CN206480644U - 一种多层折射率渐变硅胶封装发光二极管 - Google Patents
一种多层折射率渐变硅胶封装发光二极管 Download PDFInfo
- Publication number
- CN206480644U CN206480644U CN201621489969.0U CN201621489969U CN206480644U CN 206480644 U CN206480644 U CN 206480644U CN 201621489969 U CN201621489969 U CN 201621489969U CN 206480644 U CN206480644 U CN 206480644U
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- CN
- China
- Prior art keywords
- refractive index
- negative electrode
- electrode pin
- led chip
- emitting diode
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621489969.0U CN206480644U (zh) | 2016-12-31 | 2016-12-31 | 一种多层折射率渐变硅胶封装发光二极管 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621489969.0U CN206480644U (zh) | 2016-12-31 | 2016-12-31 | 一种多层折射率渐变硅胶封装发光二极管 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206480644U true CN206480644U (zh) | 2017-09-08 |
Family
ID=59750962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621489969.0U Expired - Fee Related CN206480644U (zh) | 2016-12-31 | 2016-12-31 | 一种多层折射率渐变硅胶封装发光二极管 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206480644U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108006491A (zh) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | Led隧道灯 |
CN111505865A (zh) * | 2020-04-20 | 2020-08-07 | 深圳市隆利科技股份有限公司 | 直下式背光模组 |
-
2016
- 2016-12-31 CN CN201621489969.0U patent/CN206480644U/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108006491A (zh) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | Led隧道灯 |
CN108006491B (zh) * | 2017-11-28 | 2020-10-30 | 吉安建伟纸塑制品包装有限公司 | Led隧道灯 |
CN111505865A (zh) * | 2020-04-20 | 2020-08-07 | 深圳市隆利科技股份有限公司 | 直下式背光模组 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170918 Address after: 528478 Guangdong city of Zhongshan Province town Henglan Maohui Industrial Zone (3) Yi Hui Road No. 58 Tongxing Industrial Park B Building 5 floor of Patentee after: Zhongshan aiyinte photoelectric Co Ltd Address before: 528478 Guangdong city of Zhongshan Province town Henglan Maohui Industrial Zone (3) Yi Hui Road No. 58 Tongxing Industrial Park B Building 5 floor of the Zhongshan aiyinte photoelectric Co Ltd Patentee before: Jiang Zuhui |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170908 Termination date: 20191231 |