CN206432256U - A kind of radiator and heat abstractor - Google Patents
A kind of radiator and heat abstractor Download PDFInfo
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- CN206432256U CN206432256U CN201720151030.1U CN201720151030U CN206432256U CN 206432256 U CN206432256 U CN 206432256U CN 201720151030 U CN201720151030 U CN 201720151030U CN 206432256 U CN206432256 U CN 206432256U
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- radiator
- boss
- substrate
- heat
- elastic device
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model embodiment provides a kind of radiator and heat abstractor, and radiator includes：Heat abstractor and substrate；Wherein, the heat abstractor includes radiator body, boss and elastic device；The radiator body is fixedly connected with the substrate, the boss is bolted the substrate and the radiator body, non-threaded section of the boss located at the bolt, the elastic device, the elastic device and the boss and the substrate connection are provided between the boss and the substrate.So, the radiator of the utility model embodiment, boss can float, the dimensional tolerance between radiator and thermal source is absorbed by the boss of floating, the less Heat Conduction Material of thermal resistance so can be smeared in heat source surface, make between boss and thermal source by the less Heat Conduction Material heat transfer of thermal resistance, reduce thermal resistance caused by Heat Conduction Material, improve the radiating effect of radiator.
Description
Technical field
The utility model is related to communication technical field, more particularly to a kind of radiator and heat abstractor.
Background technology
With the development of the communication technology, the function of communication products gradually increases, and the power consumptions of communication products chips is also gradually
Increase, accordingly, it would be desirable to install radiator on chip.Because the distance between radiator base plate and chip bottom circuit board are solid
Fixed, it usually needs the filling thickness larger heat conductive pad or thermally conductive gel between radiator bottom and chip upper surface, with
The gap for absorbing chip size difference and bringing.When packing material thickness is big, when the power consumption that chip is produced is larger, it is easily caused and leads
Thermal resistance is larger caused by hot material.
It can be seen that, the radiating effect of existing radiator is poor.
Utility model content
The purpose of the utility model embodiment is to provide a kind of radiator and heat abstractor, solves the radiating of radiator
The problem of effect is poor.
To reach above-mentioned purpose, the utility model embodiment provides a kind of radiator, including：
Heat abstractor and substrate；
Wherein, the heat abstractor includes radiator body, boss and elastic device；
The radiator body is fixedly connected with the substrate, and the boss is bolted the substrate and described scattered
Hot device body, the boss is filled located at the non-threaded section of the bolt between the boss and the substrate provided with the elasticity
Put, the elastic device and the boss and the substrate connection.
The utility model embodiment additionally provides a kind of heat abstractor, including：
Radiator body, boss and elastic device；
The boss is bolted the radiator body, and the boss is located at the non-threaded section of the bolt, institute
State and the elastic device is provided between boss and the radiator body, the elastic device connects the boss and the radiating
Device body.
A technical scheme in above-mentioned technical proposal has the following advantages that or beneficial effect：
The radiator of the utility model embodiment, boss can float in the unthreaded portion of bolt, can be by floating
Boss absorb dimensional tolerance between radiator and thermal source, it is convex when smearing the less Heat Conduction Material of thermal resistance in heat source surface
It can be conducted heat between platform and thermal source by the less Heat Conduction Material of thermal resistance, reduce thermal resistance caused by Heat Conduction Material, improve scattered
The radiating effect of hot device.
Brief description of the drawings
Fig. 1 is a kind of radiator bottom surface explosive view that the utility model embodiment is provided；
Fig. 2 is another radiator bottom surface explosive view that the utility model embodiment is provided；
Fig. 3 is another radiator bottom surface explosive view that the utility model embodiment is provided；
Fig. 4 is a kind of radiator front explosive view that the utility model embodiment is provided；
Fig. 5 is a kind of structure chart for boss that the utility model embodiment is provided；
Fig. 6 is another radiator bottom surface explosive view that the utility model embodiment is provided；
Fig. 7 is a kind of front assembling assumption diagram for radiator that the utility model embodiment is provided；
Fig. 8 is a kind of bottom surface assembling assumption diagram for radiator that the utility model embodiment is provided.
Embodiment
To make the technical problems to be solved in the utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing
And specific embodiment is described in detail.
Referring to Fig. 1, Fig. 1 is a kind of radiator bottom surface explosive view that the utility model embodiment is provided.Radiator includes：
Heat abstractor 1 and substrate 2；
Wherein, the heat abstractor 1 includes radiator body 11, boss 12 and elastic device 13；
The radiator body 11 is fixedly connected with the substrate 2, and the boss 12 connects the substrate 2 by bolt 14
With the radiator body 11, the boss 12 located at the bolt 14 non-threaded section, the boss 12 and the substrate 2 it
Between be provided with the elastic device 13, the elastic device 13 is connected with the boss 12 and the substrate 2.
In the utility model embodiment, radiator can include one or more heat abstractors, heat abstractor and substrate
A heat abstractor in connection, Fig. 1 is only citing.When radiator includes multiple heat abstractors, it can be used for multi-chip
Radiating, improves radiating effect.
Boss is provided with multiple holes, and the screw rod of bolt is passed through after the hole of boss, is connected with substrate and radiator body.
When being installed, the threaded portion of bolt can be contacted with the bottom of substrate, reach the purpose for tightening radiator.The hole of boss
The size in hole can be determined according to the diameter of bolt, boss is floated downward by hole on the unthreaded portion of bolt
It is dynamic.Elastic device can be set between boss and substrate, for example, shell fragment can be set between boss and substrate, make shell fragment
With boss and substrate connection；Spring can also be set between boss and substrate, and spring can be located between boss and substrate
On the screw rod of bolt, make spring and boss and substrate connection.So, the chi between thermal source and substrate is absorbed by the floating of boss
Very little tolerance.Heat Conduction Material can be filled between boss and substrate, boss can be transmitted the heat of thermal source by Heat Conduction Material
To radiator body, so as to dissipate a part of heat by radiator body.Multiple alignment pins can be set on substrate, will radiated
, can be by the nut hole position on alignment pin correspondence thermal source veneer when device is attached to thermal source, and make to dissipate through alignment pin using bolt
Hot device is fixed on thermal source.
In the utility model embodiment, boss can float in the unthreaded portion of bolt, can pass through the convex of floating
Platform absorbs the dimensional tolerance between radiator and thermal source, can smear the less Heat Conduction Material of thermal resistance in heat source surface, make boss
Conducted heat between thermal source by the less Heat Conduction Material of thermal resistance, reduce thermal resistance caused by Heat Conduction Material, improve radiator
Radiating effect.
Optionally, as shown in Fig. 2 the radiator includes heat abstractor 1 described at least two.
In this embodiment, radiator includes at least two identical heat abstractors, and heat abstractor is in an identical manner
With substrate connection, the specific connected mode of heat abstractor and substrate is referring to the description in the corresponding embodiments of Fig. 1.Two in Fig. 2
Individual heat abstractor is only citing.So, the radiator can be used to be radiated for multi-chip, space can be made full use of, and
And radiating efficiency can be improved.
Optionally, as shown in figure 3, being connected between the boss 12 of at least two heat abstractor 1 by the first heat pipe 3.
In this embodiment, connected between the boss of heat abstractor using heat pipe, making can between multiple boss
Heat transfer is carried out, so as to reach the effect of thermal source samming, it is only citing to improve two heat abstractors in radiating effect, Fig. 3.
In specific implementation process, boss can be set groove, heat pipe is arranged in the groove of boss, contact surface can be increased
Product, improves radiating effect.
Optionally, as shown in figure 4, the radiator body 11 includes sub- radiator 111, the radiator body 11 is provided with
One through hole, the sub- radiator 111 is in the through hole, and the boss 12 is bolted the substrate 2 and the son
Radiator 111.
