CN205320366U - Printed circuit board , display device - Google Patents
Printed circuit board , display device Download PDFInfo
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- CN205320366U CN205320366U CN201620007123.2U CN201620007123U CN205320366U CN 205320366 U CN205320366 U CN 205320366U CN 201620007123 U CN201620007123 U CN 201620007123U CN 205320366 U CN205320366 U CN 205320366U
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- layer
- thermal diffusion
- diffusion layer
- circuit board
- printed circuit
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- 238000009792 diffusion process Methods 0.000 claims abstract description 156
- 239000010410 layer Substances 0.000 claims description 217
- 239000012790 adhesive layer Substances 0.000 claims description 53
- 238000010276 construction Methods 0.000 claims description 7
- 238000003475 lamination Methods 0.000 claims description 4
- 238000007514 turning Methods 0.000 claims description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 229910052697 platinum Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 229910002804 graphite Inorganic materials 0.000 description 6
- 239000010439 graphite Substances 0.000 description 6
- 239000002344 surface layer Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000002313 adhesive film Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000007770 graphite material Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000037361 pathway Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- -1 specifically Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 235000003392 Curcuma domestica Nutrition 0.000 description 1
- 244000008991 Curcuma longa Species 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 235000003373 curcuma longa Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 235000013976 turmeric Nutrition 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a printed circuit board, display device for improve printed circuit board's heat conductivity, promote printed circuit board's reliability. Printed circuit board includes line layer and dielectric layer, and the dielectric layer includes multilayer bond line, at least one first thermal diffusion layer and an at least second thermal diffusion layer, first thermal diffusion layer and second thermal diffusion layer stromatolite set up, and the bond line is located between first thermal diffusion layer and the second thermal diffusion layer for bind first thermal diffusion layer and second thermal diffusion layer, and be located between first thermal diffusion layer and the line layer for bind first thermal diffusion layer and line layer, and/or be located between second thermal diffusion layer and the line layer, be used for binding second thermal diffusion layer and line layer, first thermal diffusion layer is greater than the thermal diffusivity in the second direction at the thermal diffusivity of first direction, the second thermal diffusion layer is greater than the thermal diffusivity at the first direction at the thermal diffusivity of second direction, the first direction intersects with the second direction.
Description
Technical field
This utility model relates to Display Technique field, particularly relates to a kind of printed circuit board, display device.
Background technology
Printed circuit board is the supplier of electronic devices and components electrical connection, is widely used in each electronic product. At present, modal printed circuit board is as it is shown in figure 1, mainly include surface layer 11, line layer 12 and dielectric layer 13. During part encapsulation, it is necessary to the surface layer 11 of the position of insulation is the anti-solder ink on copper face, it is necessary to the surface layer 11 at position of bonding wire place is the spray stannum on copper face, changes gold, changes silver, changes stannum and organic solderability preservative etc. Line layer 12 is copper-clad plate or circuit Copper Foil, and for layout circuit, circuit is as the instrument of conducting between original paper. Dielectric layer 13 is used for the insulating properties kept between circuit and each layer. Printed circuit board also includes functional hole 14, the via formed after depositing conductive material in functional hole 14, the circuit of more than two-layer can be made to turn on each other or as part plug-in unit use, when part is also used for assembling, fixed screw is used; The non-conduction hole not depositing conductive material in functional hole 14 is commonly used to as surface mount location etc.
The structure of dielectric layer 13 is as in figure 2 it is shown, dielectric layer 13 includes base material 132 and adhesive film 131, and it is bakelite plate, glass mat that base material 132 mainly comprises raw material, and the insulation system of various plastic plate composition; Adhesive film 131 is generally epoxy resin, at high temperature can base material 132 and line layer 12 be bonded together. Owing to the material of dielectric layer 13 is constituted, base material 132 is about 1.46W/m.K for its heat conductivity of glass fibre, and the heat conductivity of adhesive film epoxy resin is 0.2146W/m.K, and while insulation, the heat conductivity of dielectric layer 13 is excessively poor. It addition, base material 132 needs suitable thickness to ensure mechanical strength, thus the plasticity of machining is poor.
