CN206521420U - Heat radiation protection adhesive tape - Google Patents
Heat radiation protection adhesive tape Download PDFInfo
- Publication number
- CN206521420U CN206521420U CN201720215895.XU CN201720215895U CN206521420U CN 206521420 U CN206521420 U CN 206521420U CN 201720215895 U CN201720215895 U CN 201720215895U CN 206521420 U CN206521420 U CN 206521420U
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- CN
- China
- Prior art keywords
- layer
- heat
- copper cash
- glue
- adhesive tape
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
Layer is used the utility model discloses a kind of heat radiation protection adhesive tape, including non-silicone oil release layer, PET film layer, the adhesive layer of connection non-silicone oil release layer and the PET film layer, heat-conducting layer, the glue of the glue composite bed, transfer mould layer and connection heat-conducting layer and the transfer mould layer that connect PET film layer and heat-conducting layer；The good nano-composite material of thermal conductivity of the heat-conducting layer including the first copper cash being horizontally arranged at interval, the second longitudinally disposed copper cash and parcel first copper cash and the second copper cash；First copper cash and the second copper cash mutually overlap braiding, and the nano-composite material is carbon nano-tube material.Heat radiation protection adhesive tape of the present utility model, the first crisscross copper cash and the second copper cash combination nano-composite material by being set in heat-conducting layer, with good vertical and horizontal direction heat-conductive characteristic and good bending.
Description
Technical field
The utility model is related to a kind of adhesive tape of use for electronic products, more particularly to a kind of heat radiation protection adhesive tape.
Background technology
Electronic product (such as telecommunications industry, Medical Devices, notebook computer, mobile phone, PDP, memory bar, LED are applied at present
Base material etc.) Heat dissipation adhesive tape, mainly have native graphite heat dissipation film and artificial synthesized graphite heat dissipation film, its make when be both needed to by
Chemical impregnation, the process of HTHP, the production cycle is long, low production efficiency；It, which is constituted, only has native graphite or artificial-synthetic stone
One layer of ink, along with one layer of glue-line and PET protective layers, needed for being die-cut to during size, tape edge can leave powdered graphite, right
Electronic component inside the electronic products such as mobile phone, computer is also easy to produce influence, at the same it is fragile in cross cutting and taping process, and
When machine is reprocessed, breakage can not be reused；And needed after using native graphite heat dissipation film or artificial synthesized graphite heat dissipation film cross cutting
Do bound edge and do insulation processing, and then add time and cost.
Utility model content
Based on this, the utility model provides a kind of stretch-proof, the heat radiation protection adhesive tape of dust-proof insulation.
In order to realize the purpose of this utility model, the utility model uses following technical scheme：
A kind of heat radiation protection adhesive tape, including non-silicone oil release layer, PET film layer, the connection non-silicone oil release layer and PET
The adhesive layer of film layer, heat-conducting layer, glue composite bed, transfer mould layer and the connection heat conduction for connecting PET film layer and heat-conducting layer
The glue of layer and transfer mould layer uses layer；The first copper cash that the heat-conducting layer includes being horizontally arranged at interval, longitudinally disposed the
The good nano-composite material of the thermal conductivity of two copper cash and parcel first copper cash and the second copper cash；First copper cash and
Second copper cash mutually overlaps braiding, and the nano-composite material is carbon nano-tube material.
Heat radiation protection adhesive tape of the present utility model, first copper cash and second copper cash crisscross by being set in heat-conducting layer
With reference to nano-composite material, with good vertical and horizontal direction heat-conductive characteristic and good bending, process is being used
Middle vertical and horizontal direction thermal conductivity factor is high, heat point source quickly can be switched into plane heat source, advantageously reduce the temperature of electronic product,
Protection electronic component and the life-span for extending electronic product.
In one of the embodiments, the thickness of the PET film layer and heat-conducting layer is respectively 20~40 μm.
In one of the embodiments, the thickness of the PET film layer and heat-conducting layer is 25 μm.
In one of the embodiments, the adhesive layer, glue composite bed and glue are acrylic glue or silicon using layer
Glue.
In one of the embodiments, the transfer mould layer includes main part and tooth-like part, and the main part correspondence is covered
Cover the glue and use layer, the tooth-like part uses the edge of layer beyond the glue.
Brief description of the drawings
Fig. 1 is the diagrammatic cross-section of the heat radiation protection adhesive tape of first embodiment of the present utility model.
Fig. 2 is the upward view of the heat radiation protection adhesive tape of second embodiment of the present utility model.
Embodiment
For the ease of understanding the utility model, the utility model will be described more fully below.But, this practicality
It is new to realize in many different forms, however it is not limited to embodiment described herein.On the contrary, providing these implementations
The purpose of example is to make the understanding to disclosure of the present utility model more thorough comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is herein to be in term used in the description of the present utility model
The purpose of description specific embodiment, it is not intended that in limitation the utility model.
Referring to Fig. 1, be the heat radiation protection adhesive tape of first embodiment of the present utility model, including non-silicone oil release layer
10th, PET film layer 20, adhesive layer 11, heat-conducting layer 40, the connection PET of connection non-silicone oil release layer 10 and the PET film layer 20
The glue composite bed 30 of film layer 20 and heat-conducting layer 40, transfer mould layer 60 and connection heat-conducting layer 40 and transfer mould layer 60
Glue uses layer 50；The heat-conducting layer 40 include be horizontally arranged at interval the first copper cash 41, the second longitudinally disposed copper cash 42 and
Wrap up the good nano-composite material 43 of the thermal conductivity of the copper cash 42 of the first copper cash 41 and second；First copper cash 41 and
The two mutually overlap joint braidings of copper cash 42, the nano-composite material 43 is carbon nano-tube material.
In manufacturing process, heat-conducting layer 40 is first made；Non- silicone oil release layer 10 apply upper bonding layer 11, temperature 140~
Fitted at 180 DEG C with PET film layer 20；Then glue composite bed 30 is coated with the one side of PET film layer 20 towards heat-conducting layer 40,
In temperature, 100~135 DEG C carry out winding laminating to heat-conducting layer 40；The last one side in heat-conducting layer 40 towards transfer mould layer 60 is applied
If glue uses layer 50, the winding laminating transfer mould layer 60.
In the present embodiment, the thickness of the PET film layer 20 and heat-conducting layer 40 is respectively 20~40 μm；Specifically, institute
The thickness for stating PET film layer 20 and heat-conducting layer 40 is 25 μm.Adhesive layer 11, glue composite bed 30 and glue are Asia using layer 50
Gram force glue or silica gel；In use, tearing transfer mould layer 60 when glue is exposed using layer 50, you can be sticked in target
On electronic product.
Referring to Fig. 2, being the heat radiation protection adhesive tape of second embodiment of the present utility model, with dissipating for first embodiment
Thermal protection adhesive tape is similar, including non-silicone oil release layer 10, PET film layer 20, the connection non-silicone oil release layer 10 and PET film
Adhesive layer 11, heat-conducting layer 40, glue composite bed 30, the transfer mould layer for connecting PET film layer 20 and heat-conducting layer 40 of layer 20
60a and connection heat-conducting layer 40 and transfer mould layer 60a glue use layer 50；The heat-conducting layer 40 is towards glue composite bed 30
Surface be provided with some grooves 41 so that forming some bubbles between heat-conducting layer 40 and glue composite bed 30.Difference
It is, the transfer mould layer 60a of the heat radiation protection adhesive tape of the second embodiment, transfer mould layer 60a includes main part
61a and tooth-like part 62a, the main part 61a correspondences covering glue uses layer 50, and the tooth-like part 62a is then beyond described
Glue uses the edge of layer 50；Therefore, when user needs to tear transfer mould layer 60a, it is easy to find adhesive tape and start, and
It can gently dial and choose tooth-like part 62a and transfer mould layer 60a will be torn and torn.
Heat radiation protection adhesive tape of the present utility model, first copper cash 41 and second crisscross by being set in heat-conducting layer 40
Copper cash 42 combines nano-composite material 43, with good vertical and horizontal direction heat-conductive characteristic and good bending,
Vertical and horizontal direction thermal conductivity factor is high during use, heat point source quickly can be switched into plane heat source, advantageously reduces electronics production
The temperature of product, protects electronic component and extends the life-span of electronic product.
Embodiment described above only expresses several embodiments of the present utility model, and it describes more specific and detailed,
But therefore it can not be interpreted as the limitation to the utility model the scope of the claims.It should be pointed out that for the common of this area
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (5)
1. a kind of heat radiation protection adhesive tape, it is characterised in that including non-silicone oil release layer, PET film layer, connect the non-silicone oil from
Type layer and PET film layer adhesive layer, heat-conducting layer, connection PET film layer and heat-conducting layer glue composite bed, transfer mould layer,
And the glue of connection heat-conducting layer and transfer mould layer uses layer；It is the first copper cash that the heat-conducting layer includes being horizontally arranged at interval, vertical
To the second copper cash of setting and the good nano-composite material of the thermal conductivity of parcel first copper cash and the second copper cash；It is described
First copper cash and the second copper cash mutually overlap braiding, and the nano-composite material is carbon nano-tube material.
2. heat radiation protection adhesive tape according to claim 1, it is characterised in that：The thickness of the PET film layer and heat-conducting layer
Respectively 20~40 μm.
3. heat radiation protection adhesive tape according to claim 2, it is characterised in that：The thickness of the PET film layer and heat-conducting layer
It is 25 μm.
4. heat radiation protection adhesive tape according to claim 2, it is characterised in that：The adhesive layer, glue composite bed and glue
The use of layer is acrylic glue or silica gel.
5. heat radiation protection adhesive tape according to claim 1, it is characterised in that：The transfer mould layer includes main part and tooth
Shape portion, the main part correspondence covering glue uses layer, and the tooth-like part uses the edge of layer beyond the glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720215895.XU CN206521420U (en) | 2017-03-07 | 2017-03-07 | Heat radiation protection adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720215895.XU CN206521420U (en) | 2017-03-07 | 2017-03-07 | Heat radiation protection adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206521420U true CN206521420U (en) | 2017-09-26 |
Family
ID=59903269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720215895.XU Expired - Fee Related CN206521420U (en) | 2017-03-07 | 2017-03-07 | Heat radiation protection adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206521420U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111718667A (en) * | 2020-06-19 | 2020-09-29 | 宝依德精密模切(无锡)有限公司 | Adhesive tape containing heat conducting fins |
-
2017
- 2017-03-07 CN CN201720215895.XU patent/CN206521420U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111718667A (en) * | 2020-06-19 | 2020-09-29 | 宝依德精密模切(无锡)有限公司 | Adhesive tape containing heat conducting fins |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170926 Termination date: 20180307 |