CN206711891U - A kind of encapsulating structure of linear LED light source - Google Patents
A kind of encapsulating structure of linear LED light source Download PDFInfo
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- CN206711891U CN206711891U CN201720539113.8U CN201720539113U CN206711891U CN 206711891 U CN206711891 U CN 206711891U CN 201720539113 U CN201720539113 U CN 201720539113U CN 206711891 U CN206711891 U CN 206711891U
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- connection terminal
- light source
- luminescence component
- conductive coating
- led light
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Abstract
The utility model discloses a kind of linear LED light source encapsulating structure, including luminescence component, connection terminal, conductive coating and fluorescent glue sealing；Luminescence component includes one or more along flip LED chips arranged in a straight line；Connection terminal is arranged on the both ends of luminescence component, and connection terminal is electrically connected by conductive coating with luminescence component；Conductive coating electrically connects the adjacent electrode of adjacent flip-chip LED chip；Fluorescent glue sealing is coated on the luminescence component and connection terminal.A kind of linear LED light source encapsulating structure described in the utility model fixes luminescence component and connection terminal using fluorescent glue sealing, eliminates substrate, can arbitrarily bend；The electrical connection of luminescence component and connection terminal is realized using conductive coating, instead of the electric connection mode of gold thread bonding LED chip, enhances the stability of product.
Description
Technical field
A kind of linear LED light source is the utility model is related to, more particularly to a kind of encapsulating structure of linear LED light source.
Background technology
On the market in common linear LED light source, multiple LED chips are arranged on substrate and with gold thread by multiple LED cores
Piece and connection terminal bonding, and coating fluorescent glue makes fluorescent glue be coated on substrate and LED chip, then the connection terminal by both ends
It is respectively connected to the both ends of power supply.Using in the linear LED light source of such a encapsulating structure, using gold thread bonding LED chip, quality wind
Danger is high；The fluorescent glue thermal conductivity of substrate and cladding LED chip is poor, causes heat caused by LED chip not disperse；Together
When, it is difficult to ensure that fluorescent glue is uniformly coated on substrate and LED chip, reduce the photochromic homogeneity of linear LED light source.
Utility model content
In order to solve the above technical problems, the technical solution adopted in the utility model is：
A kind of linear LED light source encapsulating structure, including：
Luminescence component, including one or more is along flip LED chips arranged in a straight line；
Connection terminal, the both ends of luminescence component include a connection terminal respectively；
Conductive coating, conductive coating electrically connect the adjacent electrode of two neighboring flip LED chips, and connection terminal passes through conduction
Coating electrically connects with the adjacent electrode of the flip LED chips at luminescence component both ends；
Fluorescent glue sealing, it is coated on the luminescence component and connection terminal.
Further, in luminescence component adjacent flip-chip LED chip adjacent electrode on the contrary, flip LED chips using series connection
Connected mode.
Further, the both positive and negative polarity of flip LED chips is completely covered in the conductive coating.
Further, the width of the conductive coating is equal with the width of fluorescent glue sealing.
A kind of encapsulation step of the encapsulating structure of linear LED light source described in the utility model is：
A, flip LED chips array is arranged using arrangement machine, makes each column or the often rear and front end of row flip LED chips
A connection terminal is arranged with respectively；
B, fluorescent glue is covered on the product that step A is obtained using wafer-level package technology, and fluorescent glue is dried；
C, plate conductive coating using electrode of the vacuum coating equipment in connection terminal and flip LED chips, make it is adjacent fall
Fill the adjacent electrode electrical connection of LED chip, connection terminal flip LED chips electrical connection adjacent thereto；
D, it is linear LED described in the utility model to cut the product obtained in C in units of column or row using scribing machine
Light source.
Flip LED chips are used in a kind of encapsulating structure of linear LED light source described in the utility model, pass through conductive coating
The adjacent electrode and connection terminal of adjacent flip-chip LED chip are electrically connected, then luminescence component and connection terminal are coated with fluorescent glue.
A kind of encapsulating structure of linear LED light source described in the utility model has the following advantages：
(1) substrate is eliminated, the plasticity of linear LED light source described in the utility model is improved, can arbitrarily bend, can use
In linear LED light source of different shapes is made；
(2) conductive coating is covered on the electrode of flip LED chips, increases the area of dissipation of flip LED chips；
(3) electrically connected between flip-chip LED by conductive coating, instead of the electrical connection side of gold thread bonding LED chip
Formula, and substrate is eliminated, reduce production cost；
(4) flip LED chips are used, the stability of linear LED light source is stronger；
(5) the product overlying that linear LED light source described in the utility model obtains step B using wafer-level package technology
Lid fluorescent glue, and the product obtained in scribing machine cutting step C is used, ensure the concentration one of fluorescent glue on linear LED light source
Cause, scribing machine can accurately control the size of the linear LED light source of acquisition, make linear LED light source described in the utility model
Photochromic uniformity is more preferably；
(6) linear LED light source described in the utility model can be produced in high volume, be more suitable for industrial production.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of the encapsulating structure of linear LED light source described in the utility model；
Fig. 2 is a kind of stereogram of the encapsulating structure of linear LED light source described in the utility model.
Realization, functional characteristics and the advantage of the utility model purpose will be described further referring to the drawings in conjunction with the embodiments.
Embodiment
It should be appreciated that specific embodiment described herein is not used to limit this only to explain the utility model
Utility model.
Reference picture 1-2, proposes an embodiment of the present utility model, and the encapsulating structure of the linear LED light source includes hair
Optical assembly 1, conductive coating 2, connection terminal 3 and fluorescent glue sealing 4.
The luminescence component 1 is formed by multiple flip LED chips 11 along arranged in a straight line, and adjacent flip LED chips 11
Adjacent electrode is on the contrary, the adjacent adjacent electrode of flip LED chips 11 is electrically connected by conductive coating 2, i.e. flip LED chips 11
The negative poles 112 of the flip LED chips 11 adjacent thereto of positive pole 111 electrically connected by conductive coating 2.
The both ends of luminescence component 1 are respectively equipped with a connection terminal 3, the flip LED chips 11 adjacent thereto of connection terminal 3
Adjacent electrode is electrically connected by conductive coating 2, and the connection terminal 3 at the both ends of luminescence component 1 is used for the both ends for accessing power supply.
Fluorescent glue sealing 4 is fixed on luminescence component 1 and connection terminal 3 coated on luminescence component 1 and connection terminal 3
On fluorescent glue sealing 4, substrate is saved, the production material of linear LED light source has been saved, has reduced cost；It is new to improve this practicality
The plasticity of linear LED light source, can arbitrarily bend described in type.
For conductive coating 2 coated on the adjacent electrode of adjacent flip-chip LED chip 11, conductive coating 2 realizes luminescence component 1
Electrical connection between connection terminal 3, the adjacent electrode of the flip LED chips adjacent thereto of connection terminal 3 pass through conductive coating 2
Electrical connection, avoid, using gold thread bonding luminescence component 1 and connection terminal 3, improving the stability of linear LED light source quality.
The two poles of the earth of flip LED chips 11 are completely covered in conductive coating 2, and conductive coating 2 adds dissipating for flip LED chips 11
Hot area, be advantageous to increase the life-span of flip LED chips 11；When the width of conductive coating 2 is identical with the width of fluorescent glue sealing 4
When, conductive coating 2 can be used for the light that reflection flip LED chips 11 are sent downwards, be advantageous to increase the light intensity of linear LED light source.
A kind of encapsulation step of the encapsulating structure of linear LED light source described in the utility model is：
A, flip LED chips array is arranged using arrangement machine, makes the adjacent electricity of two adjacent flip LED chips of each column
It is extremely different, and the rear and front end of each column flip LED chips is arranged with a connection terminal respectively；
B, fluorescent glue is covered on the product obtained in step using wafer-level package technology, and dries fluorescent glue；
C, plate conductive coating using electrode of the vacuum coating equipment in connection terminal and flip LED chips, make it is adjacent fall
Fill the adjacent electrode electrical connection of LED chip, connection terminal flip LED chips electrical connection adjacent thereto；
D, the use of scribing machine is linear LED light source described in the utility model with the product arranged to be obtained in unit cutting C.
The wafer-level package technology used in wherein step B includes but is not limited to coating, spraying, evaporation and mould.
A kind of encapsulation step of the encapsulating structure of linear LED light source described in the utility model is given birth to suitable for industrial mass
Production, fluorescent glue is coated using wafer-level package technology, and with the product obtained in scribing machine cutting step C, ensure fluorescent glue
Concentration is consistent, and scribing machine can accurately control the size of the linear LED light source of acquisition, improve the photochromic of linear LED light source
Uniformity, illuminating effect is more preferably.
Preferred embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model,
Every equivalent structure transformation made using the utility model specification and accompanying drawing content, or directly or indirectly it is used in other phases
The technical field of pass, similarly it is included in scope of patent protection of the present utility model.
Claims (4)
- A kind of 1. linear LED light source encapsulating structure, it is characterised in that including：Luminescence component, including one or more is along flip LED chips arranged in a straight line；Connection terminal, the both ends of luminescence component include a connection terminal respectively；Conductive coating, conductive coating electrically connect the adjacent electrode of adjacent flip-chip LED chip, and connection terminal passes through conductive coating and hair The flip LED chips electrical connection at optical assembly both ends；Fluorescent glue sealing, it is coated on the luminescence component and connection terminal.
- A kind of 2. linear LED light source encapsulating structure according to claim 1, it is characterised in that in luminescence component it is adjacent fall The adjacent electrode of LED chip is filled on the contrary, flip LED chips are using the connected mode connected.
- 3. a kind of linear LED light source encapsulating structure according to claim 1, it is characterised in that the conductive coating is complete Cover the both positive and negative polarity of flip LED chips.
- A kind of 4. linear LED light source encapsulating structure according to claim 3, it is characterised in that the width of the conductive coating Degree is equal with the width of fluorescent glue sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720539113.8U CN206711891U (en) | 2017-05-12 | 2017-05-12 | A kind of encapsulating structure of linear LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720539113.8U CN206711891U (en) | 2017-05-12 | 2017-05-12 | A kind of encapsulating structure of linear LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206711891U true CN206711891U (en) | 2017-12-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720539113.8U Active CN206711891U (en) | 2017-05-12 | 2017-05-12 | A kind of encapsulating structure of linear LED light source |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106981483A (en) * | 2017-05-12 | 2017-07-25 | 中山市立体光电科技有限公司 | A kind of encapsulating structure of linear LED/light source |
-
2017
- 2017-05-12 CN CN201720539113.8U patent/CN206711891U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106981483A (en) * | 2017-05-12 | 2017-07-25 | 中山市立体光电科技有限公司 | A kind of encapsulating structure of linear LED/light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211028 Address after: 528400 building 1-10 / building 11, first floor / building 12-15, No. 1, MuLinSen Avenue, Xiaolan Town, Zhongshan City, Guangdong Province (two business places are added, No. 6, Yucheng Third Street, Xiaolan Town, No. 1, Nantai street, Xiaolan Town) Patentee after: ZHONGSHAN MLS ELECTRONIC Co.,Ltd. Address before: 528415 one of the first and second floors of Building 9, No. 45, Industrial Avenue, Xiaolan Town, Zhongshan City, Guangdong Province Patentee before: ZHONGSHAN LITI LIGHTING TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |