CN211531645U

CN211531645U - Novel heat dissipation device

Info

Publication number: CN211531645U
Application number: CN202020495940.3U
Authority: CN
Inventors: 王强; 成京明
Original assignee: Shenzhen Zhuo Shengtai Electronics Co ltd
Current assignee: Shenzhen Zhuo Shengtai Electronics Co ltd
Priority date: 2020-04-08
Filing date: 2020-04-08
Publication date: 2020-09-18
Anticipated expiration: 2030-04-08

Abstract

The utility model provides a pair of novel heat dissipation device, including fin group, bottom plate and a plurality of heat pipe, be equipped with on the fin group with the through-hole that heat pipe quantity equals, one side of fin group and every the through-hole is equipped with a positioning groove relatively, a plurality of the one end of heat pipe with the bottom plate is connected, every the other end of heat pipe passes one respectively the through-hole, through the positioning groove location the heat pipe is made by external force the through-hole with be located the structure that heat pipe in the through-hole warp. The utility model has the advantages of simple structure, no tin processing green, no need of chemical surface treatment of the fin group and greatly reduced manufacturing cost.

Description

Novel heat dissipation device

Technical Field

The utility model belongs to the technical field of the heat dissipation, especially, relate to a novel heat dissipation device.

Background

At present, most of heat pipe radiators adopt a tin welding process, and FIN (FIN group) surface treatment needs chemical nickel for welding; the other part adopts a process of penetrating a tin-free heat pipe into FIN, and the heat pipe is in interference fit with the FIN; has the defects of tin welding process: the part which is welded with the heat pipe in a matching way needs surface chemical nickel treatment and needs solder paste as a medium; the amount of tin affects indirect thermal resistance; solder paste is not coated between the radiator heat pipe and the FIN, the solder paste is incomplete and empty soldering occurs; the performance of the radiator is deteriorated, and defective products are increased; the defect of the FIN process of the tin-free heat pipe: the overall structure of the radiator has limitations; the machine is difficult to adjust by passing through the FIN, and the processing time is too long; the poor rejection rate is high.

SUMMERY OF THE UTILITY MODEL

In order to overcome the problems, the utility model provides a simple structure, tin-free processing procedure green, need not fin group and do chemical surface treatment and reduce substantially the novel heat abstractor of cost of manufacture.

In order to achieve the purpose, the utility model adopts the following technical proposal:

the utility model provides a novel heat dissipation device, includes fin group, bottom plate and a plurality of heat pipes, be equipped with on the fin group with the through-hole that heat pipe quantity equals, one side of fin group and every the through-hole is equipped with a positioning groove relatively, a plurality of the one end of heat pipe with the bottom plate is connected, every the other end of heat pipe passes one respectively the through-hole, through the positioning groove location the heat pipe is made by external force the through-hole with be located heat pipe in the through-hole warp.

To the improvement of the utility model, the fin group includes layer board and a plurality of fins, a plurality of the fin is separated by predetermined distance parallel arrangement and is in on the layer board, the layer board covers positioning groove.

To the utility model discloses an improve, be equipped with a plurality of arc recesses on the bottom plate, the one end of heat pipe is established in the arc recess with the bottom plate is connected, the transverse section of arc recess is the arc, the arc is greater than the semicircle.

Compared with the prior art, the beneficial effects of the utility model are that:

Drawings

FIG. 1 is a schematic view of an exploded structure of the present invention;

FIG. 2 is an exploded view of the present invention in another direction;

FIG. 3 is a schematic view of the present invention after a direction combination;

FIG. 4 is a schematic view of the combined structure in another direction of the present invention;

the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

In the description of the present invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or assembly referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may for example be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. The specific meaning of the above terms in the present invention can be understood in specific cases for those skilled in the art.

Referring to fig. 1 to 4, what is disclosed in fig. 1 to 4 is a novel heat dissipation device, which includes a fin group 1, a bottom plate 2 and a plurality of heat pipes 3, through holes 11 equal in number to the heat pipes 3 are provided on the fin group 1, a positioning groove 12 is provided on one side of the fin group 1 opposite to each through hole 11, one end 31 of each of the plurality of heat pipes 3 is connected to the bottom plate 2, the other end 32 of each of the plurality of heat pipes 3 passes through one of the through holes 11, the heat pipe 3 is positioned by the positioning groove 12, and the heat pipe 3 positioned by the positioning groove 12 deforms the through hole 11 and the heat pipe 3 positioned in the through hole 11 by an external force. After the heat pipe 3 penetrates through the through hole 11, the positioning groove 12 is extruded through a stamping jig, so that the heat pipe 3 positioned in the through hole 11 is deformed, and the heat pipe 3 positioned at the opening of the through hole 11 is expanded due to the deformation of the heat pipe 3 positioned in the through hole 11, so that the heat pipe 3 and the fin group 1 are tightly combined. The utility model has the advantages of simple structure, no tin processing green, no need of chemical surface treatment of the fin group 1 and greatly reduced manufacturing cost.

It should be noted that the heat pipes 3 are used for heat conduction, and the number of the heat pipes 3 is determined according to the required heat generation amount, i.e. power of the product.

Preferably, the fin group 1 includes a supporting plate 13 and a plurality of fins 14, the plurality of fins 14 are arranged on the supporting plate 13 in parallel at a predetermined distance, and the supporting plate 13 covers the positioning groove 12.

Preferably, be equipped with a plurality of arc recesses 21 on the bottom plate 2, the one end 31 of heat pipe 3 is established in the arc recess 21 with bottom plate 2 is connected, the transverse section of arc recess 21 is the arc, the arc is greater than the semicircle. When one end 31 of the heat pipe 3 is inserted into the arc-shaped groove 21, the heat pipe 3 outside the gap of the arc-shaped groove 21 is pressed down by using external force, so that the heat pipe 3 in the arc-shaped groove 21 is deformed, and the one end 31 of the heat pipe 3 is tightly connected with the bottom plate 2.

It should be understood that equivalent alterations and modifications can be made by those skilled in the art according to the technical solution of the present invention and the inventive concept thereof, and all such alterations and modifications should fall within the scope of the appended claims.

Claims

1. The utility model provides a novel heat abstractor which characterized in that: including fin group (1), bottom plate (2) and a plurality of heat pipe (3), be equipped with on fin group (1) with through-hole (11) that heat pipe (3) quantity equals, one side of fin group (1) and every through-hole (11) are equipped with a positioning groove (12) relatively, a plurality of one end (31) of heat pipe (3) with bottom plate (2) are connected, every other end (32) of heat pipe (3) pass one respectively through-hole (11), through positioning groove (12) location heat pipe (3) are made by external force through-hole (11) with be located heat pipe (3) in through-hole (11) warp.

2. The novel heat dissipation device of claim 1, wherein: the fin group (1) comprises a supporting plate (13) and a plurality of fins (14), the fins (14) are arranged on the supporting plate (13) in parallel at preset intervals, and the supporting plate (13) covers the positioning groove (12).

3. The novel heat dissipation device of claim 1, wherein: be equipped with a plurality of arc recess (21) on bottom plate (2), establish one end (31) of heat pipe (3) in arc recess (21) with bottom plate (2) are connected, the transverse section of arc recess (21) is the arc, the arc is greater than the semicircle.