CN206493027U - A kind of integrated circuit cushion press fit device - Google Patents
A kind of integrated circuit cushion press fit device Download PDFInfo
- Publication number
- CN206493027U CN206493027U CN201720126485.8U CN201720126485U CN206493027U CN 206493027 U CN206493027 U CN 206493027U CN 201720126485 U CN201720126485 U CN 201720126485U CN 206493027 U CN206493027 U CN 206493027U
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- CN
- China
- Prior art keywords
- mucigel
- top board
- window frame
- integrated circuit
- press fit
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Abstract
The utility model discloses a kind of integrated circuit cushion press fit device, including base, top board, lower platen, top board clamping part, motor, first mucigel, second mucigel and heater, the middle part of the top board uniformly offers some groups of window frame bodies, the window frame mouthful is in the soldering opening of shape wide at the top and narrow at the bottom, direction of the lower wall of the window frame mouthful from edge to the periphery is provided with compacting protuberance, first mucigel is connected with the bottom surface bonding of the top board, first mucigel opens up consistent with the under shed shape of the window frame body, the lower platen is arranged on the base.Integrated circuit cushion press fit device of the present utility model, applied in the copper framework bonding wire production process in integrated circuit, the apparatus structure is simple, can effectively eliminate the covibration of copper framework in bonding wire operation, bonding wire is uniformly distributed in solder side, improve the yields of product.
Description
Technical field
The utility model is related to IC processing equipment, more particularly to a kind of integrated circuit cushion press fit device.
Background technology
IC chip is widely used in various electronic products, and the copper framework in integrated circuit is the crucial bone of chip
Need to carry out bonding wire operation to copper framework in frame parts, production process.The middle part of copper framework is loads chip big unit, and this is big
The both sides of unit are connected with loading chip junior unit, and the middle part of junior unit is recessed loading surface, and chip wafer is loaded for fixed.
Press fit device is pressed to copper framework, and bonding equipment carries out bonding wire operation to copper framework, during bonding wire, and heat is produced using ultrasonic wave
Amount, makes the solder side softening on the copper cash and copper framework of bonding equipment output, forms molecule and be mutually fitted together to alloy, complete bonding wire work
Industry.
In the prior art, the ultrasonic wave of bonding equipment output has fixed directionality, can produce the copper framework in bonding wire operation
Raw covibration, it is difficult to ensure the flatness on copper framework surface, bonding wire fails to be evenly distributed on solder side, influences the non-defective unit of product
Rate.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of integrated circuit cushion press fit device, applied to integrated electricity
In copper framework bonding wire production process in road, the covibration of copper framework in bonding wire operation can be effectively eliminated, bonding wire is uniformly divided
Solder side is distributed in, the yields of product is improved, the apparatus structure is simple.
In order to solve the above-mentioned technical problem, the technical solution of the utility model is：
A kind of integrated circuit cushion press fit device, including base, top board, lower platen, top board clamping part, motor,
One mucigel, the second mucigel and heater, the middle part of the top board uniformly offer some groups of window frame bodies, the window frame mouthful
In the soldering opening of shape wide at the top and narrow at the bottom, the lower wall of the window frame mouthful is from edge direction to the periphery provided with compacting protuberance, institute
State the first mucigel to be connected with the bottom surface bonding of the top board, first mucigel opens up the under shed with the window frame body
Shape is consistent, and the lower platen is arranged on the base, is heat conduction cavity, the bottom between the base and the lower platen
The sidepiece of seat offers heat conduction interface tube, and the heat conduction interface tube is connected with the heat conduction cavity, and the base is connected with heating
Device, the heater is connected with the heat conducting pipe sealing joint, and second mucigel connects in the surface bonding of the lower platen
Connect, the both sides of the edge of the top board offer pin installing port, and the motor is connected with the top board clamping part by bolt
Connect, the top board clamping part is fixed on the pin installing port by pin.
Preferably, the thickness of first mucigel is more than second mucigel.
Preferably, the material of first mucigel is silica gel, and the material of second mucigel is polyimides high temperature
Adhesive tape.
Preferably, the top board gradually increases adjacent to the thickness of the sheet material in the direction of the pin installing port.
Using above-mentioned technical proposal, compacting protuberance and the first mucigel on top board, which coordinate, is adhesive with the second mucigel
Lower platen bonding operation is carried out to copper framework, it is ensured that the surfacing of copper framework is high, while the mucigel of bonding wire operation first and the
Two mucigel pressing components, two layers of elastic material bed of material clamping intermediate piece, the ultrasonic wave that bonding wire hair goes out is inhaled by the elastic material bed of material
Receive, eliminate the directionality resonance problem of copper framework, bonding wire is uniformly distributed in solder side, improve the yields of product, window frame
Mouth avoids the bonding wire head of inverted cone shape from encountering the inwall of window frame mouthful in shape wide at the top and narrow at the bottom, damages bonding wire head, connect base
Heater the heat of generation is transmitted to the surface of lower platen, the bonding of the second mucigel and lower platen is more firm, motor and
The drive device of top board clamping part composition, the drive device is connected with top board by pin, can be at any time according to producing more
Pressing plate is changed, the top board clamping part at motor linkage two ends drives top board, it is ensured that the plate of pressing pressure integrally descends pressure consistent
Property, workpiece uniform force, whole device critical piece is few, safeguards simple.
Brief description of the drawings
Fig. 1 is a kind of cross-sectional view of integrated circuit cushion press fit device of the present utility model；
Fig. 2 is a kind of top board of integrated circuit cushion press fit device of the present utility model and looking up for peripheral power set
Figure；
Fig. 3 is the top view of integrated circuit cushion press fit device of the present utility model.
In figure, 1- bases；2- top boards；3- lower platens；4- top board clamping parts；5- motors；The mucigels of 6- first；7-
Two mucigels；8- heaters；9- window frame bodies；10- suppresses protuberance；12- heat conduction cavitys；13- heat conduction interface tubes；14- pins are pacified
Fill mouth；15- pins.
Embodiment
Embodiment of the present utility model is described further below in conjunction with the accompanying drawings.Herein it should be noted that
Explanation for these embodiments is used to help understand the utility model, but does not constitute to restriction of the present utility model.This
Outside, as long as technical characteristic involved in each embodiment of the utility model disclosed below does not constitute conflict each other
It can just be mutually combined.
Shown in reference picture 1-3, a kind of integrated circuit cushion press fit device, including base 1, top board 2, lower platen 3, upper pressure
Plate clamping part 4, motor 5, the first mucigel 6, the second mucigel 7 and heater 8, the middle part of top board 1 uniformly offer some
Group window frame body 9, window frame mouthfuls 9 is in shape wide at the top and narrow at the bottom, and the direction of the lower wall of window frame mouthful 9 from edge to the periphery is protruded provided with compacting
Portion 10, the first mucigel 6 is connected with the bottom surface bonding of top board 2, and the first mucigel 6 opens up the under shed shape with window frame body 9
Unanimously, lower platen 3 is arranged on base 1, is heat conduction cavity 12 between base 1 and lower platen 3, the sidepiece of base 1, which is offered, leads
Heat pipe interfaces 13, heat conduction interface tube 13 is connected with heat conduction cavity 12, the connection having heaters 8 of base 1, heater 8 and the heat conduction
Interface tube 13 is tightly connected, and the second mucigel 7 is connected in the surface bonding of lower platen 3, and the both sides of the edge of top board 2 offer pin
Installing port 14 is followed closely, motor 5 is bolted with top board clamping part 4, and top board clamping part 4 is fixed on pin by pin 15
Installing port 14.The mucigel 6 of compacting protuberance 10 and first on top board 2 coordinates 3 pairs of lower platen for being adhesive with the second mucigel 7
Copper framework carries out bonding operation, it is ensured that the surfacing of copper framework is high, while bonding wire operation the first mucigel 6 and the second mucigel 7
Pressing component, two layers of elastic material bed of material clamping intermediate piece, the ultrasonic wave that bonding wire hair goes out is absorbed by the elastic material bed of material, eliminated
The directionality resonance problem of copper framework, makes bonding wire be uniformly distributed in solder side, improves the yields of product, and window frame mouthful 9 presents width
Under narrow shape avoid the bonding wire head of inverted cone shape from encountering the inwall of window frame mouthful 9, damage bonding wire head, the heating of connect base 1
Device is transmitted to the heat of generation on the surface of lower platen 3, and the bonding of the second mucigel 7 and lower platen 3 is more firm, motor 5 and upper
The drive device that pressing plate clamping part 4 is constituted, the drive device is connected with top board 2 by pin 15, can be at any time according to production
Top board 2 is changed, the top board clamping part 4 at the linkage of motor 5 two ends drives top board 2, it is ensured that the plate of pressing pressure is integrally pushed
Power uniformity, workpiece uniform force, whole device critical piece is few, safeguards simple.Top board 2 is adjacent to the pin installing port 14
The thickness of sheet material in direction gradually increase.The sheet metal thickness of top board 2 gradually increases in the intensity for ensureing top board 2, extension
The service life of pressing plate 2.
Specifically, the thickness of the first mucigel 6 on top board 2 is more than second mucigel 7 on the surface of lower platen 3.Set
The second mucigel on thicker the first mucigel cooperation lower platen acts on workpiece and more consolidated, and top board 2 is action drives
Part, long-term heated and stress, the top board 2 somewhat worn and torn coordinates the first mucigel 6 to remain to use, extends top board to a certain degree
Service life.
Wherein, the material of the first mucigel 6 is silica gel, and the material of the second mucigel 7 is polyimides high temperature gummed tape.Polyamides
Imines high temperature gummed tape high temperature resistant, adhesion strength is strong, and cull is not stayed on shielded surface after removing, it is to avoid cull is sticked on lower platen,
Silica gel material elasticity is good, nontoxic, harmless to workpiece pressing result preferably, and operator's health will not be had undesirable effect.
In the course of the work, copper framework enters bonding wire region to the utility model, and the press fit device is pressed to workpiece, made
Copper framework surfacing, bonding equipment carries out bonding wire operation, after workpiece operation is finished, press fit device by window frame body 9 to copper framework
Unclamp after the mucigel sent out on copper framework, upper and lower pressing plate is damaged to change at any time, and upper and lower mucigel coordinates upper and lower pressure
Plate is used, it is to avoid upper and lower pressing plate extends the service life of upper and lower pressing plate to a certain extent to the rigid contact of workpiece.
Embodiment of the present utility model is explained in detail above in association with accompanying drawing, but the utility model is not limited to be retouched
The embodiment stated.For a person skilled in the art, it is right in the case where not departing from the utility model principle and spirit
These embodiments carry out a variety of change, modification, replacement and modification, still fall within protection domain of the present utility model.
Claims (4)
1. a kind of integrated circuit cushion press fit device, including base, top board, lower platen, top board clamping part, motor, first
Mucigel, the second mucigel and heater, it is characterised in that：The middle part of the top board uniformly offers some groups of window frame bodies,
The window frame mouthful is in shape wide at the top and narrow at the bottom, the lower wall of the window frame mouthful from edge direction to the periphery provided with compacting protuberance,
First mucigel is connected with the bottom surface bonding of the top board, and first mucigel is opened up with being opened under the window frame body
The consistent soldering opening of mouth-shaped, the lower platen is arranged on the base, is heat conduction between the base and the lower platen
Cavity, the sidepiece of the base offers heat conduction interface tube, and the heat conduction interface tube is connected with the heat conduction cavity, the base
Having heaters is connected, the heater is connected with the heat conducting pipe sealing joint, and second mucigel is in the lower platen
Surface bonding is connected, and the both sides of the edge of the top board offer pin installing port, the motor and the top board clamping part
It is bolted, the top board clamping part is fixed on the pin installing port by pin.
2. integrated circuit cushion press fit device according to claim 1, it is characterised in that：The thickness of first mucigel
More than the thickness of second mucigel.
3. integrated circuit cushion press fit device according to claim 1, it is characterised in that：The material of first mucigel
For silica gel, the material of second mucigel is polyimides high temperature gummed tape.
4. integrated circuit cushion press fit device according to claim 1, it is characterised in that：The top board is adjacent to the pin
End of the thickness of the sheet material of nail installing port from center to both sides gradually increases.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720126485.8U CN206493027U (en) | 2017-02-10 | 2017-02-10 | A kind of integrated circuit cushion press fit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720126485.8U CN206493027U (en) | 2017-02-10 | 2017-02-10 | A kind of integrated circuit cushion press fit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206493027U true CN206493027U (en) | 2017-09-15 |
Family
ID=59804538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720126485.8U Active CN206493027U (en) | 2017-02-10 | 2017-02-10 | A kind of integrated circuit cushion press fit device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206493027U (en) |
-
2017
- 2017-02-10 CN CN201720126485.8U patent/CN206493027U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180418 Address after: 529100 2 Dong Hou Road, Xinhui District, Jiangmen, Guangdong, 2 Patentee after: Jiangmen Huakai Technology Co., Ltd. Address before: 529100 2 Dong Hou Road, Xinhui District, Jiangmen, Guangdong, 2 Co-patentee before: Li Jinxia Patentee before: Wen Weijie Co-patentee before: Li Weiguo Co-patentee before: Zhang Yamin |