CN206674302U - A kind of double side printed wiring board - Google Patents
A kind of double side printed wiring board Download PDFInfo
- Publication number
- CN206674302U CN206674302U CN201720448666.2U CN201720448666U CN206674302U CN 206674302 U CN206674302 U CN 206674302U CN 201720448666 U CN201720448666 U CN 201720448666U CN 206674302 U CN206674302 U CN 206674302U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- wiring board
- insulating medium
- medium layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 59
- 239000011889 copper foil Substances 0.000 claims abstract description 58
- 239000000919 ceramic Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052573 porcelain Inorganic materials 0.000 claims 1
- 238000005530 etching Methods 0.000 abstract description 12
- 238000010586 diagram Methods 0.000 abstract description 9
- 230000004888 barrier function Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- HPNSNYBUADCFDR-UHFFFAOYSA-N chromafenozide Chemical compound CC1=CC(C)=CC(C(=O)N(NC(=O)C=2C(=C3CCCOC3=CC=2)C)C(C)(C)C)=C1 HPNSNYBUADCFDR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses a kind of double side printed wiring board, including wiring board body, wiring board body includes ceramic substrate, the top of ceramic substrate connects upper insulating medium layer by upper copper foil layer, the bottom of ceramic substrate connects lower insulating medium layer by lower copper foil layer, copper foil circuit groove and blind hole are evenly equipped with the outer surface of upper insulating medium layer and lower insulating medium layer, and through hole is provided between upper insulating medium layer and lower insulating medium layer；Printed wiring board of the present utility model can portray the wiring board of complexity in copper foil circuit groove, and by through hole by the connection in upper and lower insulating medium layer together, pass through blind hole simultaneously, circuit in copper foil circuit groove can be linked together with upper copper foil layer and lower copper foil layer respectively, the circuit diagram of complexity can be etched on printed wiring board, make it have stronger stability, electric conductivity and resistance to elevated temperatures, and circuit etching can individually be separated every circuit in copper foil circuit groove.
Description
Technical field
A kind of printed wiring board is the utility model is related to, more particularly to a kind of double side printed wiring board, belongs to printed wiring
Board device technical field.
Background technology
Exploitation and development drastically of the nineties in last century due to ball bar array (BGA) component, its I/O (output and
Input pin) number sharply increase, the exploitation of wafer-level package and other up-to-date technologies (such as FCP, flipchip package)
With rapid popularization and application, these components and package technique develop rapidly, it is meant that PCB industry must use new manufacture skill
Art and technique productions go out more highdensity PCB, to adapt to the component of these high density finer pitch and smaller conductor size
It is required that.
Traditional pcb board (i.e. printed substrate) by realizing circuit function in insulation board surface etch circuit diagram, and
Only one side can portray circuit, when in face of extremely complex circuit diagram, it is necessary to extremely complex electric circuit diagram design is carried out,
Need larger pcb board formula to carry this circuit diagram simultaneously, if traditional printed substrate carries this circuit diagram, need larger
Area is etched, can so make that the volume of wiring board is big, in quality, does not meet the development trend of electronics industry in the prior art with regard to body
The light-weighted demand of product.
The content of the invention
The utility model proposes a kind of double side printed wiring board, if it is multiple to solve printed substrate carrying in the prior art
Miscellaneous circuit diagram, then larger etching area is needed, can so make that the volume of wiring board is big, in quality, does not meet present electronics
The problem of industrial expansion trend is with regard to volume lightweight demand.
In order to solve the above-mentioned technical problem, the utility model provides following technical scheme：
A kind of double side printed wiring board of the utility model, including wiring board body, the wiring board body include ceramic base
Plate and mounting hole, four mounting holes are symmetrically arranged with the wiring board body, the top of the ceramic substrate passes through upper copper foil
The upper insulating medium layer of layer connection, the bottom of the ceramic substrate connect lower insulating medium layer, the upper insulation by lower copper foil layer
Be evenly equipped with copper foil circuit groove and blind hole on the outer surface of dielectric layer and lower insulating medium layer, and the upper insulating medium layer and it is lower absolutely
Through hole is provided between edge dielectric layer.
As a kind of optimal technical scheme of the present utility model, the blind hole is bellmouth, and the upper insulating medium layer
Upper copper foil layer and lower copper foil layer are connected respectively with the blind-hole bottom on lower insulating medium layer.
As a kind of optimal technical scheme of the present utility model, several cylinders are provided with the upper insulating medium layer
Fixing hole.
As a kind of optimal technical scheme of the present utility model, the ceramic substrate by insulating barrier connect upper copper foil layer and
Lower copper foil layer.
As a kind of optimal technical scheme of the present utility model, the aperture connection copper foil line slot of the through hole, its inwall
On scribble insulating medium layer.
The beneficial effect that the utility model is reached is：Printed wiring board of the present utility model passes through in upper insulating medium layer
Copper foil circuit groove is furnished with lower insulating medium layer, the wiring board of complexity can be portrayed in copper foil circuit groove, and passes through through hole
By the connection in upper and lower insulating medium layer together, while by blind hole, the circuit in copper foil circuit groove can be distinguished
Linked together with upper copper foil layer and lower copper foil layer, the circuit diagram of complexity can be etched on printed wiring board, made it have
Stronger stability, electric conductivity and resistance to elevated temperatures, and by circuit etching in copper foil circuit groove, can be by every circuit
Individually separate, when avoiding the occurrence of etching, different circuits, which etches the situation for together, causing etching to fail, to be occurred, and is advantageous to carry
The etching success rate of high printed wiring board, easy to use, small volume, light weight, it is easy to use and promotes.
Brief description of the drawings
Accompanying drawing is used for providing further understanding to of the present utility model, and a part for constitution instruction, with this practicality
New embodiment is used to explain the utility model together, does not form to limitation of the present utility model.In the accompanying drawings：
Fig. 1 is subjective structural representation of the present utility model；
In figure：1st, wiring board body；2nd, ceramic substrate；3rd, upper copper foil layer；4th, upper insulating medium layer；5th, lower copper foil layer；6、
Lower insulating medium layer；7th, mounting hole；8th, copper foil circuit groove；9th, through hole；10th, blind hole；11st, fixing hole.
Embodiment
Preferred embodiment of the present utility model is illustrated below in conjunction with accompanying drawing, it will be appreciated that described herein excellent
Select embodiment to be merely to illustrate and explain the utility model, be not used to limit the utility model.
Embodiment 1
As shown in figure 1, the utility model provides a kind of double side printed wiring board, including wiring board body 1, wiring board body
1 includes ceramic substrate 2 and mounting hole 7, and ceramic substrate 2 is made up of ceramic matric composite, be with ceramics for matrix with it is various
A kind of composite of fiber composite；Ceramic matrix can be the high-temperature structural ceramics such as silicon nitride, carborundum；With high temperature resistant, height
Strength and stiffness, relative weight be lighter, the excellent properties such as anticorrosive, can reduce the weight of wiring board, improve its high temperature resistant, height
Strength and stiffness and erosion-resisting ability, four mounting holes 7 are symmetrically arranged with wiring board body 1, are easy to pacify by bolt
Printed wiring board is filled, the top of ceramic substrate 2 connects upper insulating medium layer 4 by upper copper foil layer 3, and the bottom of ceramic substrate 2 leads to
Cross down the lower insulating medium layer 6 of the connection of copper foil layer 5, copper foil is evenly equipped with the outer surface of upper insulating medium layer 4 and lower insulating medium layer 6
Line slot 8 and blind hole 10, the wiring board of complexity can be portrayed in copper foil circuit groove 8, by the way that circuit is etched in copper foil circuit
In groove 8, every circuit can individually be separated, when avoiding the occurrence of etching, different circuits etches together, causes etching to fail
Situation occur, be advantageous to improve the etching success rate of printed wiring board, and upper insulating medium layer 4 and lower insulating medium layer 6 it
Between be provided with through hole 9, by through hole 9 can by the connection in upper and lower insulating medium layer together, while by blind hole 10,
Circuit in copper foil circuit groove 8 can be linked together with upper copper foil layer 3 and lower copper foil layer 5 respectively, can be by the electricity of complexity
Road figure etching makes it have stronger stability, electric conductivity and resistance to elevated temperatures on printed wiring board.
Blind hole 10 is bellmouth, and the bottom of blind hole 10 on upper insulating medium layer 4 and lower insulating medium layer 6 connects respectively
Copper foil layer 3 and lower copper foil layer 5, be easy to by the circuit of upper insulating medium layer 4 and lower insulating medium layer 6 respectively with upper copper foil layer 3 and
Lower copper foil layer 5 links together.
Several cylindrical fixing holes 11 are provided with upper insulating medium layer 4, are easily installed fixed chip.
Ceramic substrate 2 connects upper copper foil layer 3 and lower copper foil layer 5 by insulating barrier, is easy to upper copper foil layer 3 and lower copper foil layer
5 are separated with ceramic substrate 2 by insulating barrier, are avoided copper foil layer 3 and lower copper foil layer 5 from being linked together by ceramic substrate 2, are made
Into getting lines crossed, so as to which the situation for causing printing to fail occurs.
Through hole 9 is the hole of cylinder, and the aperture connection copper foil line slot of through hole 9, and insulating medium layer is scribbled on its inwall,
Be easy to by copper foil circuit by the connection in upper and lower insulating medium layer together.
Printed wiring board of the present utility model in upper insulating medium layer 4 and lower insulating medium layer 6 by being furnished with copper foil line
Road groove 8, the wiring board of complexity can be portrayed in copper foil circuit groove 8, and by through hole 9 by the circuit in upper and lower insulating medium layer
Link together, while by blind hole 10, can by the circuit in copper foil circuit groove 8 respectively with upper copper foil layer 3 and lower copper foil layer 5
Link together, the circuit diagram of complexity can be etched on printed wiring board, make it have stronger stability, electric conductivity
Energy and resistance to elevated temperatures, and every circuit can individually be separated in copper foil circuit groove 8, avoid the occurrence of quarter by circuit etching
During erosion, different circuits, which etches the situation for together, causing etching to fail, to be occurred, and is advantageous to improve being etched into for printed wiring board
Power, easy to use, small volume, light weight, it is easy to use and promotes.
Finally it should be noted that：Preferred embodiment of the present utility model is the foregoing is only, is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it can still modify to the technical scheme described in foregoing embodiments, or to which part technical characteristic
Carry out equivalent substitution.All any modification, equivalent substitution and improvements within the spirit and principles of the utility model, made etc.,
It should be included within the scope of protection of the utility model.
Claims (5)
1. a kind of double side printed wiring board, including wiring board body（1）, it is characterised in that the wiring board body（1）Including pottery
Porcelain substrate（2）And mounting hole（7）, the wiring board body（1）On be symmetrically arranged with four mounting holes（7）, the ceramic substrate
（2）Top pass through upper copper foil layer（3）Insulating medium layer in connection（4）, the ceramic substrate（2）Bottom pass through lower copper foil layer
（5）The lower insulating medium layer of connection（6）, the upper insulating medium layer（4）With lower insulating medium layer（6）Outer surface on be evenly equipped with copper
Paper tinsel line slot（8）And blind hole（10）, and the upper insulating medium layer（4）With lower insulating medium layer（6）Between be provided with through hole
（9）.
A kind of 2. double side printed wiring board according to claim 1, it is characterised in that the blind hole（10）For bellmouth,
And the upper insulating medium layer（4）With lower insulating medium layer（6）On blind hole（10）Bottom connects copper foil layer respectively（3）With under
Copper foil layer（5）.
A kind of 3. double side printed wiring board according to claim 2, it is characterised in that the upper insulating medium layer（4）On
It is provided with several cylindrical fixing holes（11）.
A kind of 4. double side printed wiring board according to claim 1, it is characterised in that the ceramic substrate（2）By exhausted
The upper copper foil layer of edge layer connection（3）With lower copper foil layer（5）.
A kind of 5. double side printed wiring board according to claim 1, it is characterised in that the through hole（9）Aperture connection
Copper foil circuit groove, insulating medium layer is scribbled on its inwall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720448666.2U CN206674302U (en) | 2017-04-26 | 2017-04-26 | A kind of double side printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720448666.2U CN206674302U (en) | 2017-04-26 | 2017-04-26 | A kind of double side printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206674302U true CN206674302U (en) | 2017-11-24 |
Family
ID=60370844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720448666.2U Expired - Fee Related CN206674302U (en) | 2017-04-26 | 2017-04-26 | A kind of double side printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206674302U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113163657A (en) * | 2021-03-20 | 2021-07-23 | 福建闽威科技股份有限公司 | Double-sided printed circuit board convenient to mount and production method thereof |
-
2017
- 2017-04-26 CN CN201720448666.2U patent/CN206674302U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113163657A (en) * | 2021-03-20 | 2021-07-23 | 福建闽威科技股份有限公司 | Double-sided printed circuit board convenient to mount and production method thereof |
| CN113163657B (en) * | 2021-03-20 | 2022-08-30 | 福建闽威科技股份有限公司 | Double-sided printed circuit board convenient to mount and production method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200313 Address after: 518125 room 605, No.1, Plaza 9, Liaofeng Road, Shangliao community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Yaozhong Toby Technology Co.,Ltd. Address before: 518125, room 1, No. 9, 606, Lao Feng Road, Lao community, Shenzhen, Guangdong Patentee before: SHENZHEN QIANHAI DELTON TECHNOLOGY ELECTRICAL Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171124 |