The heat conduction in lamp bar of the conventional printed circuit boards of prior art is distributed as shown in Figure 3, wherein light emitting diode (LightEmittingDiode, LED) 73 it is encapsulated in printed circuit board 72 side and constitutes lamp bar, and the opposite side of printed circuit board 72 is pasted onto on structure carrier 70 is carried out heat conduction by heat-conducting glue 71.Owing to the conduction of heat direction that the dielectric layer in printed circuit board is main is vertical direction, conduction of heat in horizontal direction is poor, therefore the LED thermal source above printed circuit board, the heat conduction of vertical direction is carried out mainly by A district, in printed circuit board, B district then cannot participate in heat conduction, so, the overall thermal conductivity of printed circuit board is poor.
The modal another kind of printed circuit board of prior art is aluminum base circuit board, aluminum base circuit board structurally includes three-decker equally, the difference is that the base material in the dielectric layer of aluminum base circuit board material select aluminum, there is good heat conductivity, adhesive film in dielectric layer is to be made up of the polymer of the relatively good ceramic filler of heat conduction, thermal resistance is less, viscoelastic property is excellent, although aluminium base dielectric layer improves the overall thermal conductivity of printed circuit board, but owing to which increasing implant, still have gap and anisotropy compared to the heat conduction of pure aluminum metal. It addition, the base material of aluminum base circuit board is also required to suitable thickness to ensure mechanical strength, thus the plasticity of machining is also poor.
In sum, the heat conductivity of prior art printed circuit board is poor, and reliability is poor, and the plasticity of machining is also poor.
Utility model content
This utility model embodiment provides a kind of printed circuit board, display device, in order to improve the heat conductivity of printed circuit board, promotes the reliability of printed circuit board.
A kind of printed circuit board that this utility model embodiment provides, including line layer and dielectric layer, described dielectric layer is between adjacent two layers line layer, and wherein, described dielectric layer includes some layers of adhesive layer, at least one of which the first thermal diffusion layer and at least one of which the second thermal diffusion layer;
Described first thermal diffusion layer and described second thermal diffusion layer lamination are arranged, and described adhesive layer is between described first thermal diffusion layer and described second thermal diffusion layer, for described first thermal diffusion layer and described second thermal diffusion layer being sticked together; And
Described adhesive layer is between described first thermal diffusion layer and described line layer, for described first thermal diffusion layer and described line layer are sticked together, and/or between described second thermal diffusion layer and described line layer, for described second thermal diffusion layer and described line layer are sticked together;
Described first thermal diffusion layer thermal diffusion coefficient in a first direction is more than thermal diffusion coefficient in a second direction; Described second thermal diffusion layer thermal diffusion coefficient in a second direction is more than thermal diffusion coefficient in a first direction;
Described first direction intersects with described second direction.
The printed circuit board provided by this utility model embodiment, including line layer and dielectric layer, dielectric layer includes some layers of adhesive layer, at least one of which the first thermal diffusion layer and at least one of which the second thermal diffusion layer, owing to the thermal diffusion coefficient in a first direction of the first thermal diffusion layer in this utility model embodiment is more than thermal diffusion coefficient in a second direction, namely the first thermal diffusion layer in this utility model embodiment has good heat conductivity in a first direction, it is possible to well ensure conduction of heat in a first direction, second thermal diffusion layer thermal diffusion coefficient in a second direction is more than thermal diffusion coefficient in a first direction, namely the second thermal diffusion layer in this utility model embodiment has good heat conductivity in a second direction, can be good at the conduction of heat ensured in a second direction, compared with prior art, this utility model embodiment is capable of the good heat conductivity on more than one direction, therefore, it is possible to by printed circuit board itself and be encapsulated in the even heat of components and parts thereon and quickly pass, improve the heat conductivity of printed circuit board, and then promote the reliability of printed circuit board.
It is preferred that the laminated construction that described dielectric layer is from top to bottom includes successively: adhesive layer, the second thermal diffusion layer, adhesive layer, the first thermal diffusion layer and adhesive layer.
It is preferred that the laminated construction that described dielectric layer is from top to bottom includes successively: adhesive layer, the first thermal diffusion layer, adhesive layer, the second thermal diffusion layer, adhesive layer, the first thermal diffusion layer and adhesive layer; Or,
Adhesive layer, the second thermal diffusion layer, adhesive layer, the first thermal diffusion layer, adhesive layer, the second thermal diffusion layer and adhesive layer.
It is preferred that described first direction is horizontal direction, described second direction is vertical direction.
It is preferred that the thickness of described adhesive layer is 12 μm to 100 μm.
It is preferred that the thickness of described first thermal diffusion layer is 25 μm to 200 μm.
It is preferred that the thickness of described second thermal diffusion layer is 20 μm to 150 μm.
It is preferred that also include the via running through described line layer and described dielectric layer, described via is for turning on the line layer of more than two-layer and two-layer, or is used for fixed screw.
This utility model embodiment additionally provides a kind of display device, and this display device includes above-mentioned printed circuit board.
Accompanying drawing explanation
Fig. 1 is the cross section structure schematic diagram of the printed circuit board of prior art;
Fig. 2 is the cross section structure schematic diagram of the dielectric layer in the printed circuit board of prior art;
Fig. 3 is the conventional printed circuit boards of prior art heat conduction distribution schematic diagram in lamp bar;
The cross section structure schematic diagram of a kind of printed circuit board that Fig. 4 provides for this utility model embodiment;
The cross section structure schematic diagram of a kind of printed circuit board that Fig. 5 provides for this utility model embodiment one;
The cross section structure schematic diagram of a kind of printed circuit board that Fig. 6 (a) and Fig. 6 (b) provides for this utility model embodiment two;
A kind of printed circuit board that Fig. 7 provides for this utility model embodiment heat conduction distribution schematic diagram in lamp bar;
The mechanical performance schematic diagram of the printed circuit board that Fig. 8 provides for this utility model embodiment.
Detailed description of the invention
This utility model embodiment provides a kind of printed circuit board, display device, in order to improve the heat conductivity of printed circuit board, promotes the reliability of printed circuit board.
In order to make the purpose of this utility model, technical scheme and advantage clearly, below in conjunction with accompanying drawing, this utility model is described in further detail, obviously, described embodiment is only a part of embodiment of this utility model, rather than whole embodiments. Based on the embodiment in this utility model, all other embodiments that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of this utility model protection.
In accompanying drawing, each thicknesses of layers and area size, shape do not react the actual proportions of each rete, and purpose is schematically illustrate this utility model content.
Printed circuit board that this utility model specific embodiment provide is discussed in detail below in conjunction with accompanying drawing.
As shown in Figure 4, this utility model specific embodiment provides a kind of printed circuit board, including line layer 12 and dielectric layer 13, dielectric layer 13 is between adjacent two layers line layer 12, wherein, dielectric layer 13 includes some layers of adhesive layer 1303, at least one of which the first thermal diffusion layer 1301 and at least one of which the second thermal diffusion layer 1302;
First thermal diffusion layer 1301 and the second thermal diffusion layer 1302 lamination are arranged, and adhesive layer 1303 is between the first thermal diffusion layer 1301 and the second thermal diffusion layer 1302, for the first thermal diffusion layer 1301 and the second thermal diffusion layer 1302 being sticked together;And
Adhesive layer 1303 is between the first thermal diffusion layer 1301 and line layer 12, for the first thermal diffusion layer 1301 and line layer 12 are sticked together, and/or between the second thermal diffusion layer 1302 and line layer 12, for the second thermal diffusion layer 1302 and line layer 12 are sticked together;
First thermal diffusion layer 1301 thermal diffusion coefficient in a first direction is more than thermal diffusion coefficient in a second direction; Second thermal diffusion layer 1302 thermal diffusion coefficient in a second direction is more than thermal diffusion coefficient in a first direction;
First direction intersects with second direction, it is preferable that the first direction in this utility model specific embodiment is horizontal direction, and second direction is vertical direction.
