CN206490893U - A kind of copper foil of circuit board surface protection structure - Google Patents
A kind of copper foil of circuit board surface protection structure Download PDFInfo
- Publication number
- CN206490893U CN206490893U CN201720194123.2U CN201720194123U CN206490893U CN 206490893 U CN206490893 U CN 206490893U CN 201720194123 U CN201720194123 U CN 201720194123U CN 206490893 U CN206490893 U CN 206490893U
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- copper foil
- layer
- circuit board
- protective layer
- protection structure
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Abstract
The utility model relate to a kind of copper foil of circuit board surface protection structure.A kind of copper foil of circuit board surface protection structure, it includes copper foil layer；The lower section of the copper foil layer sets matcoveredn；Multiple positioning holes are correspondingly arranged on the copper foil layer and protective layer；The four of the copper foil layer in the four of protective layer between be provided with adhesive layer, be provided with adhesive layer between the edge of the positioning hole of copper foil layer and the edge of the positioning hole of protective layer, make to form closing space between copper foil layer and protective layer.A kind of copper foil of circuit board surface protection structure of the present utility model; there is provided protective layer; sealing space will be arranged between copper foil layer and protective layer; effectively completely cut off the surface of foreign matter and foreign substance pollution copper foil, meanwhile, protection materials play cushioning effect; surface during circuit board pressing is avoided to produce pit; so as to meeting the product requirement strict to surface smoothness requirement, and simultaneously, it is to avoid because surface smoothness is bad and causes the outer artificial repair cost or product rejection of volume.
Description
Technical field
The utility model is related to a kind of copper foil of circuit board field, more particularly to a kind of copper foil of circuit board surface protection knot
Structure.
Background technology
The pressing of current wiring board is mainly directly to be pressed using copper foil, and the product appearance of the method production can be present
Small rut, is only applicable the loose product of flatness requirement.In the case of product is strict with flat appearance degree.For example：There is golden hand
When referring to design, it is necessary to after the completion of product, to there is the flatness of the golden finger of conductive contact strictly to be screened, with this
Meanwhile, the extra manual repair's cost of formation or product rejection.And directly can not keep copper using copper foil production wiring board at present
Clean in face；And without cushion protection.
Utility model content
In order to solve the above technical problems, the utility model provides a kind of copper foil of circuit board surface protection structure, it can completely cut off
The surface of foreign matter and foreign substance pollution copper foil, meanwhile, protection materials play cushioning effect, it is to avoid is produced from surface during circuit board pressing
Raw pit, so as to meet the strict product requirement of appearance requirement.
The utility model solves the technical scheme that its technical problem used：A kind of copper foil of circuit board surface protection knot
Structure, it includes copper foil layer；The lower section of the copper foil layer sets matcoveredn；It is correspondingly arranged on the copper foil layer and protective layer many
Individual positioning hole；The four of the copper foil layer in the four of protective layer between be provided with adhesive layer, the edge of the positioning hole of copper foil layer
Adhesive layer is provided between the edge of the positioning hole of protective layer, makes to form closing space between copper foil layer and protective layer.
The thickness of the copper foil layer is 6-105 microns.
The protective layer is aluminium lamination, aluminium alloy layer or composite layer.
The thermal coefficient of expansion of the protective layer is more than or equal to copper foil layer.
The beneficial effects of the utility model：A kind of copper foil of circuit board surface protection structure of the present utility model, there is provided protecting
Sheath, by position bore edges position be also bonded to together, sealing space will be arranged between copper foil layer and protective layer, effectively every
The surface of exhausted foreign matter and foreign substance pollution copper foil, meanwhile, protection materials play cushioning effect, it is to avoid surface during circuit board pressing
Pit is produced, so that the strict product requirement of appearance requirement is met, and simultaneously, it is to avoid the stranger that volume is caused because of bad order
Work repair cost or product rejection.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of copper foil of circuit board surface protection structure of embodiment；
Fig. 2 is the schematic diagram of Fig. 1 A-A sections.
Embodiment
In order to deepen to understand of the present utility model, the utility model is done further below in conjunction with drawings and examples
It is described in detail, the embodiment is only used for explaining the utility model, protection domain of the present utility model is not constituted and limited.
