CN206461828U - A kind of mixed pressure high frequency double-sided PCB board - Google Patents
A kind of mixed pressure high frequency double-sided PCB board Download PDFInfo
- Publication number
- CN206461828U CN206461828U CN201720114695.5U CN201720114695U CN206461828U CN 206461828 U CN206461828 U CN 206461828U CN 201720114695 U CN201720114695 U CN 201720114695U CN 206461828 U CN206461828 U CN 206461828U
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- CN
- China
- Prior art keywords
- conducting glue
- glue layer
- copper base
- teflon plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model is related to a kind of mixed pressure high frequency double-sided PCB board, including copper base, bolt hole, upper heat-conducting glue layer A, the first Teflon plate, upper heat-conducting glue layer B, first line plate, the first solder mask layer, lower heat-conducting glue layer A, the second Teflon plate, lower heat-conducting glue layer B, the second wiring board, the second solder mask layer and fin, four turnings of the copper base are equipped with bolt hole, and the edge on the two sides of the copper base is distributed with fin.The mixed pressure high frequency double-sided PCB board, by the two sides that the first Teflon plate and the second Teflon plate are arranged on to copper base, quick heat conduction work can be carried out to the first Teflon plate and the second Teflon plate by copper base, and the fin for the edge welding for passing through copper base two sides can be easy to carry out quick radiating treatment work to copper base, and the first Teflon plate and the second Teflon plate can also be positioned by fin, and facilitate the installment work of the first Teflon plate and the second Teflon plate.
Description
Technical field
The utility model is related to pcb board equipment technical field, specially a kind of mixed pressure high frequency double-sided PCB board.
Background technology
It is a kind of extraordinary pcb board for HF link in high frequency double-sided PCB board, its material to substrate has higher
It is required that, involve great expense, polytetrafluoroethylene (PTFE) is commonly called as Teflon, be a kind of high frequency plate frequently with substrate material, but due to polytetrafluoro
The characteristic of ethene, the problem of heat dispersion for causing traditional high frequency double-sided PCB board is one more serious, it is impossible to it is quick then
Fatal influence can be caused to the work of high frequency plate.
Utility model content
The purpose of this utility model, which is that, provides a kind of simple in construction, reasonable in design one in order to solve the above problems
Plant mixed pressure high frequency double-sided PCB board.
The utility model is achieved through the following technical solutions above-mentioned purpose：
A kind of mixed pressure high frequency double-sided PCB board, including copper base, bolt hole, upper heat-conducting glue layer A, the first Teflon plate, on lead
Hot glue layer B, first line plate, the first solder mask layer, lower heat-conducting glue layer A, the second Teflon plate, lower heat-conducting glue layer B, the second line
Road plate, the second solder mask floor and fin, four turnings of the copper base are equipped with bolt hole, the two sides of the copper base
Edge be distributed with fin, the surface crown of the copper base is provided with upper heat-conducting glue layer A, the top of the upper heat-conducting glue layer A
Portion is provided with the first Teflon plate, and the top of the first Teflon plate is provided with upper heat-conducting glue layer B, the top of the upper heat-conducting glue layer B
Portion is provided with first line plate, and the top of the first line plate is provided with the first solder mask layer, the surface bottom portion of the copper base
Provided with lower heat-conducting glue layer A, the bottom of the lower heat-conducting glue layer A is provided with the second Teflon plate, the bottom of the second Teflon plate
Provided with lower heat-conducting glue layer B, the bottom of the lower heat-conducting glue layer B is provided with the second wiring board, and the bottom of second wiring board is provided with
Second solder mask layer.
As further prioritization scheme of the present utility model, the copper base is welded with fin.
The beneficial effects of the utility model are：
The utility model is simple in construction, reasonable in design, by the way that the first Teflon plate and the second Teflon plate are arranged on into copper
The two sides of substrate, can carry out quick heat conduction work, and pass through by copper base to the first Teflon plate and the second Teflon plate
The fin of the edge welding on copper base two sides can be easy to carry out copper base quick radiating treatment work, and pass through radiating
Piece can also be positioned to the first Teflon plate and the second Teflon plate, and facilitate the first Teflon plate and the second Teflon plate
Installment work, and it is easy to by the bolt hole at four turnings of copper base the installment work of the mixed pressure high frequency double-sided PCB board.
Brief description of the drawings
Fig. 1 is axonometric drawing of the present utility model；
Fig. 2 is sectional view of the present utility model.
In figure：1 copper base, 2 bolts hole, heat-conducting glue layer A on 3,4 first Teflon plates, heat-conducting glue layer B, 6 First Lines on 5
Road plate, 7 first solder mask floor, 8 times heat-conducting glue layer A, 9 second Teflon plates, 10 times heat-conducting glue layer B, 11 second wiring boards, 12
Second solder mask layer, 13 fin.
Embodiment
The utility model is described in further detail below in conjunction with the accompanying drawings：
As shown in Figure 1 and Figure 2, a kind of mixed pressure high frequency double-sided PCB board, including including copper base 1, bolt hole 2, upper heat-conducting glue
Layer A3, the first Teflon plate 4, upper heat-conducting glue layer B5, first line plate 6, the first solder mask layer 7, lower heat-conducting glue layer A8, second
Teflon plate 9, lower heat-conducting glue layer B10, the second wiring board 11, the second solder mask layer 12 and fin 13, the copper base 1
Four turnings are equipped with bolt hole 2, and the edge on the two sides of the copper base 1 is distributed with fin 13, the table of the copper base 1
Upper heat-conducting glue layer A3 is provided with the top of face, copper base 1 is completed with proposing the connection of the first Teflon plate 4 by upper heat-conducting glue layer A3.
The top of the upper heat-conducting glue layer A3 is provided with the first Teflon plate 4, and the top of the first Teflon plate 4 is provided with upper heat-conducting glue layer
B5, the connection of the first Teflon plate and the first solder mask layer is completed by upper heat-conducting glue layer B5.The upper heat-conducting glue layer B5's
Top is provided with first line plate 6, and the top of the first line plate 6 is provided with the first solder mask layer 7, the table of the copper base 1
Face bottom is provided with lower heat-conducting glue layer A8, and the connection of the Teflon plate 9 of copper base 1 and second is completed by lower heat-conducting glue layer A8.It is described
Lower heat-conducting glue layer A8 bottom is provided with the second Teflon plate 9, and the bottom of the second Teflon plate 9 is provided with lower heat-conducting glue layer B10,
The connection of the second Teflon plate 9 and the second wiring board 11 is completed by lower heat-conducting glue layer B10.The bottom of the lower heat-conducting glue layer B10
Portion is provided with the second wiring board 11, and the bottom of second wiring board 11 is provided with the second solder mask layer 12.The copper base 1 is with dissipating
Backing 13 is welded.
The utility model is simple in construction, reasonable in design, by the way that the first Teflon plate 4 and the second Teflon plate 9 are arranged on
The two sides of copper base 1, can carry out quick heat conduction work by the Teflon plate 9 of 1 pair of first Teflon plate of copper base 4 and second,
And the fin 13 for the edge welding for passing through the two sides of copper base 1 can be easy to carry out copper base 1 quick radiating treatment work, and
And the first Teflon plate 4 and the second Teflon plate 9 can also be positioned by fin 13, and facilitate the first Teflon plate 4
With the installment work of the second Teflon plate 9, and it is easy to by the bolt hole 2 at 1 four turnings of copper base the mixed pressure high frequency double
The installment work of face pcb board.
General principle of the present utility model, principal character and advantage has been shown and described above.The technical staff of the industry
It should be appreciated that the utility model is not restricted to the described embodiments, the simply explanation described in above-described embodiment and specification is originally
The principle of utility model, on the premise of the utility model spirit and scope are not departed from, the utility model also has various change
And improvement, these changes and improvements are both fallen within the range of claimed the utility model.Scope is claimed in the utility model
Defined by appended claims and its effect thing.
Claims (2)
1. a kind of mixed pressure high frequency double-sided PCB board, it is characterised in that：Including copper base（1）, bolt hole（2）, upper heat-conducting glue layer A
（3）, the first Teflon plate（4）, upper heat-conducting glue layer B（5）, first line plate（6）, the first solder mask layer（7）, lower heat-conducting glue layer
A（8）, the second Teflon plate（9）, lower heat-conducting glue layer B（10）, the second wiring board（11）, the second solder mask layer（12）And radiating
Piece（13）, the copper base（1）Four turnings be equipped with bolt hole（2）, the copper base（1）The edge on two sides be distributed
There is fin（13）, the copper base（1）Surface crown be provided with upper heat-conducting glue layer A（3）, the upper heat-conducting glue layer A（3）Top
Portion is provided with the first Teflon plate（4）, the first Teflon plate（4）Top be provided with upper heat-conducting glue layer B（5）, the upper heat conduction
Glue-line B（5）Top be provided with first line plate（6）, the first line plate（6）Top provided with the first solder mask layer（7）,
The copper base（1）Surface bottom portion be provided with lower heat-conducting glue layer A（8）, the lower heat-conducting glue layer A（8）Bottom it is special provided with second
Fluorine dragon plate（9）, the second Teflon plate（9）Bottom be provided with lower heat-conducting glue layer B（10）, the lower heat-conducting glue layer B（10）'s
Bottom is provided with the second wiring board（11）, second wiring board（11）Bottom provided with the second solder mask layer（12）.
2. a kind of mixed pressure high frequency double-sided PCB board according to claim 1, it is characterised in that：The copper base（1）With radiating
Piece（13）Welded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720114695.5U CN206461828U (en) | 2017-02-08 | 2017-02-08 | A kind of mixed pressure high frequency double-sided PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720114695.5U CN206461828U (en) | 2017-02-08 | 2017-02-08 | A kind of mixed pressure high frequency double-sided PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206461828U true CN206461828U (en) | 2017-09-01 |
Family
ID=59695106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720114695.5U Active CN206461828U (en) | 2017-02-08 | 2017-02-08 | A kind of mixed pressure high frequency double-sided PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206461828U (en) |
-
2017
- 2017-02-08 CN CN201720114695.5U patent/CN206461828U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170925 Address after: 514000 B District, Meizhou Economic Development Zone, Guangdong Patentee after: Meizhou Li Yu Da circuit board Co., Ltd. Address before: 514031 banana Industrial Park, Guangdong, Meizhou Patentee before: Meizhou Hongli circuit board Co. Ltd. |