CN206481498U - A kind of circuit board package equipment - Google Patents

A kind of circuit board package equipment Download PDF

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Publication number
CN206481498U
CN206481498U CN201621423634.9U CN201621423634U CN206481498U CN 206481498 U CN206481498 U CN 206481498U CN 201621423634 U CN201621423634 U CN 201621423634U CN 206481498 U CN206481498 U CN 206481498U
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CN
China
Prior art keywords
circuit board
encapsulating mould
lifting rod
rod
electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201621423634.9U
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Chinese (zh)
Inventor
陈少铭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen City Three Golds Precise Circuit Technology Co., Ltd.
Original Assignee
Guangdong Gao Qi Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Gao Qi Technology Co Ltd filed Critical Guangdong Gao Qi Technology Co Ltd
Priority to CN201621423634.9U priority Critical patent/CN206481498U/en
Application granted granted Critical
Publication of CN206481498U publication Critical patent/CN206481498U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Vacuum Packaging (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The utility model discloses a kind of circuit board package equipment, including mobile encapsulating mould, circuit board display unit and fixed encapsulating mould, the fixed encapsulating mould two ends are connected to the first electric lifting rod and the second electric lifting rod, the first miniature lifting motor and the second miniature lifting motor are installed inside first electric lifting rod and the second electric lifting rod, first electric lifting rod and the second electric lifting rod other end are connected to head rod and the second connecting rod, the head rod and the second connecting rod other end link together with mobile encapsulating mould, the fixed encapsulating mould top is provided with electric heater unit, the electric heater unit is internally provided with groove, the mobile encapsulating mould bottom is provided with vacuum extractor and pneumatic fitting, the circuit board display unit upper surface is placed with circuit board, the circuit board surface is covered with encapsulating film, the equipment packages mode is simple, substantially increase packaging efficiency and quality.

Description

A kind of circuit board package equipment
Technical field
The utility model is related to sealed in unit technical field, specially a kind of circuit board package equipment.
Background technology
Circuit board makes circuit miniaturization, directly perceivedization, batch production and optimization electrical appliance layout lifting for permanent circuit Act on.Circuit board can be described as printed substrate or printed circuit board (PCB), encapsulation, just refer to the circuit pin on silicon chip, with leading Line, which connects, to be guided at external lug, in order to which other devices are connected.Packing forms refer to install semiconductor integrated circuit chip Shell.It not only plays a part of in terms of installation, fixed, sealing, protection chip and enhancing electric heating property, but also passes through core Contact on piece is wired on the pin of package casing, and these pins are further through the wire on printed circuit board (PCB) and other Device is connected, so as to realize the connection of inside chip and external circuit, existing circuit board using the technique of low-pressure injection molding come The effect of waterproof sealing, flame-resistant insulation is reached, due to continuing to develop for scientific and technological level, it is desirable to which the circuit board specification of encapsulation is got over Industry is bigger, it is necessary to which the thickness of the product of encapsulation is more and more broad.When circuit board size is increased, the area of injecting glue can also be increased, note Glue amount also accordingly increases.The product after injecting glue can so be caused, and cool time lengthens in a mold, can not only influence production efficiency, Also substantial amounts of defective products and defect ware can be formed because forming injecting glue " collapsing " influence presentation quality when injecting glue product cooling is shunk, Greatly reduce the quality and efficiency of circuit board package.
Utility model content
For problem above, the utility model provides a kind of circuit board package equipment, and packaged type is simple, greatly improves Packaging efficiency and quality, the problem of effectively can solving in background technology.
To achieve the above object, the utility model provides following technical scheme:A kind of circuit board package equipment, including movement Encapsulating mould, circuit board display unit and fixed encapsulating mould, the fixed encapsulating mould two ends are connected to the first electronic liter Drop and the first miniature lifting is installed inside bar and the second electric lifting rod, first electric lifting rod and the second electric lifting rod Motor and the second miniature lifting motor, first electric lifting rod and the second electric lifting rod other end are connected to first Connecting rod and the second connecting rod, the head rod and the second connecting rod other end are and mobile encapsulating mould is connected to one Rise, the fixed encapsulating mould top is provided with electric heater unit, and the electric heater unit is internally provided with groove, the movement Encapsulating mould bottom is provided with vacuum extractor and pneumatic fitting, and the circuit board display unit upper surface is placed with circuit Plate, the circuit board surface is covered with encapsulating film.
It is preferred that, the fixed encapsulating mould bottom is connected with support frame, and the support frame as described above other end is provided with movable pulley, The quantity of the movable pulley is four.
It is preferred that, the first miniature lifting motor and the second miniature lifting motor are powered using external power supply.
It is preferred that, the electric heater unit uses mains-supplied, and electric heater unit outer surface uses glass-reinforced plastic material.
It is preferred that, first electric lifting rod and the second electric lifting rod use stainless steel material, the electrical heating The groove set in device uses Collapsible structure.
Compared with prior art, the beneficial effects of the utility model are:The circuit board package equipment, by setting the first electricity Dynamic elevating lever and the second electric lifting rod, the automatic lifting for realizing mobile encapsulating mould, are being packaged using vacuum extractor When take air away, while pneumatic fitting and elevating lever complete pressurization jointly, realize being brought into close contact for encapsulating film and circuit board, Heater is used to heat, so as to realize more preferable packaging effect, and whole device conveniently moving, can be with after being packaged Transfer.
Brief description of the drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is the utility model encapsulating structure schematic diagram.
In figure:1- moves encapsulating mould;The connecting rods of 2- second;3- pneumatic fittings;The electric lifting rods of 4- first;5- Two electric lifting rods;The miniature lifting motors of 6- first;The miniature lifting motors of 7- second;8- vacuum extractors;9- circuit board placings Platform;10- circuit boards;11- electric heater units;12- fixes encapsulating mould;13- support frames;14- movable pulleys;15- head rods; 16- grooves;17- encapsulating films.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belongs to the scope of the utility model protection.
Embodiment:
Fig. 1 and Fig. 2 are referred to, the utility model provides a kind of technical scheme:A kind of circuit board package equipment, including movement Encapsulating mould 1, circuit board display unit 9 and fixed encapsulating mould 12, the fixed two ends of encapsulating mould 12 are connected to first Is provided with inside the electric lifting rod 5 of electric lifting rod 4 and second, the electric lifting rod 5 of the first electric lifting rod 4 and second The one miniature lifting motor 7 of miniature lifting motor 6 and second, the other end of 4 and second electric lifting rod of the first electric lifting rod 5 The connecting rod 2 of head rod 15 and second is connected to, the other end of 15 and second connecting rod of head rod 2 is equal and moves Dynamic encapsulating mould 1 links together, and the fixed top of encapsulating mould 12 is provided with electric heater unit 11, the electric heater unit 11 are internally provided with groove 16, and the mobile bottom of encapsulating mould 1 is provided with vacuum extractor 8 and pneumatic fitting 3, and institute State the upper surface of circuit board display unit 9 and be placed with circuit board 10, the surface of circuit board 10 is covered with encapsulating film 17.
The bottom of fixed encapsulating mould 12 is connected with support frame 13, and the other end of support frame as described above 13 is provided with movable pulley 14, the quantity of the movable pulley 14 is four, and the miniature lifting motor 7 of the first miniature lifting motor 6 and second is using external Power supply is powered, and the electric heater unit 11 uses mains-supplied, and the outer surface of electric heater unit 11 uses glass-reinforced plastic material, described First electric lifting rod 4 and the second electric lifting rod 5 use the groove set in stainless steel material, the electric heater unit 11 16 use Collapsible structure.
Operation principle of the present utility model:Circuit board 10 is placed on the surface of circuit board display unit 9, and in the table of circuit board 10 Face covers one layer of encapsulating film 17, and then circuit board display unit 9 is placed into inside groove 16, while start electric heater unit 11, Begin to warm up.
Then the first miniature lifting motor 7 of miniature lifting motor 6 and second, the first electric lifting rod 4 and the second electricity are started Dynamic elevating lever 5 is begun to decline, and when mobile encapsulating mould 1 is close to fixed encapsulating mould 12, is started vacuum extractor 8, is extracted out Internal air, keeps vacuum environment, then starts pneumatic fitting 3, in the presence of electric heater unit 11, encapsulating film 17 It is close to circuit board 10, passes through pneumatic fitting 18 so that encapsulating film 17 is encapsulated on the circuit board 10, completes after encapsulating, the One electric lifting rod 4 and the second electric lifting rod 5 rise, and close electric heater unit 11, vacuum extractor 8, pneumatic fitting 3, packaged circuit board 10 is taken out, while the movement of the equipment can be realized using movable pulley 14 so that operation is more Plus flexibly.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model Any modifications, equivalent substitutions and improvements made within the spirit and principle of utility model etc., should be included in the utility model Protection domain within.

