CN210052715U - Laminating device for chip bonding welding - Google Patents
Laminating device for chip bonding welding Download PDFInfo
- Publication number
- CN210052715U CN210052715U CN201920983297.6U CN201920983297U CN210052715U CN 210052715 U CN210052715 U CN 210052715U CN 201920983297 U CN201920983297 U CN 201920983297U CN 210052715 U CN210052715 U CN 210052715U
- Authority
- CN
- China
- Prior art keywords
- pressing
- frame
- heating cushion
- cushion block
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The utility model discloses a compression fittings is used in chip bonding welding, it relates to semiconductor chip bonding technical field. The heating device comprises a pressing plate arranged above a frame and a heating cushion block arranged below the frame; two rows of pressing and fixing windows which are arranged in a matrix manner are formed in the middle section of the pressing plate, the two rows of pressing and fixing windows are continuously arranged at intervals, the number of the pressing and fixing windows in each row is a plurality, and the frame is pressed and fixed on the top of the heating cushion block by the pressing plate; two suction holes are formed between the top surface and the bottom surface of the heating cushion block in a penetrating mode, the two suction holes are symmetrically arranged on two sides of the heating cushion block, and the two suction holes are arranged on two sides of the outer side edge of the press fixing window. The utility model has the advantages that: reduce into two with original four rows of solid windows of pressing, solve empty too many, the not tight condition of pressure, rock fewly, the pressfitting is effectual, and the operation is stable, and board warning reduces, and upward pressure inhales, adsorbs and the pressfitting of frame on the heating cushion, makes heating effect better, guarantees the welding quality.
Description
Technical Field
The utility model relates to a semiconductor chip bonding technical field, concretely relates to compression fittings is used in chip bonding welding.
Background
A semiconductor chip is a semiconductor device which is formed by etching, wiring, or the like on a semiconductor wafer and can realize a certain function. In the manufacturing process of semiconductor chips, after a wafer is cut into small chips, the chips need to be interconnected with pins to achieve the conduction function thereof, and also need to achieve mechanical support, protection and the like, so that the small chips need to be packaged.
The conventional chip packaging methods include a wire bonding method, a tape automated bonding technology, a flip chip technology, and the like. Wherein wire bonding is a process technique for connecting the semiconductor chip pads to the wiring pads on the frame using a metal filament. Before wire bonding, the frame must be pressed flat by a pressing plate above the frame and a heating pad below the frame.
As shown in fig. 1, the pressing plates used in the prior art are all four rows or more of pressing windows, and when the multiple rows of pressing windows are pressed, too many spaces and untight pressing conditions exist, which may cause shaking, resulting in infirm pressing, and excessive machine alarm, resulting in a cold joint phenomenon during the wire bonding process, resulting in yield loss. Accordingly, there is a need for an improved frame compression fitting that overcomes the aforementioned deficiencies of the prior art.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a compression fittings is used in chip bonding welding, empty too many, the pressure is not tight, can produce between the clamp plate that can solve exist among the prior art and the frame and rock, appear rosin joint phenomenon scheduling problem.
In order to solve the technical problem, the utility model adopts the technical scheme that: the heating device comprises a pressing plate arranged above a frame and a heating cushion block arranged below the frame; two rows of pressing and fixing windows which are arranged in a matrix manner are formed in the middle section of the pressing plate, the two rows of pressing and fixing windows are continuously arranged at intervals, the number of the pressing and fixing windows in each row is a plurality, the frame is pressed and fixed on the top of the heating cushion block by the pressing plate, and each pressing and fixing window is correspondingly pressed and fixed on a chip lead welding area; two suction holes are formed between the top surface and the bottom surface of the heating cushion block in a penetrating mode, the two suction holes are symmetrically arranged on two sides of the heating cushion block, and the two suction holes are arranged on two sides of the outer side edge of the press fixing window.
Furthermore, the press-fixing window is contracted from the top surface to the bottom surface, and the area of the bottom of the press-fixing window is smaller than that of the top.
Furthermore, the two ends of the pressing plate are symmetrically provided with connecting end parts, the connecting end parts are provided with positioning holes, and the two side edges of the pressing plate are respectively provided with side edge bulges extending outwards.