Specifically, the printed circuit board in this utility model specific embodiment also includes the via 30 running through line layer 12 and dielectric layer 13, and via 30 is for turning on the line layer 12 of more than two-layer and two-layer, or is used for part plug-in unit, or for fixed screw. Via 30 position is specifically set, and concrete method to set up is same as the prior art, repeats no more here.
Printed circuit board in this utility model specific embodiment also includes surface layer 11, and the protective measure such as surface layer 11 adopts welding resistance according to the actual requirements, sprays paint, turmeric, specifically arranging of surface layer 11 is same as the prior art, repeats no more here.
This utility model specific embodiment can be fabricated to corresponding single sided board, doubling plate and multi-layer sheet according to the number of line layer 12, the complexity of each sandwich circuit will affect the Three-dimension process difficulty of printed circuit board, specifically arranging of line layer 12 is same as the prior art, repeats no more here.
This utility model specific embodiment dielectric layer 13 is according to actual needs, changed heat radiation and the intensity of printed circuit board by the thickness and stacking quantity changing the first thermal diffusion layer and the second thermal diffusion layer, the stack manner of several first thermal diffusion layer and second thermal diffusion layer is discussed in detail below in conjunction with accompanying drawing.
Embodiment one:
As it is shown in figure 5, the dielectric layer laminated construction from top to bottom in the printed circuit board that provides of this utility model specific embodiment includes successively: adhesive layer the 1303, second thermal diffusion layer 1302, adhesive layer the 1303, first thermal diffusion layer 1301 and adhesive layer 1303.
In this utility model specific embodiment, the first thermal diffusion layer 1301 thermal diffusion coefficient in the horizontal direction is more than the thermal diffusion coefficient of in the vertical direction, preferably, this utility model specific embodiment the first thermal diffusion layer 1301 selects heat-conductive characteristic preferably graphite material in the horizontal direction.
In this utility model specific embodiment, the thermal diffusion coefficient of the second thermal diffusion layer 1302 in the vertical direction is more than thermal diffusion coefficient in the horizontal direction, preferably, this utility model specific embodiment the second thermal diffusion layer 1302 selects in the vertical direction heat-conductive characteristic preferably metal platinum layer, specifically, metal platinum layer adopts ductility and the good aluminum of thermal diffusivity or copper.
Embodiment two:
As shown in Fig. 6 (a), the laminated construction from top to bottom of the dielectric layer in the printed circuit board that this utility model specific embodiment provides includes successively: adhesive layer the 1303, first thermal diffusion layer 1301, adhesive layer the 1303, second thermal diffusion layer 1302, adhesive layer the 1303, first thermal diffusion layer 1301 and adhesive layer 1303.
As shown in Fig. 6 (b), the laminated construction from top to bottom of the dielectric layer in the printed circuit board that this utility model specific embodiment provides includes successively: adhesive layer the 1303, second thermal diffusion layer 1302, adhesive layer the 1303, first thermal diffusion layer 1301, adhesive layer the 1303, second thermal diffusion layer 1302 and adhesive layer 1303.
In this utility model specific embodiment two, the first thermal diffusion layer 1301 thermal diffusion coefficient in the horizontal direction is more than the thermal diffusion coefficient of in the vertical direction, it is preferable that this utility model specific embodiment 2 first thermal diffusion layer 1301 also selects graphite material.
In this utility model specific embodiment two, the thermal diffusion coefficient of the second thermal diffusion layer 1302 in the vertical direction is more than thermal diffusion coefficient in the horizontal direction, preferably, this utility model specific embodiment 2 second thermal diffusion layer 1302 also selects metal platinum layer, specifically, metal platinum layer adopts aluminum or copper.
