manufacturing process used may not be able to process.
In one embodiment of the present invention, the at least one ground pad is connected to two shielding lines formed along the extending direction of the routing channel, and the schematic diagram is shown in fig. 5A.
In this embodiment, the ground pad is separately disposed between two adjacent differential pad pairs, and both sides of the ground pad are connected to the shield line of the shield structure, so that the shield structure on the peripheral side of the differential pad pair realizes crosstalk shielding by grounding.
In another embodiment of the present invention, the at least one ground pad is integrally connected to two shield wires formed along the extending direction of the routing channel, and the schematic diagram is shown in fig. 5B.
In this embodiment, the ground pad and the shielding structure are integrally disposed, for example, the arrangement between two adjacent differential pad pairs on the signal board shown in fig. 5B is the integrally disposed ground pad and shielding structure, and similarly, the shielding structure is connected to the ground pad to implement grounding and implement crosstalk shielding in a grounding manner.
Further, an embodiment of the present invention further provides a PCB, where the PCB includes: the device comprises a grounding plate, a signal plate and a surface plate; wherein:
through hole units and wiring channels are arranged on the signal board at intervals; the through hole unit comprises a through hole pad and a shielding structure positioned on the peripheral side of the through hole pad, wherein the through hole pad comprises at least one differential pad pair and at least one grounding pad; wherein, the schematic diagram of the signal plate can be as shown in fig. 2;
the differential pad pair and the ground pad are positioned to form a differential signal pair and a ground via, respectively.
Further, in the embodiment of the present invention, a wiring gap is disposed between the target differential pad pair and the wiring channel on the signal board; wherein the target differential pad pair is at least one of the differential pad pairs;
the signal board is provided with a differential signal line connected with the target differential pad pair, wherein the differential signal line comprises an outgoing line section passing through the wiring gap and a transmission section extending along the wiring channel.
Taking the signal board shown in fig. 3 as an example, the target differential pad pair may include a 2 nd differential pad pair in the 2 nd column of differential pad pairs, a 1 st differential pad pair and a 3 rd differential pad pair in the 4 th column of differential pad pairs, a 2 nd differential pad pair and a 4 th differential pad pair in the 5 th column of differential pad pairs, and so on; and the black thick lines connected with the target bonding pad pairs are the differential signal lines connected with the corresponding target differential bonding pad pairs.
Further, in the embodiment of the present invention, the shielding structure includes two shielding lines formed along the extending direction of the wiring passage and a connecting shielding line connecting the two shielding lines;
the size of the shielding wire with the wiring notch is larger than that of the shielding wire on the other side.
Taking the 2 nd column of differential pad pairs in the signal board shown in fig. 3 as an example, since there is a trace on the right side of the column of differential pad pairs and no trace on the left side, the width of the shielding line on the right side of the column of differential pad pairs may be greater than that on the left side.
Further, in one embodiment, the at least one ground pad is connected to two shielding wires, and a schematic diagram thereof may be as shown in fig. 5A.
In this embodiment, the ground pad is separately disposed between two adjacent differential pad pairs, and both sides of the ground pad are connected to the shield line of the shield structure, so that the shield structure on the peripheral side of the differential pad pair realizes crosstalk shielding by grounding.
Further, in another embodiment, the at least one ground pad is integrally connected to the two shielding wires, and a schematic diagram thereof is shown in fig. 5B.
In this embodiment, the ground pad and the shielding structure are integrally disposed, for example, the arrangement between two adjacent differential pad pairs on the signal board shown in fig. 5B is the integrally disposed ground pad and shielding structure, and similarly, the shielding structure is connected to the ground pad to implement grounding and implement crosstalk shielding in a grounding manner.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (6)
1. A Printed Circuit Board (PCB) preparation process is characterized by comprising the following steps:
etching through hole units and wiring channels which are arranged at intervals on a signal plate, wherein each through hole unit comprises a through hole pad and a shielding structure located on the peripheral side of the through hole pad, and each through hole pad comprises at least one differential pad pair and at least one grounding pad;
pressing the grounding plate, the signal plate and the surface plate to form a PCB;
drilling through holes at the positions of the differential bonding pad pair and the grounding bonding pad;
metallizing the through holes to form differential signal pairs and grounding holes;
before the pressing of the grounding plate, the signal plate and the surface plate to form the PCB, the method further comprises the following steps: etching a wiring gap between a target differential bonding pad pair and a wiring channel on a signal board, wherein the target differential bonding pad pair is at least one of the differential bonding pad pairs;
etching a signal board to form a differential signal line connected with the target differential bonding pad pair, wherein the differential signal line comprises an outgoing line section passing through the wiring gap and a transmission section extending along a wiring channel; the shielding structure comprises two shielding wires formed along the extending direction of the wiring channel and a connecting shielding wire for connecting the two shielding wires;
and the size of the shielding wire at one side with the wiring notch is larger than that of the shielding wire at the other side.