Embodiment
As depicted in figs. 1 and 2, a kind of copper foil of circuit board surface protection structure is present embodiments provided, it includes copper foil layer；
The lower section of the copper foil layer 1 sets matcoveredn 2；Multiple positioning holes 3 are correspondingly arranged on the copper foil layer 1 and protective layer 2；Institute
Adhesive layer 4, the edge of the positioning hole 3 of copper foil layer 1 and protection are provided between the four of copper foil layer 1 are stated in the four of protective layer 2
Adhesive layer 4 is provided between the edge of the positioning hole 3 of layer 2, makes to form closing space between copper foil layer 1 and protective layer 2；The copper
The thickness of layers of foil 1 is 6-105 microns；The protective layer 2 is aluminium lamination, aluminium alloy layer or composite layer；The heat of the protective layer 2
The coefficient of expansion is more than or equal to copper foil layer 1.
A kind of positioning hole of the copper foil of circuit board surface protection structure of the present embodiment can according to process equipment difference, make
Different geometries, including but not limited to square, the geometry such as circle, and do different holes according to physical device requirement
Position and the quantity in hole.
A kind of copper foil of circuit board surface protection structure of the present embodiment, in production, first by copper foil layer with being opened on protective layer
If good positioning hole, then, adhesive is covered each by the edge of four sides of copper foil layer and protective layer and wherein positioning hole, then by copper
Layers of foil is bonded together after being alignd with protective layer, also can first copper foil layer and protective layer four while with wherein wait beat positioning hole while
Edge is covered each by adhesive, then is bonded together after copper foil layer is alignd with protective layer, finally, enters in the position of positioning hole to be beaten
Row punching.
A kind of thermal coefficient of expansion of the protective layer of copper foil of circuit board surface protection structure of the present embodiment is more than or equal to copper
Layers of foil, to prevent that copper foil can not expand during heating, cause fold.
A kind of copper foil of circuit board surface protection structure of the present embodiment, there is provided protective layer, by the position at the edge of positioning hole
Put and be also bonded to together, sealing space will be arranged between copper foil layer and protective layer, effectively isolation foreign matter and foreign substance pollution
The surface of copper foil, meanwhile, protection materials play cushioning effect, it is to avoid surface produces pit during circuit board pressing, so as to meet outer
Sight requires strict product requirement, and simultaneously, it is to avoid outer artificial repair cost or the product report of volume is caused because of bad order
It is useless.
Above-described embodiment should not in any way limit the utility model, all by the way of equivalent substitution or equivalency transform
The technical scheme of acquisition is all fallen within protection domain of the present utility model.
Claims (4)
1. a kind of copper foil of circuit board surface protection structure, it is characterised in that：It includes copper foil layer；The lower section of the copper foil layer is set
Matcoveredn；Multiple positioning holes are correspondingly arranged on the copper foil layer and protective layer；Four sides of the copper foil layer and protective layer
Adhesive layer is provided between four sides, bonding is provided between the edge of the positioning hole of copper foil layer and the edge of the positioning hole of protective layer
Layer, makes to form closing space between copper foil layer and protective layer.
2. a kind of copper foil of circuit board surface protection structure according to claim 1, it is characterised in that：The thickness of the copper foil layer
Spend for 6-105 microns.
3. a kind of copper foil of circuit board surface protection structure according to claim 1, it is characterised in that：The protective layer is aluminium
Layer, aluminium alloy layer or similar planarizing material layer.
4. a kind of copper foil of circuit board surface protection structure according to claim 3, it is characterised in that：The heat of the protective layer
The coefficient of expansion is more than or equal to copper foil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720194123.2U CN206490893U (en) | 2017-03-01 | 2017-03-01 | A kind of copper foil of circuit board surface protection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720194123.2U CN206490893U (en) | 2017-03-01 | 2017-03-01 | A kind of copper foil of circuit board surface protection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206490893U true CN206490893U (en) | 2017-09-12 |
Family
ID=59762813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720194123.2U Active CN206490893U (en) | 2017-03-01 | 2017-03-01 | A kind of copper foil of circuit board surface protection structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206490893U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106658952A (en) * | 2017-03-01 | 2017-05-10 | 苏州思诺林电子有限公司 | Copper foil surface protection structure of circuit board |
-
2017
- 2017-03-01 CN CN201720194123.2U patent/CN206490893U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106658952A (en) * | 2017-03-01 | 2017-05-10 | 苏州思诺林电子有限公司 | Copper foil surface protection structure of circuit board |
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