CN206727057U - A kind of pallet grippers applied on ESEM - Google Patents

A kind of pallet grippers applied on ESEM Download PDF

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Publication number
CN206727057U
CN206727057U CN201720170304.1U CN201720170304U CN206727057U CN 206727057 U CN206727057 U CN 206727057U CN 201720170304 U CN201720170304 U CN 201720170304U CN 206727057 U CN206727057 U CN 206727057U
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China
Prior art keywords
pallet
board
wafer
pallet grippers
esem
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CN201720170304.1U
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Chinese (zh)
Inventor
王世伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Hiwafer Technology Co Ltd
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Chengdu Hiwafer Technology Co Ltd
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Priority to CN201720170304.1U priority Critical patent/CN206727057U/en
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Abstract

The utility model provides a kind of pallet grippers applied on ESEM, by making a diameter 200mm metal tray, 150mm wafers are placed in tray slots with Special-purpose forceps, corresponding salient point in wafer recess alignment tray slots, after putting well, pallet is put into the 200mm cassettes of standard, pallet is captured by board mechanical arm together with wafer to enter within board cavity, wafer so as the identification of board can, carry out the wafer of output survey 150mm sizes using the existing board for receiving 200mm specification wafers, such a design does not change board existing structure, board zero is injured, realize simple, cost is low, and can simultaneously compatible 200mm and 150mm wafer, improve the practicality and multifunctionality of board.

Description

A kind of pallet grippers applied on ESEM
Technical field
Microscope pallet field is the utility model is related to, more particularly to a kind of tray clamps applied on ESEM Tool.
Background technology
CD SEM(SEM)It is a kind of microcosmic property observation hand between transmission electron microscope and light microscope Section, directly it can carry out microcosmic imaging using the material performance of sample surfaces material.The advantages of ESEM is that 1. have higher put Big multiple, continuously adjustabe between ten thousand times of 20-20;2. there is the very big depth of field, the visual field is big, is imaged rich in third dimension, can directly observe The fine structure on the various uneven surfaces of sample;3. sample prepares simple.Therefore in field of semiconductor manufacture, its amount of being used to Feature such as the lines CD and layer of the figure of crystal column surface are surveyed to layer alignment etc., is a kind of very important measurement equipment, is known as core The eyes of piece.
Currently in semi-conductor market, what SEM occupied major mass part market is the Hitachi, Ltd of Japan (Hitachi), its SEM produced has stable performance, and simple to operate, image clearly, accuracy in measurement is high, speed Spend the advantages that fast.But this board is only suitable for the wafer for producing 200mm sizes, if to be used for producing 150mm sizes For wafer, it is necessary to which huge structural modification is done, it is necessary to change a series of parts such as platform by genuine company, so transformation cycle is longer, Costly, cost is high, while risk is also very big.
Utility model content
To realize above-mentioned technical purpose and the technique effect, now provide a kind of support applied on ESEM Plate clamp, pallet grippers apparent size is identical with 200mm wafers, and diameter 150mm grooves are dug in pallet, the crystalline substance that the desired amount is surveyed Circle is placed within groove, pallet and wafer is put cassette into together, is transmitted by mechanical arm, such 150mm wafers It will be sent in board cavity and produce twice.This pallet grippers does not change former bench structure, simple easily operated, is free from risk.
The utility model is achieved through the following technical solutions:A kind of pallet grippers applied on ESEM, it is special Sign is that the pallet grippers are a diameter of 200mm disk, and 150mm groove is arranged concentrically among disk, and depth of groove is small In pallet thickness, its internal setting round rubber pad;Recess, the groove top inwall are provided with the top of the pallet grippers Upper and recess matched position is provided with salient point, is set in bottom interior wall and is outwards provided with rectangle frame, the recess inner vertex and square Shape frame center positioned at it is same diametrically.
Specifically,
The pallet thickness is 800-1000 μm.
The rectangle frame length is 20mm, width 10mm.
The rubber sheet gasket has 4.
The situation of prior art is different from, the beneficial effects of the utility model are:Diameter 150mm grooves are dug in pallet, The wafer that the desired amount is surveyed is placed within groove, pallet and wafer is put cassette into together, is transmitted by mechanical arm, So 150mm wafers will be sent in board cavity and produce twice.This pallet grippers does not change former bench structure, is simply easy to Operation, is free from risk.
Brief description of the drawings
Fig. 1 is pallet grippers schematic top plan view.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out Clearly and completely describing, it is clear that described embodiment is only part of the embodiment of the present utility model, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belong to the scope of the utility model protection.
Referring to Fig. 1, a kind of pallet grippers applied on ESEM, it is characterised in that the pallet grippers are straight Footpath is 200mm disk 1, and 150mm groove 2 is arranged concentrically among disk, and depth of groove is less than pallet thickness, its internal setting Round rubber pad 3;Recess 4 is provided with the top of the pallet grippers, is installed on the groove top inwall with recess match bit Salient point 5 is equipped with, is set in bottom interior wall and is outwards provided with rectangle frame 6, the inner vertex of recess 4 is located at rectangle frame center It is same diametrically.
Specifically,
The pallet thickness is 800-1000 μm.
The rectangle frame length is 20mm, width 10mm.
The rubber sheet gasket has 4.
In specific implementation process, the utility model uses above-mentioned material structure, by making a diameter 200mm metal Pallet, 150mm wafers are placed in tray slots with Special-purpose forceps, it is corresponding in wafer recess alignment tray slots Salient point, after putting well, pallet is put into the 200mm cassettes of standard, when 150mm wafers are put into circular groove, whole wafer Fall in groove, and four rubber blankets can prevent wafer from being slided in tray slots, and pallet is captured by board mechanical arm Enter together with wafer within board cavity, wafer as such board can identification, use existing receiving The board of 200mm specification wafers carrys out the wafer that output surveys 150mm sizes.
By the above-mentioned means, digging diameter 150mm grooves in pallet, the wafer that the desired amount is surveyed is placed within groove, Pallet and wafer is put cassette into together, transmitted by mechanical arm, such 150mm wafers will be sent to board cavity Twice, such a design does not change board existing structure, and board zero is injured for interior production, realizes that simply cost is low, and can be same When compatibility 200mm and 150mm wafer, improve the practicality of board with it is multi-functional.
Embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model, it is every The equivalent structure or equivalent flow conversion made using the utility model specification and accompanying drawing content, or direct or brief introduction are used in Other correlative technology fields, similarly it is included in scope of patent protection of the present utility model.