2. The PCB manufacturing process of claim 1, wherein the at least one ground pad is connected to the two shield wires.
3. The PCB manufacturing process of claim 1, wherein the at least one ground pad is integrally formed with the two shield wire connections.
4. A Printed Circuit Board (PCB) is characterized by comprising a grounding plate, a signal plate and a surface plate; wherein:
through hole units and wiring channels are arranged on the signal board at intervals; the through hole unit comprises a through hole pad and a shielding structure positioned on the peripheral side of the through hole pad, and the through hole pad comprises at least one differential pad pair and at least one grounding pad;
a differential signal pair and a grounding hole are respectively formed on the positions of the differential bonding pad pair and the grounding bonding pad; a wiring gap is arranged between the target differential bonding pad pair and the wiring channel on the signal board; wherein the target differential pad pair is at least one of the differential pad pairs;
a differential signal line connected with the target differential pad pair is arranged on the signal board, wherein the differential signal line comprises an outgoing line section passing through the wiring gap and a transmission section extending along a wiring channel;
the shielding structure comprises two shielding wires formed along the extending direction of the wiring channel and a connecting shielding wire for connecting the two shielding wires;
and the size of the shielding wire at one side with the wiring notch is larger than that of the shielding wire at the other side.
5. The PCB of claim 4, wherein the at least one ground pad is connected to the two shield wires.
6. The PCB of claim 4, wherein the at least one ground pad is integrally formed with the two shield wire connections.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710726230.XA CN107548226B (en) | 2017-08-22 | 2017-08-22 | Printed circuit board preparation process and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710726230.XA CN107548226B (en) | 2017-08-22 | 2017-08-22 | Printed circuit board preparation process and printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN107548226A CN107548226A (en) | 2018-01-05 |
| CN107548226B true CN107548226B (en) | 2020-05-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710726230.XA Active CN107548226B (en) | 2017-08-22 | 2017-08-22 | Printed circuit board preparation process and printed circuit board |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113133186A (en) * | 2021-04-15 | 2021-07-16 | 山东英信计算机技术有限公司 | High-density connector PCB structure based on PCIe 5.0 protocol |
| CN113473724B (en) * | 2021-08-16 | 2023-02-14 | 展讯通信（上海）有限公司 | Printed circuit board and wiring method thereof |
| CN113573472B (en) * | 2021-09-23 | 2022-02-01 | 中兴通讯股份有限公司 | Printed circuit board and signal transmission system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102110920A (en) * | 2009-12-23 | 2011-06-29 | 上海贝尔股份有限公司 | High-speed connector package and packaging method |
| JP2011211147A (en) * | 2010-03-12 | 2011-10-20 | Fuji Electric Co Ltd | Printed board |
| CN103260348A (en) * | 2013-04-01 | 2013-08-21 | 广州兴森快捷电路科技有限公司 | High-speed PCB and difference via hole impedance control method |
| CN204090285U (en) * | 2014-09-12 | 2015-01-07 | 杭州华三通信技术有限公司 | Circuit board and via structure thereof |
-
2017
- 2017-08-22 CN CN201710726230.XA patent/CN107548226B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102110920A (en) * | 2009-12-23 | 2011-06-29 | 上海贝尔股份有限公司 | High-speed connector package and packaging method |
| JP2011211147A (en) * | 2010-03-12 | 2011-10-20 | Fuji Electric Co Ltd | Printed board |
| CN103260348A (en) * | 2013-04-01 | 2013-08-21 | 广州兴森快捷电路科技有限公司 | High-speed PCB and difference via hole impedance control method |
| CN204090285U (en) * | 2014-09-12 | 2015-01-07 | 杭州华三通信技术有限公司 | Circuit board and via structure thereof |
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| CN107548226A (en) | 2018-01-05 |
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