After adopting the structure, the utility model has the advantages that:
1. by forming two rows of pressing windows arranged in a matrix on the pressing plate, the original four rows of pressing windows are reduced into two rows of pressing windows, the problems of too much empty and untightening pressing are solved, the empty space is small, the shaking is less, the pressing is ensured, the pressing effect is good, the condition of insufficient soldering is avoided, the welding fastness is ensured, the effective fixing effect is realized on the pins in the lead bonding process, the bonding quality and the yield are improved, the operation is stable, and the alarm of a machine table is reduced;
2. two suction holes are formed between the top surface and the bottom surface of the heating cushion block in a penetrating manner, the frame can be adsorbed on the heating cushion block through the two suction holes by a negative pressure adsorption device at the bottom of the heating cushion block, the adsorption effect of the two suction holes is better than that of one suction hole, the frame can be better adsorbed, and the heating effect is better;
3. through the adsorption equipment of clamp plate and heating cushion bottom, act on the frame jointly, inhale under the top pressure, adsorb and the pressfitting with the frame on heating cushion, make heating effect better, and can guarantee the welding quality.
Drawings
FIG. 1 is a schematic diagram of a platen according to the prior art;
fig. 2 is a side view of the present invention;
fig. 3 is a schematic structural view of the pressing plate of the present invention;
fig. 4 is a schematic structural view of the heating mat of the present invention.
Description of reference numerals: the device comprises a pressing plate 1, a heating cushion block 2, a frame 3, a pressing and fixing window 4, a suction hole 5, a connecting end part 11, a positioning hole 12 and a side edge bulge 13.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and the following detailed description. The following examples are presented to enable those skilled in the art to more fully understand the present invention and are not intended to limit the scope of the present invention.
As shown in fig. 2, fig. 3 and fig. 4, the following technical solutions are adopted in the present embodiment: the heating device comprises a pressing plate 1 arranged above a frame 3 and a heating cushion block 2 arranged below the frame 3, wherein the frame 3 is pressed in the middle by the pressing plate 1 and the heating cushion block 2; two rows of press-fixing windows 4 arranged in a matrix are formed in the middle section of the press plate 1, the two rows of press-fixing windows 4 are continuously arranged at intervals, the four rows are changed into two rows, the joint degree between the press plate 1 and the frame 3 is better, the press can be more compact, no pore is arranged between the two rows, the press is directly and continuously arranged, the number of empty spaces is small, the press-fixing effect is better, the number of the press-fixing windows 4 in each row is a plurality, the frame 3 is pressed and fixed on the top of the heating cushion block 2 by the press plate 1, and each press-fixing window 4 is correspondingly pressed and fixed on a chip lead welding area; wear to establish between the top surface of heating cushion block 2 and the bottom surface and be formed with two and inhale hole 5, two inhale 5 symmetries in the both sides of heating cushion block 2 of setting up, two inhale the both sides on the outside limit of hole 5 position and establish pressing solid window 4, two inhale the setting of hole 5, than set up one in the middle and inhale the effect in hole better, can make the adsorption effect better, tightly adsorb frame 3 on heating cushion block 2.
The press-fixing window 4 is contracted from the top surface to the bottom surface, and the bottom area of the press-fixing window 4 is smaller than the top area; the two ends of the pressing plate 1 are symmetrically provided with connecting end parts 11, the connecting end parts 11 are provided with positioning holes 12, the two side edges of the pressing plate 1 are respectively provided with side protrusions 13 extending outwards, and the positioning holes 12 arranged on the connecting end parts 11 are convenient for connecting the pressing plate 1 and are used for lifting and pressing the pressing plate 1.
The working principle is as follows: set up the consolidated window 4 in the middle of the clamp plate 1 into two and arrange in succession, the laminating degree of clamp plate 1 and frame 3 is better, can press tighter, and does not establish the hole between two, and direct continuous setting, empty few, the pressfitting effect is better, and two settings of inhaling hole 5 can make adsorption effect better, tightly adsorb frame 3 on heating cushion 2, clamp plate 1 with frame 3 consolidated in heating cushion 2's top, through the adsorption equipment of clamp plate 1 and heating cushion 2 bottom, act on frame 3 jointly, the suction is inhaled from top to bottom, adsorb frame 3 and pressfitting on heating cushion 2, every consolidated window 4 corresponds to press solidly on a chip lead wire weld area to the pressfitting is on the pin of chip to play effective fixed action to the pin in the lead bonding in-process, the heating effect is better, and can guarantee the welding quality.
According to the embodiment, two rows of press-fixing windows arranged in a matrix are formed on the pressing plate, the original four rows of press-fixing windows are reduced into two rows of press-fixing windows, the problems of too much empty and not tight pressing are solved, the empty space is less, the shaking is less, the pressing is ensured, the pressing effect is good, the condition of insufficient soldering is avoided, the welding fastness is ensured, the effective fixing effect on the pins in the lead bonding process is realized, the bonding quality and the yield are improved, the operation is stable, and the machine alarm is reduced; two suction holes are formed between the top surface and the bottom surface of the heating cushion block in a penetrating manner, the frame can be adsorbed on the heating cushion block through the two suction holes by a negative pressure adsorption device at the bottom of the heating cushion block, the adsorption effect of the two suction holes is better than that of one suction hole, the frame can be better adsorbed, and the heating effect is better; through the adsorption equipment of clamp plate and heating cushion bottom, act on the frame jointly, inhale under the top pressure, adsorb and the pressfitting with the frame on heating cushion, make heating effect better, and can guarantee the welding quality.
The basic principles and main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (3)
1. The utility model provides a chip bonding compression fittings for welding which characterized in that: comprises a pressing plate arranged above a frame and a heating cushion block arranged below the frame; two rows of pressing and fixing windows which are arranged in a matrix manner are formed in the middle section of the pressing plate, the two rows of pressing and fixing windows are continuously arranged at intervals, the number of the pressing and fixing windows in each row is a plurality, the frame is pressed and fixed on the top of the heating cushion block by the pressing plate, and each pressing and fixing window is correspondingly pressed and fixed on a chip lead welding area; two suction holes are formed between the top surface and the bottom surface of the heating cushion block in a penetrating mode, the two suction holes are symmetrically arranged on two sides of the heating cushion block, and the two suction holes are arranged on two sides of the outer side edge of the press fixing window.
2. The die bonding apparatus according to claim 1, wherein: the press-fixing window is contracted from the top surface to the bottom surface, and the area of the bottom of the press-fixing window is smaller than that of the top.
3. The die bonding apparatus according to claim 1, wherein: the two ends of the pressing plate are symmetrically provided with connecting end parts, positioning holes are formed in the connecting end parts, and side protrusions extending outwards are respectively arranged on the two side edges of the pressing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920983297.6U CN210052715U (en) | 2019-06-27 | 2019-06-27 | Laminating device for chip bonding welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920983297.6U CN210052715U (en) | 2019-06-27 | 2019-06-27 | Laminating device for chip bonding welding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210052715U true CN210052715U (en) | 2020-02-11 |
Family
ID=69396523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920983297.6U Active CN210052715U (en) | 2019-06-27 | 2019-06-27 | Laminating device for chip bonding welding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210052715U (en) |
-
2019
- 2019-06-27 CN CN201920983297.6U patent/CN210052715U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2023024450A1 (en) | Internal connection copper sheet of power module and manufacturing method therefor, and power semiconductor module | |
| CN210052715U (en) | Laminating device for chip bonding welding | |
| CN202977380U (en) | Line type pressure welding clamp used for QFN, DFN integrated circuit packaging | |
| CN106783793A (en) | A kind of leads of semiconductor device framework of use TO types encapsulation | |
| CN207765419U (en) | Semiconductor leads are bonded frock clamp and its heating block structure | |
| CN213945409U (en) | Plate pressing device | |
| CN217719509U (en) | Pressing plate of semiconductor product packaging bonding machine | |
| CN206558497U (en) | A kind of leads of semiconductor device framework of use TO types encapsulation | |
| CN206148401U (en) | Bonding wire device and single -row pressure form clamp plate thereof | |
| CN216097243U (en) | Lead bonding clamp | |
| CN215658667U (en) | Tool for pressing and holding welding strip | |
| CN213305887U (en) | Tin brushing structure | |
| CN207149554U (en) | Lead frame and semiconductor devices | |
| CN104600047B (en) | Power module and packaging method thereof | |
| CN108389854B (en) | Ultrathin miniature bridge rectifier | |
| CN219520998U (en) | Bonding wire tool top board | |
| CN112108827A (en) | Plate pressing device | |
| CN207217480U (en) | A kind of more row high-density lead frame bonding tools | |
| CN111885849A (en) | QFP packaging chip welding method | |
| CN220031448U (en) | Dispensing and pressing jig for scraping processing | |
| CN219286344U (en) | Pressing device for QFN chip | |
| CN105470189B (en) | A kind of twin islet frame bonding heat block and fixture | |
| CN211479981U (en) | Heating block of integrated circuit packaging wire bonding machine | |
| CN114453814B (en) | Shell parallel seam welding clamp with antistatic function and fixing method | |
| CN107481990A (en) | Lead frame, semiconductor devices and its packaging technology |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |