1286647 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種導光板模具製法及其模具，尤指一 種利用半導體製程及微電鑄製程製作出的導光板模具，具 有向精度的導光圖案。 【先刚技術】 導光板被大1的應用在液晶平面顯示器的背光模組 t ’作為導光作用，將燈管集中光、線導引向上折射而出， 提供一平面光源。 二；導光板主要作用為提供一均勻亮度的平面光源， 故目則導光板表面的導光圖案設計種類繁多，而目前導光 f的製作方式即需要準備不同導光圖案的模具，而大部份 :以射出成型（如公開第200517238號「導光板射出成型 2二具51」77:明專利申請案）或是加Μ成型（如公開第 力工 2號「導光板製造方法」發明專利申請案）等的 方Z式生產出特定導光圖案的導光板，該等加工成型 :的需要模具來辅助成型導光板上的導光圖案，因此， 二二！狀即決定導光板導光圖案的精密度。而目前模且 故其形成導光板的_案 …限於模具:製作精;:x’目前導光板的導光圈案精 【發明内容】 半導ίΓΓ主要發明目的係提供一種導光板模具製法，以 電鍍製程製作出導光圖案精細度高的模具，而提 1286647 供各導光板設計公 司或工廠實現南精度導光圖案的導光板1286647 IX. Description of the Invention: [Technical Field] The present invention relates to a method for manufacturing a light guide plate mold and a mold thereof, and more particularly to a light guide plate mold manufactured by using a semiconductor process and a micro electroforming process, and having a precision guiding light pattern. [First Technology] The light guide plate is applied to the backlight module t ’ of the liquid crystal flat panel display as a light guiding function, and the concentrated light and the wire guide of the lamp tube are refracted upward to provide a planar light source. Secondly, the light guide plate mainly functions to provide a planar light source with uniform brightness. Therefore, the light guide pattern on the surface of the light guide plate has a wide variety of designs, and the current way of making the light guide f requires the preparation of molds with different light guide patterns, and most of them. Parts: injection molding (such as the publication of the 200517238 "light guide plate injection molding 2 two 51" 77: Ming patent application) or twisting molding (such as the disclosure of the No. 2 "light guide plate manufacturing method" invention patent application The formula Z, etc., produces a light guide plate with a specific light guiding pattern, which requires a mold to assist the shaping of the light guiding pattern on the light guiding plate, therefore, 22! The shape determines the precision of the light guiding pattern of the light guide plate. However, the current mode and the formation of the light guide plate are limited to the mold: making fine;: x' current light guide plate of the light guide plate [invention] The main purpose of the invention is to provide a light guide plate mold method for electroplating The process produces a mold with a high degree of fineness of the light guide pattern, and 1286647 is provided for each light guide plate design company or factory to realize a light guide plate with a south precision light guide pattern.
欲達上述目的所使用的主要技術手段係令該導光板模 具製法包含有： 準備一早晶發材料基板，其具有一平坦的上端面； 於该早晶矽材料基板上以黃光製程形成導光板的導光 圖案； 沉稽一厚道带 曰 電層於該單晶矽材料基板的導光圖案層 上；及 電鍍導光圖幸展 ^ ^ ^ ^ ，、曰’猎由導電層的導電特性，將基板置 於電解液中，於導 電曰上再電鑛出一層較厚的金屬層，構 成一導光板模具。 由於.亥導光板模具上的圖案係採用半導體製程製出， :案具有高精細|，對於實現高精細度導光圖案的導光 扳來說，不再有諸多限制。 【實施方式】 請參閱第一圖A〜τ所+ 〆 ^^ ^ I所不，係為本發明導光板模具一 車乂佳實施例的製程步驟，其包含有· 準備一單晶矽材料基板（ 工，从f 端面； 1 ◦)，其具有一平坦的上 依序形成一阻播層（11、 〇σ 、 丄）及一光阻層（12)於一 單晶矽材料基板（1 〇 )的 ^ 彡的上缒面，該阻擋層（11)可 為矽氧化物或矽氮化物； 將阻播層（1 1 )轉換為—圖案層（1 3 )，係藉由 1286647 光阻層（1 2 a、 換為一圖案層（ι)3及)曝光顯影的製程將阻播層（1 !)轉 移除光阻（1 2 ) · 形成一導光屬安 上端面，係依昭單f 4)於單晶石夕材料基板（“） 配合其上端面的、1= 板（1〇)的晶格特性，再 方式，對單晶石夕’選擇合適的乾、濕敍刻 蝕刻，其中乾式 土反1〇)進行等向性或非等向性 S购刻可採用離子钱刻（R_ivel〇nEtching 移除單曰石夕：濕式钱刻則使用氫氧化卸敍刻液； =早4材料基板（1Q)上的導光圖 /儿積一層導電層（1 〇〇 4 )， 的導光圖案（14)上；及^早晶石夕材料基极（10) αο形成—内模層（工6)於該導電 早晶矽材料基板（丄〇 )連 θ )上，係將 中，如第一圖Η σ θ(15)浸入電解槽 D及：圖Η所不’該電解槽（2〇)内有電解液（2 屬（2 2 )，由於該單晶矽 端面有導電層，故會於導 〆土反（10)上 層，…， 層（1 5 )上再電鍍-層金屬 (1 〇 ;内模層（1 6 )，該内模層依單晶矽材料某板 =的導光圖案（“）成型，如此即完 板k具的製作。請配合參閱第三圖 ，：二導先 6 )可為複數長條V形凹槽（ “莫層（1The main technical means for achieving the above purpose is that the light guide plate molding method comprises: preparing an early crystal growth material substrate having a flat upper end surface; forming a light guide plate on the early green germanium material substrate by a yellow light process a light guiding pattern; a thick layer of 沉 一 厚 于 on the light guiding pattern layer of the single crystal 矽 material substrate; and the electroplating light guiding diagram fortunately ^ ^ ^ ^, 曰 'hunting the conductive properties of the conductive layer, The substrate is placed in an electrolyte, and a thick metal layer is electroconducted on the conductive crucible to form a light guide plate mold. Since the pattern on the light guide plate mold is made by a semiconductor process, the case has a high precision||, and there are no many limitations for the light guide which implements a high-definition light guide pattern. [Embodiment] Please refer to the first figure A~τ+ 〆^^ ^I, which is a process step of the embodiment of the light guide plate mold of the present invention, which comprises: preparing a single crystal germanium material substrate (working from the f end face; 1 ◦), which has a flat upper layer sequentially forming a blocking layer (11, 〇σ, 丄) and a photoresist layer (12) on a single crystal germanium material substrate (1 〇 The barrier layer (11) may be a tantalum oxide or a tantalum nitride; the barrier layer (11) is converted into a pattern layer (13) by a 1286647 photoresist layer. (1 2 a, replaced by a pattern layer (1) and) the process of exposure development removes the blocking layer (1 !) from the photoresist (1 2 ) · Forms a light guide to the upper end face, which is based on Single f 4) on the single crystal stone substrate (") with its upper end face, 1 = plate (1 〇) lattice characteristics, and then, select a suitable dry and wet etch for the single crystal stone , where the dry soil is reversed 1)) Isotropic or anisotropic S purchase can be used to ionic money engraving (R_ivel〇nEtching removes the monolithic stone: wet money engraving uses the hydroxide decantation = light guide on the material substrate (1Q) / light guide pattern (1 〇〇 4 ) on the material substrate (1Q); and ^ early crystal stone base (10) α ο formation - The inner mold layer (Work 6) is immersed in the electrolyzer D and the first graph σ σ θ (15) on the conductive pre-crystal material substrate (the θ); There is an electrolyte in the electrolytic cell (2〇) (2 genus (2 2 ). Since the end face of the single crystal has a conductive layer, it will be electroplated on the upper layer of the conductive earth (10), ..., layer (15). - layer metal (1 〇; inner mold layer (16), the inner mold layer is formed by a light guide pattern (") of a single crystal 矽 material = plate, so that the finished sheet is made. Please refer to the third Figure: two guides first 6) can be a plurality of long V-shaped grooves ("mo layer (1
所示，為複數獨立的四角錐形凹槽（16:了為第三圖B ::常見導光板的導光圖案係為凹槽式設 厂圓形狀（請配合參照第二圖A〜Η所示）或四角錐 1286647 的凹槽，而上述為形成¥形凹槽（141)導光圖 4 )的導光板模具的製程實旆 l^ 诚…，、 ％實細例，如要製作半圓形狀的凹 料:則在上述形成導光圖案（ι“）的步 ^ ㈣晶方向的單晶料料基板（10)選擇適 §的敍刻液，並控制钱刻時間，即能形成v形凹槽（14 !)或半圓形凹槽（l41a)的導光 ： 4a)。 ”、丄 =上述說明可知，本發明係藉由選用單晶♦材料基板 及適當的半導體製程步 導光= t 形成對應 , ^累再糟由早晶矽材料基板的導光圖 二果里冑°亥單晶石夕材料基板的導光圖案再沉積-層導 =，再進行電鍵出-層符合射出成型導光板所需的模具 :又’由於半導體沉積出導金屬層的速度太耗時，故配合 方式形成之’是以’藉由本發明的導光板模具的 不但可製造出高精密度導光圖案的導光板模具， 精"導體製私亦能大量地生產出導光板模具，而該 徵及功效均是—般機械加卫所無料成的。 ， 【圖式簡單說明】 ^ 一圖A〜I ·係本發明第一較佳實施例的製程步驟。 =一圖A〜Η ·係本發明第二較佳實施例的製程步驟。 弟：圖A :係本發明内模層一較佳實施例。 "圖B ·係本發明内模層另一較佳實施例。 【主要元件符號說明】 (1〇)基板As shown, it is a plurality of independent quadrangular pyramid grooves (16: for the third figure B: the light guide pattern of the common light guide plate is a groove type factory round shape (please refer to the second figure A~Η Show) or the groove of the quadrangular cone 1286647, and the above-mentioned process for forming the light guide plate mold of the shape-forming groove (141) of the light guide plate)), %..., % real example, if a semicircular shape is to be made The concave material is selected from the above-mentioned single crystal material substrate (10) in the step of forming the light guiding pattern (ι"), and the etched time is selected, and the v-shaped concave shape can be formed. The light guide of the groove (14!) or the semicircular groove (l41a): 4a). 丄, 上述 = The above description shows that the present invention uses a single crystal ♦ material substrate and a suitable semiconductor process step light guide = t Corresponding to the formation, the squeezing of the light-guided pattern of the substrate of the early-crystal enamel material, the red light-depositing of the light-guide pattern of the 亥 亥 单晶 单晶 单晶 单晶 夕 夕 夕 material substrate, and then the electrical-elective-layer conforming to the injection molding guide The mold required for the light plate: 'Because the speed at which the semiconductor layer is deposited by the semiconductor is too time consuming, the way of forming the 'by' is The light guide plate mold of the invention not only can manufacture a light guide plate mold with high precision light guide pattern, but also can widely produce a light guide plate mold, and the function and the effect are all mechanically enhanced. Unexpected. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. A to I] are process steps of a first preferred embodiment of the present invention. = Figure A - Η - The process steps of the second preferred embodiment of the present invention. Brother: Figure A: A preferred embodiment of the inner mold layer of the present invention. "B> is another preferred embodiment of the inner mold layer of the present invention. [Main component symbol description] (1〇) substrate