The dielectric layer of this utility model specific embodiment one adopts the stacking rete of five layers, and the dielectric layer of this utility model specific embodiment two adopts the stacking rete of seven layers; This utility model specific embodiment two is compared with this utility model specific embodiment one, and each rete, about the horizontal center line symmetrically structure of dielectric layer, is symmetrical arranged advantageously with heat uniform conductive in printed circuit board.
The heat conduction distribution in lamp bar of the printed circuit board in this utility model specific embodiment is made a concrete analysis of below in conjunction with accompanying drawing, further checking adopts the structure of the printed circuit board in this utility model specific embodiment, it is possible to by printed circuit board itself and encapsulate the even heat of components and parts thereon and quickly pass.
The heat conduction in lamp bar of the printed circuit board in this utility model specific embodiment is distributed as shown in Figure 7, due to the dielectric layer adopting graphite and metal platinum layer to be composited in the printed circuit board in this utility model specific embodiment, metal platinum layer can ensure that the heat conductivity in vertical direction, and the heat in A district can be effectively diffused into B district and carry out downwards vertical heat transfer path again by the superelevation radiating effect that graphite linings is in the horizontal direction, conduction of heat therefore can be carried out substantially. In figure, 74 represent the thermally conductive pathways in newly-increased horizontal direction, and 75 represent the thermally conductive pathways in newly-increased vertical direction.
Preferably, in this utility model specific embodiment, the thickness of adhesive layer is 12 μm to 100 μm, and the thickness of the first thermal diffusion layer is 25 μm to 200 μm, and the thickness of the second thermal diffusion layer is 20 μm to 150 μm. In actual production process, in this utility model specific embodiment, the concrete thickness of adhesive layer, the first thermal diffusion layer and the second thermal diffusion layer can be set according to the needs of actual production.
When being embodied as, the thickness of the graphite linings in this utility model specific embodiment is set to 25 μm, the thickness of metal platinum layer is set to 20 μm, the thickness of adhesive layer is set to 12 μm, so, the gross thickness of graphite linings, metal platinum layer and adhesive layer can be as thin as less than 100 μm, and the density of graphite linings, metal platinum layer and adhesive layer is all smaller thus quality is also lighter. Graphite itself does not have independence and a three-dimension process, but with metal platinum layer compound after, it is possible to having some machining properties such as bending, as shown in Figure 8, the printed circuit board being especially suitable for some curved surface requirements makes. Therefore the structure of the printed circuit board in employing this utility model specific embodiment, it is possible to make printed circuit board have certain plasticity, it is achieved the structures such as bending need.
This utility model specific embodiment additionally provides a kind of display device, this display device includes above-mentioned printed circuit board, this display device can be the display devices such as liquid crystal panel, liquid crystal display, LCD TV, Organic Light Emitting Diode (OrganicLightEmittingDiode, OLED) panel, OLED display, OLED TV or Electronic Paper.
In sum, this utility model specific embodiment provides a kind of printed circuit board, including line layer and dielectric layer, dielectric layer is between adjacent two layers line layer, and dielectric layer includes some layers of adhesive layer, at least one of which the first thermal diffusion layer and at least one of which the second thermal diffusion layer, first thermal diffusion layer and the second thermal diffusion layer lamination are arranged, and adhesive layer is between the first thermal diffusion layer and the second thermal diffusion layer, for the first thermal diffusion layer and the second thermal diffusion layer being sticked together, and adhesive layer is between the first thermal diffusion layer and line layer, for the first thermal diffusion layer and line layer are sticked together, and/or between the second thermal diffusion layer and line layer, for the second thermal diffusion layer and line layer are sticked together, first thermal diffusion layer thermal diffusion coefficient in a first direction is more than thermal diffusion coefficient in a second direction, second thermal diffusion layer thermal diffusion coefficient in a second direction is more than thermal diffusion coefficient in a first direction, first direction intersects with second direction. owing to the thermal diffusion coefficient in a first direction of the first thermal diffusion layer in this utility model specific embodiment is more than thermal diffusion coefficient in a second direction, namely the first thermal diffusion layer in this utility model specific embodiment has good heat conductivity in a first direction, it is possible to well ensure conduction of heat in a first direction, second thermal diffusion layer thermal diffusion coefficient in a second direction is more than thermal diffusion coefficient in a first direction, namely the second thermal diffusion layer in this utility model specific embodiment has good heat conductivity in a second direction, can be good at the conduction of heat ensured in a second direction, compared with prior art, this utility model specific embodiment is capable of the good heat conductivity on more than one direction, therefore, it is possible to by printed circuit board itself and be encapsulated in the even heat of components and parts thereon and quickly pass, the more effective reliability promoting design meets heat radiation needs.
