CN206727057U - A kind of pallet grippers applied on ESEM - Google Patents
A kind of pallet grippers applied on ESEM Download PDFInfo
- Publication number
- CN206727057U CN206727057U CN201720170304.1U CN201720170304U CN206727057U CN 206727057 U CN206727057 U CN 206727057U CN 201720170304 U CN201720170304 U CN 201720170304U CN 206727057 U CN206727057 U CN 206727057U
- Authority
- CN
- China
- Prior art keywords
- pallet
- board
- wafer
- pallet grippers
- esem
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a kind of pallet grippers applied on ESEM, by making a diameter 200mm metal tray, 150mm wafers are placed in tray slots with Special-purpose forceps, corresponding salient point in wafer recess alignment tray slots, after putting well, pallet is put into the 200mm cassettes of standard, pallet is captured by board mechanical arm together with wafer to enter within board cavity, wafer so as the identification of board can, carry out the wafer of output survey 150mm sizes using the existing board for receiving 200mm specification wafers, such a design does not change board existing structure, board zero is injured, realize simple, cost is low, and can simultaneously compatible 200mm and 150mm wafer, improve the practicality and multifunctionality of board.
Description
Technical field
Microscope pallet field is the utility model is related to, more particularly to a kind of tray clamps applied on ESEM
Tool.
Background technology
CD SEM(SEM)It is a kind of microcosmic property observation hand between transmission electron microscope and light microscope
Section, directly it can carry out microcosmic imaging using the material performance of sample surfaces material.The advantages of ESEM is that 1. have higher put
Big multiple, continuously adjustabe between ten thousand times of 20-20;2. there is the very big depth of field, the visual field is big, is imaged rich in third dimension, can directly observe
The fine structure on the various uneven surfaces of sample;3. sample prepares simple.Therefore in field of semiconductor manufacture, its amount of being used to
Feature such as the lines CD and layer of the figure of crystal column surface are surveyed to layer alignment etc., is a kind of very important measurement equipment, is known as core
The eyes of piece.
Currently in semi-conductor market, what SEM occupied major mass part market is the Hitachi, Ltd of Japan
(Hitachi), its SEM produced has stable performance, and simple to operate, image clearly, accuracy in measurement is high, speed
Spend the advantages that fast.But this board is only suitable for the wafer for producing 200mm sizes, if to be used for producing 150mm sizes
For wafer, it is necessary to which huge structural modification is done, it is necessary to change a series of parts such as platform by genuine company, so transformation cycle is longer,
Costly, cost is high, while risk is also very big.
Utility model content
To realize above-mentioned technical purpose and the technique effect, now provide a kind of support applied on ESEM
Plate clamp, pallet grippers apparent size is identical with 200mm wafers, and diameter 150mm grooves are dug in pallet, the crystalline substance that the desired amount is surveyed
Circle is placed within groove, pallet and wafer is put cassette into together, is transmitted by mechanical arm, such 150mm wafers
It will be sent in board cavity and produce twice.This pallet grippers does not change former bench structure, simple easily operated, is free from risk.
The utility model is achieved through the following technical solutions:A kind of pallet grippers applied on ESEM, it is special
Sign is that the pallet grippers are a diameter of 200mm disk, and 150mm groove is arranged concentrically among disk, and depth of groove is small
In pallet thickness, its internal setting round rubber pad;Recess, the groove top inwall are provided with the top of the pallet grippers
Upper and recess matched position is provided with salient point, is set in bottom interior wall and is outwards provided with rectangle frame, the recess inner vertex and square
Shape frame center positioned at it is same diametrically.
Specifically,
The pallet thickness is 800-1000 μm.
The rectangle frame length is 20mm, width 10mm.
The rubber sheet gasket has 4.
The situation of prior art is different from, the beneficial effects of the utility model are:Diameter 150mm grooves are dug in pallet,
The wafer that the desired amount is surveyed is placed within groove, pallet and wafer is put cassette into together, is transmitted by mechanical arm,
So 150mm wafers will be sent in board cavity and produce twice.This pallet grippers does not change former bench structure, is simply easy to
Operation, is free from risk.
Brief description of the drawings
Fig. 1 is pallet grippers schematic top plan view.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only part of the embodiment of the present utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Referring to Fig. 1, a kind of pallet grippers applied on ESEM, it is characterised in that the pallet grippers are straight
Footpath is 200mm disk 1, and 150mm groove 2 is arranged concentrically among disk, and depth of groove is less than pallet thickness, its internal setting
Round rubber pad 3;Recess 4 is provided with the top of the pallet grippers, is installed on the groove top inwall with recess match bit
Salient point 5 is equipped with, is set in bottom interior wall and is outwards provided with rectangle frame 6, the inner vertex of recess 4 is located at rectangle frame center
It is same diametrically.
Specifically,
The pallet thickness is 800-1000 μm.
The rectangle frame length is 20mm, width 10mm.
The rubber sheet gasket has 4.
In specific implementation process, the utility model uses above-mentioned material structure, by making a diameter 200mm metal
Pallet, 150mm wafers are placed in tray slots with Special-purpose forceps, it is corresponding in wafer recess alignment tray slots
Salient point, after putting well, pallet is put into the 200mm cassettes of standard, when 150mm wafers are put into circular groove, whole wafer
Fall in groove, and four rubber blankets can prevent wafer from being slided in tray slots, and pallet is captured by board mechanical arm
Enter together with wafer within board cavity, wafer as such board can identification, use existing receiving
The board of 200mm specification wafers carrys out the wafer that output surveys 150mm sizes.
By the above-mentioned means, digging diameter 150mm grooves in pallet, the wafer that the desired amount is surveyed is placed within groove,
Pallet and wafer is put cassette into together, transmitted by mechanical arm, such 150mm wafers will be sent to board cavity
Twice, such a design does not change board existing structure, and board zero is injured for interior production, realizes that simply cost is low, and can be same
When compatibility 200mm and 150mm wafer, improve the practicality of board with it is multi-functional.
Embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model, it is every
The equivalent structure or equivalent flow conversion made using the utility model specification and accompanying drawing content, or direct or brief introduction are used in
Other correlative technology fields, similarly it is included in scope of patent protection of the present utility model.
Claims (4)
1. a kind of pallet grippers applied on ESEM, it is characterised in that the pallet grippers are a diameter of 200mm's
Disk, 150mm groove is arranged concentrically among disk, depth of groove is less than pallet thickness, and it is internal to set round rubber pad;
It is provided with recess at the top of the pallet grippers, is provided with salient point on the groove top inwall with recess matched position, in bottom
Set on wall and be outwards provided with rectangle frame, the recess inner vertex and rectangle frame center positioned at it is same diametrically.
2. pallet grippers according to claim 1, it is characterised in that:The pallet thickness is 800-1000 μm.
3. pallet grippers according to claim 1, it is characterised in that:The rectangle frame length is 20mm, width 10mm.
4. pallet grippers according to claim 1, it is characterised in that:The rubber sheet gasket has 4.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720170304.1U CN206727057U (en) | 2017-02-24 | 2017-02-24 | A kind of pallet grippers applied on ESEM |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720170304.1U CN206727057U (en) | 2017-02-24 | 2017-02-24 | A kind of pallet grippers applied on ESEM |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206727057U true CN206727057U (en) | 2017-12-08 |
Family
ID=60500680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201720170304.1U Active CN206727057U (en) | 2017-02-24 | 2017-02-24 | A kind of pallet grippers applied on ESEM |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206727057U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111834246A (en) * | 2019-04-23 | 2020-10-27 | 上海新微技术研发中心有限公司 | Wafer bonding device |
-
2017
- 2017-02-24 CN CN201720170304.1U patent/CN206727057U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111834246A (en) * | 2019-04-23 | 2020-10-27 | 上海新微技术研发中心有限公司 | Wafer bonding device |
CN111834246B (en) * | 2019-04-23 | 2023-12-08 | 上海新微技术研发中心有限公司 | Wafer bonding device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104075928B (en) | A kind of grinding wafer transmission electron microscope sample mechanical reduction method | |
CN102455259A (en) | Planar transmission electron microscope (TEM) sample preparation method | |
CN206727057U (en) | A kind of pallet grippers applied on ESEM | |
CN104075918B (en) | A kind of preparation method of micro-through-hole interconnection structure for transmission electron microscope sample | |
CN104201135A (en) | Wet etching device and use method thereof | |
CN109060850B (en) | Resolution test card for detecting Nano CT imaging quality and preparation method thereof | |
CN103698170A (en) | Preparation method of TEM sample | |
CN102646566B (en) | The SEM sample clamp observed for online SEM and SEM sample observation method | |
CN106931916A (en) | A kind of micro-nano step standard jig and its tracking method | |
CN103854972B (en) | The method improving crystal column surface warpage | |
CN102786028A (en) | Manufacturing method of multi-needle point array used for large area friction induced micro/nano-processing | |
CN106128972A (en) | A kind of discrete bare chip probe test positional matrix device | |
CN203101425U (en) | Sample stage for scanning various sample sections by using atomic force microscope | |
CN209963032U (en) | Chip cutting device | |
CN205997527U (en) | Photosensitive seal machine exposes common template | |
CN106596226A (en) | Sample preparation method and sample observation method for three-dimensional MOS (metal oxide semiconductor) memory chip | |
CN106526510A (en) | Device and method for measuring magnetic declination of magnet part | |
CN103855047B (en) | The physical analysis structure of deep trench product and method | |
CN106531601B (en) | A kind of work stage for ion bean etcher | |
CN105807459A (en) | Substrate alignment device and alignment method | |
CN207930497U (en) | A kind of orientation auxiliary device of c to sapphire ingot guide edge | |
TWI286647B (en) | Method for manufacturing a light guide plate mold and the mold thereof | |
CN218203016U (en) | Clamp for quantum chip processing | |
CN216669766U (en) | Object stage and detection device for positioning defects | |
CN107900747A (en) | Multifunction electromagnetic quick-clamping instrument |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |