CN220774285U - Plastic package device for semiconductor chip - Google Patents
Plastic package device for semiconductor chip Download PDFInfo
- Publication number
- CN220774285U CN220774285U CN202321976382.2U CN202321976382U CN220774285U CN 220774285 U CN220774285 U CN 220774285U CN 202321976382 U CN202321976382 U CN 202321976382U CN 220774285 U CN220774285 U CN 220774285U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 238000007789 sealing Methods 0.000 claims abstract description 37
- 238000010438 heat treatment Methods 0.000 claims abstract description 30
- 238000004806 packaging method and process Methods 0.000 claims description 46
- 238000000465 moulding Methods 0.000 claims description 6
- 238000012423 maintenance Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 7
- 230000005611 electricity Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
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Abstract
The utility model discloses a semiconductor chip plastic package device, which relates to the technical field of chip production plastic package device design and comprises a fixed flat plate, a plastic package power unit, a chip fixed unit and a heating component fixed flat plate, wherein the fixed flat plate comprises a die body and a heating component: the upper side surface is provided with plastic envelope power pack, the bottom surface is provided with heating element in the fixed casing in the plastic envelope power pack, fixed dull and stereotyped downside surface four corners respectively fixed connection supporting leg chip fixed unit include support dead lever, joint board, lower plastic envelope mould, seal groove, go up plastic envelope mould, feeding pipeline and sealing strip, the rectangular hole has been seted up to the fixed casing upside surface in the plastic envelope power pack, the rectangular hole extends to in the fixed casing, be provided with lower plastic envelope mould in the rectangular hole, it is more convenient to dismantle the plastic envelope mould when carrying out the plastic envelope to the chip, does not influence the chip plastic envelope, and is more convenient to plastic envelope device maintenance after the plastic envelope, does not influence the plastic envelope use.
Description
Technical Field
The utility model relates to the technical field of chip production plastic packaging device design, in particular to a semiconductor chip plastic packaging device.
Background
The shell for mounting semiconductor integrated circuit chip plays roles of placing, fixing, sealing, protecting chip and enhancing electrothermal performance, and is also a bridge for communicating the world inside the chip with external circuits, namely, the joints on the chip are connected to pins of the packaging shell by leads, and the pins are connected with other devices by leads on the printed board. Therefore, packaging plays an important role in both CPU and other LSI integrated circuits, and for convenience in protecting semiconductor chips, a semiconductor chip molding device is required for use in producing semiconductor chips to produce semiconductor chips.
The existing semiconductor chip plastic packaging device is inconvenient to detach and replace a plastic packaging die when the chip is subjected to plastic packaging, and influences the plastic packaging of the chip.
Disclosure of Invention
The utility model aims to overcome the existing defects, and provides the semiconductor chip plastic packaging device which is convenient to detach and replace a plastic packaging die when the chip is subjected to plastic packaging, does not influence the plastic packaging of the chip, is more convenient to overhaul after plastic packaging, does not influence the plastic packaging use, and can effectively solve the problems in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a semiconductor chip plastic package device comprises a fixed flat plate, a plastic package power unit, a chip fixing unit and a heating component;
fixing a flat plate: the upper side surface is provided with a plastic package power unit, the inner bottom surface of a fixed shell in the plastic package power unit is provided with a heating component, and four corners of the lower side surface of the fixed flat plate are respectively and fixedly connected with supporting legs;
chip fixing unit: the plastic package device comprises a supporting fixing rod, a clamping plate, a lower plastic package die, a sealing groove, an upper plastic package die, a feeding pipeline and a sealing strip, wherein a rectangular hole is formed in the upper side surface of a fixing shell in a plastic package power unit, the rectangular hole extends into the fixing shell, the lower plastic package die is arranged in the rectangular hole, a chip is arranged in the lower plastic package die, the sealing groove is formed in the position of the edge of the upper side surface of the lower plastic package die, the lower side surface of a movable flat plate in the plastic package power unit is located at the position of the corresponding lower plastic package die, the sealing strip is fixedly connected with the corresponding sealing groove, the position of the edge of the feeding circular hole in the upper plastic package die is fixedly connected with the feeding pipeline, the other end of the feeding pipeline penetrates through the movable flat plate and extends to the upper side of the corresponding movable flat plate, the inner bottom surface of the fixing shell is fixedly connected with four rectangular array supporting fixing rods, the upper side surfaces of the four supporting fixing rods are fixedly connected with the clamping plate respectively, and the clamping plates are fixedly connected with the corresponding lower plastic package die respectively, and the lower side surface of the corresponding lower plastic package die is fixedly connected with a corresponding plug post.
The fixed flat plate is used for fixing device, the plastic packaging power unit is used for providing power for plastic packaging, and is convenient to carry out plastic packaging, and the heating element is used for carrying out plastic packaging, and is convenient to carry out heating shaping, and is convenient to carry out plastic packaging, and the supporting leg is used for supporting the device, and the supporting fixed rod is used for fixing the joint board, and the joint board is used for fixing down plastic packaging mould, and is convenient to dismantle, and it carries out plastic packaging to conveniently change different moulds, sealing strip and seal groove joint, let lower plastic packaging mould and last plastic packaging mould joint, and it is convenient to carry out filling plastic packaging material, and the feeding pipeline is used for carrying out the feeding, and is convenient to carry out plastic packaging, lower plastic packaging mould and last plastic packaging mould joint, and it is convenient to carry out filling plastic packaging material, and plastic packaging.
Further, the chip fixing unit further comprises limiting cylinders and limiting round holes, the limiting round holes are respectively formed in the positions, located at four corners of the edge of the lower plastic package die, of the upper side surface of the fixing shell in the plastic package power unit, the lower side surface of the movable flat plate in the plastic package power unit is located at the positions corresponding to the four limiting round holes and is fixedly connected with the limiting cylinders respectively, and the four limiting cylinders are spliced with the corresponding limiting round holes respectively.
The limiting cylinder and the limiting round hole are clamped, so that the die can move more stably, the die is limited, and plastic packaging is convenient.
Further, plastic envelope power unit includes the fixed shell, supports soon, dead lever, stable traveller, removes the slider, removes dull and stereotyped and fixed roof, fixed dull and stereotyped upside surface fixed connection fixed shell, the left and right sides surface of fixed shell is two equidistant supports soon of fixed connection respectively, four support soon upside surface fixed connection dead lever respectively, the spout has been seted up respectively to the corresponding one side surface around four dead levers, sliding connection removes the slider respectively in every spout, the stable traveller of fixed connection respectively in four spouts, sliding hole on four removal sliders is on corresponding stable traveller sliding connection, one side surface fixed connection that corresponds about four removal sliders removes dull and stereotyped, one fixed roof of four dead lever upside surface fixed connection.
The fixed shell is used for fixed support soon, supports soon and is used for fixed dead lever, and the dead lever is used for supporting fixed roof, and fixed roof is used for fixed L push rod dead lever, and stable slide column is used for letting the slider that removes slide more stable, removes the slider and slides, drives the removal flat board and removes, conveniently lets the mould joint, carries out plastic envelope semiconductor chip.
Further, plastic envelope power unit still contains L push rod dead lever and electric putter, the terminal surface fixed connection of the vertical direction of fixed roof upside surface and two L push rod dead levers, one side fixed surface connection electric putter that two L push rod dead levers horizontal direction are corresponding, electric putter's lower extreme runs through fixed roof and with corresponding movable plate's upside surface fixed connection, electric putter's input is connected with external power source's output electricity through outside control switch group.
The L push rod fixing rod is used for fixing the electric push rod, and the electric push rod is started to drive the movable flat plate to move so as to facilitate the matching of the dies and perform plastic packaging.
Further, the heating element includes rectangle dead lever, fixed joint board and hot plate, the fixed connection rectangle dead lever of position fixed connection that bottom surface is located between four support dead levers in the fixed shell, fixed joint board is connected to rectangle dead lever upside surface fixed, fixed joint board upside surface is located the position that plastic envelope mould corresponds down and is provided with the hot plate, the input of hot plate passes through outside control switch group and is connected with external power source's output electricity.
The rectangle dead lever is used for fixed joint board, and fixed joint board is used for fixed hot plate, and the hot plate adopts high Wen Zhulv hot plate, heats, conveniently carries out plastic envelope, conveniently uses.
Further, still include access door board and pulling handrail, the manhole has been seted up to the position that the fixed casing front side surface is located the hot plate and corresponds, the manhole extends to in the fixed casing, one of them side sliding connection access door board in the manhole, access door board's front side surface passes through movable pin axle and pulls handrail swing joint.
The access door plate is used for protecting the device to facilitate maintenance, and the pulling handrail is used for driving the access door plate to slide to facilitate maintenance so as to protect the device.
Compared with the prior art, the utility model has the beneficial effects that:
1. the semiconductor chip plastic packaging device has the following advantages: the die fixing device is provided with a die fixing unit, the fixing unit is used for fixing the clamping plate through the supporting fixing rod, the clamping plate is used for fixing the lower plastic package die to facilitate disassembly, different dies are replaced to facilitate plastic package, the sealing strip and the sealing groove are clamped to enable the lower plastic package die to be clamped with the upper plastic package die to facilitate filling plastic package materials, the feeding pipeline is used for feeding to facilitate plastic package, the lower plastic package die and the upper plastic package die are clamped to facilitate filling plastic package materials, the limiting cylinder and the limiting round hole are clamped to enable the dies to move more stably to limit the dies to facilitate plastic package;
2. the semiconductor chip plastic packaging device has the following advantages: the plastic package power unit is arranged, the plastic package power unit is used for fixing and supporting a fast, the fast is used for fixing a fixing rod, the fixing rod is used for supporting a fixing top plate, the fixing top plate is used for fixing an L push rod fixing rod, the stable sliding column is used for enabling the movable sliding block to slide more stably, the movable sliding block slides to drive the movable flat plate to move so as to facilitate the clamping of the die, the L push rod fixing rod is used for fixing an electric push rod, the electric push rod is started to drive the movable flat plate to move so as to facilitate the matching of the die, and power is provided for plastic package;
3. the semiconductor chip plastic packaging device has the following advantages: when the chip is subjected to plastic packaging, the plastic packaging mold is convenient to detach and replace, the plastic packaging of the chip is not affected, after plastic packaging, the plastic packaging device is more convenient to overhaul, and the plastic packaging use is not affected.
Drawings
FIG. 1 is a schematic diagram of the front structure of the present utility model;
FIG. 2 is a schematic view of the rear cross-sectional structure of the present utility model;
FIG. 3 is a schematic side sectional view of the present utility model.
In the figure: the device comprises a fixed flat plate 1, a supporting leg 2, a plastic package power unit 3, a fixed shell 31, a fast supporting block 32, a fixed rod 33, a stable sliding column 34, a movable sliding block 35, a movable flat plate 36, a fixed top plate 37, a fixed rod 38L push rod, an electric push rod 39, a chip fixing unit 4, a supporting fixed rod 41, a clamping plate 42, a lower plastic package die 43, a sealing groove 44, an upper plastic package die 45, a feeding pipeline 46, a sealing strip 47, a limiting cylinder 48, a limiting round hole 49, a heating component 5, a rectangular fixed rod 51, a fixed connecting plate 52, a heating plate 53, an access door plate 6 and a pulling handrail 7.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, the present embodiment provides a technical solution: a semiconductor chip plastic package device comprises a fixed flat plate 1, a plastic package power unit 3, a chip fixing unit 4 and a heating component 5;
fixation plate 1: the upper side surface is provided with a plastic package power unit 3, the inner bottom surface of a fixed shell 31 in the plastic package power unit 3 is provided with a heating component 5, and four corners of the lower side surface of a fixed flat plate 1 are respectively and fixedly connected with supporting legs 2;
chip fixing unit 4: the plastic package power unit 3 comprises a support fixing rod 41, a clamping plate 42, a lower plastic package die 43, a sealing groove 44, an upper plastic package die 45, a feeding pipeline 46 and a sealing strip 47, wherein rectangular holes are formed in the upper side surface of a fixing shell 31 in the plastic package power unit 3, the rectangular holes extend into the fixing shell 31, the lower plastic package die 43 is arranged in the rectangular holes, a chip is arranged in the lower plastic package die 43, the sealing groove 44 is formed in the position of the edge of the upper side surface of the lower plastic package die 43, the lower side surface of a movable flat plate 36 in the plastic package power unit 3 is positioned at the position of the corresponding lower plastic package die 43, the upper plastic package die 45 is fixedly connected with the sealing strip 47, the sealing strip 47 is fixedly connected with the corresponding sealing groove 44, the position of the edge of the feeding round hole in the upper plastic package die 45 is fixedly connected with a certain position of the feeding pipeline 46, the other end of the feeding pipeline 46 penetrates through the movable flat plate 36 and extends to the upper side of the corresponding movable flat plate 36, the inner bottom end surface of the fixing shell 31 is fixedly connected with four rectangular array support fixing rods 41, the upper side surfaces of the four support fixing rods 41 are respectively fixedly connected with the clamping plates 42, and the four clamping plates 42 are respectively fixedly connected with the upper side surfaces of the corresponding lower plastic package dies 43 through the corresponding lower pin 43.
The fixed flat plate 1 is used for fixing device, the plastic package power unit 3 is used for providing power for plastic package, so as to facilitate plastic package, the heating component 5 is used for carrying out plastic package, so as to facilitate heating and shaping, plastic package is carried out, the supporting leg 2 is used for supporting the device, the supporting fixing rod 41 is used for fixing the clamping plate 42, the clamping plate 42 is used for fixing the lower plastic package die 43, so as to facilitate disassembly, so as to facilitate replacement of different dies for plastic package, the sealing strip 47 and the sealing groove 44 are clamped, so as to facilitate clamping of the lower plastic package die 43 and the upper plastic package die 45, so as to facilitate filling of plastic package materials, the feeding pipeline 46 is used for feeding, so as to facilitate plastic package, and the lower plastic package die 43 and the upper plastic package die 45 are clamped, so as to facilitate filling of plastic package materials, so as to facilitate plastic package.
The chip fixing unit 4 further comprises a limiting cylinder 48 and limiting round holes 49, the limiting round holes 49 are respectively formed in the positions, located at four corners of the edge of the lower plastic package die 43, of the upper side surface of the fixing shell 31 in the plastic package power unit 3, the lower side surface of the movable flat plate 36 in the plastic package power unit 3 is located at the positions corresponding to the four limiting round holes 49, the limiting cylinders 48 are respectively fixedly connected, and the four limiting cylinders 48 are respectively spliced with the corresponding limiting round holes 49.
The limiting cylinder 48 and the limiting round hole 49 are clamped, so that the die can move more stably, the die is limited, and plastic packaging is convenient.
The plastic package power unit 3 comprises a fixed shell 31, a support block 32, a fixed rod 33, a stable sliding column 34, a movable sliding block 35, a movable flat plate 36 and a fixed top plate 37, wherein the upper side surface of the fixed flat plate 1 is fixedly connected with the fixed shell 31, the left side surface and the right side surface of the fixed shell 31 are respectively and fixedly connected with two equidistant support blocks 32, the upper side surfaces of the four support blocks 32 are respectively and fixedly connected with the fixed rod 33, sliding grooves are respectively formed in the front side surface and the rear side surface of the four fixed rods 33, the movable sliding block 35 is respectively and slidingly connected in each sliding groove, the stable sliding column 34 is respectively and fixedly connected in the four sliding grooves, the sliding holes on the four movable sliding blocks 35 are in sliding connection with the corresponding stable sliding column 34, the left side surface and the right side surface of the four movable sliding blocks 35 are fixedly connected with the movable flat plate 36, and the upper side surface of the four fixed rods 33 is fixedly connected with the fixed top plate 37.
The fixed shell 31 is used for fixing and supporting the fast 32, supports fast 32 and is used for fixing the dead lever 33, and the dead lever 33 is used for supporting the fixed roof 37, and the fixed roof 37 is used for fixing L push rod dead lever 38, and stable slide column 34 is used for letting the removal slider 35 slide more stably, and the removal slider 35 slides, drives and removes dull and stereotyped 36 and removes, conveniently lets the mould joint, carries out plastic packaging semiconductor chip.
The plastic package power unit 3 further comprises an L push rod fixing rod 38 and an electric push rod 39, the upper side surface of the fixing top plate 37 is fixedly connected with the end faces of the two L push rod fixing rods 38 in the vertical direction, one electric push rod 39 is fixedly connected with one side surface of the two L push rod fixing rods 38 corresponding to the horizontal direction, the lower end of the electric push rod 39 penetrates through the fixing top plate 37 and is fixedly connected with the upper side surface of the corresponding movable flat plate 36, and the input end of the electric push rod 39 is electrically connected with the output end of an external power supply through an external control switch group.
The L-shaped push rod fixing rod 38 is used for fixing an electric push rod 39, and the electric push rod 39 is started to drive the movable flat plate 36 to move, so that the dies can be matched conveniently to perform plastic packaging.
The heating component 5 comprises a rectangular fixing rod 51, a fixing clamping plate 52 and a heating plate 53, wherein the inner bottom surface of the fixing shell 31 is fixedly connected with the rectangular fixing rod 51 at a position between the four supporting fixing rods 41, the upper surface of the rectangular fixing rod 51 is fixedly connected with the fixing clamping plate 52, the heating plate 53 is arranged at a position corresponding to the lower plastic package die 43 on the upper surface of the fixing clamping plate 52, and the input end of the heating plate 53 is electrically connected with the output end of an external power supply through an external control switch group.
The rectangular fixing rod 51 is used for fixing the fixing clamping plate 52, the fixing clamping plate 52 is used for fixing the heating plate 53, and the heating plate 53 is a high Wen Zhulv heating plate to heat so as to facilitate plastic packaging and use.
Still include access door panel 6 and pulling handrail 7, the manhole has been seted up to the position that fixed shell 31 front side surface is located the hot plate 53 and corresponds, and the manhole extends to in the fixed shell 31, and one of them side sliding connection access door panel 6 in the manhole, the front side surface of access door panel 6 passes through movable pin axle and pulls handrail 7 swing joint.
The access door panel 6 is used for protecting the device to facilitate maintenance, and the pulling handrail 7 is used for driving the access door panel 6 to slide to facilitate maintenance so as to protect the device.
The working principle of the semiconductor chip plastic package device provided by the utility model is as follows: firstly, a semiconductor chip is placed in a lower plastic package die 43, a fixing shell 31 is used for fixing a supporting block 32, the supporting block 32 is used for fixing a fixing rod 33, the fixing rod 33 is used for supporting a fixing top plate 37, the fixing top plate 37 is used for fixing an L push rod fixing rod 38, a stable sliding column 34 is used for enabling a movable sliding block 35 to slide more stably, the movable sliding block 35 slides to drive a movable flat plate 36 to move so as to facilitate the clamping of the die, the L push rod fixing rod 38 is used for fixing an electric push rod 39, the electric push rod 39 is started to drive the movable flat plate 36 to move so as to facilitate the matching of the die, the supporting fixing rod 41 is used for fixing a clamping plate 42, the clamping plate 42 is used for fixing the lower plastic package die 43 so as to facilitate the disassembly, and the replacement of different dies is facilitated, sealing strip 47 and seal groove 44 joint let lower plastic envelope mould 43 and last plastic envelope mould 45 joint, conveniently fill the plastic envelope material, conveniently carry out the plastic envelope, feeding pipeline 46 is used for carrying out the feeding, conveniently carry out the plastic envelope, lower plastic envelope mould 43 and last plastic envelope mould 45 joint, conveniently carry out the plastic envelope material that fills, spacing cylinder 48 and spacing round hole 49 joint, let the mould remove more stably, carry out spacing to the mould, conveniently carry out the plastic envelope, after the plastic envelope material is filled, be used for fixed joint board 52 through rectangle dead lever 51, fixed joint board 52 is used for fixed hot plate 53, hot plate 53 adopts high Wen Zhulv hot plate, heat, conveniently carry out the plastic envelope, carry out the plastic envelope design.
It should be noted that the core chip of the external control switch set disclosed in the above embodiment is a PLC chip, the heating plate 53 is a high Wen Zhulv heating plate, and the external control switch set controls the electric push rod 39 and the heating plate 53 to work by a method commonly used in the prior art.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (6)
1. A semiconductor chip plastic package device is characterized in that: comprises a fixed flat plate (1), a plastic package power unit (3), a chip fixing unit (4) and a heating component (5);
fixing plate (1): the upper side surface is provided with a plastic package power unit (3), the inner bottom surface of a fixed shell (31) in the plastic package power unit (3) is provided with a heating component (5), and four corners of the lower side surface of the fixed flat plate (1) are respectively fixedly connected with supporting legs (2);
chip fixing unit (4): the sealing device comprises a supporting fixing rod (41), a clamping plate (42), a lower plastic sealing die (43), a sealing groove (44), an upper plastic sealing die (45), a feeding pipeline (46) and a sealing strip (47), wherein a rectangular hole is formed in the upper side surface of a fixing shell (31) in a plastic sealing power unit (3), the rectangular hole extends into the fixing shell (31), the lower plastic sealing die (43) is arranged in the rectangular hole, a chip is arranged in the lower plastic sealing die (43), the sealing groove (44) is formed in the position of the edge of the upper side surface of the lower plastic sealing die (43), the lower side surface of a movable flat plate (36) in the plastic sealing power unit (3) is fixedly clamped with the upper plastic sealing die (45) at a position corresponding to the lower plastic sealing die (43), the sealing strip (47) is fixedly connected with the position of the edge of the feeding round hole on the upper plastic sealing die (45), the position of the edge of the feeding round hole is fixedly connected with the feeding pipeline (46), the other end of the upper plastic sealing die (45) penetrates through the corresponding rectangular pipeline (46) and is fixedly connected with the other end of the movable flat plate (31) at one end, which is fixedly connected with the movable flat plate (31), the upper side surfaces of the four supporting and fixing rods (41) are respectively and fixedly connected with the clamping plates (42), and the four clamping plates (42) are respectively and fixedly clamped with the lower side surfaces of the corresponding lower plastic package mold (43) through the inserting columns.
2. The semiconductor chip molding apparatus of claim 1, wherein: the chip fixing unit (4) further comprises limiting cylinders (48) and limiting round holes (49), the limiting round holes (49) are respectively formed in the positions, located at four corners of the edge of the lower plastic packaging die (43), of the upper side surface of the fixing shell (31) in the plastic packaging power unit (3), the lower side surface of the movable flat plate (36) in the plastic packaging power unit (3) is located at the positions corresponding to the four limiting round holes (49) and is fixedly connected with the limiting cylinders (48) respectively, and the four limiting cylinders (48) are spliced with the corresponding limiting round holes (49) respectively.
3. The semiconductor chip molding apparatus of claim 1, wherein: plastic packaging power unit (3) include fixed shell (31), support soon (32), dead lever (33), stable slide column (34), remove slider (35), remove dull and stereotyped (36) and fixed roof (37), fixed shell (31) is connected to fixed dull and stereotyped (1) upside surface, two equidistant support soon (32) of left and right sides surface difference fixed connection of fixed shell (31), four support soon (32) upside surfaces respectively fixed connection dead lever (33), the spout has been seted up respectively to the corresponding one side surface around four dead levers (33), sliding connection removes slider (35) respectively in every spout, the downthehole fixed connection stable slide column (34) respectively of four spouts, the slide hole on corresponding stable slide column (34) on four removal slider (35) is connected one and is removed dull and stereotyped (36) about corresponding one side surface fixed connection, a fixed roof (37) are connected to four dead lever (33) upside surface fixed connection.
4. The semiconductor chip molding apparatus according to claim 3, wherein: the plastic package power unit (3) further comprises an L push rod fixing rod (38) and an electric push rod (39), the upper side surfaces of the fixing top plates (37) are fixedly connected with the end faces of the two L push rod fixing rods (38) in the vertical direction, one electric push rod (39) is fixedly connected with one side surface corresponding to the two L push rod fixing rods (38) in the horizontal direction, the lower ends of the electric push rods (39) penetrate through the fixing top plates (37) and are fixedly connected with the upper side surfaces of the corresponding movable flat plates (36), and the input ends of the electric push rods (39) are electrically connected with the output ends of an external power supply through an external control switch group.
5. The semiconductor chip molding apparatus according to claim 3, wherein: the heating assembly (5) comprises rectangular fixing rods (51), fixing clamping plates (52) and heating plates (53), the inner bottom surface of the fixing shell (31) is fixedly connected with one rectangular fixing rod (51) at the position between the four supporting fixing rods (41), the fixing clamping plates (52) are fixedly connected with the upper side surfaces of the rectangular fixing rods (51), the heating plates (53) are arranged at the positions, corresponding to the lower plastic package die (43), of the upper side surfaces of the fixing clamping plates (52), and the input ends of the heating plates (53) are electrically connected with the output ends of an external power supply through an external control switch group.
6. The semiconductor chip molding device according to claim 5, wherein: still include access door plant (6) and pulling handrail (7), the manhole has been seted up to the position that fixed shell (31) front side surface is located hot plate (53) correspondence, the manhole extends to in fixed shell (31), wherein one side sliding connection access door plant (6) in the manhole, the front side surface of access door plant (6) is through movable pin axle and pulling handrail (7) swing joint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321976382.2U CN220774285U (en) | 2023-07-26 | 2023-07-26 | Plastic package device for semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321976382.2U CN220774285U (en) | 2023-07-26 | 2023-07-26 | Plastic package device for semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220774285U true CN220774285U (en) | 2024-04-12 |
Family
ID=90618453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321976382.2U Active CN220774285U (en) | 2023-07-26 | 2023-07-26 | Plastic package device for semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220774285U (en) |
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2023
- 2023-07-26 CN CN202321976382.2U patent/CN220774285U/en active Active
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