In this embodiment, radiator body is provided with a through hole, sub- radiator in the through hole, bolt through boss and
After substrate, it is fixedly connected with sub- radiator.In sub- radiator and boss joint, substrate can equally set through hole, dissipate son
Hot device and boss docking, can fill Heat Conduction Material, such as thermally conductive gel or heat conductive pad between sub- radiator and boss, this
Sample, a part of heat that can transmit boss is shed by radiator body, and a part of heat is shed by sub- radiator, can
To improve radiating efficiency, radiating effect is improved.
Optionally, as shown in figure 5, the elastic device 13 is shell fragment 131.
Shell fragment is set between boss and substrate, when boss is contacted with thermal source, active force and shell fragment of the thermal source to boss
The active force control boss of boss is fluctuated, so as to absorb the dimensional tolerance of thermal source and radiator, reduces Heat Conduction Material
Thermal resistance, improves the radiating effect of radiator.
Optionally, as shown in figure 5, the boss 12 is provided with the groove 121 matched with the shell fragment 131, the shell fragment 131
Partial portion be located in the boss 12 in the groove 121 that is matched with the shell fragment 131.
Boss is provided with the groove that size is matched with shell fragment, the partial portion of shell fragment is placed in groove, prevents shell fragment from sliding
Move and influence the stability of radiator heat-dissipation.So, the heat dispersion of radiator is stable, can improve radiating effect.
Optionally, as shown in fig. 6, being provided with the second heat pipe 4, the substrate 2 and institute between the boss 12 and the substrate 2
State boss 12 and be respectively equipped with the groove matched with second heat pipe 4, one end of second heat pipe 4 is located at the substrate 2
In groove, the other end of second heat pipe 4 is located in the groove matched in the boss 12 with second heat pipe 4.
Heat pipe is provided between boss and substrate, can be provided with respectively on boss and substrate with heat pipe sizes match it is recessed
Groove, so, can be by one end of heat pipe in the groove of boss, and the other end of heat pipe is in the groove of substrate, so as to increase
The contact surface of big heat pipe and substrate, and heat pipe and boss contact surface, improve heat-conducting effect.On the other hand, heat pipe is located at
It in groove, can prevent the position of heat pipe from moving, improve the stability of radiator.The shape of heat pipe can be set to U-shaped, so,
The contact surface and heat pipe and the contact surface of substrate in space, increase heat pipe and boss can be saved, radiating effect can be improved.
Fig. 7 and Fig. 8 is the structure chart of front and bottom surface after assembling radiator.Radiator when in use, can put shell fragment
Put between boss and substrate, Heat Conduction Material is then added between boss and sub- radiator, such as heat conductive pad or heat conduction coagulate
Glue, and tightly lock bolt 14.Next appropriate Heat Conduction Material is applied in heat source surface, such as heat-conducting silicone grease is placed on radiator
On thermal source, the boss of radiator is corresponding with heat source position, and the alignment pin 5 of radiator corresponds to the last nut hole position of veneer, positioning
Tight lock screw 6, completes to install afterwards.
The utility model embodiment also provides a kind of heat abstractor, as shown in figure 1, heat abstractor includes：
Radiator body 11, boss 12 and elastic device 13；
The boss 12 connects the radiator body 11 by bolt 14, and the boss 12 is located at the nothing of the bolt 14
Thread segment, is provided with the elastic device 13 between the boss 12 and the radiator body 11, the elastic device 13 is connected
The boss 12 and the radiator body 11.
In this embodiment, Heat Conduction Material or heat conduction can be set between the boss and radiator body of heat abstractor
Pipe, makes boss transfer heat to radiator body, and the boss of heat abstractor can fluctuate in the non-threaded section of bolt, can
To absorb the dimensional tolerance between radiator and thermal source, thermal resistance caused by reduction Heat Conduction Material improves radiating effect.
Optionally, as shown in figure 4, the radiator body 11 includes sub- radiator 111, the radiator body 11 is provided with
One through hole, the sub- radiator 111 is in the through hole, and the sub- radiator 111 is connected with the radiator body 11, institute
Boss is stated to be connected with the sub- radiator 111 by bolt.
In this embodiment, radiator body is provided with through hole, and sub- radiator is in through hole, in radiator body through hole
Projective structure can be provided with, radiator body and sub- radiator can be connected by screw bolts.Boss can transfer heat to scattered
Hot device body and sub- radiator, can expand area of dissipation, improve radiating effect.
Optionally, as shown in figure 5, the elastic device is shell fragment.
In this embodiment, shell fragment can be set between boss and radiator body, when boss is contacted with thermal source, heat
Source is fluctuated to the active force of boss with shell fragment to the active force control boss of boss, so as to absorb the chi of thermal source and radiator
Very little tolerance, reduces the thermal resistance of Heat Conduction Material, improves the radiating effect of radiator.Described above is of the present utility model be preferable to carry out
Mode, it is noted that for those skilled in the art, before principle described in the utility model is not departed from
Put, some improvements and modifications can also be made, these improvements and modifications also should be regarded as protection domain of the present utility model.
Claims (10)
1. a kind of radiator, it is characterised in that including：
Heat abstractor and substrate；
Wherein, the heat abstractor includes radiator body, boss and elastic device；
The radiator body is fixedly connected with the substrate, and the boss is bolted the substrate and the radiator
Body, the boss is provided with the elastic device, institute located at the non-threaded section of the bolt between the boss and the substrate
State elastic device and the boss and the substrate connection.
2. radiator as claimed in claim 1, it is characterised in that the radiator includes heat abstractor described at least two.
3. radiator as claimed in claim 2, it is characterised in that pass through between the boss of at least two heat abstractor
One heat pipe is connected.
4. radiator as claimed in claim 3, it is characterised in that the radiator body includes sub- radiator, the radiating
Device body is provided with a through hole, and the sub- radiator is in the through hole, and the boss is bolted the substrate and institute
State sub- radiator.
5. radiator as claimed in claim 4, it is characterised in that the elastic device is shell fragment.
6. radiator as claimed in claim 5, it is characterised in that the boss is provided with the groove matched with the shell fragment, institute
The partial portion for stating shell fragment is located in the groove matched in the boss with the shell fragment.
7. radiator as claimed in claim 6, it is characterised in that the second heat pipe is provided between the boss and the substrate,
The substrate and the boss are respectively equipped with the groove matched with second heat pipe, and one end of second heat pipe is located at described
In the groove of substrate, the other end of second heat pipe is located in the groove matched in the boss with second heat pipe.
8. a kind of heat abstractor, it is characterised in that including：
Radiator body, boss and elastic device；
The boss is bolted the radiator body, and the boss is located at the non-threaded section of the bolt, described convex
The elastic device is provided between platform and the radiator body, the elastic device connects the boss and the radiator sheet
Body.
9. heat abstractor as claimed in claim 8, it is characterised in that the radiator body includes sub- radiator, described to dissipate
Hot device body is provided with a through hole, and the sub- radiator is in the through hole, and the sub- radiator connects with the radiator body
Connect, the boss is connected by bolt with the sub- radiator.
10. heat abstractor as claimed in claim 9, it is characterised in that the elastic device is shell fragment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720151030.1U CN206432256U (en) | 2017-02-20 | 2017-02-20 | A kind of radiator and heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720151030.1U CN206432256U (en) | 2017-02-20 | 2017-02-20 | A kind of radiator and heat abstractor |
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| Publication Number | Publication Date |
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| CN206432256U true CN206432256U (en) | 2017-08-22 |
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ID=59590322
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| Application Number | Title | Priority Date | Filing Date |
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| CN201720151030.1U Active CN206432256U (en) | 2017-02-20 | 2017-02-20 | A kind of radiator and heat abstractor |
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| CN (1) | CN206432256U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113966648A (en) * | 2019-04-12 | 2022-01-21 | 上海诺基亚贝尔股份有限公司 | Heat dissipation |
-
2017
- 2017-02-20 CN CN201720151030.1U patent/CN206432256U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113966648A (en) * | 2019-04-12 | 2022-01-21 | 上海诺基亚贝尔股份有限公司 | Heat dissipation |
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