Obviously, this utility model can be carried out various change and modification without deviating from spirit and scope of the present utility model by those skilled in the art. So, if these amendments of the present utility model and modification belong within the scope of this utility model claim and equivalent technologies thereof, then this utility model is also intended to comprise these change and modification.
Claims (9)
1. a printed circuit board, including line layer and dielectric layer, described dielectric layer is between adjacent two layers line layer, it is characterised in that described dielectric layer includes some layers of adhesive layer, at least one of which the first thermal diffusion layer and at least one of which the second thermal diffusion layer;
Described first thermal diffusion layer and described second thermal diffusion layer lamination are arranged, and described adhesive layer is between described first thermal diffusion layer and described second thermal diffusion layer, for described first thermal diffusion layer and described second thermal diffusion layer being sticked together; And
Described adhesive layer is between described first thermal diffusion layer and described line layer, for described first thermal diffusion layer and described line layer are sticked together, and/or between described second thermal diffusion layer and described line layer, for described second thermal diffusion layer and described line layer are sticked together;
Described first thermal diffusion layer thermal diffusion coefficient in a first direction is more than thermal diffusion coefficient in a second direction; Described second thermal diffusion layer thermal diffusion coefficient in a second direction is more than thermal diffusion coefficient in a first direction;
Described first direction intersects with described second direction.
2. printed circuit board according to claim 1, it is characterised in that described dielectric layer laminated construction from top to bottom includes successively: adhesive layer, the second thermal diffusion layer, adhesive layer, the first thermal diffusion layer and adhesive layer.
3. printed circuit board according to claim 1, it is characterised in that described dielectric layer laminated construction from top to bottom includes successively: adhesive layer, the first thermal diffusion layer, adhesive layer, the second thermal diffusion layer, adhesive layer, the first thermal diffusion layer and adhesive layer; Or,
Adhesive layer, the second thermal diffusion layer, adhesive layer, the first thermal diffusion layer, adhesive layer, the second thermal diffusion layer and adhesive layer.
4. the printed circuit board according to Claims 2 or 3, it is characterised in that described first direction is horizontal direction, described second direction is vertical direction.
5. printed circuit board according to claim 4, it is characterised in that the thickness of described adhesive layer is 12 μm to 100 μm.
6. printed circuit board according to claim 4, it is characterised in that the thickness of described first thermal diffusion layer is 25 μm to 200 μm.
7. printed circuit board according to claim 4, it is characterised in that the thickness of described second thermal diffusion layer is 20 μm to 150 μm.
8. printed circuit board according to claim 4, it is characterised in that also include the via running through described line layer and described dielectric layer, described via is for turning on the line layer of more than two-layer and two-layer, or is used for fixed screw.
9. a display device, it is characterised in that include the printed circuit board described in claim 1-8 any claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620007123.2U CN205320366U (en) | 2016-01-04 | 2016-01-04 | Printed circuit board , display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620007123.2U CN205320366U (en) | 2016-01-04 | 2016-01-04 | Printed circuit board , display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205320366U true CN205320366U (en) | 2016-06-15 |
Family
ID=56201665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620007123.2U Expired - Fee Related CN205320366U (en) | 2016-01-04 | 2016-01-04 | Printed circuit board , display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205320366U (en) |
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2016
- 2016-01-04 CN CN201620007123.2U patent/CN205320366U/en not_active Expired - Fee Related
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160615 |
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| CF01 | Termination of patent right due to non-payment of annual fee |