CN206611638U

CN206611638U - A kind of improved PCB substrate and pcb board

Info

Publication number: CN206611638U
Application number: CN201720085309.4U
Authority: CN
Inventors: 闵存忠
Original assignee: CHONGQING HUIDING ELECTRONIC CIRCUIT Co Ltd
Current assignee: CHONGQING HUIDING ELECTRONIC CIRCUIT Co Ltd
Priority date: 2017-01-23
Filing date: 2017-01-23
Publication date: 2017-11-03
Anticipated expiration: 2027-01-23

Abstract

The utility model discloses a kind of improved PCB substrate, from top to bottom, copper foil layer, the first precoat, core material layer are disposed with, copper foil layer is coated on the first precoat, first precoat is coated in core material layer, and the first precoat is the polyimides precoat containing carborane.Also disclose a kind of pcb board.The utility model is using the heat resistance preferably pi containing carborane, therefore with welding heat resistance well, and the heat resistance for solving current pcb board material is not high, the problem of dielectric constant is again too high.

Description

A kind of improved PCB substrate and pcb board

Technical field

The utility model is related to electronic technology field, and in particular to a kind of improved PCB substrate and pcb board.

Background technology

Printing board PCB is to be manufactured with copper clad laminate (Copper-clad Laminate abbreviation CCL) as raw material Electrical equipment or electronics important mechanism component.Substrate is by dielectric layer (resin Resin, glass fibre Glass fiber), and height The composite (Composite material) that both conductors (copper foil Copper foil) of purity are constituted.

More and more important, the plank of some special high-temperature uses is understood in adaptation of the circuit board to temperature, non-epoxy institute Can be competent, about 120 DEG C or so of traditional type FR4 Tg also only reaches 180-190 DEG C even if H.D FR4.Therefore in order to adapt to Special high-temperature use, it is necessary to design a kind of circuit board that can adapt to higher temperature.

Utility model content

The utility model purpose is a kind of improved PCB substrate of offer, and the PCB substrate is due to more preferable using heat resistance The pi containing carborane, therefore with welding heat resistance well, solve the heat resistance of current pcb board material not Height, the problem of dielectric constant is again too high.Also disclose a kind of pcb board.

The utility model is achieved through the following technical solutions：

A kind of improved PCB substrate, from top to bottom, is disposed with copper foil layer, the first precoat, core material layer, copper foil layer It is coated on the first precoat, the first precoat is coated in core material layer, the first precoat is the polyimides face containing carborane The bed of material.The heat resistance of polyimides containing carborane can reach more than 400 DEG C, it is clear that can be applied to special high temperature and use On the way, its heat resisting temperature considerably beyond existing PCB substrate material, therefore with progressive.And the polyimides containing carborane Also known road, is not used in the preparation of PCB substrate also simply.Polyimides containing carborane is polyimides One kind.

Covered with one layer of resin bed on the copper foil layer.Applying one layer of resin bed on copper foil can be on the surface of copper foil The uniform resin bed of a layer thickness is formed, the thickness of resin bed is 30-100 microns.

The resin bed is novolac resin layer, epoxy resin layer or polyester resin layer.According to the resin bed species of coating Difference, assign copper foil surface there are different high-performance, be adapted to specific use use.

Also include the second precoat, second precoat is coated on the lower surface of core material layer, under the second precoat Copper foil layer is coated with surface, the second precoat is also the polyimide curing piece containing carborane.Single substrate can not expire The demand of sufficient actual package, now composite base plate allow for single basic performance and strengthened, can be used in the envelope of many occasions Dress.The second precoat and copper foil layer are used in the utility model so that single substrate turns into composite base plate, strengthens single substrate Function, expand its application surface.

First precoat is glass fabric or the fiberglass cloth for being impregnated with epoxy resin.

Second precoat is glass fabric or the glass fabric for being impregnated with epoxy resin.It can also be infiltrated His resin material, can flexibly be selected according to actual demand.

The core material layer is paper, glassine paper or the all-glass paper impregnated through resin.

Resin is epoxy resin or phenolic resin.

A kind of pcb board of the PCB substrate including as described in before power.

The utility model compared with prior art, has the following advantages and advantages：

The utility model is using the heat resistance preferably pi containing carborane, therefore with welding heat-resisting well Performance, the heat resistance for solving current pcb board material is not high, the problem of dielectric constant is again too high.

Brief description of the drawings

Accompanying drawing described herein is used for providing further understanding the utility model embodiment, constitutes the one of the application Part, does not constitute the restriction to the utility model embodiment.In the accompanying drawings：

Fig. 1 is the utility model structural representation.

Fig. 2 is the figure of embodiment 2.

Mark and corresponding parts title in accompanying drawing：

1- copper foil layers, the 2, first precoat, 3, core material layer, the 4, second precoat, 5, resin bed.

Embodiment

For the purpose of this utility model, technical scheme and advantage is more clearly understood, with reference to embodiment and accompanying drawing, The utility model is described in further detail, and exemplary embodiment of the present utility model and its explanation are only used for explaining this Utility model, is not intended as limiting of the present utility model.

Embodiment 1

As shown in figure 1, a kind of improved PCB substrate, from top to bottom, is disposed with copper foil layer 1, the first precoat 2, core The bed of material 3, copper foil layer 1 is coated on the first precoat 2, and the first precoat 2 is coated in core material layer 3, and the first precoat 2 is carbon containing The polyimides precoat of borine.The heat resistance of polyimides containing carborane can reach more than 400 DEG C, it is clear that Neng Goushi For special high-temperature use, its heat resisting temperature considerably beyond existing PCB substrate material, therefore with progressive.And it is carbon containing The polyimides of borine also known road recently, is not used in the preparation of PCB substrate also simply.

Covered with one layer of resin bed 5 on the copper foil layer 1.Applied on copper foil one layer of resin bed 5 can copper foil table The uniform resin bed 5 of a layer thickness is formed on face, the thickness of resin bed 5 is 30-100 microns.

The resin bed 5 is novolac resin layer, epoxy resin layer or polyester resin layer.According to 5 kinds of the resin bed of coating The difference of class, assigning copper foil surface has different high-performance, to be adapted to the use of specific use.

Embodiment 2

As shown in Fig. 2 also including the second precoat 4, second precoat 4 is coated on the lower surface of core material layer 3, the Copper foil layer 1 is coated with the lower surface of two precoats 4, the second precoat 4 is also the polyimide curing piece containing carborane.It is single Substrate can not meet the demand of actual package, and now composite base plate allows for single basic performance and strengthened, can Encapsulation for many occasions.The second precoat 4 and copper foil layer 1 are used in the utility model so that single substrate turns into composite base Plate, strengthens the function of single substrate, expands its application surface.

First precoat 2 is glass fabric or the fiberglass cloth for being impregnated with epoxy resin.

Second precoat 4 is glass fabric or the glass fabric for being impregnated with epoxy resin.It can also infiltrate Other resin materials, can flexibly be selected according to actual demand.

The core material layer 3 is paper, glassine paper or the all-glass paper impregnated through resin.

Resin is epoxy resin or phenolic resin.

Embodiment 3

Above-described embodiment, is entered to the purpose of this utility model, technical scheme and beneficial effect One step is described in detail, be should be understood that and be the foregoing is only embodiment of the present utility model, is not used to limit Fixed protection domain of the present utility model, all any modifications within spirit of the present utility model and principle, made, is equally replaced Change, improve, should be included within protection domain of the present utility model.

Claims

1. a kind of improved PCB substrate, from top to bottom, is disposed with copper foil layer (1), the first precoat (2), core material layer (3), Copper foil layer (1) is coated on the first precoat (2), and the first precoat (2) is coated in core material layer (3), it is characterised in that first Precoat (2) is the polyimides precoat containing carborane.

2. a kind of improved PCB substrate according to claim 1, it is characterised in that covered with one on the copper foil layer (1) Layer resin bed (5).

3. a kind of improved PCB substrate according to claim 2, it is characterised in that the resin bed (5) is phenolic resin Layer, epoxy resin layer or polyester resin layer.

4. a kind of improved PCB substrate according to claim 1, it is characterised in that also including the second precoat (4), institute State the second precoat (4) to be coated on the lower surface of core material layer (3), copper foil layer is coated with the lower surface of the second precoat (4) (1), the second precoat (4) is also the polyimide curing piece containing carborane.

5. a kind of improved PCB substrate according to claim 1, it is characterised in that first precoat (2) is glass Fiber cloth or the fiberglass cloth for being impregnated with epoxy resin.

6. a kind of improved PCB substrate according to claim 4, it is characterised in that second precoat (4) is glass Fiber cloth or the glass fabric for being impregnated with epoxy resin.

7. a kind of improved PCB substrate according to claim 1, it is characterised in that the core material layer (3) is paper, glass Paper or the all-glass paper impregnated through resin.

8. a kind of improved PCB substrate according to claim 1, it is characterised in that resin is epoxy resin or phenolic aldehyde Resin.

9. a kind of pcb board of the PCB substrate including as described in claim any one of 1-8.