Claims (5)

1. a kind of circuit board package equipment, including mobile encapsulating mould(1), circuit board display unit(9)With fixed encapsulating mould (12), it is characterised in that:The fixed encapsulating mould(12)Two ends are connected to the first electric lifting rod(4)It is electronic with second Elevating lever(5), first electric lifting rod(4)With the second electric lifting rod(5)Inside is provided with the first miniature lifting motor (6)With the second miniature lifting motor(7), first electric lifting rod(4)With the second electric lifting rod(5)The other end connects respectively It is connected to head rod(15)With the second connecting rod(2), the head rod(15)With the second connecting rod(2)The other end and Mobile encapsulating mould(1)Link together, the fixed encapsulating mould(12)Top is provided with electric heater unit(11), the electricity Heater(11)It is internally provided with groove(16), the mobile encapsulating mould(1)Bottom is provided with vacuum extractor(8)It is gentle Dynamic pressue device(3), and the circuit board display unit(9)Upper surface is placed with circuit board(10), the circuit board(10)Surface Covered with encapsulating film(17).
2. a kind of circuit board package equipment according to claim 1, it is characterised in that:The fixed encapsulating mould(12)Bottom End is connected with support frame(13), support frame as described above(13)The other end is provided with movable pulley(14), the movable pulley(14)Quantity For four.
3. a kind of circuit board package equipment according to claim 1, it is characterised in that:The first miniature lifting motor (6)With the second miniature lifting motor(7)Powered using external power supply.
4. a kind of circuit board package equipment according to claim 1, it is characterised in that:The electric heater unit(11)Using Mains-supplied, and electric heater unit(11)Outer surface uses glass-reinforced plastic material.
5. a kind of circuit board package equipment according to claim 1, it is characterised in that:First electric lifting rod(4) With the second electric lifting rod(5)Use stainless steel material, the electric heater unit(11)The groove of interior setting(16)Using can Stretching structure.
CN201621423634.9U 2016-12-23 2016-12-23 A kind of circuit board package equipment Active CN206481498U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621423634.9U CN206481498U (en) 2016-12-23 2016-12-23 A kind of circuit board package equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621423634.9U CN206481498U (en) 2016-12-23 2016-12-23 A kind of circuit board package equipment

Publications (1)

Publication Number Publication Date
CN206481498U true CN206481498U (en) 2017-09-08

Family

ID=59749482

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621423634.9U Active CN206481498U (en) 2016-12-23 2016-12-23 A kind of circuit board package equipment

Country Status (1)

Country Link
CN (1) CN206481498U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109062340A (en) * 2018-06-19 2018-12-21 上海宴阳智能科技有限公司 A kind of mainboard sealed in unit of the computer hardware development with dedusting function

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109062340A (en) * 2018-06-19 2018-12-21 上海宴阳智能科技有限公司 A kind of mainboard sealed in unit of the computer hardware development with dedusting function

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CB03 Change of inventor or designer information

Inventor after: Zhang Daobing

Inventor before: Chen Shaoming

CB03 Change of inventor or designer information
TR01 Transfer of patent right

Effective date of registration: 20171012

Address after: 518000 Hongxing Industrial Zone, Songgang Town, Baoan District, Guangdong, Shenzhen

Patentee after: Shenzhen City Three Golds Precise Circuit Technology Co., Ltd.

Address before: 516000 Guangdong city of Huizhou province Huizhou City Zhongkai high tech Zone weatherite east two Road No. 16 Building No. 606 building C

Patentee before: Guangdong Gao Qi Technology Co., Ltd.

TR01 Transfer of patent right