Claims (4)

1. a kind of pallet grippers applied on ESEM, it is characterised in that the pallet grippers are a diameter of 200mm's Disk, 150mm groove is arranged concentrically among disk, depth of groove is less than pallet thickness, and it is internal to set round rubber pad; It is provided with recess at the top of the pallet grippers, is provided with salient point on the groove top inwall with recess matched position, in bottom Set on wall and be outwards provided with rectangle frame, the recess inner vertex and rectangle frame center positioned at it is same diametrically.
2. pallet grippers according to claim 1, it is characterised in that:The pallet thickness is 800-1000 μm.
3. pallet grippers according to claim 1, it is characterised in that:The rectangle frame length is 20mm, width 10mm.
4. pallet grippers according to claim 1, it is characterised in that:The rubber sheet gasket has 4.
CN201720170304.1U 2017-02-24 2017-02-24 A kind of pallet grippers applied on ESEM Active CN206727057U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720170304.1U CN206727057U (en) 2017-02-24 2017-02-24 A kind of pallet grippers applied on ESEM

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720170304.1U CN206727057U (en) 2017-02-24 2017-02-24 A kind of pallet grippers applied on ESEM

Publications (1)

Publication Number Publication Date
CN206727057U true CN206727057U (en) 2017-12-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720170304.1U Active CN206727057U (en) 2017-02-24 2017-02-24 A kind of pallet grippers applied on ESEM

Country Status (1)

Country Link
CN (1) CN206727057U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111834246A (en) * 2019-04-23 2020-10-27 上海新微技术研发中心有限公司 Wafer bonding device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111834246A (en) * 2019-04-23 2020-10-27 上海新微技术研发中心有限公司 Wafer bonding device
CN111834246B (en) * 2019-04-23 2023-12-08 上海新微技术研发中心有限公司 Wafer bonding device

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