CN213945409U - Plate pressing device - Google Patents

Plate pressing device Download PDF

Info

Publication number
CN213945409U
CN213945409U CN202022112363.8U CN202022112363U CN213945409U CN 213945409 U CN213945409 U CN 213945409U CN 202022112363 U CN202022112363 U CN 202022112363U CN 213945409 U CN213945409 U CN 213945409U
Authority
CN
China
Prior art keywords
pressing
claw
pressing plate
platen
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202022112363.8U
Other languages
Chinese (zh)
Inventor
廖伟强
袁伟刚
范庆庆
李鑫
梁政
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gree Electric Appliances Inc of Zhuhai
Zhuhai Gree Xinyuan Electronics Co Ltd
Original Assignee
Gree Electric Appliances Inc of Zhuhai
Zhuhai Gree Xinyuan Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gree Electric Appliances Inc of Zhuhai, Zhuhai Gree Xinyuan Electronics Co Ltd filed Critical Gree Electric Appliances Inc of Zhuhai
Priority to CN202022112363.8U priority Critical patent/CN213945409U/en
Application granted granted Critical
Publication of CN213945409U publication Critical patent/CN213945409U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

The utility model provides a plate pressing device relates to welding equipment technical field, has solved plate pressing device and can not steadily push down the frame, causes solder joint rosin joint, bonding wire on-stick, the high technical problem of product disability rate. The pressing plate device comprises a pressing plate frame capable of pressing a product to be welded, wherein an operation window capable of exposing a welding area of the product to be welded is arranged on the pressing plate frame, and the pressing plate device also comprises a first auxiliary pressing plate assembly which is arranged on the pressing plate frame and capable of pressing the welding area in the operation window. The utility model discloses guaranteed pressing tightly between pressure claw and the frame among the presser device laminating stably for bonding wire in-process frame can not take place to rock, squint, has effectively reduced the solder joint and has not beaten the defective rate of line, solder joint rosin joint, has improved the quality of product, improved material utilization rate, saving cost.

Description

Plate pressing device
Technical Field
The utility model belongs to the technical field of the welding equipment technique and specifically relates to a presser device is related to.
Background
With the rapid development of the semiconductor packaging industry, the wire bonding process is one of the most important production processes of semiconductor packaging. In the bonding wire production process, need be in the same place gold thread/copper line and frame, chip welding, traditional welding mode all carries out the bonding wire with the help of clamp plate and supplementary fixed back of heating block in the semiconductor trade: and placing the frame on the heating block, pressing and fixing the frame by using a pressing plate, and then welding wires. The auxiliary bonding wire pressing plate device has the advantages that due to the fact that the design is unreasonable and the machining precision does not meet requirements, the pressing plate and the frame are usually in an unstable state, the quality problems that welding spots are welded in a faulty mode and welding spots and bonding wires are not sticky are caused to products, the product rejection rate is high, and material cost is high in waste.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a plate pressing device to the plate pressing device who exists can not stably push down the frame among the solution prior art, causes solder joint rosin joint, the bonding wire on-stick, the high technical problem of product disability rate.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the utility model provides a pair of plate pressing device, including can will treating the clamp plate frame that the product pushed down, be provided with the operation window that can will treat the weld zone exposure of welding the product on the clamp plate frame, still including setting up can be located on the clamp plate frame treat the first supplementary clamp plate subassembly that the weld zone pushed down in the operation window.
As a further improvement, the pressing plate device is also arranged on the pressing plate frame and can carry out spacing second auxiliary pressing plate assembly on the welding area.
As a further improvement of the present invention, the first auxiliary pressing plate assembly includes a first pressing claw and a second pressing claw, one end of the base of the first pressing claw and the base of the second pressing claw are detachably fixed on the pressing plate frame, and the other end is suspended in the operation window; the claw portions of the first pressing claw and the second pressing claw extend into the operation window along the respective base portions and abut on the base island of the welding zone.
As a further improvement of the present invention, the length of the claw portion of the first pressing claw is the same as or different from the length of the claw portion of the second pressing claw.
As a further improvement of the present invention, the shape or specification of the claw portion of the first pressing claw is the same as or different from the shape or specification of the claw portion of the second pressing claw.
As a further improvement of the present invention, the length of the claw portion of the first pressing claw is greater than the length of the claw portion of the second pressing claw.
As a further improvement of the present invention, the jaw specification of the first pressing jaw is smaller than the jaw specification of the second pressing jaw.
As a further improvement of the utility model, the first pressing claw and the second pressing claw are arranged relatively and are respectively positioned on two sides of the operation window.
As a further improvement, the second auxiliary pressing plate assembly comprises a fixing groove communicated with the operation window, a rubber strip for adhering to a product to be welded and a convex strip for setting the fixing groove, wherein the pressing plate frame is provided with a convex strip for welding the product to be welded.
As a further improvement of the utility model, the number of the fixing grooves is multiple, and the fixing grooves are arranged side by side in sequence; the number of the second pressing claws is multiple, and the second pressing claws are respectively arranged between two adjacent fixing grooves.
As a further improvement, the pressing plate frame is made of a tool steel material, and the surface of the pressing plate frame is subjected to blackening treatment.
Compared with the prior art, the utility model following beneficial effect has:
the utility model provides a pressing plate device, including the clamp plate frame, inboard fretwork is the operation window in the middle of the clamp plate frame simultaneously, on the operation window, the opposite side sets up 3 short pressure claws and 6 long pressure claws respectively down, a frame pastes the chip base island position periphery for pushing down cascaded structure, pressing plate device has still set up 3 fixed slots and a length 45mm that are used for assembling the high temperature adhesive tape in clamp plate frame bottom very much simultaneously, high 0.5 mm's sand grip, adhesive tape and sand grip are used for pushing down cascaded structure's frame upper and lower pin integral part, thereby make and reach the steady effect of pressfitting between whole pressing plate device and the cascaded structure frame, it is stable to have guaranteed to compress tightly between pressing plate device middle pressure claw and the frame, make bonding wire in-process frame can not take place to rock, the skew, effectively reduced the solder joint and can not make the line, the defective rate of solder joint rosin joint, the quality of product is improved, Improve the material utilization rate and save the cost.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic perspective view of the plate pressing device of the present invention;
fig. 2 is a top view of the plate pressing device of the present invention after the first pressing claw and the second pressing claw are removed;
fig. 3 is a bottom view of the plate pressing device of the present invention with the first pressing claw and the second pressing claw removed;
fig. 4 is a schematic perspective view of a first pressing claw in the plate pressing device of the present invention;
fig. 5 is a schematic perspective view of a second pressing claw in the plate pressing device of the present invention.
In the figure 1, a pressing frame; 11. an operating window; 2. a first pressing claw; 3. a second pressing claw; 4. fixing grooves; 5. and (4) raised strips.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1, the utility model provides a pressure plate device, including can will treat the pressure plate frame 1 that the product pushed down, be provided with on the pressure plate frame 1 and can treat the operation window 11 that the weld zone of welding the product exposes, still including setting up on the pressure plate frame 1 can will be located the first supplementary clamp plate subassembly that the welding zone pushed down of treating of operation window 11. The first auxiliary pressing plate assembly can limit the products to be welded in the vertical direction and the horizontal direction.
Specifically, the operation window 11 is a rectangular structure, the product to be welded is a frame, a plurality of base islands are arranged on the frame, chips are arranged on the base islands, and the chips on the base islands need to be subjected to wire bonding operation; the area to be welded is the area where the base island needing welding wires is located.
Further, the pressing plate device further comprises a second auxiliary pressing plate assembly which is arranged on the pressing plate frame 1 and can limit the area to be welded.
As an optional implementation manner of the present invention, the first auxiliary pressing plate assembly includes a first pressing claw 2 and a second pressing claw 3 for pressing and fixing the frame island, and ensuring that the chip on the frame island is kept stable in the wire bonding process, one end of the base of the first pressing claw 2 and the base of the second pressing claw 3 are detachably fixed on the pressing plate frame 1, and the other end is suspended in the operation window 11; the claw portions of the first pressing claw 2 and the second pressing claw 3 extend into the operation window 11 along the respective base portions and abut on the base island of the land.
It should be noted that, since the chip is soldered on the base island, the ends of the first pressing claw 2 and the second pressing claw 3 are disposed on the peripheral edge of the base island so as to avoid the chip. And the positions of the first pressing claw 2 and the second pressing claw 3 and the claw position are set according to the position of the base island on the frame.
In an optional embodiment of the present invention, there are 9 base islands on the frame to which the lead wires need to be welded, so that the total number of the first pressing claw 2 and the second pressing claw 3 needs to be set to 9. Each pressing claw presses one base island.
As shown in fig. 4 and 5, since each base island is different in height, the length of the claw portion of the first pressing claw 2 is the same as or different from the length of the claw portion of the second pressing claw 3. In particular, in an alternative embodiment of the present invention, the length of the jaw portion of the first pressing jaw 2 is greater than the length of the jaw portion of the second pressing jaw 3.
Since the sizes of the islands are different from each other and the areas to be pressed by the pressing claws are different from each other, the shape or size of the claw portion of the first pressing claw 2 is the same as or different from the shape or size of the claw portion of the second pressing claw 3. Specifically, in an alternative embodiment of the present invention, the jaw size of the first pressing jaw 2 is smaller than that of the second pressing jaw 3.
Further, the claw portions of the first pressing claw 2 and the second pressing claw 3 are rectangular.
As shown in fig. 1, the first pressing claw 2 and the second pressing claw 3 are disposed opposite to each other and are located on both sides of the operating window 11.
As shown in fig. 2 and fig. 3, the second auxiliary pressing plate assembly includes a fixing groove 4 communicated with the operation window 11, a rubber strip arranged in the fixing groove 4 for adhering the product to be welded and ensuring that the whole pressing plate device and the frame are pressed stably and not prone to shift, and a protruding strip 5 arranged on the pressing plate frame 1, on the contact side of the product to be welded and opposite to the fixing groove 4 and used for pressing and fixing the tube leg part of the frame.
Specifically, the number of the fixing grooves 4 is multiple, the fixing grooves are sequentially arranged side by side, and further, the number of the fixing grooves 4 is 3; the number of the second pressing claws 3 is plural, specifically 3, and the second pressing claws are respectively arranged between two adjacent fixing grooves 4. The quantity of first pressure claw 2 is 6, sets up side by side in proper order, falls into three pairs of settings, and the structure of each pair of first pressure claw 2 is the mirror image structure setting.
The pressing plate frame 1, the first auxiliary pressing plate assembly and the second auxiliary pressing plate assembly are made of tool steel materials, and the surfaces of the pressing plate frame 1, the first auxiliary pressing plate assembly and the second auxiliary pressing plate assembly are subjected to blackening treatment. Specifically, the tool steel material is SUS420 grade tool steel, and the material has the following characteristics: high hardness, high toughness, thermal conductivity 100 ℃ (W/m.k): 22.2; coefficient of thermal expansion 25 ℃ (ppm/° c): 10.2; density (g/cm 3): 7.75; hardness HRB: 97, a stabilizer; tensile strength (RM/MPa): 635; the surface blackening treatment adopts HRC45-55 heat treatment for blackening, and the surface is not easy to fade under the high temperature condition for a long time.
The convex strips 5 are long strips, and have the specification of being 45mm long and 0.5mm high. Adhesive tape and sand grip 5 are used for pushing down the upper and lower pin integral part of the frame of cascaded structure to make and reach the steady effect of pressfitting between whole presser device and the cascaded structure frame, guaranteed that the clamp plate device is pressed down between pressure claw and the frame and is laminated stably, make the bonding wire in-process frame can not take place to rock, squint, effectively reduced the solder joint and made the defective rate of line, solder joint rosin joint not, improved the quality of product, improve material utilization ratio, practice thrift the cost.
Specifically, the contact surface of the pressing plate frame 1 and a product to be welded is a reference surface; the height of the convex strip 5 is 0.5 +/-0.002 mm, and the height H1 of the claw part of the first pressing claw 2 protruding out of the reference plane is 2.02 +/-0.005 mm; the height H2 of the claw part of the second pressing claw 3 protruding from the reference surface is 0.5 +/-0.005 mm; since there are six first pressing claws 2, the maximum height difference (highest-lowest) between six H1 is less than 0.005 mm; since there are three second pressing claws 3, the maximum height difference (highest-lowest) between the three H2 is less than 0.005 mm; the height difference between the fixing groove 4 and the claw part of the second pressing claw 3 after the rubber strip is assembled is less than 0.01 mm.
In order to perform fine adjustment, a hole formed in the first pressing claw 2 for a bolt to pass through is a waist-shaped hole, so that the left and right positions of the first pressing claw 2 can be conveniently adjusted.
It should be noted that "inward" is a direction toward the center of the accommodating space, and "outward" is a direction away from the center of the accommodating space.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship indicated based on the orientation or positional relationship shown in fig. 1, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (7)

1. A pressing plate device is characterized by comprising a pressing plate frame capable of pressing a product to be welded, wherein the pressing plate frame is provided with an operation window capable of exposing a welding area of the product to be welded, and the pressing plate device also comprises a first auxiliary pressing plate assembly which is arranged on the pressing plate frame and capable of pressing the area to be welded in the operation window; the second auxiliary pressing plate assembly is arranged on the pressing plate frame and can limit the area to be welded; the first auxiliary pressing plate assembly comprises a first pressing claw and a second pressing claw which are oppositely arranged and respectively positioned on two sides of the operation window, one end of the base part of each of the first pressing claw and the second pressing claw is detachably fixed on the pressing plate frame, and the other end of each of the base parts of the first pressing claw and the second pressing claw is suspended in the operation window; the claw parts of the first pressing claw and the second pressing claw extend into the operation window along the base parts of the first pressing claw and the second pressing claw and abut against the base island of the welding area; the second auxiliary pressing plate assembly comprises a fixing groove communicated with the operation window, an adhesive tape arranged in the fixing groove and used for adhering a product to be welded, and a convex strip arranged on the contact side of the pressing plate frame and the product to be welded and opposite to the fixing groove.
2. The platen device of claim 1, wherein the jaw portion length of the first platen jaw is the same as or different from the jaw portion length of the second platen jaw.
3. The platen device according to claim 1, wherein a shape or a specification of the claw portion of the first pressing claw is the same as or different from a shape or a specification of the claw portion of the second pressing claw.
4. The platen device of claim 3, wherein a jaw portion length of the first platen jaw is greater than a jaw portion length of the second platen jaw.
5. The platen device of claim 4, wherein the jaw portion gauge of the first platen jaw is smaller than the jaw portion gauge of the second platen jaw.
6. The platen device of claim 1, wherein the number of the fixing grooves is plural, and the fixing grooves are arranged side by side in sequence; the number of the second pressing claws is multiple, and the second pressing claws are respectively arranged between two adjacent fixing grooves.
7. The platen apparatus of claim 1, wherein the platen frame, the first auxiliary platen assembly and the second auxiliary platen assembly are made of a tool steel material and have a blackened surface.
CN202022112363.8U 2020-09-23 2020-09-23 Plate pressing device Active CN213945409U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022112363.8U CN213945409U (en) 2020-09-23 2020-09-23 Plate pressing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022112363.8U CN213945409U (en) 2020-09-23 2020-09-23 Plate pressing device

Publications (1)

Publication Number Publication Date
CN213945409U true CN213945409U (en) 2021-08-13

Family

ID=77202012

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022112363.8U Active CN213945409U (en) 2020-09-23 2020-09-23 Plate pressing device

Country Status (1)

Country Link
CN (1) CN213945409U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113793831A (en) * 2021-08-21 2021-12-14 汕头华汕电子器件有限公司 Chip frame fixing support of semiconductor chip wire bonding equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113793831A (en) * 2021-08-21 2021-12-14 汕头华汕电子器件有限公司 Chip frame fixing support of semiconductor chip wire bonding equipment

Similar Documents

Publication Publication Date Title
CN213945409U (en) Plate pressing device
WO2023024450A1 (en) Internal connection copper sheet of power module and manufacturing method therefor, and power semiconductor module
KR101321190B1 (en) Folded frame carrier for mosfet bga
CN112108827A (en) Plate pressing device
KR100721280B1 (en) A method of forming semiconductor chip assembly and an apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip
CN110883505A (en) Multipoint aluminum-nickel simultaneous welding method
CN216097243U (en) Lead bonding clamp
CN207149554U (en) Lead frame and semiconductor devices
CN111863687A (en) Semiconductor TO encapsulation double-material-sheet rail device
CN112222586A (en) Parallel seam welds frock clamp for technology
CN210475786U (en) Welding tool bit structure for welding flexible circuit board and welding machine
CN111092364A (en) Micro-channel packaging structure of high-power bar laser and sintering method thereof
CN218694733U (en) Brazing tool for plate heat exchanger
CN210052715U (en) Laminating device for chip bonding welding
CN107481990A (en) Lead frame, semiconductor devices and its packaging technology
CN211531645U (en) Novel heat dissipation device
CN219169260U (en) Jig for correcting warp substrate
CN214956772U (en) Large chip product bonding and pressing fixture
CN212322975U (en) Semiconductor TO encapsulation double-material-sheet rail device
CN219632984U (en) Pressing plate and pressure welding clamp
CN209729878U (en) A kind of jig for high temperature die Bonder
CN211218127U (en) Flat pressing device of heat pipe of radiator
CN215815862U (en) Power module internal connection copper sheet and power semiconductor module
CN111482692B (en) Welding pressing strip and welding system for welding battery string bus bar
CN117206782A (en) Welding tool and welding method for microwave high-frequency microstrip board

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant